JP5335839B2 - 電力変換モジュールの放熱装置 - Google Patents
電力変換モジュールの放熱装置 Download PDFInfo
- Publication number
- JP5335839B2 JP5335839B2 JP2011055065A JP2011055065A JP5335839B2 JP 5335839 B2 JP5335839 B2 JP 5335839B2 JP 2011055065 A JP2011055065 A JP 2011055065A JP 2011055065 A JP2011055065 A JP 2011055065A JP 5335839 B2 JP5335839 B2 JP 5335839B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- power conversion
- conversion module
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 48
- 238000006243 chemical reaction Methods 0.000 title claims description 34
- 230000020169 heat generation Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 11
- 230000005855 radiation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Description
また、前記高放熱ヒートシンクはアルミニウムまたは銅で構成され、前記ケースの空間部は回路ボードの高発熱部の対応される位置に形成される。
また、前記回路ボードは電力変換素子が装着される。
以下、添付図面を参照して本発明の好適な実施例に係る電力変換モジュールの放熱装置について詳細に説明する。
110 ケース
120 放熱フィン
200 電力変換モジュールの放熱装置
210 ケース
211 放熱フィン部
212 空間部
220 高放熱ヒートシンク
230 回路ボード
240 締結部材
Claims (4)
- 複数の放熱フィンが所定間隔離隔されて配置された放熱フィン部および空間部が隣り合うように一面に形成されるケースと、
前記ケースの空間部に装着される高放熱ヒートシンクと、
前記ケースの下部に結合される回路ボートとを含み、
前記ケースの空間部は回路ボードにおいて他の領域に比べて高い熱が発生する高発熱部に対応される位置に形成され、
前記回路ボードの高発熱部は高放熱ヒートシンクによって熱が放射される電力変換モジュールの放熱装置。 - 前記高放熱ヒートシンクはアルミニウムまたは銅で構成されることを特徴とする、請求項1に記載の電力変換モジュールの放熱装置。
- 前記ケースおよび回路ボードは、互いに対応する複数の締結部が形成され、締結部に挿入結合されてケースと回路ボードとを結合させる締結部材をさらに含むことを特徴とする、請求項1に記載の電力変換モジュールの放熱装置。
- 前記回路ボードは電力変換素子が装着されたことを特徴とする、請求項1に記載の電力変換モジュールの放熱装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0106231 | 2010-10-28 | ||
KR1020100106231A KR101156903B1 (ko) | 2010-10-28 | 2010-10-28 | 전력변환모듈의 방열장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012095517A JP2012095517A (ja) | 2012-05-17 |
JP5335839B2 true JP5335839B2 (ja) | 2013-11-06 |
Family
ID=45995370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011055065A Expired - Fee Related JP5335839B2 (ja) | 2010-10-28 | 2011-03-14 | 電力変換モジュールの放熱装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8630090B2 (ja) |
JP (1) | JP5335839B2 (ja) |
KR (1) | KR101156903B1 (ja) |
CN (1) | CN102469752B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101237668B1 (ko) | 2011-08-10 | 2013-02-26 | 삼성전기주식회사 | 반도체 패키지 기판 |
CN103390987B (zh) * | 2012-05-08 | 2016-05-04 | 富士电机株式会社 | 逆变器装置 |
US9474189B2 (en) * | 2012-05-23 | 2016-10-18 | Mitsubishi Electric Corporation | Inverter device |
TWI503656B (zh) * | 2012-09-07 | 2015-10-11 | Inventec Corp | 散熱結構 |
JP2014163743A (ja) * | 2013-02-22 | 2014-09-08 | Fujitsu Telecom Networks Ltd | 蓄電池の試験装置 |
US20160018137A1 (en) | 2014-07-16 | 2016-01-21 | Bronswerk Marine Inc. | Modular refrigeration system, e.g., for ships |
US9841793B2 (en) * | 2015-07-31 | 2017-12-12 | Dell Products L.P. | Solid state drive cooling in dense storage |
FR3105713B1 (fr) * | 2019-12-24 | 2022-03-11 | Valeo Systemes De Controle Moteur | Dispositif de dissipation de chaleur, système électrique comportant un tel dispositif et procédé de fabrication associé |
CN112702871A (zh) * | 2020-12-23 | 2021-04-23 | 松山湖材料实验室 | 激光雷达的散热结构 |
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JPH07245849A (ja) * | 1994-02-28 | 1995-09-19 | Furukawa Electric Co Ltd:The | 電気接続箱 |
US5566749A (en) * | 1994-04-12 | 1996-10-22 | Thermalloy, Inc. | Stamped and formed heat sink |
JP3653529B2 (ja) | 1996-10-03 | 2005-05-25 | 利夫 小島 | 電子冷却ユニット |
KR19980029146U (ko) * | 1996-11-27 | 1998-08-05 | 이형도 | 캡스턴 모터용 아이씨 칩의 방열구조 |
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US5945746A (en) * | 1997-08-21 | 1999-08-31 | Tracewell Power, Inc. | Power supply and power supply/backplane assembly and system |
US5940288A (en) * | 1998-06-08 | 1999-08-17 | Tracewell Power, Inc. | Card cage mounted power supply with heat dissipating architecture |
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US7177153B2 (en) * | 2002-01-16 | 2007-02-13 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved cooling configuration |
JP4108348B2 (ja) * | 2002-02-19 | 2008-06-25 | 株式会社三社電機製作所 | 電源装置 |
JP2003259658A (ja) | 2002-03-06 | 2003-09-12 | Fuji Electric Co Ltd | 電力変換装置 |
JP2003259657A (ja) | 2002-03-06 | 2003-09-12 | Fuji Electric Co Ltd | 電力変換装置 |
US6839234B2 (en) * | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
FI20021027A0 (fi) * | 2002-05-31 | 2002-05-31 | Outokumpu Oy | Jäähdytinelementti elektroniikkalaitteeseen |
CA2394403C (en) * | 2002-07-22 | 2012-01-10 | Celestica International Inc. | Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board |
CN2629393Y (zh) * | 2003-06-20 | 2004-07-28 | 艾默生网络能源有限公司 | 一种模块电源 |
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DK200301577A (da) * | 2003-10-27 | 2005-04-28 | Danfoss Silicon Power Gmbh | Flowfordelingsenhed og köleenhed |
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CN100342530C (zh) * | 2004-07-30 | 2007-10-10 | 奇鋐科技股份有限公司 | 具有导引风管及风罩的散热模组 |
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-
2010
- 2010-10-28 KR KR1020100106231A patent/KR101156903B1/ko active IP Right Grant
-
2011
- 2011-03-01 US US13/037,803 patent/US8630090B2/en not_active Expired - Fee Related
- 2011-03-14 JP JP2011055065A patent/JP5335839B2/ja not_active Expired - Fee Related
- 2011-03-14 CN CN201110060426.2A patent/CN102469752B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012095517A (ja) | 2012-05-17 |
US20120103589A1 (en) | 2012-05-03 |
CN102469752B (zh) | 2015-11-25 |
CN102469752A (zh) | 2012-05-23 |
KR101156903B1 (ko) | 2012-06-21 |
KR20120044756A (ko) | 2012-05-08 |
US8630090B2 (en) | 2014-01-14 |
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