DE9312152U1 - Kühlkörper zur Wärmeableitung an elektrischen Bauteilen - Google Patents
Kühlkörper zur Wärmeableitung an elektrischen BauteilenInfo
- Publication number
- DE9312152U1 DE9312152U1 DE9312152U DE9312152U DE9312152U1 DE 9312152 U1 DE9312152 U1 DE 9312152U1 DE 9312152 U DE9312152 U DE 9312152U DE 9312152 U DE9312152 U DE 9312152U DE 9312152 U1 DE9312152 U1 DE 9312152U1
- Authority
- DE
- Germany
- Prior art keywords
- electrical components
- heat
- heat dissipation
- heat sink
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9312152U DE9312152U1 (de) | 1993-08-15 | 1993-08-15 | Kühlkörper zur Wärmeableitung an elektrischen Bauteilen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9312152U DE9312152U1 (de) | 1993-08-15 | 1993-08-15 | Kühlkörper zur Wärmeableitung an elektrischen Bauteilen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9312152U1 true DE9312152U1 (de) | 1993-10-07 |
Family
ID=6896761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9312152U Expired - Lifetime DE9312152U1 (de) | 1993-08-15 | 1993-08-15 | Kühlkörper zur Wärmeableitung an elektrischen Bauteilen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9312152U1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004049154A1 (de) * | 2004-09-30 | 2006-04-06 | Robert Bosch Gmbh | Elektrisches Gerät, insbesondere Steuergerät |
DE102007057533A1 (de) * | 2007-11-29 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers |
DE102008019797A1 (de) * | 2008-04-18 | 2009-10-22 | Sew-Eurodrive Gmbh & Co. Kg | Kühlanordnung und Umrichter |
-
1993
- 1993-08-15 DE DE9312152U patent/DE9312152U1/de not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004049154A1 (de) * | 2004-09-30 | 2006-04-06 | Robert Bosch Gmbh | Elektrisches Gerät, insbesondere Steuergerät |
DE102007057533A1 (de) * | 2007-11-29 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers |
DE102007057533B4 (de) * | 2007-11-29 | 2016-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlkörper, Verfahren zur Herstellung eines Kühlkörpers und Leiterplatte mit Kühlkörper |
DE102008019797A1 (de) * | 2008-04-18 | 2009-10-22 | Sew-Eurodrive Gmbh & Co. Kg | Kühlanordnung und Umrichter |
DE102008019797B4 (de) | 2008-04-18 | 2023-09-21 | Sew-Eurodrive Gmbh & Co Kg | Kühlanordnung und Umrichter |
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