WO2004103047A1

WO2004103047A1 - High efficient heat dissipating module and method of manufacture

Info

Publication number: WO2004103047A1
Application number: PCT/CN2004/000472
Authority: WO
Inventors: Chingyi Chen
Original assignee: Chingyi Chen
Priority date: 2003-05-14
Filing date: 2004-05-12
Publication date: 2004-11-25

Abstract

This invention relates to high efficient heat dissipating module, which uses precursor material having liquid crystal character in form of liquid phase and moulds, arranges inner liquid crystal long type molecular orderly in same direction by pressure, and forms integrally moulded body having thermal conducting fins. When the module is used, the body contacts the thermal source, the heat can be quickly transferred to thermal conducting fins, with the help of forced flowing air, the heat from thermal source can be rapidly removed, thereby highly improved the heat radiating efficiency.

Description

High-efficiency thermally conductive module and manufacturing method thereof

The invention relates to a heat sink, and in particular to a high-efficiency heat-conducting module which is in contact with a heat source device so that the heat of the contacted heat source can be transferred quickly, and the gas flow is quickly taken away to increase heat dissipation efficiency. The invention also relates to a method for manufacturing the aforementioned high-efficiency heat-conducting module.

Background technique

In general, mechanical operation or electrical power operation equipment will have more or less heat loss during operation, and increase the heat formation temperature, which causes the operation to be smooth or the efficiency to be greatly reduced; therefore, there is a heat sink to Metal aluminum is extruded. With this type of heat sink, the metal aluminum contacts the heat source of the mechanical or electrical power running equipment. The metal aluminum contact heat is dissipated through conduction; however, the functions of various devices have been greatly improved recently, especially in The operating speed and operating energy are greatly increased, resulting in high-speed and large-capacity operation. The heat generated by relative operation is also greatly increased. The high-temperature environment is not conducive to the operation of such equipment. Therefore, how to quickly remove heat and control the operating temperature of the equipment will form a very Important and indispensable topics.

Especially recently, computer equipment is increasingly demanding fast and large data processing functions. In computer equipment, its main control unit (CPU) requires more high-speed operation, and the heat generated by the main control unit (CPU) is increased. The increase in temperature brings about a reduction in the function of the main control unit (CPU) in processing a large amount of data. In order to solve this problem, there is a device as shown in FIG. 1. The heat sink 1 is made of metal and aluminum. The bottom side of the heat sink 1 contacts the main control unit (CPU). 2. The heat is transferred out and a fan 3 is used. The blown air took away the heat. In order to make up for the lack of heat dissipation capability of the metal aluminum heat sink 1, there is a tube 4 (copper pipe) surrounding the side of the metal aluminum heat sink. The copper tube is filled with refrigerant inside, and the heat is absorbed by the refrigerant through the copper tube. There are also heat pipes that are filled with special materials inside the copper pipe, and heat pipes are used to assist in the transfer of heat, in order to increase the effect of heat dissipation.

However, metal aluminum heat sinks with copper pipes or heat pipes can slightly increase the heat dissipation effect, but metal aluminum heat sinks with copper pipes or heat pipes surround it. This type of equipment will greatly increase the cost of goods, which is not conducive to the popularization of products or low prices. Trend, and the copper tube or heat pipe surround not only increases the overall volume, it is not suitable for the trend of computer and daily electronic products to develop light, thin and short; so if there is a heat sink, it does not need to increase the copper tube or heat pipe surround, but can directly Contacting the heat source provides an impressive heat dissipation effect, and can be integrated into one body, which can reduce costs, reduce volume, and meet the trend of the era of low prices and small volume. It will not only solve the lack of existing technology, but also become popular with the public. Accepted products.

Summary of the Invention

The object of the present invention is to improve the shortcomings in the prior art, and to provide a high-efficiency heat-conducting module that can improve the heat dissipation effect and reduce the cost, and meet the trend of low-cost, thin and short electronic products; The purpose is to provide the manufacturing method of the aforementioned high-efficiency thermally conductive module.

The purpose of the present invention is achieved in this way-a high-efficiency thermally conductive module, which generally includes:

A body, which is an integrally formed component, is composed of a carbide of an aromatic polymer material having liquid crystal characteristics, and the liquid crystal long molecules inside it are arranged neatly, and the body is in contact with a thermal device in use; The body is a component integrally formed by a mold, and the long liquid crystal molecules inside it are aligned in a direction of molding flow;

Most of the thermally conductive wings are integrally formed and connected to the body. They are also composed of carbides of aromatic polymer materials with liquid crystal characteristics. The liquid crystal long molecules inside the thermally conductive wings are arranged neatly. The liquid crystal long molecules are connected to the liquid crystal long molecules inside the body; the thermally conductive wing is also a component integrally formed with a mold, and the liquid crystal long molecules inside the liquid crystal are aligned neatly in the direction of the molding flow. The molecules form liquid crystal long molecules that are connected to the inside of the body along the molding flow direction.

The high-efficiency heat-conducting module also includes an air-exhaust assembly, which is disposed on the side of the heat-conducting wing. The air-exhaust assembly is installed in such a way that the blowing gas flows through the heat-conducting wing, so that the heat transmitted by the heat-conducting wing is quickly Take away, increase heat dissipation. The air outlet of the air exhaust assembly is located at a gap where the blown gas can flow through the heat conducting wing. . '

The high-efficiency heat-conducting module provided by the present invention is manufactured by the following method-firstly selecting an aromatic polymer material having liquid crystal characteristics as a precursor material, placing it in a container to heat and liquefy into a liquid-phase precursor material, and applying a pressure source A container is introduced, and the liquid-phase precursor material is pressed by the pressure source, so that the liquid crystal long molecules of the liquid-phase precursor material form a regular flow in the direction of flow and enter a mold, which is injected into the mold to form a heat conduction. The module body; then heat the thermal module body in a temperature environment corresponding to the carbonization of the material used, and carbonize the thermal module body to form a thermal module with high heat conduction efficiency. The precursor material is formed in a liquid phase to form a molecular alignment and a mold under pressure to form a thermally conductive module.

The precursor material is preferably a carbon precursor material having a nitrogen component. The carbonization temperature of the precursor material is above 1000 degrees Celsius. When forming the thermal module module body, it is heated in an environment higher than 1000 degrees Celsius to form a flexible heat conduction mold. group.

Further, the embryonic body of the thermal conduction module is subjected to graphitization treatment, so that the elongated molecules are formed in a long axis direction and arranged in the same direction, so as to form a flexible thermal conduction module.

Then, the heat-conducting module made by the above method contacts the heat source device to quickly transfer the heat generated by the heat source device, and then cooperates with the exhaust component to blow the gas flow, which can quickly remove the heat from the heat source device and increase the heat dissipation effect. The main characteristic of aromatic polymers with liquid crystal properties is that the molecules have an elongated structure, which means that the elongated molecular structure is one of the characteristics of liquid crystals. Directional properties are required for further use of liquid crystal materials, such as

LED liquid crystal.

Aromatic polymers with liquid crystal characteristics in different structures have different liquefaction temperatures. Aromatic polymers with low liquefaction temperatures do not need to be carbonized. Aromatic polymers with liquefaction temperatures above 1000 ° F require carbonization. Therefore, it is not necessary to limit the temperature at 1000 ° C, but if you choose an aromatic polymer with a liquid crystal characteristic above 1000 ° C, the heat resistance temperature of the finished product will be relatively increased, and the similar temperature resistance characteristics of metal will be relatively Better, it doesn't have to be used at iooo ° c, loocrc above is just an option.

Graphitization is a finished product state included in carbonization; carbonization is an operation procedure, and graphitization is a product achieved by the carbonization operation procedure. Graphitization is carried out at a higher temperature, and relatively deep desalination operations can be performed. The embryo body desalination degree is more complete and can be more uniformly desalinated.

The carbonization heating operation and the operation of the pressure of the liquid cause the long axes of the liquid-shaped long molecules to form a co-aligned flow, so that the long molecules are side-by-side and connected at both ends of the long axis, that is, when the present invention is operated, It utilizes the characteristics of long molecules connected in the long axis direction and operates with liquid phase, pressure, and temperature conditions.

The characteristic of the liquid-crystalline aromatic polymer is that the long molecules, that is, the molecules are in the shape of long strips (major axes). The long molecules can flow in the liquid phase, and pressure operation is performed when they are in the liquid phase. The long molecules are aligned in the long axis, and the order is continuous. The long molecules are arranged in the long axis direction, and there is no lateral staggering. The two ends of the molecules are well connected, and they will be subject to fluid flow at turns or turns. Affects the formation of a smooth streamline connection, and the heat conduction effect is relatively better, so the heat conduction effect is good. '

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is further described below with reference to the drawings.

FIG. 1 is a schematic diagram of a heat sink used in the prior art;

FIG. 2 is a schematic flowchart of manufacturing a thermally conductive module according to a first preferred embodiment of the present invention; FIG.

2A is a schematic diagram of a structural formula of an aromatic polymer having liquid crystal characteristics as a precursor material selected in the first preferred embodiment of the present invention;

2B, 2C, and 2D are schematic diagrams of the process of forming the precursor material shown in FIG. 2A in the prior art and a schematic diagram of the structure after carbonization;

Fig. 3 is a schematic diagram of a carbon precursor in a first preferred embodiment of the present invention placed in a container and heated to liquefy; + Fig. 4 is a first preferred embodiment of the present invention in which a molding die is pre-cast to make the main body and the inside of a thermally conductive wing Schematic diagram of neatly arranged molecular alignment directions;

FIG. 5 is a schematic cross-sectional view of a heat conduction module according to a first preferred embodiment of the present invention.

FIG. 6 is a schematic diagram of using a heat conducting module according to a first preferred embodiment of the present invention.

The first preferred embodiment of the high-efficiency thermally conductive module of the present invention, the manufacturing process of which is generally shown in FIG. 2 includes the following procedures: ''

Firstly, a thermoplastic aromatic polymer is selected, and an aromatic polymer having liquid crystal characteristics is selected as the precursor material 10. The precursor material 10 can be classified according to specific physical properties and uses different liquid crystal polymer (LCP) structures, such as Sumitomo The liquid crystal polymer (LCP) with a representative molecular structure produced by a trading company, or the liquid crystal polymer (LCP) with a King molecular structure or an Aliphatic molecular structure produced by other manufacturers. The precursor material 10 is a liquid crystal polymer (LCP) Structure, with rod-like molecules, showing a nano-scale needle-like structure. The precursor material 10 is especially a carbon precursor material having a nitrogen component.

The precursor material 10 can be selected from materials with a specific molecular structure. Please refer to FIG. 2B. The precursor material 10 can use a specific ring group for molecular recombination and binding. Please refer to FIG. 2C. The liquid phase precursor material 11 with extended alignment characteristics is shown in FIG. 2D.

The previously selected precursor material 10 is placed in a container 20, which has a channel 21 to which a mold 22 can be connected. The container 20 is a storage tank for injection molding equipment, and heating components of these equipment can be used. The heating temperature is controlled in an environment within 1000 degrees Celsius, the precursor material 10 is heated to form a liquid state, the precursor material 10 forms a flowable liquid phase precursor material 11;

'' The use of aromatic polymer plastics to form carbon slag in a high temperature environment, please refer to FIG. 2D, control the heating temperature to 1000 degrees Celsius or above, such as 1200 degrees, so that the molecules in the liquid phase precursor material 11 are combined A nitrogen-containing carbon precursor material forming a graphite-like structure is shown in FIG. 3;

The pipe 23 is guided to an external pressure source, and the pipe 23 communicates with the container 20 to guide an appropriate pressure. This pressure has different set pressure ranges according to the size and characteristics of the molding object of the mold 22, usually from several kilograms to several Ten kilograms or hundreds of kilograms of pressure, the appropriate pressure is guided to the container 20 by the pressure source guided by the pipe 23, this pressure is applied to the liquid phase precursor material 11;

