JP6679573B2 - 一体構成要素を備えたサーモサイホン - Google Patents
一体構成要素を備えたサーモサイホン Download PDFInfo
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- JP6679573B2 JP6679573B2 JP2017511876A JP2017511876A JP6679573B2 JP 6679573 B2 JP6679573 B2 JP 6679573B2 JP 2017511876 A JP2017511876 A JP 2017511876A JP 2017511876 A JP2017511876 A JP 2017511876A JP 6679573 B2 JP6679573 B2 JP 6679573B2
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- 239000007788 liquid Substances 0.000 claims description 141
- 238000012546 transfer Methods 0.000 claims description 72
- 238000001704 evaporation Methods 0.000 claims description 58
- 230000008020 evaporation Effects 0.000 claims description 54
- 238000009833 condensation Methods 0.000 claims description 52
- 230000005494 condensation Effects 0.000 claims description 52
- 238000000926 separation method Methods 0.000 claims description 38
- 238000004891 communication Methods 0.000 claims description 28
- 239000012530 fluid Substances 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 12
- 238000009834 vaporization Methods 0.000 claims description 8
- 230000008016 vaporization Effects 0.000 claims description 8
- 230000037361 pathway Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002028 premature Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (15)
- サーモサイホン冷却装置であって、
熱を受けて内部の液体を蒸発させるように配置された少なくとも1つの蒸発経路、及び、前記少なくとも1つの蒸発経路に凝縮液体を送達する液体返却路を含む少なくとも1つの蒸発器部と、
蒸発液体からの熱を周辺環境に伝達することにより前記蒸発液体を凝縮するように配置された少なくとも1つの凝縮経路、及び、前記少なくとも1つの凝縮経路に蒸発液体を送達する蒸気供給路を含む少なくとも1つの凝縮器部と、
前記少なくとも1つの蒸発経路を前記蒸気供給路に流体接続する蒸気チャンバ、及び、前記少なくとも1つの凝縮経路を前記液体返却路に流体接続する液体チャンバを有する1つのマニホルドと、を備え、
前記蒸気チャンバから前記蒸気供給路へ、前記少なくとも1つの凝縮経路へ、前記液体チャンバへ、前記液体返却路へ、前記少なくとも1つの蒸発経路へ、そして前記蒸気チャンバへと戻る前記サーモサイホン冷却装置内の循環流動を可能とするために、前記蒸気チャンバ及び前記液体チャンバは、前記マニホルドにおいて分離壁によって流体分離され、
各蒸発器部は、前記1つのマニホルドに接続される管を含むとともに、前記少なくとも1つの蒸発経路と液体返却路とを規定する複数の経路を含み、又は、
各凝縮器部は、前記1つのマニホルドに接続される管を含むとともに、前記少なくとも1つの凝縮経路と前記蒸気供給路とを規定する複数の経路を含む、装置。 - 前記1つのマニホルドは、内部空洞を規定する外壁を含み、
前記分離壁は、前記内部空洞内に配置されて前記内部空洞を前記蒸気チャンバ及び前記液体チャンバに分離する、請求項1に記載の装置。 - 前記外壁は、対応する蒸発器部又は凝縮器部を各々受容する複数の開口を含む、請求項2に記載の装置。
- 各蒸発器部は、前記複数の開口のうちの対応する1つに受容され、前記少なくとも1つの蒸発経路が前記蒸気チャンバと流体連通し、前記液体返却路が前記液体チャンバと流体連通するように前記分離壁に係合する、請求項3に記載の装置。
- 各凝縮器部は、前記複数の開口のうちの対応する1つに受容され、前記少なくとも1つの凝縮経路が前記液体チャンバと流体連通し、前記蒸気供給路が前記蒸気チャンバと流体連通するように前記分離壁に係合する、請求項4に記載の装置。
- 各蒸発器部は、複数の蒸発経路と前記液体返却路とを含む単一で一体の管として形成され、
各凝縮器部は、複数の凝縮経路と前記蒸気供給路とを含む単一で一体の管として形成され、
前記サーモサイホン装置は、2つ以上の蒸発器部と、2つ以上の凝縮器部と、を有し、各々は、前記複数の開口のうちの対応する1つに受容されるとともに前記分離壁に係合する、請求項5に記載の装置。 - 前記サーモサイホン装置は、複数の蒸発器部又は複数の凝縮器部を有し、
各蒸発器部は、複数の蒸発経路と前記液体返却路とを含む単一で一体の管として形成され、
各凝縮器部は、複数の凝縮経路と前記蒸気供給路とを含む単一で一体の管として形成される、請求項1に記載の装置。 - 各蒸発器部の前記複数の蒸発経路は、前記蒸発経路の側方に配置された前記液体返却路と平行に配置され、
各凝縮器部の前記複数の凝縮経路は、前記凝縮経路の側方に配置された前記蒸気供給路と平行に配置される、請求項7に記載の装置。 - 前記分離壁は、前記蒸気供給路を含む凝縮器部の対応部分を各々受容する複数の蒸気チャンバ開口と、前記液体返却路を含む蒸発器部の対応部分を各々受容する複数の液体チャンバ開口と、を含む、請求項1に記載の装置。
- 各蒸発器部は、複数の蒸発経路及び前記液体返却路を含む単一で一体の管として形成され、
各凝縮器部は、複数の凝縮経路及び前記蒸気供給路を含む単一で一体の管として形成され、
前記分離壁は、前記蒸発経路が前記分離壁の第一の側にありかつ前記液体返却路が前記分離壁の第二の側にあるように各蒸発器部に係合し、
前記分離壁は、前記凝縮経路が前記分離壁の前記第二の側にありかつ前記蒸気供給路が前記分離壁の前記第一の側にあるように各凝縮器部に係合する、請求項1に記載の装置。 - 前記外壁及び前記分離壁は、1つの屈曲シートから形成される、請求項2に記載の装置。
- 前記サーモサイホン装置は、複数の蒸発器部と、複数の凝縮器部と、を有し、
各蒸発器部は、複数の蒸発経路及び前記液体返却路を含む単一で一体の管として形成され、
各凝縮器部は、複数の凝縮経路及び前記蒸気供給路を含む単一で一体の管として形成される、請求項1に記載の装置。 - 前記蒸発器部の少なくとも一部と熱的に直接接触する蒸発器熱伝達構造と、
前記凝縮器部の少なくとも一部と熱的に直接接触する凝縮器熱伝達構造と、を備える、請求項12に記載の装置。 - 前記蒸発器部のうち前記液体返却路に隣接する部分は、前記蒸発器熱伝達構造と接触しない、請求項13に記載の装置。
- 前記凝縮器部のうち前記蒸気供給路に隣接する部分は、前記凝縮器熱伝達構造と接触しない、請求項13に記載の装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/053131 WO2016032482A1 (en) | 2014-08-28 | 2014-08-28 | Thermosiphon with integrated components |
Related Child Applications (1)
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JP2019076373A Division JP2019113310A (ja) | 2019-04-12 | 2019-04-12 | 一体構成要素を備えたサーモサイホン |
Publications (3)
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JP2017525929A JP2017525929A (ja) | 2017-09-07 |
JP2017525929A5 JP2017525929A5 (ja) | 2017-10-19 |
JP6679573B2 true JP6679573B2 (ja) | 2020-04-15 |
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JP2017511876A Expired - Fee Related JP6679573B2 (ja) | 2014-08-28 | 2014-08-28 | 一体構成要素を備えたサーモサイホン |
Country Status (5)
Country | Link |
---|---|
US (1) | US10054371B2 (ja) |
EP (1) | EP3186574B1 (ja) |
JP (1) | JP6679573B2 (ja) |
CN (2) | CN108801012B (ja) |
WO (1) | WO2016032482A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102014204935A1 (de) * | 2014-03-17 | 2015-10-01 | Mahle International Gmbh | Heizkühlmodul |
JP2018513342A (ja) * | 2015-04-21 | 2018-05-24 | アアヴィッド・サーマロイ・エルエルシー | マルチポート管及び流れ配置を備えたサーモサイホン |
CN106288893A (zh) * | 2015-06-03 | 2017-01-04 | 丹佛斯微通道换热器(嘉兴)有限公司 | 换热器系统 |
EP3489604B1 (en) * | 2017-11-24 | 2020-12-23 | TitanX Holding AB | Vehicle condenser |
CN111132526A (zh) * | 2020-01-20 | 2020-05-08 | 深圳兴奇宏科技有限公司 | 热虹吸散热装置的连通强化结构 |
US11388840B2 (en) | 2020-04-14 | 2022-07-12 | Deere & Company | Condensers and electronic assemblies |
CN115410941A (zh) * | 2021-05-28 | 2022-11-29 | 中微半导体设备(上海)股份有限公司 | 控温部件、控温装置及反应腔温控方法 |
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JPS61234059A (ja) * | 1985-04-10 | 1986-10-18 | Hitachi Ltd | 半導体素子の沸謄冷却装置 |
