CN101044811A - 用于立式板卡型计算机系统的机架中的集成式热交换器 - Google Patents
用于立式板卡型计算机系统的机架中的集成式热交换器 Download PDFInfo
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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Abstract
一种用于对发热物体(12),例如位于机架中的计算机板卡进行冷却的系统,其包括里面设有发热物体的机壳(16)。机壳具有空气入口和空气出口,并且风扇(14)将气流引入到空气入口中,穿过机壳,并排出空气出口。热交换器(20)位于机壳中,使得热交换器和发热物体保持间隔开的关系。移动穿过或经过发热物体的空气被加热,并且热交换器在空气离开机壳之前除去热量。
Description
背景
本发明涉及用于冷却电子和其它发热设备的系统,更具体地说涉及用于对垂直成排地设置在机架或机柜中的电子设备附近流动的空气进行冷却的系统。
计算机工业在过去的几十年中的成长已经是非常显著的。许多新的计算机设计组合了多个计算机/处理器板卡(board)来构造“高端”计算机和“服务器”。由于占地面积的需求,计算机板卡时常配置为垂直地“叠置”在机架或机柜中。许多现有的包含在这种立式机架中的用于电子设备的冷却系统并不能提供充分的冷却。在许多这些冷却系统中,空气被抽吸到包含计算机板卡的机架或机柜的底部,并且垂直地移动穿过机柜,从而逐步地冷却相应的计算机板卡。在这种设计中,安装在机架“较高处”的板卡比那些朝着底部安装的板卡接受温度更高的空气,因为这些空气已经通过一个或多个板卡,并且吸收了来自一个或多个板卡的热量。因此,“较高处”的板卡没有被温度更高的气流充分冷却。
同时正不断地引入更新的更大功率的微处理器,但这种更高的性能通常伴随着显著增加的发热。因而,这些新的处理器配置将热负荷提高到“单独的”空气冷却不能提供足够的冷却能力来防止这些“叠置”的计算机过热的临界点。结果,“叠置”的服务器可能必须以降低的处理速度来运转,以限制热负荷,这则削弱了性能。
另外,现有的冷却系统具有相当有限的冷却能力。例如,许多现有的冷却系统具有大约80瓦/平方英尺(W/ft2)的热密度,但某些仍在研制的冷却系统据说拥有高达150W/ft2的热密度。然而,即使具有这些热密度的冷却系统,可能也不会有效地冷却现有工艺水平的电子设备。
很明显的是,如果不充分冷却设备,那么设备中的电子部件的内部温度将在相对较短的时间周期内显著增加,这可能导致显著下降的系统性能,并且在某些情况下,导致部件或整个系统的失效。即使在并不削弱系统性能的情况下,低效率的冷却也可能会不必要地提高冷却设备的成本。因而,目前仍存在对一种可对垂直成排地设置在机架中的计算机板卡进行充分且有效冷却的冷却系统的需求。
概要
一种用于对发热物体,例如位于机架中的计算机板卡进行冷却的系统,包括里面设有发热物体的机壳。机壳具有空气入口和空气出口,并且风扇将气流引入到空气入口中,穿过机壳,并排出空气出口。风扇可位于空气入口或出口附近,或者可在入口和出口处使用多个风扇。热交换器位于机壳中,使得热交换器和发热物体保持间隔开的关系。移动穿过或经过发热物体的空气被加热,并且热交换器在空气离开机壳之前除去热量。
在某些示例性的实施例中,热交换器位于空气入口的附近。在其它实施例中,热交换器位于空气出口的附近,或热交换器位于机壳的入口和出口处。通常多个发热物体垂直地位于机壳中,并且多个热交换器位于机壳中,使得热交换器以间隔开的关系位于相邻的发热物体之间。
附图简介
通过阅读以下详细描述,并参照附图将可以清楚了解本发明的其它目的和优点,其中:
图1是示意性地显示了一种用于冷却机柜中的发热物体的系统的透视图。
图2是示意性地显示了一种用于冷却机柜中的发热物体的备选系统的透视图。
图3和图4分别是示意性地显示了用于冷却机柜中的发热物体的另一系统地正视图和侧视图。
虽然本发明允许各种变型和备选形式,但是,通过附图中的示例已经显示了其特定实施例,并且将在这里进行详细描述。然而应该懂得,这里特定实施例的描述并不意图将本发明限定在所公开的特定形式上,相反,本发明旨在覆盖处于所附权利要求所限定的本发明的精神和范围内的所有改型、等效形式和备选形式。
详细描述
下面将描述本发明的说明性的实施例。为了清楚起见,在本说明书中没有描述实际实现的所有特征。当然应该懂得,在任何这种实际实施例的研制中,必须做出许多实施例专有的决策,以获得研究者的特定目的,例如与系统相关且与商业相关的约束适应性,其将根据实施例而变化。此外,应该懂得,这种研制工作是复杂且耗时的,但仍然是本领域中普通技术人员在获益于本说明书的条件下所承担的日常工作。
现在转到图1,其显示了冷却系统10的一个实施例,其用于冷却成排地设置在机壳例如机柜16中的发热物体12。发热物体通常由包括机架机柜16中的电子组件,例如电路板组件。冷却系统包括风扇14,其将气流沿着箭头15的方向通过入口而引入到机柜16中,向上并穿过机柜16,并通过出口而离开机柜16。本领域中的技术人员应该懂得,风扇14可定位在引导气流穿过机柜16的任何位置,而且可使用多个风扇。气流15在穿过每排设备时冷却电子设备12。对电子设备12的冷却导致流动的气流的温度增加,使得离开机柜16的顶部出口的气流19比进入机柜16的空气入口的气流温度更高。当气流穿过定位在每排电子设备12之间的热交换器20时,气流本身被冷却。热交换器20与设备12间隔开,从而在设备12和热交换器20之间限定了空气间隙。当气流19经过顶部热交换器18和向外离开机柜16中的部件时,气流19还被冷却,使其不会对室内空调增加任何不必要的热负荷。