The liquid phase precursor material 11 has thermoplasticity and the liquid crystal long molecules 12 have extended alignment characteristics; and the injection molding equipment is used to operate, control the feeding and injection time, so that the liquid phase precursor material 11 moves from the container 20 to the channel 21 Flow, the liquid phase precursor material 11 is injected into the mold 22, as shown in FIGS. 3 and 4;

When the liquid-phase precursor material 11 flows toward the channel 21 under pressure and is injected into the mold 22, the liquid crystal long molecules 12 of the liquid-phase precursor material 11 are aligned in a long axis direction and aligned in the flow direction. The liquid-phase precursor Material 11 is injected into the mold 20 to form a thermally conductive module body 30; the thermally conductive module body 30 forms a body 31 and a plurality of thermally conductive wings 32, and the liquid crystal long molecules 12 of the liquid phase precursor material 11 are located on the body 31 Forming in the direction of A, the liquid crystal long molecules 12 of the liquid-phase precursor material 11 form continuous circulation according to fluid flow;

The liquid crystal long molecules 12 of the liquid-phase precursor material 11 are located on the thermally conductive wings 32 to form an array extending in the B direction. Heating a suitable high-temperature environment, generally set the environment at 1200 degrees Celsius for carbonization treatment; in this high-temperature environment, an oxygen-deficient state is formed to perform carbonization treatment to remove nitrogen and hydrogen components, thereby forming a heat conduction module with high heat conduction efficiency. The user can control and control different temperatures and times according to different choices, so that the surface layer of the thermally conductive module embryo body 30 can be carbonized with a certain thickness, or even the whole can be uniformly carbonized to form graphitization.

The heat conduction module of the present invention has a body 31 which is connected to a plurality of heat conduction wings 32. The heat conduction wings 3.2 are plate-shaped and formed at regular intervals, please refer to FIG. 6; the body 31 contacts a heat source device 40, and the heat source device 40 It can be a CPU component. An exhaust component 50 is installed on the side of the heat conducting wing 32. The exhaust air blow direction of the exhaust component 50 is aligned with the space of the heat conducting wing 32, so that the gas generated by the exhaust can pass through the air smoothly. The thermally conductive wings 32 flow in an equally spaced space. '

In the present invention, when the main body 31 is used to form the mold 23, the main body 31 has a graphite-like nitrogen-containing carbon precursor material, and the liquid phase precursor material 11 forms a thermoplastic aromatic polymer and has characteristics of extended alignment. When the liquid phase precursor material 11 flows into the mold 23 in a liquid state, please refer to FIG. 4 and FIG. 5; the liquid crystal long molecules 12 in the liquid crystal are aligned in the direction of the molding flow, because the fluid flow is Continuity, so the liquid crystal long molecules 12 also form a continuous connection arrangement. The liquid crystal long molecules 12 are located in the body 31 to form the A direction, and the liquid crystal long molecules 12 are located in the thermally conductive wing 32 to form an extension direction B. The liquid crystal long molecules 12 of the liquid phase precursor material 11 form continuous circulation according to fluid flow, and the liquid crystal long molecules 12 form a continuous connection structure;

In addition, the precursor material 10 is particularly selected from a carbon precursor material having a nitrogen component. When the carbonization treatment is performed at a high temperature to form an anoxic state, gas components such as nitrogen and hydrogen are removed to form a flexible graphite characteristic. The body 31, The thermally conductive wing 32 can be formed into an appropriate thickness as required, and has flexible characteristics and is provided for bending use.

When the present invention is used, the body 31 is in close contact with the heat source device 40 (CPU component). Please refer to FIG. 6, the thermal energy generated by the operation of the heat source device 40 is transferred to the body 31, the body 31 and the heat transfer wing 32. The liquid crystal long molecules 12 are continuously connected and aligned to form a feature with high heat conduction efficiency. The heat generated by the heat source can be quickly transmitted from the body 31 and the thermal conductive wing 32. The exhaust air blow direction of the exhaust component 50 is opposite. By combining the heat-conducting wing 32 with an equal space, the heat transmitted by the heat-conducting wing 32 can be carried away smoothly and quickly through the gas, so the heat generated by the heat source device 40 can be quickly removed and can be maintained at normal temperature.

According to the present invention, the body 31 and the heat transfer wing 32 can be directly used as a heat source heat transfer component, without having to be surrounded by a heat pipe or a copper pipe filled with a refrigerant, so its volume can be appropriately reduced, and the device is manufactured more than the prior art device. Simplicity and simplified structure relatively reduce the manufacturing cost, which is in line with the current trend of electronic information products towards the popularization of light, thin and small consumer products.

In summary, the high-efficiency thermally conductive module provided by the present invention In order to form a molecular alignment match, the mold is pressurized to form a thermally conductive module and a contact heat source device, which can quickly transfer heat. With the exhaust air component, the gas flow is blown away, and the heat is quickly removed and the heat dissipation effect is increased. It has industrial use And the novelty of the first invention; the structure described in this invention is considered to be the best embodiment, and the invention is not limited to the disclosed embodiment, but also includes the spirit and arrangement of the invention.

Industrial applicability

The high-efficiency heat-conducting module provided by the present invention is made of a liquid crystal, a matching mold, and a pressure to form a body connected to a heat-conducting wing by selecting a precursor material with liquid crystal characteristics, so that the inner long molecules are aligned in the same direction to improve the heat-conducting effect. Heat is quickly removed, increasing heat dissipation.

Claims

Claim

1. A manufacturing process for a high-efficiency thermally conductive module, which is characterized by:

Select aromatic polymers with liquid crystal characteristics as precursor materials;

The precursor material is heated in a container to form a liquid phase precursor material that can flow in a liquid state, and the container has a channel that can be connected to a mold;

Connect a pressure source to the container, guide a pressure, and apply pressure to the liquid phase precursor material by the pressure guided by the pressure source;

The liquid phase precursor material is caused to flow toward the channel and enter the mold. The liquid crystal long molecules of the liquid phase precursor material are aligned in a direction of flow. The liquid phase precursor material is injected into the mold to form a thermally conductive module embryo. ;

Then, the heat-conducting module embryo body is carbonized, and is performed in a heating environment that is isolated from oxygen to form a heat-conducting module with high heat conduction efficiency.

2. The manufacturing process of a high-efficiency thermally conductive module according to claim 1, characterized in that: the precursor material is a carbon precursor material having a nitrogen component, and the carbonization temperature of the precursor material is above 1000 degrees Celsius. The embryo body is heated in an environment higher than 1000 degrees Celsius to form a flexible thermally conductive module.

'3. The high-efficiency thermally conductive module manufacturing process according to claim 1, characterized in that: the carbonized treatment of the thermally conductive module embryo body is graphitized, so that the long molecules are connected in the same direction in the long axis direction arrangement.

4. A high-efficiency heat-conducting module, comprising:-a body composed of a carbide of an aromatic polymer material having liquid crystal characteristics, a member integrally formed by a mold, and a long liquid crystal inside The molecules are formed neatly in the direction of the molding flow;

Most of the thermally conductive wings are composed of carbides of aromatic polymer materials with liquid crystal characteristics. They are integrally formed with a mold and connected to the body. The liquid crystal long molecules inside the thermally conductive wings form a neat array in the direction of molding flow. The liquid crystal long molecules inside the thermally conductive wings form liquid crystal long molecules connected to the inside of the body along the molding flow direction.

5. The high-efficiency heat-conducting module according to claim 4, further comprising an air exhaust component installed on a side of the heat-conducting wing, and the position of the air outlet of the air exhaust component is blown gas. Flow is passed through the thermally conductive wings.

6. The high-efficiency heat-conducting module according to claim 5, wherein the position of the air outlet of the exhaust component is a gap through which the blown gas can flow through the heat-conducting wing.