DE602004010792D1 - Kühlkörper mit gespaltenen rippen - Google Patents

Kühlkörper mit gespaltenen rippen

Info

Publication number
DE602004010792D1
DE602004010792D1 DE602004010792T DE602004010792T DE602004010792D1 DE 602004010792 D1 DE602004010792 D1 DE 602004010792D1 DE 602004010792 T DE602004010792 T DE 602004010792T DE 602004010792 T DE602004010792 T DE 602004010792T DE 602004010792 D1 DE602004010792 D1 DE 602004010792D1
Authority
DE
Germany
Prior art keywords
cropped
ribs
cooling body
core
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004010792T
Other languages
English (en)
Other versions
DE602004010792T2 (de
Inventor
Ketan Shah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE602004010792D1 publication Critical patent/DE602004010792D1/de
Application granted granted Critical
Publication of DE602004010792T2 publication Critical patent/DE602004010792T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00—Extruding metal; Impact extrusion
    • B21C23/02—Making uncoated products
    • B21C23/04—Making uncoated products by direct extrusion
    • B21C23/08—Making wire, bars, tubes
    • B21C23/10—Making finned tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube
    • Y10T29/49385—Made from unitary workpiece, i.e., no assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Polarising Elements (AREA)
DE602004010792T 2003-03-13 2004-02-04 Kühlkörper mit gespaltenen rippen Expired - Lifetime DE602004010792T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/388,153 US6714415B1 (en) 2003-03-13 2003-03-13 Split fin heat sink
US388153 2003-03-13
PCT/US2004/003153 WO2004084301A1 (en) 2003-03-13 2004-02-04 Split fin heat sink

Publications (2)

Publication Number Publication Date
DE602004010792D1 true DE602004010792D1 (de) 2008-01-31
DE602004010792T2 DE602004010792T2 (de) 2008-04-30

Family

ID=31993889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004010792T Expired - Lifetime DE602004010792T2 (de) 2003-03-13 2004-02-04 Kühlkörper mit gespaltenen rippen

Country Status (7)

Country Link
US (2) US6714415B1 (de)
EP (1) EP1602129B1 (de)
CN (1) CN1757107B (de)
AT (1) ATE381780T1 (de)
DE (1) DE602004010792T2 (de)
TW (1) TWI270336B (de)
WO (1) WO2004084301A1 (de)

