CN1551724B - 热虹吸管及其制造方法 - Google Patents
热虹吸管及其制造方法 Download PDFInfo
- Publication number
- CN1551724B CN1551724B CN2004100431418A CN200410043141A CN1551724B CN 1551724 B CN1551724 B CN 1551724B CN 2004100431418 A CN2004100431418 A CN 2004100431418A CN 200410043141 A CN200410043141 A CN 200410043141A CN 1551724 B CN1551724 B CN 1551724B
- Authority
- CN
- China
- Prior art keywords
- thermal siphon
- evaporator
- lid
- rib
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0301381-0 | 2003-05-12 | ||
SE0301381A SE0301381D0 (sv) | 2003-05-12 | 2003-05-12 | Extruded heat sink with integrated thermosyphon |
SE03013810 | 2003-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1551724A CN1551724A (zh) | 2004-12-01 |
CN1551724B true CN1551724B (zh) | 2010-08-04 |
Family
ID=20291279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100431418A Expired - Fee Related CN1551724B (zh) | 2003-05-12 | 2004-05-12 | 热虹吸管及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050056403A1 (zh) |
EP (1) | EP1477762A3 (zh) |
CN (1) | CN1551724B (zh) |
SE (1) | SE0301381D0 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7147045B2 (en) | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
US6935409B1 (en) | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
US7305843B2 (en) * | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
US7857037B2 (en) * | 2001-11-27 | 2010-12-28 | Thermotek, Inc. | Geometrically reoriented low-profile phase plane heat pipes |
US7198096B2 (en) * | 2002-11-26 | 2007-04-03 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
CA2561769C (en) * | 2004-03-31 | 2009-12-22 | Belits Computer Systems, Inc. | Low-profile thermosyphon-based cooling system for computers and other electronic devices |
US7958935B2 (en) * | 2004-03-31 | 2011-06-14 | Belits Computer Systems, Inc. | Low-profile thermosyphon-based cooling system for computers and other electronic devices |
US7772456B2 (en) * | 2004-06-30 | 2010-08-10 | Kimberly-Clark Worldwide, Inc. | Stretchable absorbent composite with low superaborbent shake-out |
TWI262285B (en) * | 2005-06-03 | 2006-09-21 | Foxconn Tech Co Ltd | Loop-type heat exchange apparatus |
US7900692B2 (en) * | 2005-10-28 | 2011-03-08 | Nakamura Seisakusho Kabushikigaisha | Component package having heat exchanger |
CN101155497A (zh) * | 2006-09-29 | 2008-04-02 | 诺亚公司 | 相变散热装置与方法 |
CN101184381A (zh) * | 2006-11-14 | 2008-05-21 | 诺亚公司 | 具有相变散热装置的机壳 |
JP5334288B2 (ja) * | 2008-09-05 | 2013-11-06 | 日本モレックス株式会社 | ヒートパイプおよび電子機器 |
EP2246653B1 (en) * | 2009-04-28 | 2012-04-18 | ABB Research Ltd. | Twisted tube thermosyphon |
EP2246654B1 (en) * | 2009-04-29 | 2013-12-11 | ABB Research Ltd. | Multi-row thermosyphon heat exchanger |
US9091489B2 (en) | 2010-05-14 | 2015-07-28 | Paragon Space Development Corporation | Radiator systems |
CN102338581B (zh) * | 2010-07-23 | 2013-10-30 | 奇鋐科技股份有限公司 | 热虹吸板结构 |
CN102338583B (zh) * | 2010-07-23 | 2014-05-07 | 奇鋐科技股份有限公司 | 一种压力差驱动热板 |
WO2012115214A1 (ja) * | 2011-02-22 | 2012-08-30 | 日本電気株式会社 | 冷却装置及びその製造方法 |
WO2013169774A2 (en) | 2012-05-07 | 2013-11-14 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
JP5754431B2 (ja) * | 2012-10-10 | 2015-07-29 | 日本軽金属株式会社 | ヒートシンクの製造方法及び伝熱板の製造方法 |
ITBO20120618A1 (it) * | 2012-11-09 | 2014-05-10 | Mecc Al S R L A Socio Unico | Procedimento per la realizzazione di un dissipatore e dissipatore cosi' ottenuto |
CN103813695B (zh) * | 2012-11-13 | 2016-08-17 | 台达电子工业股份有限公司 | 虹吸式散热装置 |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
JP6679573B2 (ja) | 2014-08-28 | 2020-04-15 | アアヴィッド・サーマロイ・エルエルシー | 一体構成要素を備えたサーモサイホン |
CN108917439B (zh) * | 2018-08-30 | 2024-04-19 | 无锡格林沃科技有限公司 | 相变散热器 |
CN109900146A (zh) * | 2019-03-28 | 2019-06-18 | 南昌大学 | 一种带有热虹吸回路的双锥度微通道散热器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2151769B (en) | 1983-12-21 | 1987-11-04 | Marconi Electronic Devices | Heat sink arrangement |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
DE3825981A1 (de) * | 1988-07-27 | 1990-02-15 | Licentia Gmbh | Isothermisierter kuehlkoerper |
US5303768A (en) * | 1993-02-17 | 1994-04-19 | Grumman Aerospace Corporation | Capillary pump evaporator |
JPH06266474A (ja) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | 電子機器装置及びラップトップ型電子機器装置 |
JP3385482B2 (ja) * | 1993-11-15 | 2003-03-10 | 株式会社日立製作所 | 電子機器 |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
TW307837B (zh) * | 1995-05-30 | 1997-06-11 | Fujikura Kk | |
JP3634028B2 (ja) * | 1995-09-08 | 2005-03-30 | 住友精密工業株式会社 | 半導体素子冷却装置 |
US5725049A (en) * | 1995-10-31 | 1998-03-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Capillary pumped loop body heat exchanger |
JPH10154781A (ja) * | 1996-07-19 | 1998-06-09 | Denso Corp | 沸騰冷却装置 |
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
DE60007674T2 (de) * | 1999-03-05 | 2004-12-09 | Denso Corp., Kariya | Siede- und Kühlvorrichtung |
US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
US6216343B1 (en) | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
KR100338810B1 (ko) * | 1999-11-08 | 2002-05-31 | 윤종용 | 냉각장치 |
DE10006215A1 (de) * | 2000-02-11 | 2001-08-16 | Abb Semiconductors Ag Baden | Kühlvorrichtung für ein Hochleistungs-Halbleitermodul |
US6418017B1 (en) | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
JP2002141449A (ja) * | 2000-10-31 | 2002-05-17 | Denso Corp | 沸騰冷却器 |
US6483705B2 (en) * | 2001-03-19 | 2002-11-19 | Harris Corporation | Electronic module including a cooling substrate and related methods |
US6609560B2 (en) * | 2001-04-28 | 2003-08-26 | Samsung Electronics Co., Ltd. | Flat evaporator |
JP2003035470A (ja) * | 2001-05-15 | 2003-02-07 | Samsung Electronics Co Ltd | 微細ウィック構造を有するcpl冷却装置の蒸発器 |
JP3946018B2 (ja) * | 2001-09-18 | 2007-07-18 | 株式会社日立製作所 | 液冷却式回路装置 |
KR100438825B1 (ko) * | 2001-10-29 | 2004-07-05 | 삼성전자주식회사 | 단열 수단을 구비하는 열 전달 장치 |
JP2004037039A (ja) * | 2002-07-05 | 2004-02-05 | Sony Corp | 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法 |
JP4032954B2 (ja) * | 2002-07-05 | 2008-01-16 | ソニー株式会社 | 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法 |
JP2004077051A (ja) * | 2002-08-20 | 2004-03-11 | Sony Corp | 熱輸送装置およびその製造方法 |
-
2003
- 2003-05-12 SE SE0301381A patent/SE0301381D0/xx unknown
-
2004
- 2004-04-26 EP EP04076228A patent/EP1477762A3/en not_active Withdrawn
- 2004-04-28 US US10/833,324 patent/US20050056403A1/en not_active Abandoned
- 2004-05-12 CN CN2004100431418A patent/CN1551724B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
Non-Patent Citations (1)
Title |
---|
说明书第4列第45-65行,图3. |
Also Published As
Publication number | Publication date |
---|---|
US20050056403A1 (en) | 2005-03-17 |
EP1477762A2 (en) | 2004-11-17 |
EP1477762A3 (en) | 2006-06-07 |
CN1551724A (zh) | 2004-12-01 |
SE0301381D0 (sv) | 2003-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAPA AB Free format text: FORMER OWNER: GRANGES CO., LTD. Effective date: 20131114 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: GRANGES CO., LTD. Free format text: FORMER NAME: SAPA CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Stockholm Patentee after: Garan Giese Ltd. Address before: Stockholm Patentee before: SAPA AB |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131114 Address after: Stockholm Patentee after: SAPA AB Address before: Stockholm Patentee before: Garan Giese Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100804 Termination date: 20140512 |