FR2760593B1 - Ensemble electrique a forte dissipation de chaleur - Google Patents

Ensemble electrique a forte dissipation de chaleur

Info

Publication number
FR2760593B1
FR2760593B1 FR9800786A FR9800786A FR2760593B1 FR 2760593 B1 FR2760593 B1 FR 2760593B1 FR 9800786 A FR9800786 A FR 9800786A FR 9800786 A FR9800786 A FR 9800786A FR 2760593 B1 FR2760593 B1 FR 2760593B1
Authority
FR
France
Prior art keywords
heat dissipation
high heat
electrical assembly
electrical
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9800786A
Other languages
English (en)
Other versions
FR2760593A1 (fr
Inventor
Charles P Minning
Douglas W Wolfe
John H Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OL Security LLC
Original Assignee
Hughes Aircraft Co
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co, Hughes Electronics Corp filed Critical Hughes Aircraft Co
Publication of FR2760593A1 publication Critical patent/FR2760593A1/fr
Application granted granted Critical
Publication of FR2760593B1 publication Critical patent/FR2760593B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/907—Porous

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9800786A 1997-01-27 1998-01-26 Ensemble electrique a forte dissipation de chaleur Expired - Lifetime FR2760593B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/789,678 US5847927A (en) 1997-01-27 1997-01-27 Electronic assembly with porous heat exchanger and orifice plate

Publications (2)

Publication Number Publication Date
FR2760593A1 FR2760593A1 (fr) 1998-09-11
FR2760593B1 true FR2760593B1 (fr) 2002-02-22

Family

ID=25148362

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9800786A Expired - Lifetime FR2760593B1 (fr) 1997-01-27 1998-01-26 Ensemble electrique a forte dissipation de chaleur

Country Status (2)

Country Link
US (1) US5847927A (fr)
FR (1) FR2760593B1 (fr)

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US6073684A (en) * 1998-02-23 2000-06-13 Applied Thermal Technology Clad casting for laptop computers and the like
US6158454A (en) * 1998-04-14 2000-12-12 Insync Systems, Inc. Sieve like structure for fluid flow through structural arrangement
KR19990085965A (ko) * 1998-05-23 1999-12-15 박호군 다공핀 평판관형 열교환기
US6034875A (en) 1998-06-17 2000-03-07 International Business Machines Corporation Cooling structure for electronic components
US6304447B1 (en) * 1998-12-31 2001-10-16 Lucent Technologies, Inc. Arrangement for cooling an electrical assembly
US6188130B1 (en) * 1999-06-14 2001-02-13 Advanced Technology Interconnect Incorporated Exposed heat spreader with seal ring
WO2001072099A2 (fr) * 2000-03-21 2001-09-27 Liebert Corporation Procede et appareil pour refroidir des enceintes electroniques
JP2004507886A (ja) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション 温度制御された自動試験用熱プラットフォーム
KR100468217B1 (ko) * 2001-12-31 2005-01-26 한국과학기술연구원 다공성 금속물질을 이용한 축방열 시스템
EP2314956A1 (fr) 2003-12-05 2011-04-27 Liebert Corporation Système de refroidissement pour charge de chaleur haute densité
US7331377B1 (en) * 2004-01-30 2008-02-19 Isothermal Systems Research, Inc. Diamond foam spray cooling system
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
CN101044811A (zh) * 2004-11-14 2007-09-26 利伯特公司 用于立式板卡型计算机系统的机架中的集成式热交换器
EP1929850B1 (fr) * 2005-08-04 2013-06-19 Liebert Corporation Armoire d'equipement electronique pourvue d'un systeme integre de refroidissement a capacite elevee et systeme de ventilation de secours
FR2893329B1 (fr) * 2005-11-14 2008-05-16 Aluminium Pechiney Soc Par Act Cuve d'electrolyse avec echangeur thermique.
DE102007003614A1 (de) * 2006-07-26 2008-01-31 Endress + Hauser Flowtec Ag Vorrichtung zum Messen des Volumen- oder Massestroms eines Mediums in einer Rohrleitung
US8016022B2 (en) * 2006-11-27 2011-09-13 Honeywell International Inc. Systems and methods for passive thermal management using phase change material
US20080166492A1 (en) * 2007-01-09 2008-07-10 International Business Machines Corporation Metal-graphite foam composite and a cooling apparatus for using the same
CN101340796B (zh) * 2007-07-04 2010-09-29 富准精密工业(深圳)有限公司 散热装置
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
DE102008055137A1 (de) * 2008-12-23 2010-07-01 Robert Bosch Gmbh Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils
US20100326642A1 (en) * 2009-06-30 2010-12-30 Dino Scorziello Diamond modified heat exchangers, steam generators, condensers, radiators and feedwater heaters
US10006720B2 (en) * 2011-08-01 2018-06-26 Teledyne Scientific & Imaging, Llc System for using active and passive cooling for high power thermal management
US9279626B2 (en) * 2012-01-23 2016-03-08 Honeywell International Inc. Plate-fin heat exchanger with a porous blocker bar
JP5871053B2 (ja) * 2012-03-14 2016-03-01 富士通株式会社 冷却システム
DE102015214928A1 (de) * 2015-08-05 2017-02-09 Siemens Aktiengesellschaft Bauteilmodul und Leistungsmodul
US20170146273A1 (en) * 2015-11-23 2017-05-25 L-3 Communications Corporation Evaporator Assembly
US11022383B2 (en) 2016-06-16 2021-06-01 Teledyne Scientific & Imaging, Llc Interface-free thermal management system for high power devices co-fabricated with electronic circuit
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US11121504B2 (en) * 2020-02-03 2021-09-14 Rockwell Collins, Inc. Circuit board separation mechanism
DE102021200378A1 (de) 2021-01-15 2022-07-21 Carl Zeiss Industrielle Messtechnik Gmbh Bilderfassungsvorrichtung und Verfahren zur Herstellung einer Bilderfassungsvorrichtung

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Also Published As

Publication number Publication date
US5847927A (en) 1998-12-08
FR2760593A1 (fr) 1998-09-11

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
RM Correction of a material error
TP Transmission of property

Owner name: OL SECURITY LIMITED LIABILITY COMPANY, US

Effective date: 20130327

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20