AU9677498A - Non-electrically conductive thermal dissipator for electronic components - Google Patents
Non-electrically conductive thermal dissipator for electronic componentsInfo
- Publication number
- AU9677498A AU9677498A AU96774/98A AU9677498A AU9677498A AU 9677498 A AU9677498 A AU 9677498A AU 96774/98 A AU96774/98 A AU 96774/98A AU 9677498 A AU9677498 A AU 9677498A AU 9677498 A AU9677498 A AU 9677498A
- Authority
- AU
- Australia
- Prior art keywords
- electrically conductive
- electronic components
- conductive thermal
- thermal dissipator
- dissipator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7089897P | 1997-11-10 | 1997-11-10 | |
| US60070898 | 1997-11-10 | ||
| PCT/US1998/020621 WO1999025022A1 (en) | 1997-11-10 | 1998-09-29 | Non-electrically conductive thermal dissipator for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU9677498A true AU9677498A (en) | 1999-05-31 |
Family
ID=22098033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU96774/98A Abandoned AU9677498A (en) | 1997-11-10 | 1998-09-29 | Non-electrically conductive thermal dissipator for electronic components |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1029351A1 (en) |
| JP (1) | JP2001523047A (en) |
| AU (1) | AU9677498A (en) |
| WO (1) | WO1999025022A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0932200A3 (en) * | 1998-01-22 | 2000-08-23 | International Business Machines Corporation | Heat sink device for microprocessor |
| JP2001284504A (en) * | 2000-03-30 | 2001-10-12 | Three M Innovative Properties Co | Heat-conductive sheet and peel film therefor |
| US6919504B2 (en) * | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
| KR101003654B1 (en) * | 2008-08-27 | 2010-12-23 | 삼성전기주식회사 | semiconductor package transfomer |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60241239A (en) * | 1984-05-16 | 1985-11-30 | Hitachi Ltd | Semiconductor device |
| JPH0815189B2 (en) * | 1987-01-13 | 1996-02-14 | 株式会社東芝 | Method for manufacturing semiconductor device |
| US5294750A (en) * | 1990-09-18 | 1994-03-15 | Ngk Insulators, Ltd. | Ceramic packages and ceramic wiring board |
| MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
| US5550326A (en) * | 1994-07-13 | 1996-08-27 | Parker-Hannifin Corporation | Heat dissipator for electronic components |
| US5729052A (en) * | 1996-06-20 | 1998-03-17 | International Business Machines Corporation | Integrated ULSI heatsink |
-
1998
- 1998-09-29 AU AU96774/98A patent/AU9677498A/en not_active Abandoned
- 1998-09-29 EP EP98950829A patent/EP1029351A1/en not_active Withdrawn
- 1998-09-29 JP JP2000519924A patent/JP2001523047A/en active Pending
- 1998-09-29 WO PCT/US1998/020621 patent/WO1999025022A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999025022A1 (en) | 1999-05-20 |
| JP2001523047A (en) | 2001-11-20 |
| EP1029351A1 (en) | 2000-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |