ES2152108T3 - Base de soporte para un circuito integrado. - Google Patents
Base de soporte para un circuito integrado.Info
- Publication number
- ES2152108T3 ES2152108T3 ES97951095T ES97951095T ES2152108T3 ES 2152108 T3 ES2152108 T3 ES 2152108T3 ES 97951095 T ES97951095 T ES 97951095T ES 97951095 T ES97951095 T ES 97951095T ES 2152108 T3 ES2152108 T3 ES 2152108T3
- Authority
- ES
- Spain
- Prior art keywords
- integrated circuit
- cover
- support base
- heat sink
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
- H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Connecting Device With Holders (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
LA INVENCION SE REFIERE A UNA BASE PARA UN CIRCUITO INTEGRADO, QUE TIENE UNA ENVOLTURA DE PANTALLA ABIERTA POR EL LADO QUE SE ORIENTA A LA PLACA DE CIRCUITO IMPRESO, Y QUE ESTA DOTADA DE UN BASTIDOR (3...6) Y UNA TAPA (2), PARA ALOJAR EL CIRCUITO INTEGRADO (1), Y UNA UNIDAD (7) DE CONTACTO CON LA BASE. LA TAPA (2) SE PUEDE ABRIR CON EL FIN DE RETIRAR EL CIRCUITO INTEGRADO. PARA UNA MEJOR DISIPACION TERMICA, LA TAPA PUEDE DISEÑARSE COMO DISIPADOR DE CALOR (8) DOTADO DE REBORDES DE REFRIGERACION Y COMPLETARSE POSIBLEMENTE CON UN DISIPADOR DE CALOR (8) EN EL LADO OPUESTO AL DE LA PLACA DE CIRCUITO IMPRESO (9). LA INVENCION SE APLICA A BASES PARA ELEMENTOS ESTRUCTURALES MULTIPOLARES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29620596U DE29620596U1 (de) | 1996-11-26 | 1996-11-26 | Sockel für eine integrierte Schaltung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2152108T3 true ES2152108T3 (es) | 2001-01-16 |
Family
ID=8032497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97951095T Expired - Lifetime ES2152108T3 (es) | 1996-11-26 | 1997-11-25 | Base de soporte para un circuito integrado. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6208515B1 (es) |
EP (1) | EP0941642B1 (es) |
AT (1) | ATE196968T1 (es) |
DE (2) | DE29620596U1 (es) |
ES (1) | ES2152108T3 (es) |
WO (1) | WO1998024283A1 (es) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7666191B2 (en) | 1996-12-12 | 2010-02-23 | Intuitive Surgical, Inc. | Robotic surgical system with sterile surgical adaptor |
US6132368A (en) * | 1996-12-12 | 2000-10-17 | Intuitive Surgical, Inc. | Multi-component telepresence system and method |
US8529582B2 (en) | 1996-12-12 | 2013-09-10 | Intuitive Surgical Operations, Inc. | Instrument interface of a robotic surgical system |
US6331181B1 (en) * | 1998-12-08 | 2001-12-18 | Intuitive Surgical, Inc. | Surgical robotic tools, data architecture, and use |
US7727244B2 (en) | 1997-11-21 | 2010-06-01 | Intuitive Surgical Operation, Inc. | Sterile surgical drape |
US8182469B2 (en) | 1997-11-21 | 2012-05-22 | Intuitive Surgical Operations, Inc. | Surgical accessory clamp and method |
US8206406B2 (en) | 1996-12-12 | 2012-06-26 | Intuitive Surgical Operations, Inc. | Disposable sterile surgical adaptor |
US6496374B1 (en) * | 2000-10-24 | 2002-12-17 | Lsi Logic Corporation | Apparatus suitable for mounting an integrated circuit |
US6449162B1 (en) * | 2001-06-07 | 2002-09-10 | International Business Machines Corporation | Removable land grid array cooling solution |
US20040052064A1 (en) * | 2001-11-15 | 2004-03-18 | Oliver Michael J. | Electromagnetic shielding and cooling device for printed circuit board |
US6490161B1 (en) * | 2002-01-08 | 2002-12-03 | International Business Machines Corporation | Peripheral land grid array package with improved thermal performance |
US6600661B1 (en) * | 2002-04-08 | 2003-07-29 | Hewlett-Packard Development Company, L.P. | Method and apparatus for supporting a circuit component |
TW540988U (en) * | 2002-10-04 | 2003-07-01 | Hon Hai Prec Ind Co Ltd | A heat dissipating assembly |
US6947284B2 (en) * | 2002-11-20 | 2005-09-20 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly with retaining device |
US6971887B1 (en) * | 2004-06-24 | 2005-12-06 | Intel Corporation | Multi-portion socket and related apparatuses |
TWM273028U (en) * | 2005-04-15 | 2005-08-11 | Inventec Corp | Heat sink fixing device |
US7422448B2 (en) * | 2005-07-28 | 2008-09-09 | Delphi Technologies, Inc. | Surface mount connector |
DE102005057508B4 (de) * | 2005-12-01 | 2011-11-17 | Multitest Elektronische Systeme Gmbh | Dockingvorrichtung zum Kuppeln einer Handhabungsvorrichtung mit einem Testkopf für elektronische Bauelemente |
US7236365B1 (en) * | 2005-12-15 | 2007-06-26 | Huang-Chou Huang | Receptacle for a central processing unit |
US20080080160A1 (en) * | 2005-12-16 | 2008-04-03 | Laird Technologies, Inc. | Emi shielding assemblies |
US7262369B1 (en) | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
TWM291035U (en) * | 2005-12-22 | 2006-05-21 | Inventec Corp | Heat-dissipating device |
US7623360B2 (en) | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
CN101861075A (zh) * | 2009-04-08 | 2010-10-13 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
EP2774465A4 (en) * | 2011-10-31 | 2015-09-09 | Thomson Licensing | SHIELDING STRUCTURE FOR AN ELECTRONIC DEVICE |
US8599559B1 (en) * | 2012-05-30 | 2013-12-03 | Tyco Electronics Corporation | Cage with a heat sink mounted on its mounting side and an EMI gasket with its fingers electrically connected to the mounting side |
US10616993B1 (en) * | 2018-01-15 | 2020-04-07 | Arista Networks, Inc. | Heatsink backing plate |
KR102007823B1 (ko) * | 2018-01-30 | 2019-10-21 | 주식회사 대성엔지니어링 | 테스트소켓가열모듈 및 이를 포함하는 소자테스트장치 |
CN108227594B (zh) * | 2018-02-28 | 2021-03-19 | 广东美的制冷设备有限公司 | 一种控制器及具有该控制器的家用电器 |
CN113766726B (zh) * | 2021-07-15 | 2023-02-07 | 苏州瑞煜华电子科技有限公司 | 一种通讯用高防护性高密度型线路板结构 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
US4433886A (en) * | 1981-12-17 | 1984-02-28 | Elco Corporation | Connector mounting for integrated circuit chip packages |
GB2163287B (en) * | 1984-08-07 | 1988-06-08 | Aavid Eng Inc | Electronic chip-carrier heat sinks |
DE3629567A1 (de) * | 1986-08-30 | 1988-03-03 | Bbc Brown Boveri & Cie | Halbleiterblock |
DE8716007U1 (es) | 1987-12-03 | 1989-01-05 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
WO1989010014A1 (en) * | 1988-04-06 | 1989-10-19 | Amhet Manufacturing Company, Inc. | An electronic chip connection assembly and method |
JPH062316Y2 (ja) | 1988-07-08 | 1994-01-19 | アルプス電気株式会社 | シールドケースの底面カバー取付構造 |
JPH0677469B2 (ja) * | 1988-12-28 | 1994-09-28 | 日本電気株式会社 | 多接点コネクタの案内構造 |
US4906194A (en) * | 1989-04-13 | 1990-03-06 | Amp Incorporated | High density connector for an IC chip carrier |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5241453A (en) | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
US5357404A (en) * | 1991-11-18 | 1994-10-18 | The Whitaker Corporation | EMI shield, and assembly using same |
DE4326207A1 (de) * | 1992-10-06 | 1994-04-07 | Hewlett Packard Co | Mechanisch schwimmendes Mehr-Chip-Substrat |
JPH06164265A (ja) * | 1992-11-16 | 1994-06-10 | Toshiba Corp | マイクロ波増幅器 |
US5302853A (en) * | 1993-01-25 | 1994-04-12 | The Whitaker Corporation | Land grid array package |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5380213A (en) * | 1993-05-21 | 1995-01-10 | Burndy Corporation | Electrical connector with improved ejectors and assembly |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
DE19511229A1 (de) * | 1994-03-28 | 1995-10-05 | Whitaker Corp | Chipträgersystem |
-
1996
- 1996-11-26 DE DE29620596U patent/DE29620596U1/de not_active Expired - Lifetime
-
1997
- 1997-11-25 ES ES97951095T patent/ES2152108T3/es not_active Expired - Lifetime
- 1997-11-25 EP EP97951095A patent/EP0941642B1/de not_active Expired - Lifetime
- 1997-11-25 US US09/308,904 patent/US6208515B1/en not_active Expired - Fee Related
- 1997-11-25 AT AT97951095T patent/ATE196968T1/de not_active IP Right Cessation
- 1997-11-25 WO PCT/DE1997/002756 patent/WO1998024283A1/de active IP Right Grant
- 1997-11-25 DE DE59702473T patent/DE59702473D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE196968T1 (de) | 2000-10-15 |
WO1998024283A1 (de) | 1998-06-04 |
EP0941642B1 (de) | 2000-10-11 |
US6208515B1 (en) | 2001-03-27 |
DE59702473D1 (de) | 2000-11-16 |
DE29620596U1 (de) | 1998-01-22 |
EP0941642A1 (de) | 1999-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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