JP6311795B2 - パワーコンディショナ - Google Patents
パワーコンディショナ Download PDFInfo
- Publication number
- JP6311795B2 JP6311795B2 JP2016558908A JP2016558908A JP6311795B2 JP 6311795 B2 JP6311795 B2 JP 6311795B2 JP 2016558908 A JP2016558908 A JP 2016558908A JP 2016558908 A JP2016558908 A JP 2016558908A JP 6311795 B2 JP6311795 B2 JP 6311795B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- power conditioner
- heat
- auxiliary plate
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J3/00—Circuit arrangements for ac mains or ac distribution networks
- H02J3/18—Arrangements for adjusting, eliminating or compensating reactive power in networks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
- H02M5/40—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc
- H02M5/42—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters
- H02M5/44—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac
- H02M5/443—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac using devices of a thyratron or thyristor type requiring extinguishing means
- H02M5/45—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
- H02M5/4505—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only having a rectifier with controlled elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
20:放熱部材
21:主板
22:放熱フィン
22Ed:脚部
23:第1挿通孔
24:第2挿通孔
29P:突起
31,32,33,34:回路基板
40:枠体
50:装着用補助板
51:主板
60:壁側治具
61:主体
62:受け板
63:フック部材
91:光発電パネル
92:蓄電池
211:天面
212:底面
213:第1側面
214:第2側面
215:第3側面
216:第4側面
261,262:ネジ留め用の孔
290P:鉤状孔
311,321,331:コネクタ
510:凹凸部
513,514:切り込み
531,532:貫通孔
541,542:庇
F31:PVコンバータ
F32:双方向型DC/DCコンバータ
F331:双方向型DC/ACインバータ
F332:ACラインフィルタ
F34:システムコントローラ
Claims (5)
- 電気的発熱素子を含むパワーコンディショナ回路が形成された回路基板と、
表面に前記回路基板が実装され、裏面に複数の放熱フィンが配列された放熱部材と、
前記放熱部材の裏面側に固定され、壁への装着用の孔が設けられ、前記放熱部材よりも
剛性の高い装着用補助板と、
を備え、
前記複数の放熱フィンは、前記放熱部材の裏面を平面視して、第1方向に延びる長尺状であり、前記第1方向に直交する第2方向に間隔を空けて配列されており、
前記放熱部材は、前記複数の放熱フィンの前記配列の方向の両端に脚部を備え、
前記複数の放熱フィンの少なくとも1つには、前記装着用補助板に当接する突起を備え、
前記装着用補助板は、前記突起と前記脚部とに対して複数箇所で固定されており、
前記放熱フィンと前記装着用補助板との間には空隙を有する、
パワーコンディショナ。 - 前記突起は、前記放熱部材の裏面を平面視した略中央を通る放熱フィンに一体形成されている、
請求項1に記載のパワーコンディショナ。 - 前記装着用補助板は、凹凸部を備える、
請求項1乃至請求項2のいずれかに記載のパワーコンディショナ。 - 発熱部品を含む回路基板と、
前記回路基板が配置される第1面と、前記第1面と対向する第2面とを有する放熱部材と、
壁への装着用の孔が設けられ、前記放熱部材よりも剛性の高い装着用補助板と、
を備え、
前記第2面には、前記第2面から前記第1面への方向と逆方向に延伸する複数の突部が設けられ、
前記装着用補助板は前記突部に固定される、
パワーコンディショナ。 - 前記複数の突部は、複数の第1突部と複数の第2突部を含み、
前記装着用補助板は前記第1突部で固定され、前記第2突部は放熱フィンを構成する
請求項4に記載のパワーコンディショナ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014228749 | 2014-11-11 | ||
JP2014228749 | 2014-11-11 | ||
PCT/JP2015/074330 WO2016075986A1 (ja) | 2014-11-11 | 2015-08-28 | パワーコンディショナ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016075986A1 JPWO2016075986A1 (ja) | 2017-07-27 |
JP6311795B2 true JP6311795B2 (ja) | 2018-04-18 |
Family
ID=55954081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016558908A Active JP6311795B2 (ja) | 2014-11-11 | 2015-08-28 | パワーコンディショナ |
Country Status (4)
Country | Link |
---|---|
US (1) | US10168754B2 (ja) |
JP (1) | JP6311795B2 (ja) |
DE (1) | DE112015004679T5 (ja) |
WO (1) | WO2016075986A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11369043B2 (en) * | 2018-10-18 | 2022-06-21 | Mitsubishi Electric Corporation | Board housing case |
CN113224771B (zh) * | 2021-05-14 | 2022-10-18 | 台州安耐杰电力设备有限公司 | 一种混合型动态无功补偿装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5267122A (en) * | 1992-06-15 | 1993-11-30 | Alcatel Network Systems, Inc. | Optical network unit |
JPH09140159A (ja) * | 1995-11-10 | 1997-05-27 | Teikoku Denki Seisakusho:Kk | 防爆インバータ盤 |
JP3159071B2 (ja) * | 1996-08-01 | 2001-04-23 | 株式会社日立製作所 | 放熱フィンを有する電気装置 |
JP3263637B2 (ja) * | 1997-10-07 | 2002-03-04 | 三洋電機株式会社 | 電源装置の屋外装着構造 |
JP2001176739A (ja) * | 1999-12-14 | 2001-06-29 | Toyota Autom Loom Works Ltd | 車両用電磁誘導型非接触充電装置 |
JP2008103576A (ja) * | 2006-10-20 | 2008-05-01 | Yaskawa Electric Corp | モータ制御装置 |
JP2008259282A (ja) * | 2007-04-03 | 2008-10-23 | Toyota Motor Corp | 電源装置 |
JP2012170183A (ja) * | 2011-02-10 | 2012-09-06 | Sanyo Electric Co Ltd | パワーコンディショナ |
JP5963124B2 (ja) * | 2011-05-19 | 2016-08-03 | パナソニックIpマネジメント株式会社 | 箱 |
JP2014204606A (ja) * | 2013-04-08 | 2014-10-27 | 株式会社日立産機システム | 電力変換装置および冷却フィン |
-
2015
- 2015-08-28 JP JP2016558908A patent/JP6311795B2/ja active Active
- 2015-08-28 DE DE112015004679.8T patent/DE112015004679T5/de not_active Ceased
- 2015-08-28 WO PCT/JP2015/074330 patent/WO2016075986A1/ja active Application Filing
-
2017
- 2017-05-09 US US15/590,412 patent/US10168754B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016075986A1 (ja) | 2017-07-27 |
DE112015004679T5 (de) | 2017-08-03 |
US10168754B2 (en) | 2019-01-01 |
WO2016075986A1 (ja) | 2016-05-19 |
US20170242464A1 (en) | 2017-08-24 |
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