FR2875927B1 - Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce - Google Patents

Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce

Info

Publication number
FR2875927B1
FR2875927B1 FR0410110A FR0410110A FR2875927B1 FR 2875927 B1 FR2875927 B1 FR 2875927B1 FR 0410110 A FR0410110 A FR 0410110A FR 0410110 A FR0410110 A FR 0410110A FR 2875927 B1 FR2875927 B1 FR 2875927B1
Authority
FR
France
Prior art keywords
chip
electronic chip
protecting
self
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0410110A
Other languages
English (en)
Other versions
FR2875927A1 (fr
Inventor
Gilles Delapierre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0410110A priority Critical patent/FR2875927B1/fr
Priority to US11/660,950 priority patent/US20080010690A1/en
Priority to JP2007532923A priority patent/JP2008515179A/ja
Priority to PCT/FR2005/002312 priority patent/WO2006035135A1/fr
Priority to EP05805782A priority patent/EP1803085A1/fr
Publication of FR2875927A1 publication Critical patent/FR2875927A1/fr
Application granted granted Critical
Publication of FR2875927B1 publication Critical patent/FR2875927B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Storage Device Security (AREA)
FR0410110A 2004-09-24 2004-09-24 Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce Expired - Fee Related FR2875927B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0410110A FR2875927B1 (fr) 2004-09-24 2004-09-24 Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce
US11/660,950 US20080010690A1 (en) 2004-09-24 2005-09-19 Method for Protecting an Electronic Chip
JP2007532923A JP2008515179A (ja) 2004-09-24 2005-09-19 電子チップを保護する方法
PCT/FR2005/002312 WO2006035135A1 (fr) 2004-09-24 2005-09-19 Procede de protection d’une puce electronique
EP05805782A EP1803085A1 (fr) 2004-09-24 2005-09-19 Procede de protection d'une puce elecrtonique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0410110A FR2875927B1 (fr) 2004-09-24 2004-09-24 Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce

Publications (2)

Publication Number Publication Date
FR2875927A1 FR2875927A1 (fr) 2006-03-31
FR2875927B1 true FR2875927B1 (fr) 2006-12-08

Family

ID=34951881

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0410110A Expired - Fee Related FR2875927B1 (fr) 2004-09-24 2004-09-24 Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce

Country Status (5)

Country Link
US (1) US20080010690A1 (fr)
EP (1) EP1803085A1 (fr)
JP (1) JP2008515179A (fr)
FR (1) FR2875927B1 (fr)
WO (1) WO2006035135A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081763A1 (fr) 2007-12-25 2009-07-02 Fujikura Ltd. Dispositif à semi-conducteurs et son procédé de fabrication
FR3012237B1 (fr) 2013-10-22 2017-03-03 Commissariat Energie Atomique Puce electronique comprenant des moyens de protection de sa face arriere
US9627333B1 (en) 2016-03-28 2017-04-18 International Business Machines Corporation Emergency destruction of integrated circuits
US9997451B2 (en) 2016-06-30 2018-06-12 International Business Machines Corporation Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
US10800649B2 (en) 2016-11-28 2020-10-13 Analog Devices International Unlimited Company Planar processing of suspended microelectromechanical systems (MEMS) devices
US10843920B2 (en) 2019-03-08 2020-11-24 Analog Devices International Unlimited Company Suspended microelectromechanical system (MEMS) devices
WO2020183639A1 (fr) * 2019-03-13 2020-09-17 三菱電機株式会社 Dispositif et procédé de commande

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961578A1 (de) * 1999-12-21 2001-06-28 Bosch Gmbh Robert Sensor mit zumindest einer mikromechanischen Struktur und Verfahren zur Herstellung
DE10252329A1 (de) * 2002-11-11 2004-05-27 Giesecke & Devrient Gmbh Chip mit Sicherheitssensor
KR100471153B1 (ko) * 2002-11-27 2005-03-10 삼성전기주식회사 Ｓｏｉ웨이퍼를 이용한 mems 디바이스의 제조 및 접지 방법
US6995094B2 (en) * 2003-10-13 2006-02-07 International Business Machines Corporation Method for deep trench etching through a buried insulator layer

Also Published As

Publication number Publication date
WO2006035135A1 (fr) 2006-04-06
EP1803085A1 (fr) 2007-07-04
US20080010690A1 (en) 2008-01-10
JP2008515179A (ja) 2008-05-08
FR2875927A1 (fr) 2006-03-31

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120531