NO20034071D0 - Elektronisk modul omfattende kjölesubstrat og relaterte metoder - Google Patents

Elektronisk modul omfattende kjölesubstrat og relaterte metoder

Info

Publication number
NO20034071D0
NO20034071D0 NO20034071A NO20034071A NO20034071D0 NO 20034071 D0 NO20034071 D0 NO 20034071D0 NO 20034071 A NO20034071 A NO 20034071A NO 20034071 A NO20034071 A NO 20034071A NO 20034071 D0 NO20034071 D0 NO 20034071D0
Authority
NO
Norway
Prior art keywords
electronic module
module including
related methods
including cooling
cooling substrate
Prior art date
Application number
NO20034071A
Other languages
English (en)
Other versions
NO20034071L (no
Inventor
Steven Robert Snyder
Charles Michael Newton
Michael Ray Lange
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of NO20034071D0 publication Critical patent/NO20034071D0/no
Publication of NO20034071L publication Critical patent/NO20034071L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
NO20034071A 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter NO20034071L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,827 US6483705B2 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate and related methods
PCT/US2002/007417 WO2002076165A1 (en) 2001-03-19 2002-03-12 Electronic module including a cooling substrate and related methods

Publications (2)

Publication Number Publication Date
NO20034071D0 true NO20034071D0 (no) 2003-09-15
NO20034071L NO20034071L (no) 2003-11-18

Family

ID=25207701

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20034071A NO20034071L (no) 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter

Country Status (9)

Country Link
US (1) US6483705B2 (no)
EP (1) EP1378153B1 (no)
JP (1) JP4004963B2 (no)
KR (1) KR100553171B1 (no)
CN (1) CN1333627C (no)
AU (1) AU2002254176B2 (no)
CA (1) CA2440522C (no)
NO (1) NO20034071L (no)
WO (1) WO2002076165A1 (no)

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CN102623416B (zh) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 一种射频功放模块的功率器件无封装结构及其组装方法
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CN104603934B (zh) * 2012-08-27 2018-01-16 三菱电机株式会社 电力用半导体装置
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Also Published As

Publication number Publication date
KR20030087643A (ko) 2003-11-14
EP1378153A1 (en) 2004-01-07
CN1507767A (zh) 2004-06-23
KR100553171B1 (ko) 2006-02-22
AU2002254176B2 (en) 2004-05-20
CA2440522C (en) 2010-05-11
EP1378153A4 (en) 2009-05-06
JP4004963B2 (ja) 2007-11-07
NO20034071L (no) 2003-11-18
JP2004523920A (ja) 2004-08-05
CA2440522A1 (en) 2002-09-26
US6483705B2 (en) 2002-11-19
WO2002076165A1 (en) 2002-09-26
CN1333627C (zh) 2007-08-22
EP1378153B1 (en) 2011-08-10
US20020131237A1 (en) 2002-09-19

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