图2中显示了另一系统10A,其中热交换器22位于第一热负荷或发热装置12的前面或在其之前。如图2中所示,可将前热交换器22放置风扇14和第一发热装置12之间。这允许空气在进入到发热装置中或其周围之前进行“预冷却”。在典型的情形下,风扇14将气流沿着箭头15的方向,通过空气入口向上引入到机柜16中。气流首先经过前热交换器22,在此处,其在与发热装置12发生接触之前进行冷却。现在已预冷却的空气然后向上流动,穿过和/或围绕发热装置12,并在穿过顶部热交换器18并经由空气出口离开机柜16之前,可选地穿过一个或多个补充的中间热交换器20。如之前所述,包含顶部热交换器18可允许离开机柜16的气流19在进入到室内之前进行冷却,从而最大程度地减小热负荷对室内空调的影响。如图2中所示,发热装置12和相应的热交换器18,20,22保持间隔开的关系,从而在发热物体12和相邻的热交换器之间限定了空气间隙。
图3和图4示意性地显示了另一示例性的冷却系统10B的正视图和侧视图。如图所示,冷却系统10B包括在前热交换器22前面或在其之前间隔开地布置的第一风扇14。系统10B还包括垂直设置(一个装置12定位在另一装置的上面)在机柜16中的多个发热装置12,其中一个或多个热交换器20之间留有必要的间隙,以便获得最有效的冷却,并且顶部热交换器18在发热装置12的下游间隔开,但仍保留在机柜16中。在各装置12和相邻的热交换器20之间限定了空气间隙。在系统10B的顶端靠近机柜的空气出口处设有第二风扇,24,其可安装在机柜16的外部,或者可选地包含在机柜16中。第二风扇24的使用允许已经被顶部热交换器18冷却的空气被向上抽吸和/或远离机柜16和封装在机柜中的部件,从而有助于最大程度地减小在室内空调系统上增加的额外的热负荷。在运转过程中,气流被第一风扇14抽吸到系统10B中,并在箭头15的方向上移动。气流被引导向上,穿过机柜,并在穿过每排装置时对发热装置12进行冷却。当气流通过前热交换器20以及穿过或围绕散布在装置12之间的其它热交换器20时,这种气流本身被进一步冷却。然后当其穿过或围绕顶部热交换器18时,该气流被最后冷却一段时间,并被第二风扇24向上抽吸而离开机柜16,并将空气推动离开机柜16和容纳在机柜中的部件。
如图3和图4中所示,可将第二风扇24直接连接到机柜16上。作为备选,并且是同样可接受的是,可将风扇24容纳在机柜16的上部分中,例如介于顶部热交换器18和机柜顶部面板的空气出口之间。同样可接受的是,可将第二风扇24与机柜16间隔开一定的距离,其范围可在几个毫米至更大的距离,这将取决于风扇24的强度。例如,可将第二风扇24从顶板结构悬吊出来,或者可以作为现有冷却系统的一部分或添加到现有的冷却系统中。
图1-4显示了各具有多个发热物体和热交换器的示例性系统。其它实施例包括单个的热交换器,例如前热交换器22,其位于发热装置例如一排计算机板卡的下游。这种冷却系统尤其可用于帮助冷却不需要一个以上热交换器的发热设备,以进行有效且高效的冷却。本发明的另一优点是,它是可升级的:也就是说,可随着计算机尺寸和架构的规定而渐增地添加了许多热交换器。如此处所用词语“下游”指在另一物体后面的物体,而词语“上游”指其在另一物体之前(但不必直接在其之前)的物体。在示例中,参看图1,热交换器20处于风扇14的“下游”,而风扇14处于发热物体12的“上游”。
在某些示例性的实施例中,热交换器是放置在每排垂直定向的计算机板卡或其它发热装置之后的气流中的微通道式制冷剂热交换器。利用这些微通道热交换器,热交换器就通过在空气与下一组计算机板卡接触之前将热量传递到制冷剂中(之后将其抽走),从而冷却来自各组计算机板卡的热空气。
在某些示例性的实施例中,所使用的制冷剂是不导电的双相制冷剂,其用作替代水的备选冷却介质,这样制冷剂的泄漏不会引起电短路或相似危害的风险。由于使用微通道线圈,并且因为制冷剂在其蒸发时吸收大量的热量,所以,这类制冷剂允许在相同的空间获得更好的传热能力。双相制冷剂的使用允许热交换器基本上在等温下操作,这为计算机板卡提供了均匀的空气温度。这种系统的使用还允许获得比使用水或其它单相流体时更小的“占地面积”。
上面所公开的具体实施例仅仅是说明性的,因为本领域中的技术人员在受益于本文所传授知识的条件下,可以不同但等效的方式对本发明进行修改和实践。此外,除了如所附权利要求中所述的以外,这里所显示的结构或设计细节没有限制性。因此上面所公开的具体实施例显然可进行变更或修改,并且所有这些变型都被认为处于本发明的精神和范围内。因此,这里所寻求的保护如所附权利要求所述。
Claims (18)
1.一种用于冷却发热物体的系统,包括:
机壳,所述机壳具有空气入口和空气出口;
位于所述机壳中的发热物体;
风扇,其用于将气流引入到所述空气入口中,穿过所述机壳,并排出所述空气出口;和
热交换器,其位于所述机壳中,使得所述热交换器和所述发热物体保持间隔开的关系。
2.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,多个发热物体垂直地位于所述机壳中。
3.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述热交换器位于所述空气入口的附近。
4.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述热交换器位于所述空气出口的附近。
5.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述风扇位于所述空气出口的附近。
6.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述风扇位于所述空气入口的附近。
7.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述风扇位于所述空气入口的附近,并且第二风扇位于所述空气出口的附近。
8.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,多个发热物体垂直地位于所述机壳中,并且多个热交换器位于所述机壳中,使得热交换器以间隔开的关系而位于相邻的发热物体之间。
9.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述热交换器包含微通道。
10.根据权利要求1所述的用于冷却发热物体的系统,其特征在于,所述热交换器包含制冷剂。
11.根据权利要求10所述的用于冷却发热物体的系统,其特征在于,所述制冷剂是双相制冷剂。
12.一种用于冷却发热物体的系统,包括:
机壳,所述机壳具有空气入口和空气出口;
位于所述机壳中的发热物体;
用于将气流引入到所述空气入口中、穿过所述机壳、并排出所述空气出口的装置;和
用于从流过所述机壳的空气中除去热量的装置。
13.一种用于对位于机壳中的发热物体进行冷却的方法,所述方法包括:
将热交换器定位在所述机壳中,使得所述热交换器与所述发热物体间隔开;和
将气流引入到所述空气入口中,穿过所述机壳,并排出所述空气出口,使得所述热交换器从流过所述机壳的空气中除去热量。
14.根据权利要求13所述的方法,其特征在于,所述热交换器的定位包括,将热交换器定位在所述空气入口的附近。
15.根据权利要求13所述的方法,其特征在于,所述热交换器的定位包括,将热交换器定位在所述空气出口的附近。
16.根据权利要求13所述的方法,其特征在于,多个发热物体垂直地位于所述机壳中,其中,所述热交换器的定位包括将热交换器定位在相邻的发热物体之间,使得所述热交换器和所述发热物体彼此间隔开。
17.根据权利要求13所述的方法,其特征在于,引入气流包括,将风扇定位在所述空气入口的附近。
18.根据权利要求13所述的方法,其特征在于,引入气流包括,将风扇定位在所述空气出口的附近。
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JP (1) | JP4922943B2 (zh) |
CN (1) | CN101044811A (zh) |
WO (1) | WO2006055387A1 (zh) |
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2008
- 2008-03-20 US US12/052,599 patent/US20080251240A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103200802A (zh) * | 2012-01-06 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | 机柜系统 |
CN110662399A (zh) * | 2019-09-29 | 2020-01-07 | 孙利敏 | 一种节能型的服务器柜体结构 |
Also Published As
Publication number | Publication date |
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JP2008520104A (ja) | 2008-06-12 |
JP4922943B2 (ja) | 2012-04-25 |
EP1810558A1 (en) | 2007-07-25 |
US20080251240A1 (en) | 2008-10-16 |
EP1810558B1 (en) | 2013-04-24 |
US20060102322A1 (en) | 2006-05-18 |
US7367384B2 (en) | 2008-05-06 |
WO2006055387A1 (en) | 2006-05-26 |
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Application publication date: 20070926 |