SE0301381D0 - Extruded heat sink with integrated thermosyphon - Google Patents

Extruded heat sink with integrated thermosyphon

Info

Publication number
SE0301381D0
SE0301381D0 SE0301381A SE0301381A SE0301381D0 SE 0301381 D0 SE0301381 D0 SE 0301381D0 SE 0301381 A SE0301381 A SE 0301381A SE 0301381 A SE0301381 A SE 0301381A SE 0301381 D0 SE0301381 D0 SE 0301381D0
Authority
SE
Sweden
Prior art keywords
thermosyphon
base
lid
heat sink
integrated
Prior art date
Application number
SE0301381A
Other languages
English (en)
Inventor
Jin Hou
Bo Bengtsson
Seppo Tovinen
Anders Norlin
Original Assignee
Sapa Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sapa Ab filed Critical Sapa Ab
Priority to SE0301381A priority Critical patent/SE0301381D0/sv
Publication of SE0301381D0 publication Critical patent/SE0301381D0/sv
Priority to EP04076228A priority patent/EP1477762A3/en
Priority to US10/833,324 priority patent/US20050056403A1/en
Priority to CN2004100431418A priority patent/CN1551724B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SE0301381A 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon SE0301381D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon
EP04076228A EP1477762A3 (en) 2003-05-12 2004-04-26 Thermosyphon and method for producing it
US10/833,324 US20050056403A1 (en) 2003-05-12 2004-04-28 Thermosyphon and method for producing it
CN2004100431418A CN1551724B (zh) 2003-05-12 2004-05-12 热虹吸管及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon

Publications (1)

Publication Number Publication Date
SE0301381D0 true SE0301381D0 (sv) 2003-05-12

Family

ID=20291279

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0301381A SE0301381D0 (sv) 2003-05-12 2003-05-12 Extruded heat sink with integrated thermosyphon

Country Status (4)

Country Link
US (1) US20050056403A1 (sv)
EP (1) EP1477762A3 (sv)
CN (1) CN1551724B (sv)
SE (1) SE0301381D0 (sv)

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US7958935B2 (en) * 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
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US7900692B2 (en) * 2005-10-28 2011-03-08 Nakamura Seisakusho Kabushikigaisha Component package having heat exchanger
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EP2246653B1 (en) * 2009-04-28 2012-04-18 ABB Research Ltd. Twisted tube thermosyphon
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US9091489B2 (en) 2010-05-14 2015-07-28 Paragon Space Development Corporation Radiator systems
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US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
JP5754431B2 (ja) * 2012-10-10 2015-07-29 日本軽金属株式会社 ヒートシンクの製造方法及び伝熱板の製造方法
ITBO20120618A1 (it) * 2012-11-09 2014-05-10 Mecc Al S R L A Socio Unico Procedimento per la realizzazione di un dissipatore e dissipatore cosi' ottenuto
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US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
CN108801012B (zh) * 2014-08-28 2020-10-23 阿威德热合金有限公司 具有一体式部件的热虹吸装置
CN109900146A (zh) * 2019-03-28 2019-06-18 南昌大学 一种带有热虹吸回路的双锥度微通道散热器

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Also Published As

Publication number Publication date
CN1551724A (zh) 2004-12-01
CN1551724B (zh) 2010-08-04
EP1477762A2 (en) 2004-11-17
EP1477762A3 (en) 2006-06-07
US20050056403A1 (en) 2005-03-17

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