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US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US6937473B2 (en) * 2003-06-30 2005-08-30 Intel Corporation Heatsink device and method
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US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US7256996B2 (en) * 2004-10-14 2007-08-14 Bountiful Wifi Llc Wireless router
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
TWI274538B (en) * 2004-11-12 2007-02-21 Asustek Comp Inc Heat sink structure
US7617713B2 (en) * 2004-12-14 2009-11-17 The Goodyear Tire + Rubber Company, Inc. Final die for wire drawing machines
US20070034173A1 (en) * 2005-08-09 2007-02-15 Lee Chang C Upright heat dispensing fins of cylinder body
US20070034174A1 (en) * 2005-08-09 2007-02-15 Lee Chang C Horizontal heat dispensing fins of cylinder body
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
CN100574595C (zh) * 2006-04-14 2009-12-23 鸿富锦精密工业（深圳）有限公司 散热装置
US7362573B2 (en) * 2006-04-28 2008-04-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device
JP2008091644A (ja) * 2006-10-02 2008-04-17 Nippon Densan Corp ヒートシンク及びヒートシンク冷却装置
US20080121369A1 (en) * 2006-11-28 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation assembly having fan duct
JP2008166465A (ja) * 2006-12-28 2008-07-17 Nippon Densan Corp ヒートシンクファン
US8256258B2 (en) * 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
CA2700376C (en) 2007-09-21 2015-07-21 Cooper Technologies Company Light emitting diode recessed light fixture
JP2011505702A (ja) * 2007-12-07 2011-02-24 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング ヒートシンク、およびヒートシンクを含む点灯装置
JP2009206404A (ja) * 2008-02-29 2009-09-10 Sanyo Denki Co Ltd 発熱体冷却装置
US8381799B2 (en) * 2008-05-21 2013-02-26 Asia Vital Components Co., Ltd. Heat radiating unit
US20100108292A1 (en) * 2008-10-31 2010-05-06 Teledyne Scientific & Imaging, Llc Heat sink system with fin structure
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
ES2376801B1 (es) * 2009-04-03 2013-02-15 Universitat De Lleida Intercambiador de calor para dispositivos generadores de calor provisto de aletas conductoras.
CA2768777C (en) 2009-07-21 2017-11-28 Cooper Technologies Company Interfacing a light emitting diode (led) module to a heat sink assembly, a light reflector and electrical circuits
US8596837B1 (en) 2009-07-21 2013-12-03 Cooper Technologies Company Systems, methods, and devices providing a quick-release mechanism for a modular LED light engine
CN201563340U (zh) * 2009-09-30 2010-08-25 鸿富锦精密工业（深圳）有限公司 散热器保护套及具有该保护套的散热装置
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US9140502B2 (en) 2010-07-08 2015-09-22 Hamilton Sundstrand Corporation Active structures for heat exchanger
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
US8295046B2 (en) * 2010-07-19 2012-10-23 Hamilton Sundstrand Corporation Non-circular radial heat sink
CN102328012B (zh) * 2011-05-27 2013-09-25 昆山能缇精密电子有限公司 Led灯自动分片铆合模具
CN104025323B (zh) 2011-12-21 2017-12-26 英特尔公司 用于发光二极管的热管理
CN102588781B (zh) * 2012-01-20 2015-05-13 深圳市奥马斯光电照明有限公司 Led植物生长筒灯
US8581390B2 (en) * 2012-04-09 2013-11-12 Freescale Semiconductor, Inc. Semiconductor device with heat dissipation
US8796841B2 (en) 2012-04-09 2014-08-05 Freescale Semiconductor, Inc. Semiconductor device with embedded heat spreading
JP2014103184A (ja) * 2012-11-19 2014-06-05 Nippon Densan Corp ヒートシンクおよびヒートシンクファン
DE102014213851A1 (de) * 2014-07-16 2016-01-21 Siemens Aktiengesellschaft Kühlmodul und Elektronikgerät
NO340559B1 (en) * 2015-01-15 2017-05-15 A Markussen Holding As Heat exchanger
US9544945B2 (en) 2015-02-26 2017-01-10 Inductive Engineering Technology, LLC Magnetic induction heat engine and heat pipe delivery system and methods of producing and delivering heat
USD792390S1 (en) * 2015-03-08 2017-07-18 Vapor IO Inc. Server rack
USD815592S1 (en) * 2016-05-18 2018-04-17 Delta-Q Technologies Corp. Battery charger
DE102017010841A1 (de) 2016-12-02 2018-06-07 Sew-Eurodrive Gmbh & Co Kg Getriebe mit einem Gehäuse, welches ein unteres Gehäuseteil aufweist, auf welches ein oberes Gehäuseteil aufgesetzt ist
USD854497S1 (en) 2016-12-05 2019-07-23 Delta-Q Technologies Corp. Battery charger
US10720787B2 (en) 2017-07-26 2020-07-21 Delta-Q Technologies Corp. Combined charger and power converter
US10879813B2 (en) 2018-09-21 2020-12-29 Delta-Q Technologies Corp. Bridgeless single-stage AC/DC converter
CN110201499A (zh) * 2018-11-06 2019-09-06 深圳市贝腾科技有限公司 热交换装置及冷冻干燥机
US11812536B2 (en) 2019-06-10 2023-11-07 Inductive Engineering Technology, LLC Magnetic induction fluid heater
USD1004541S1 (en) 2020-05-05 2023-11-14 Delta-Q Technologies Corp. Battery charger
US11313631B2 (en) * 2020-07-07 2022-04-26 Hfc Industry Limited Composite heat sink having anisotropic heat transfer metal-graphite composite fins
WO2023287384A1 (en) * 2021-07-14 2023-01-19 Hi̇ti̇t Üni̇versi̇tesi̇ Rektörlüğü A heat sink with tree-structured fins
USD1022880S1 (en) 2021-11-29 2024-04-16 Delta-Q Technologies Corp. Battery charger

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Also Published As

Publication number Publication date
WO2004084301A1 (en) 2004-09-30
EP1602129B1 (de) 2007-12-19
WO2004084301B1 (en) 2004-12-29
CN1757107B (zh) 2011-02-09
TWI270336B (en) 2007-01-01
US6714415B1 (en) 2004-03-30
TW200418360A (en) 2004-09-16
CN1757107A (zh) 2006-04-05
DE602004010792T2 (de) 2008-04-30
EP1602129A1 (de) 2005-12-07
US7188418B2 (en) 2007-03-13
US20040240182A1 (en) 2004-12-02
ATE381780T1 (de) 2008-01-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition