GB9701856D0 - Heat sink for electrical or electronic components - Google Patents
Heat sink for electrical or electronic componentsInfo
- Publication number
- GB9701856D0 GB9701856D0 GB9701856A GB9701856A GB9701856D0 GB 9701856 D0 GB9701856 D0 GB 9701856D0 GB 9701856 A GB9701856 A GB 9701856A GB 9701856 A GB9701856 A GB 9701856A GB 9701856 D0 GB9701856 D0 GB 9701856D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical
- heat sink
- electronic components
- electronic
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT25096A AT404532B (en) | 1996-02-13 | 1996-02-13 | HEAT SINK FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9701856D0 true GB9701856D0 (en) | 1997-03-19 |
GB2310321A GB2310321A (en) | 1997-08-20 |
Family
ID=3485550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9701856A Withdrawn GB2310321A (en) | 1996-02-13 | 1997-01-30 | Deformable heat sink |
Country Status (5)
Country | Link |
---|---|
AT (1) | AT404532B (en) |
DE (1) | DE19704549A1 (en) |
FR (1) | FR2744873A1 (en) |
GB (1) | GB2310321A (en) |
IT (1) | IT1290293B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116171030A (en) * | 2023-04-21 | 2023-05-26 | 深圳市中电熊猫展盛科技有限公司 | Water-cooled indoor lighting intelligent control power supply and water cooling method |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19739591A1 (en) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclable circuit board, consisting of a foil and carrier system |
WO1999014805A1 (en) * | 1997-09-19 | 1999-03-25 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
US6131651A (en) * | 1998-09-16 | 2000-10-17 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
US6257328B1 (en) * | 1997-10-14 | 2001-07-10 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive unit and thermal connection structure using the same |
DE19854642C2 (en) * | 1998-11-26 | 2003-02-20 | Vacuumschmelze Gmbh | Component with improved heat sink |
SE518446C2 (en) * | 1999-06-14 | 2002-10-08 | Ericsson Telefon Ab L M | Device for cooling electronic components |
DE10004474B4 (en) * | 2000-02-02 | 2006-04-13 | Rittal Gmbh & Co. Kg | cooler |
US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
FR2811476B1 (en) | 2000-07-07 | 2002-12-06 | Thomson Csf | ELECTRONIC DEVICE WITH THERMALLY CONDUCTIVE ENCAPSULANT |
DE10033848A1 (en) * | 2000-07-12 | 2002-01-24 | Plg Elektronik Ingenieur Und D | Electrical device for dissipating heat contains a source of heat and a heat-conducting container with a liquid in a heat-dissipating path for dissipating heat. |
JP4268778B2 (en) * | 2001-12-27 | 2009-05-27 | ポリマテック株式会社 | Heating electronic component cooling method and heat conductive sheet used therefor |
GB2388473B (en) * | 2002-05-08 | 2005-09-21 | Sun Microsystems Inc | Compliant heat sink interface |
DE10235047A1 (en) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Electronics housing with integrated heat spreader |
WO2004103047A1 (en) * | 2003-05-14 | 2004-11-25 | Chingyi Chen | High efficient heat dissipating module and method of manufacture |
DE102009056607B4 (en) | 2009-12-02 | 2014-11-13 | Amphenol-Tuchel Electronics Gmbh | Cell connector cover and high current cell assembly with a cell connector cover |
WO2013092535A1 (en) | 2011-12-21 | 2013-06-27 | Tyst Design Ved Iver Munk | A heat bus |
DE102014200832A1 (en) * | 2014-01-17 | 2015-07-23 | Siemens Aktiengesellschaft | Flexible heat sink for uneven cooling surfaces |
JP2016219599A (en) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | Electronic equipment and heat spreader |
DE102016200156A1 (en) * | 2016-01-08 | 2017-07-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Cooling element for at least one equipped with electronic and / or electrical components carrier |
AT521329B1 (en) * | 2018-06-12 | 2020-03-15 | Miba Ag | accumulator |
EP3923689B1 (en) * | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Cooling device and its manufacturing method |
