BR0007034A - Dissipador de calor que inclui uma aleta de dissipação de calor e método para a fixação da aleta de dissipação de calor - Google Patents

Dissipador de calor que inclui uma aleta de dissipação de calor e método para a fixação da aleta de dissipação de calor

Info

Publication number
BR0007034A
BR0007034A BR0007034-3A BR0007034A BR0007034A BR 0007034 A BR0007034 A BR 0007034A BR 0007034 A BR0007034 A BR 0007034A BR 0007034 A BR0007034 A BR 0007034A
Authority
BR
Brazil
Prior art keywords
heat dissipation
dissipation fin
fixing
heat dissipating
dissipating fin
Prior art date
Application number
BR0007034-3A
Other languages
English (en)
Inventor
Chiyoshi Sasaki
Yasuhiro Ootori
Junji Sotani
Masaru Ohni
Toshikatsu Hama
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of BR0007034A publication Critical patent/BR0007034A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

"DISSIPADOR DE CALOR QUE INCLUI UMA ALETA DE DISSIPAçãO DE CALOR E MéTODO PARA A FIXAçãO DA ALETA DE DISSIPAçãO DE CALOR", onde o dissipador inclui uma aleta de dissipação de calor que compreende (1) uma aleta de dissipação de calor que possui uma pluralidade de partes em formato de montanha e partes base que suportam as partes em formato de montanha, (2) um elemento base que possui uma pluralidade de fendas nas quais as partes em formato de montanha da aleta de dissipação de calor devem ser inseridas e que possui uma pluralidade de orifícios para a fixação da aleta de dissipação de calor, e (3) um elemento de encaixe, dotado de uma pluralidade de partes projetadas que correspondem à pluralidade de orifícios do elemento base, para a fixação da aleta de dissipação de calor entre o elemento base e o próprio elemento de encaixe.
BR0007034-3A 1999-08-18 2000-08-15 Dissipador de calor que inclui uma aleta de dissipação de calor e método para a fixação da aleta de dissipação de calor BR0007034A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23143799A JP3273505B2 (ja) 1999-08-18 1999-08-18 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法
PCT/JP2000/005463 WO2001013430A1 (en) 1999-08-18 2000-08-15 Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin

Publications (1)

Publication Number Publication Date
BR0007034A true BR0007034A (pt) 2001-06-26

Family

ID=16923542

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0007034-3A BR0007034A (pt) 1999-08-18 2000-08-15 Dissipador de calor que inclui uma aleta de dissipação de calor e método para a fixação da aleta de dissipação de calor

Country Status (11)

Country Link
US (1) US6357514B1 (pt)
EP (1) EP1133793B1 (pt)
JP (1) JP3273505B2 (pt)
KR (1) KR20010099701A (pt)
CN (1) CN1187818C (pt)
AT (1) ATE365377T1 (pt)
AU (1) AU6477300A (pt)
BR (1) BR0007034A (pt)
CA (1) CA2349568A1 (pt)
DE (1) DE60035255T2 (pt)
WO (1) WO2001013430A1 (pt)

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CN101848626B (zh) * 2009-03-27 2013-08-07 富准精密工业(深圳)有限公司 散热器及其制造方法
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JP5165738B2 (ja) * 2010-08-28 2013-03-21 阿波製紙株式会社 紙シートの放熱器
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JP6071299B2 (ja) * 2012-07-23 2017-02-01 三菱電機株式会社 ヒートシンク装置及び照明装置
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JP6136471B2 (ja) * 2013-03-29 2017-05-31 三菱電機株式会社 照明装置およびヒートシンク
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JP6213376B2 (ja) * 2014-05-27 2017-10-18 株式会社Ｊｖｃケンウッド ヒートシンク
WO2016087211A1 (de) * 2014-12-04 2016-06-09 Eaton Industries (Austria) Gmbh Schaltschrank/schaltkasten mit verbesserter wärmeabfuhr
JP6503224B2 (ja) * 2015-05-19 2019-04-17 Ａｐｓジャパン株式会社 ヒートシンク
CN105050357A (zh) * 2015-06-30 2015-11-11 安徽博隆节能电器有限公司 一种新型插片式散热器
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Also Published As

Publication number Publication date
EP1133793B1 (en) 2007-06-20
DE60035255T2 (de) 2008-02-21
WO2001013430A1 (en) 2001-02-22
DE60035255D1 (de) 2007-08-02
JP3273505B2 (ja) 2002-04-08
US6357514B1 (en) 2002-03-19
CN1187818C (zh) 2005-02-02
ATE365377T1 (de) 2007-07-15
CA2349568A1 (en) 2001-02-22
AU6477300A (en) 2001-03-13
JP2001057405A (ja) 2001-02-27
KR20010099701A (ko) 2001-11-09
EP1133793A1 (en) 2001-09-19
CN1320275A (zh) 2001-10-31

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]