EP0298372B1 (en) * | 1987-07-10 | 1993-01-13 | Hitachi, Ltd. | Semiconductor cooling apparatus |
CN2096721U (zh) * | 1991-02-04 | 1992-02-19 | 王永生 | 温差电制冷器 |
US6357517B1 (en) * | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
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JP3487382B2 (ja) * | 1994-12-28 | 2004-01-19 | 株式会社デンソー | 沸騰冷却装置 |
JP3608272B2 (ja) * | 1995-07-05 | 2005-01-05 | 株式会社デンソー | 沸騰冷却装置およびその製造方法 |
US5655598A (en) * | 1995-09-19 | 1997-08-12 | Garriss; John Ellsworth | Apparatus and method for natural heat transfer between mediums having different temperatures |
GB2340218B (en) * | 1996-03-29 | 2000-10-25 | Denso Corp | Cooling apparatus using boiling and condensing refrigerant |
JP2001148453A (ja) * | 1999-11-19 | 2001-05-29 | Denso Corp | 沸騰冷却装置 |
SE0301381D0 (sv) * | 2003-05-12 | 2003-05-12 | Sapa Ab | Extruded heat sink with integrated thermosyphon |
US7497249B2 (en) * | 2007-03-30 | 2009-03-03 | Delphi Technologies, Inc. | Thermosiphon for laptop computer |
EP2031332B1 (en) * | 2007-08-27 | 2010-09-15 | ABB Research LTD | Heat exchanger for power-electronics components |
US7980078B2 (en) * | 2008-03-31 | 2011-07-19 | Mccutchen Co. | Vapor vortex heat sink |
EP2246653B1 (en) * | 2009-04-28 | 2012-04-18 | ABB Research Ltd. | Twisted tube thermosyphon |
EP2433480B1 (en) * | 2009-05-18 | 2013-05-01 | Huawei Technologies Co., Ltd. | Heat spreading device and method therefore |
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JP2013211297A (ja) * | 2012-03-30 | 2013-10-10 | Denso Corp | 沸騰冷却装置 |
EP3218662A1 (en) * | 2014-11-11 | 2017-09-20 | Dantherm Cooling A/S | Thermosiphon blocks and thermosiphon systems for heat transfer |
-
2014
- 2014-08-28 CN CN201810542606.6A patent/CN108801012B/zh active Active
- 2014-08-28 EP EP14766843.8A patent/EP3186574B1/en active Active
- 2014-08-28 JP JP2017511876A patent/JP6679573B2/ja not_active Expired - Fee Related
- 2014-08-28 CN CN201480041426.XA patent/CN105556232B/zh active Active
- 2014-08-28 WO PCT/US2014/053131 patent/WO2016032482A1/en active Application Filing
-
2017
- 2017-02-28 US US15/444,743 patent/US10054371B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20170167798A1 (en) | 2017-06-15 |
EP3186574B1 (en) | 2019-08-21 |
CN108801012A (zh) | 2018-11-13 |
US10054371B2 (en) | 2018-08-21 |
CN108801012B (zh) | 2020-10-23 |
EP3186574A1 (en) | 2017-07-05 |
CN105556232A (zh) | 2016-05-04 |
WO2016032482A8 (en) | 2016-04-28 |
CN105556232B (zh) | 2018-06-26 |
WO2016032482A1 (en) | 2016-03-03 |
JP2017525929A (ja) | 2017-09-07 |
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