EP3955716B1 (en) | 2020-08-13 | 2024-07-31 | Aptiv Technologies AG | Cooling device and method of manufacturing the same |
EP4025024A1 (en) | 2021-01-04 | 2022-07-06 | Aptiv Technologies Limited | Cooling device and method of manufacturing the same |
DE102021209640A1 (en) | 2021-09-01 | 2023-03-02 | Continental Automotive Technologies GmbH | Cooling device, cooling arrangement, control device and rack system |
GB2611028A (en) | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
AT524582B1 (en) * | 2021-11-04 | 2022-07-15 | Miba Emobility Gmbh | Device comprising an electronic component |
DE102022102564A1 (en) | 2022-02-03 | 2023-08-03 | Cariad Se | Cooling arrangement and cooling device for cooling at least one component on a circuit board |
DE102022207570A1 (en) | 2022-07-25 | 2024-01-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Cooling device for an assembly to be cooled in a vehicle |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3654521A (en) * | 1971-01-13 | 1972-04-04 | Gen Electric | Electronic card module thermal clip |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
DE2903685A1 (en) * | 1979-01-31 | 1980-08-14 | Siemens Ag | COOLING DEVICE FOR COOLING ELECTRICAL COMPONENTS, ESPECIALLY INTEGRATED BLOCKS |
US4538675A (en) * | 1982-04-01 | 1985-09-03 | Planning Research Corporation | Retention and cooling of plug-in electronic modules in a high shock and vibration environment |
WO1984002444A1 (en) * | 1982-12-16 | 1984-06-21 | Hasler Ag | Flat bag filled with heat-conducting liquid or paste |
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JP2569003B2 (en) * | 1986-03-20 | 1997-01-08 | 株式会社日立製作所 | Heat conduction device |
US4997032A (en) * | 1987-09-25 | 1991-03-05 | Minnesota Mining And Manufacturing Company | Thermal transfer bag |
GB2214719B (en) * | 1988-01-26 | 1991-07-24 | Gen Electric Co Plc | Housing for electronic device |
US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
EP0340520B1 (en) * | 1988-05-05 | 1992-12-02 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Convection-cooling arrangement for electrical components, particularly of integrated circuits with semiconductors |
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
DE3935662C2 (en) * | 1989-10-26 | 1997-08-28 | Bosch Gmbh Robert | Electronic circuit arranged on a substrate |
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
JPH04206555A (en) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | Cooling device for electronic equipment |
JP3017837B2 (en) * | 1991-05-31 | 2000-03-13 | 株式会社日立製作所 | Electronic equipment |
JPH0590461A (en) * | 1991-09-25 | 1993-04-09 | Hitachi Ltd | Electronic device |
DE4336961C2 (en) * | 1993-10-29 | 2000-07-06 | Kerafol Keramische Folien Gmbh | Flexible heat transfer device |
-
1996
- 1996-02-13 AT AT25096A patent/AT404532B/en not_active IP Right Cessation
-
1997
- 1997-01-28 FR FR9700889A patent/FR2744873A1/en not_active Withdrawn
- 1997-01-30 GB GB9701856A patent/GB2310321A/en not_active Withdrawn
- 1997-02-06 DE DE1997104549 patent/DE19704549A1/en not_active Ceased
- 1997-02-11 IT ITMI970270 patent/IT1290293B1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116171030A (en) * | 2023-04-21 | 2023-05-26 | 深圳市中电熊猫展盛科技有限公司 | Water-cooled indoor lighting intelligent control power supply and water cooling method |
CN116171030B (en) * | 2023-04-21 | 2023-07-04 | 深圳市中电熊猫展盛科技有限公司 | Water-cooled indoor lighting intelligent control power supply and water cooling method |
Also Published As
Publication number | Publication date |
---|---|
AT404532B (en) | 1998-12-28 |
ATA25096A (en) | 1998-04-15 |
ITMI970270A1 (en) | 1998-08-11 |
IT1290293B1 (en) | 1998-10-22 |
DE19704549A1 (en) | 1997-08-14 |
FR2744873A1 (en) | 1997-08-14 |
GB2310321A (en) | 1997-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |