ATE381780T1 - Kühlkörper mit gespaltenen rippen - Google Patents
Kühlkörper mit gespaltenen rippenInfo
- Publication number
- ATE381780T1 ATE381780T1 AT04708158T AT04708158T ATE381780T1 AT E381780 T1 ATE381780 T1 AT E381780T1 AT 04708158 T AT04708158 T AT 04708158T AT 04708158 T AT04708158 T AT 04708158T AT E381780 T1 ATE381780 T1 AT E381780T1
- Authority
- AT
- Austria
- Prior art keywords
- heatsink
- core
- split ribs
- split
- fins
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
- B21C23/04—Making uncoated products by direct extrusion
- B21C23/08—Making wire, bars, tubes
- B21C23/10—Making finned tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
- Y10T29/49378—Finned tube
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
- Y10T29/49378—Finned tube
- Y10T29/49385—Made from unitary workpiece, i.e., no assembly
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Sampling And Sample Adjustment (AREA)
- Polarising Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/388,153 US6714415B1 (en) | 2003-03-13 | 2003-03-13 | Split fin heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE381780T1 true ATE381780T1 (de) | 2008-01-15 |
Family
ID=31993889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04708158T ATE381780T1 (de) | 2003-03-13 | 2004-02-04 | Kühlkörper mit gespaltenen rippen |
Country Status (7)
Country | Link |
---|---|
US (2) | US6714415B1 (de) |
EP (1) | EP1602129B1 (de) |
CN (1) | CN1757107B (de) |
AT (1) | ATE381780T1 (de) |
DE (1) | DE602004010792T2 (de) |
TW (1) | TWI270336B (de) |
WO (1) | WO2004084301A1 (de) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US20040190245A1 (en) * | 2003-03-31 | 2004-09-30 | Murli Tirumala | Radial heat sink with skived-shaped fin and methods of making same |
US6937473B2 (en) * | 2003-06-30 | 2005-08-30 | Intel Corporation | Heatsink device and method |
TWM266686U (en) * | 2004-03-17 | 2005-06-01 | Chia Cherne Industry Co Ltd | Novel structure of bendable assembly shaving type heat sink |
US7497248B2 (en) * | 2004-04-30 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device |
US7256996B2 (en) * | 2004-10-14 | 2007-08-14 | Bountiful Wifi Llc | Wireless router |
US7164582B2 (en) * | 2004-10-29 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Cooling system with submerged fan |
TWI274538B (en) * | 2004-11-12 | 2007-02-21 | Asustek Comp Inc | Heat sink structure |
US7617713B2 (en) * | 2004-12-14 | 2009-11-17 | The Goodyear Tire + Rubber Company, Inc. | Final die for wire drawing machines |
US20070034174A1 (en) * | 2005-08-09 | 2007-02-15 | Lee Chang C | Horizontal heat dispensing fins of cylinder body |
US20070034173A1 (en) * | 2005-08-09 | 2007-02-15 | Lee Chang C | Upright heat dispensing fins of cylinder body |
US7269013B2 (en) * | 2006-01-09 | 2007-09-11 | Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. | Heat dissipation device having phase-changeable medium therein |
CN100574595C (zh) * | 2006-04-14 | 2009-12-23 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
US7362573B2 (en) * | 2006-04-28 | 2008-04-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080060793A1 (en) * | 2006-09-08 | 2008-03-13 | Tsung-Hsien Huang | Cooler device |
US20080066898A1 (en) * | 2006-09-15 | 2008-03-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
JP2008091644A (ja) * | 2006-10-02 | 2008-04-17 | Nippon Densan Corp | ヒートシンク及びヒートシンク冷却装置 |
US20080121369A1 (en) * | 2006-11-28 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation assembly having fan duct |
JP2008166465A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Densan Corp | ヒートシンクファン |
US8256258B2 (en) * | 2007-01-15 | 2012-09-04 | Nidec Corporation | Radiator, heat sink fan, and radiator manufacturing method |
US7993034B2 (en) * | 2007-09-21 | 2011-08-09 | Cooper Technologies Company | Reflector having inflection point and LED fixture including such reflector |
WO2009071110A1 (en) * | 2007-12-07 | 2009-06-11 | Osram Gesellschaft mit beschränkter Haftung | Heat sink and lighting device comprising a heat sink |
JP2009206404A (ja) * | 2008-02-29 | 2009-09-10 | Sanyo Denki Co Ltd | 発熱体冷却装置 |
US8381799B2 (en) * | 2008-05-21 | 2013-02-26 | Asia Vital Components Co., Ltd. | Heat radiating unit |
US20100108292A1 (en) * | 2008-10-31 | 2010-05-06 | Teledyne Scientific & Imaging, Llc | Heat sink system with fin structure |
US20100170657A1 (en) * | 2009-01-06 | 2010-07-08 | United Technologies Corporation | Integrated blower diffuser-fin heat sink |
ES2376801B1 (es) * | 2009-04-03 | 2013-02-15 | Universitat De Lleida | Intercambiador de calor para dispositivos generadores de calor provisto de aletas conductoras. |
US8596837B1 (en) | 2009-07-21 | 2013-12-03 | Cooper Technologies Company | Systems, methods, and devices providing a quick-release mechanism for a modular LED light engine |
EP2457018A4 (de) | 2009-07-21 | 2014-10-15 | Cooper Technologies Co | Herstellung einer schnittstelle zwischen einem led-modul, einer kühlkörperbaugruppe, einem lichtreflektor und stromschaltkreisen |
CN201563340U (zh) * | 2009-09-30 | 2010-08-25 | 鸿富锦精密工业(深圳)有限公司 | 散热器保护套及具有该保护套的散热装置 |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
US9140502B2 (en) | 2010-07-08 | 2015-09-22 | Hamilton Sundstrand Corporation | Active structures for heat exchanger |
US8498116B2 (en) * | 2010-07-16 | 2013-07-30 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
US8295046B2 (en) * | 2010-07-19 | 2012-10-23 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
CN102328012B (zh) * | 2011-05-27 | 2013-09-25 | 昆山能缇精密电子有限公司 | Led灯自动分片铆合模具 |
DE112011106000T5 (de) | 2011-12-21 | 2014-09-11 | Intel Corporation | Thermomanagement für Leuchtdioden |
CN102588781B (zh) * | 2012-01-20 | 2015-05-13 | 深圳市奥马斯光电照明有限公司 | Led植物生长筒灯 |
US8796841B2 (en) | 2012-04-09 | 2014-08-05 | Freescale Semiconductor, Inc. | Semiconductor device with embedded heat spreading |
US8581390B2 (en) * | 2012-04-09 | 2013-11-12 | Freescale Semiconductor, Inc. | Semiconductor device with heat dissipation |
JP2014103184A (ja) * | 2012-11-19 | 2014-06-05 | Nippon Densan Corp | ヒートシンクおよびヒートシンクファン |
DE102014213851A1 (de) * | 2014-07-16 | 2016-01-21 | Siemens Aktiengesellschaft | Kühlmodul und Elektronikgerät |
NO340559B1 (en) * | 2015-01-15 | 2017-05-15 | A Markussen Holding As | Heat exchanger |
US9544945B2 (en) | 2015-02-26 | 2017-01-10 | Inductive Engineering Technology, LLC | Magnetic induction heat engine and heat pipe delivery system and methods of producing and delivering heat |
USD792390S1 (en) * | 2015-03-08 | 2017-07-18 | Vapor IO Inc. | Server rack |
USD815592S1 (en) * | 2016-05-18 | 2018-04-17 | Delta-Q Technologies Corp. | Battery charger |
WO2018099605A1 (de) * | 2016-12-02 | 2018-06-07 | Sew-Eurodrive Gmbh & Co. Kg | Getriebe mit einem gehäuse, welches ein unteres gehäuseteil aufweist, auf welches ein oberes gehäuseteil aufgesetzt ist |
USD854497S1 (en) | 2016-12-05 | 2019-07-23 | Delta-Q Technologies Corp. | Battery charger |
US10720787B2 (en) | 2017-07-26 | 2020-07-21 | Delta-Q Technologies Corp. | Combined charger and power converter |
US10879813B2 (en) | 2018-09-21 | 2020-12-29 | Delta-Q Technologies Corp. | Bridgeless single-stage AC/DC converter |
CN210385380U (zh) * | 2018-11-06 | 2020-04-24 | 深圳市贝腾科技有限公司 | 热交换装置及冷冻干燥机 |
US11812536B2 (en) | 2019-06-10 | 2023-11-07 | Inductive Engineering Technology, LLC | Magnetic induction fluid heater |
USD1004541S1 (en) | 2020-05-05 | 2023-11-14 | Delta-Q Technologies Corp. | Battery charger |
US11313631B2 (en) * | 2020-07-07 | 2022-04-26 | Hfc Industry Limited | Composite heat sink having anisotropic heat transfer metal-graphite composite fins |
USD1037185S1 (en) * | 2020-12-24 | 2024-07-30 | Sollum Technologies Inc. | Heat sink for a lamp |
WO2023287384A1 (en) * | 2021-07-14 | 2023-01-19 | Hi̇ti̇t Üni̇versi̇tesi̇ Rektörlüğü | A heat sink with tree-structured fins |
