DE69707377T2 - Elektrisches Gerät mit wärmeabstrahlenden Kühlrippen - Google Patents

Elektrisches Gerät mit wärmeabstrahlenden Kühlrippen

Info

Publication number
DE69707377T2
DE69707377T2 DE69707377T DE69707377T DE69707377T2 DE 69707377 T2 DE69707377 T2 DE 69707377T2 DE 69707377 T DE69707377 T DE 69707377T DE 69707377 T DE69707377 T DE 69707377T DE 69707377 T2 DE69707377 T2 DE 69707377T2
Authority
DE
Germany
Prior art keywords
heat radiating
electrical device
radiating fins
fins
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69707377T
Other languages
English (en)
Other versions
DE69707377D1 (de
Inventor
Akihiko Emori
Hiroyuki Hanei
Tsunehiro Endo
Tomoyuki Someya
Masahiro Iwamura
Noboru Akiyama
Kazuo Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69707377D1 publication Critical patent/DE69707377D1/de
Application granted granted Critical
Publication of DE69707377T2 publication Critical patent/DE69707377T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
DE69707377T 1996-08-01 1997-07-29 Elektrisches Gerät mit wärmeabstrahlenden Kühlrippen Expired - Lifetime DE69707377T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20342096A JP3159071B2 (ja) 1996-08-01 1996-08-01 放熱フィンを有する電気装置

Publications (2)

Publication Number Publication Date
DE69707377D1 DE69707377D1 (de) 2001-11-22
DE69707377T2 true DE69707377T2 (de) 2002-07-11

Family

ID=16473788

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69707377T Expired - Lifetime DE69707377T2 (de) 1996-08-01 1997-07-29 Elektrisches Gerät mit wärmeabstrahlenden Kühlrippen

Country Status (4)

Country Link
US (1) US5940272A (de)
EP (1) EP0822647B1 (de)
JP (1) JP3159071B2 (de)
DE (1) DE69707377T2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge
DE102007014713B3 (de) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung, Umrichter und elektrisches Antriebssystem
DE102010023191A1 (de) * 2010-06-09 2011-12-15 Liebherr-Elektronik Gmbh Leistungsmodul sowie Montage eines Leistungsmoduls
DE102015115145A1 (de) * 2015-09-09 2017-03-09 Infineon Technologies Ag Stromrichteranordnung mit höherer Integrationsdichte

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US6041287A (en) * 1996-11-07 2000-03-21 Reliance Electric Industrial Company System architecture for on-line machine diagnostics
US5966288A (en) * 1998-05-22 1999-10-12 Northern Telecom Limited Assemblies of electronic devices and flexible containers thereof
DE19846156C1 (de) * 1998-10-07 2000-07-27 Bosch Gmbh Robert Anordnung eines mehrphasigen Umrichters
JP4230601B2 (ja) * 1999-03-26 2009-02-25 株式会社日立製作所 空気圧縮機
KR100343221B1 (ko) 1999-11-09 2002-07-10 윤종용 미세구조의 냉각핀을 가지는 냉각장치
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
US6422303B1 (en) * 2000-03-14 2002-07-23 Intel Corporation Silent heat exchanger and fan assembly
JP3496633B2 (ja) * 2000-10-05 2004-02-16 日本電気株式会社 ヒートシンク及びこれを用いた電源ユニット
EP1283589A3 (de) * 2001-08-09 2003-03-26 Bombardier Transportation GmbH Stromrichtermodule
SG113443A1 (en) * 2001-12-05 2005-08-29 Semiconductor Energy Laboratao Organic semiconductor element
US6972957B2 (en) 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7061775B2 (en) * 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US6926288B2 (en) * 2003-06-02 2005-08-09 Bose Corporation Electromagnetic interference filter
TW573942U (en) * 2003-06-18 2004-01-21 Delta Electronics Inc Heat sink structure for electromagnetic device
JP4572571B2 (ja) * 2004-05-07 2010-11-04 トヨタ自動車株式会社 電気機器の筐体
JP2005328659A (ja) * 2004-05-14 2005-11-24 Sansha Electric Mfg Co Ltd 電子負荷装置および電源装置の防塵冷却構造
KR100749463B1 (ko) * 2005-01-31 2007-08-14 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2007012941A (ja) * 2005-06-30 2007-01-18 Toshiba Corp 電子機器、およびこの電子機器に組み込まれたヒートシンク
US7336491B2 (en) * 2005-09-06 2008-02-26 Lear Corporation Heat sink
US7075796B1 (en) * 2005-09-06 2006-07-11 Hewlett-Packard Development Company, L.P. Cage for printed circuit board
US7431074B1 (en) 2006-03-20 2008-10-07 Fellman Michael L Radiator structure
JP4735528B2 (ja) * 2006-12-21 2011-07-27 株式会社デンソー 車載用の電子機器の冷却構造
ES2504515T3 (es) * 2007-05-25 2014-10-08 Sma Solar Technology Ag Alojamiento de inversor
US20090126967A1 (en) * 2007-11-16 2009-05-21 Continental Automotive Systems Us, Inc. Thermal packaging of transmission controller using carbon composite printed circuit board material
JP4875683B2 (ja) * 2008-10-14 2012-02-15 株式会社日立産機システム 空気圧縮機
JP5277957B2 (ja) * 2008-12-25 2013-08-28 富士電機株式会社 インバータ装置の設計支援方法
US10274263B2 (en) 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US9478479B2 (en) 2010-10-26 2016-10-25 General Electric Company Thermal management system and method
US9615482B2 (en) 2009-12-11 2017-04-04 General Electric Company Shaped heat sinks to optimize flow
JP5121779B2 (ja) * 2009-06-26 2013-01-16 株式会社日立製作所 防水通信機器およびその筐体
DE102009038806A1 (de) * 2009-08-25 2011-03-03 Ziehl-Abegg Ag Elektronische Einheit mit Kühlrippen
JP5360990B2 (ja) * 2009-10-02 2013-12-04 パナソニック株式会社 配電装置およびこれを用いた配電システム
WO2011039616A1 (ja) 2009-10-02 2011-04-07 パナソニック電工株式会社 配電装置およびこれを用いた配電システム
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
JP4448196B2 (ja) * 2009-12-14 2010-04-07 株式会社日立製作所 空気圧縮機
JP5445341B2 (ja) 2010-06-11 2014-03-19 三菱電機株式会社 半導体装置
JP5860665B2 (ja) * 2010-10-26 2016-02-16 ゼネラル・エレクトリック・カンパニイ 熱管理システム及び方法
JP5673508B2 (ja) * 2011-03-18 2015-02-18 株式会社デンソー 電源装置
JP2011208643A (ja) * 2011-07-15 2011-10-20 Hitachi Industrial Equipment Systems Co Ltd 空気圧縮機
DE102012013741A1 (de) 2011-08-02 2013-02-28 Sew-Eurodrive Gmbh & Co. Kg Anordnung zum Kühlen, Elektrogerät und Verwendung einer Anordnung zum Kühlen
CN103367977A (zh) * 2012-03-29 2013-10-23 凡甲电子(苏州)有限公司 电连接器
US9474189B2 (en) 2012-05-23 2016-10-18 Mitsubishi Electric Corporation Inverter device
EP3107361B1 (de) 2014-03-18 2020-10-28 Huawei Device Co., Ltd. Wärmeableitungsanordnung und elektronische vorrichtung
JP6302803B2 (ja) 2014-09-09 2018-03-28 日立オートモティブシステムズ株式会社 パワー半導体モジュール及びその製造方法、電力変換装置
WO2016067377A1 (ja) * 2014-10-29 2016-05-06 新電元工業株式会社 放熱構造
WO2016067390A1 (ja) * 2014-10-29 2016-05-06 新電元工業株式会社 放熱構造
WO2016067383A1 (ja) * 2014-10-29 2016-05-06 新電元工業株式会社 放熱構造
WO2016067393A1 (ja) * 2014-10-29 2016-05-06 新電元工業株式会社 放熱構造
JP6311795B2 (ja) 2014-11-11 2018-04-18 株式会社村田製作所 パワーコンディショナ
JP6701701B2 (ja) * 2015-12-04 2020-05-27 富士電機株式会社 インバータ装置
TWM541686U (zh) * 2016-12-27 2017-05-11 Micro-Star Int'l Co Ltd 電子裝置
US20180184550A1 (en) * 2016-12-28 2018-06-28 Microsoft Technology Licensing, Llc Metal additive structures on printed circuit boards
JP6700610B2 (ja) * 2017-01-12 2020-05-27 株式会社豊田自動織機 車載用流体機械
WO2019012801A1 (ja) * 2017-07-11 2019-01-17 アルプス電気株式会社 電子装置
JP6486583B1 (ja) * 2018-04-10 2019-03-20 三菱電機株式会社 モータ駆動装置
JP7206858B2 (ja) * 2018-11-30 2023-01-18 株式会社デンソー 電源装置
WO2021255924A1 (ja) * 2020-06-19 2021-12-23 三菱電機株式会社 充放電装置
JP2022148748A (ja) * 2021-03-24 2022-10-06 日立Astemo株式会社 電子制御装置

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US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
DE2426229C3 (de) * 1974-05-29 1979-10-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen
JP2536657B2 (ja) * 1990-03-28 1996-09-18 三菱電機株式会社 電気装置及びその製造方法
US5060112A (en) * 1990-04-02 1991-10-22 Cocconi Alan G Electrical component assembly with heat sink
US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
JP2983405B2 (ja) * 1993-03-23 1999-11-29 三菱電機株式会社 電動式パワーステアリング回路装置
DE4407492A1 (de) * 1994-03-07 1995-09-14 Bodenseewerk Geraetetech Einrichtung zur Abschirmung von auf einer Elektronikkarte angeordneten elektronischen Bauteilen gegen äußere, elektromagnetische Felder
DE4421319A1 (de) * 1994-06-17 1995-12-21 Abb Management Ag Niederinduktives Leistungshalbleitermodul

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge
DE102007014713B3 (de) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung, Umrichter und elektrisches Antriebssystem
DE102010023191A1 (de) * 2010-06-09 2011-12-15 Liebherr-Elektronik Gmbh Leistungsmodul sowie Montage eines Leistungsmoduls
DE102015115145A1 (de) * 2015-09-09 2017-03-09 Infineon Technologies Ag Stromrichteranordnung mit höherer Integrationsdichte
DE102015115145B4 (de) 2015-09-09 2023-12-21 Infineon Technologies Ag Stromrichteranordnung mit höherer Integrationsdichte

Also Published As

Publication number Publication date
JPH1051912A (ja) 1998-02-20
DE69707377D1 (de) 2001-11-22
US5940272A (en) 1999-08-17
EP0822647A1 (de) 1998-02-04
EP0822647B1 (de) 2001-10-17
JP3159071B2 (ja) 2001-04-23

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