MXPA03010135A - CUBIERTA DE BLINDAJE CON DISIPADOR TERMICO PARA CIRCUITOS ELeCTRICOS. - Google Patents

CUBIERTA DE BLINDAJE CON DISIPADOR TERMICO PARA CIRCUITOS ELeCTRICOS.

Info

Publication number
MXPA03010135A
MXPA03010135A MXPA03010135A MXPA03010135A MXPA03010135A MX PA03010135 A MXPA03010135 A MX PA03010135A MX PA03010135 A MXPA03010135 A MX PA03010135A MX PA03010135 A MXPA03010135 A MX PA03010135A MX PA03010135 A MXPA03010135 A MX PA03010135A
Authority
MX
Mexico
Prior art keywords
casing
heat sink
inwardly projecting
projecting element
electric circuit
Prior art date
Application number
MXPA03010135A
Other languages
English (en)
Inventor
Yoong Lum Lye
Original Assignee
Thomson Licensing Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing Sa filed Critical Thomson Licensing Sa
Publication of MXPA03010135A publication Critical patent/MXPA03010135A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Se describe una cubierta para circuitos electricos, la cual suministra blindajes a los circuitos protegiendolos de los fenomenos de EMI. E l circuito tiene un medio para establecer contacto termico con los componentes generadores de calor dentro de la cubierta, lo que permite utilizar la cubierta como un disipador termico para disipar el calor. La cubierta comprende un armazon, una cubierta y un elemento que se proyecta hacia adentro para hacer contacto termicamente con la fuente de calor dentro de la cubierta. El elemento que se proyecta hacia adentro se disena de manera que no provoca abertura alguna en la cubierta. El elemento que se proyecta hacia adentro puede ser una parte integral del armazon o la cubierta y todas las partes de la cubierta se pueden producir ventajosamente utilizando procedimientos de corte y doblado.
MXPA03010135A 2002-11-12 2003-11-06 CUBIERTA DE BLINDAJE CON DISIPADOR TERMICO PARA CIRCUITOS ELeCTRICOS. MXPA03010135A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02292807A EP1420623A1 (en) 2002-11-12 2002-11-12 Shield casing with heat sink for electric circuits

Publications (1)

Publication Number Publication Date
MXPA03010135A true MXPA03010135A (es) 2004-05-17

Family

ID=32116334

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03010135A MXPA03010135A (es) 2002-11-12 2003-11-06 CUBIERTA DE BLINDAJE CON DISIPADOR TERMICO PARA CIRCUITOS ELeCTRICOS.

Country Status (6)

Country Link
US (1) US20050018411A1 (es)
EP (1) EP1420623A1 (es)
JP (1) JP2004165664A (es)
KR (1) KR20040042814A (es)
CN (1) CN1499923A (es)
MX (1) MXPA03010135A (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4350594B2 (ja) * 2004-05-31 2009-10-21 シャープ株式会社 高周波ユニット
EP1796449B1 (en) * 2004-09-27 2010-05-05 Murata Manufacturing Co., Ltd. Shield case
JP2006303106A (ja) * 2005-04-19 2006-11-02 Denso Corp 電子回路装置
CN100463594C (zh) * 2005-06-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 具有散热功能的电磁屏蔽装置
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
CN101340806B (zh) * 2007-07-06 2012-10-31 莱尔德电子材料（上海）有限公司 屏蔽装置和制造屏蔽装置的方法
US7638717B1 (en) * 2008-08-06 2009-12-29 Apple Inc. Can spring housing contact
FR2951048A1 (fr) * 2009-10-07 2011-04-08 Valeo Vision Module de commande electronique pour un dispositif d'eclairage et/ou signalisation de vehicule
CN202738373U (zh) * 2012-01-18 2013-02-13 中怡(苏州)科技有限公司 具散热型电磁屏蔽遮罩的电子装置
CN102647895A (zh) * 2012-04-23 2012-08-22 昆山诚业德精密模具有限公司 负压式屏蔽罩
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
US9603280B2 (en) 2014-05-30 2017-03-21 EMC IP Holding Company LLC Flash module
US9398720B1 (en) 2014-05-30 2016-07-19 Emc Corporation Chassis with airflow and thermal management
US10061363B2 (en) * 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
US10080300B1 (en) 2015-12-29 2018-09-18 EMC IP Holding Company LLC Mechanical latch module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138797A (ja) * 1988-11-18 1990-05-28 Matsushita Electric Ind Co Ltd 電子機器
JPH03255697A (ja) * 1989-12-04 1991-11-14 Hitachi Ltd 集積回路用放熱構造体
JPH10190263A (ja) * 1996-12-27 1998-07-21 Alps Electric Co Ltd 電子部品の放熱構造
EP1248507A1 (de) * 2001-04-04 2002-10-09 Siemens Aktiengesellschaft Hochfrequenzmodul eines Audio-Gerätes mit optimierter Wärmeableitung

Also Published As

Publication number Publication date
KR20040042814A (ko) 2004-05-20
US20050018411A1 (en) 2005-01-27
JP2004165664A (ja) 2004-06-10
EP1420623A1 (en) 2004-05-19
CN1499923A (zh) 2004-05-26

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