USD1022880S1 (en) | 2021-11-29 | 2024-04-16 | Delta-Q Technologies Corp. | Battery charger |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3466909A (en) * | 1967-08-16 | 1969-09-16 | Ernesto J Weber | Process for obtaining the relief or clearance angle in circular edge cutting |
US4187711A (en) * | 1977-04-25 | 1980-02-12 | Wakefield Engineering, Inc. | Method and apparatus for producing a high fin density extruded heat dissipator |
JPS53132452A (en) * | 1977-04-25 | 1978-11-18 | Wakefield Eng Inc | Manufacturing process and device for high fin density extruding heat radiating body |
US4369838A (en) | 1980-05-27 | 1983-01-25 | Aluminum Kabushiki Kaisha Showa | Device for releasing heat |
US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
US5661638A (en) * | 1995-11-03 | 1997-08-26 | Silicon Graphics, Inc. | High performance spiral heat sink |
DE29618792U1 (de) | 1996-10-29 | 1997-06-19 | Leber, Dieter, Dipl.-Ing., 91207 Lauf | Für Leistungshalbleiter bestimmter stranggepreßter eloxierter Profilkühlkörper |
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
JP3431004B2 (ja) | 2000-01-14 | 2003-07-28 | 松下電器産業株式会社 | ヒートシンクおよびそれを用いた冷却装置 |
TW443716U (en) * | 1999-06-23 | 2001-06-23 | Guo Ching Sung | Wing-spread type heat dissipation device |
TW458314U (en) * | 1999-08-03 | 2001-10-01 | Ind Tech Res Inst | Heat dissipation apparatus |
CN1148628C (zh) * | 2000-05-10 | 2004-05-05 | 张玉媛 | 散热器 |
US6382306B1 (en) | 2000-08-15 | 2002-05-07 | Hul Chun Hsu | Geometrical streamline flow guiding and heat-dissipating structure |
TW562395U (en) * | 2000-09-26 | 2003-11-11 | Foxconn Prec Components Co Ltd | Heat dissipating device |
US6633484B1 (en) | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US6404634B1 (en) * | 2000-12-06 | 2002-06-11 | Hewlett-Packard Company | Single piece heat sink for computer chip |
TW532738U (en) * | 2001-03-27 | 2003-05-11 | Foxconn Prec Components Co Ltd | Heat sink assembly |
US6505680B1 (en) * | 2001-07-27 | 2003-01-14 | Hewlett-Packard Company | High performance cooling device |
US6705144B2 (en) * | 2001-09-10 | 2004-03-16 | Intel Corporation | Manufacturing process for a radial fin heat sink |
US6543522B1 (en) * | 2001-10-31 | 2003-04-08 | Hewlett-Packard Development Company, L.P. | Arrayed fin cooler |
US6487077B1 (en) * | 2001-12-10 | 2002-11-26 | Advanced Thermal Technologies | Heat dissipating device adapted to be applied to a flip chip device |
USD464939S1 (en) * | 2001-12-26 | 2002-10-29 | Thermal Integration Technology Inc. | Heat sink |
USD476958S1 (en) * | 2002-04-30 | 2003-07-08 | Asia Vital Components Co., Ltd. | Radiator |
US6575231B1 (en) * | 2002-08-27 | 2003-06-10 | Chun-Chih Wu | Spiral step-shaped heat dissipating module |
-
2003
- 2003-03-13 US US10/388,153 patent/US6714415B1/en not_active Expired - Lifetime
- 2003-06-23 TW TW092116994A patent/TWI270336B/zh not_active IP Right Cessation
- 2003-11-05 US US10/701,582 patent/US7188418B2/en not_active Expired - Fee Related
-
2004
- 2004-02-04 EP EP04708158A patent/EP1602129B1/de not_active Expired - Lifetime
- 2004-02-04 WO PCT/US2004/003153 patent/WO2004084301A1/en active IP Right Grant
- 2004-02-04 AT AT04708158T patent/ATE381780T1/de not_active IP Right Cessation
- 2004-02-04 CN CN2004800056444A patent/CN1757107B/zh not_active Expired - Fee Related
- 2004-02-04 DE DE602004010792T patent/DE602004010792T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1757107B (zh) | 2011-02-09 |
TWI270336B (en) | 2007-01-01 |
WO2004084301A1 (en) | 2004-09-30 |
EP1602129B1 (de) | 2007-12-19 |
EP1602129A1 (de) | 2005-12-07 |
WO2004084301B1 (en) | 2004-12-29 |
DE602004010792D1 (de) | 2008-01-31 |
US7188418B2 (en) | 2007-03-13 |
US6714415B1 (en) | 2004-03-30 |
US20040240182A1 (en) | 2004-12-02 |
DE602004010792T2 (de) | 2008-04-30 |
TW200418360A (en) | 2004-09-16 |
CN1757107A (zh) | 2006-04-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |