CN1953646A - 能防电磁干扰的散热装置 - Google Patents
能防电磁干扰的散热装置 Download PDFInfo
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- CN1953646A CN1953646A CNA2005101004922A CN200510100492A CN1953646A CN 1953646 A CN1953646 A CN 1953646A CN A2005101004922 A CNA2005101004922 A CN A2005101004922A CN 200510100492 A CN200510100492 A CN 200510100492A CN 1953646 A CN1953646 A CN 1953646A
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- electromagnetic interference
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- 229910003726 AI2O3 Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound 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[O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000011957 aluminium oxide Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
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- 230000001627 detrimental Effects 0.000 description 1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans, caps, conformal shields having multiple parts, e.g. frames mating with lids
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- H—ELECTRICITY
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- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【技术领域】本发明涉及一种散热装置,特别是一种能防电磁干扰的散热装置。
【背景技术】随着高科技的蓬勃发展,电子元件如CPU的体积趋于微小化,而且单位面积上的密集度也越来越高,其效能更是不断增强,在这些因素之下,电子元件的总发热量几乎逐年升高,倘若没有良好的散热方式来排除电子元件所产生的热量,过高的温度将导致电子元件产生电子游离(Thermal Runaway)与热应力(Thermal Stress)等现象,造成整体稳定性降低,以及缩短电子元件本身的寿命。为了散发电子元件产生的热量,通常借助散热器来散发上述热量。
请参照图1,揭示了一种传统的散热器10。所述散热器10安装于电子元件上,其包括多个散热片12,用于散发电子元件产生的热量。然而,因现有的电子元件通常整合了各种高频电路、数字电路和模拟电路,电子元件在工作会产生大量的电磁波,且这种散热器10没有其它结构以屏蔽所述电子元件产生的电磁波,也不能屏蔽其它电子元件产生的电磁波。故所述电子元件和其它电子元件会互相产生电磁干扰(Electromagnetic Interference,EMI),其不仅影响电子元件的功能,而且危害人体健康。因而如何协调防EMI和散热两者的关系,成为散热器制作中亟待解决的问题。
【发明内容】为解决上述现有技术存在的不足,有必要提供一种既能防电磁干扰又能散热的散热装置。
一种能防电磁干扰的散热装置,用于防电磁干扰及散发电子元件产生的热量,其包括一散热器和一防磁盖。所述防磁盖包括至少一固持片,所述散热器包括至少一收容槽,所述固持片收容在所述收容槽中。
作为上述技术方案的进一步改进,所述散热器包括一开口,所述固持片为一对并设置于所述开口的一对相对侧壁上。所述散热器包括一本体,所述收容槽为一对并设置于所述本体的一对相对侧壁上。
作为上述技术方案的进一步改进,所述散热器包括多个散热片,所述散热片设置于所述本体的一表面。所述散热装置还包括一导热片,所述导热片贴于本体的另一表面。所述导热片为矽胶片或具相变化的氧化铝/铝箔。
因所述能防电磁干扰的散热装置不仅包括能防EMI的防磁盖而且包括散热器,从而使得安装于其中的电子元件既可以防止外部电子元件产生的电磁波干扰其本身,又可以防止其本身产生的电磁波干扰外部电子元件,同时可有效降低所述电子元件的温度,进而保证了所述电子元件的性能。
【附图说明】下面参照附图结合实施例对本发明作进一步的描述。
图1是现有散热器的立体图。
图2是本发明实施方式中能防电磁干扰的散热装置与电路板的立体分解图。
图3是本发明实施方式中能防电磁干扰的散热装置与电路板的立体组装图。
图4是本发明实施方式中能防电磁干扰的散热装置与电路板的立体组装剖视图。
【具体实施方式】请参照图2,揭示了本发明实施方式的能防电磁干扰的散热装置,其固定于一具有电子元件52的电路板50上。所述散热装置既可以散发电子元件52产生的热量又可以防电磁干扰(Electromagnetic Interference,EMI),其包括一散热器20、一防磁盖30及一导热片40。
所述散热器20包括一本体22和多个散热片24。散热片24垂直于本体22的一表面,并互相平行。散热片24和本体22为一体成型。本体22的两侧壁分别开设一收容槽220。在其它实施方式中,收容槽220也可设置于散热片24。
所述防磁盖30包括一顶壁32和四个与顶壁32垂直的侧壁34。请同时参照图4,顶壁32和所述侧壁34共同围成一收容空间300,其用于收容电子元件52。顶壁32的中间开设一开口320,其长度和宽度大致等于散热器20的本体。在开口320的一对相对侧壁各有一固持片322,其可收容于散热器20的收容槽220中。
导热片40可贴于散热器20本体22的另一表面,其为矽胶片或具相变化的氧化铝或铝箔等材质,也可为其它能够导热的材质。
请参照图3和图4,组装时,先将导热片40贴于散热器20,再使防磁盖30的固持片322收容于散热器20的收容槽220中。这样,导热片40、散热器20及防磁盖30便组装为一体。然后将该组装体盖于电路板50的电子元件52之上。从而,安装于所述散热装置的电子元件52既可以屏蔽其它电子元件产生的电磁波,又可以防止电子元件52产生的电磁波干扰其它电子元件,同时可有效降低电子元件52的温度,进而保证了电子元件52的性能。
当需要更换电子元件52或维修电子元件52时,只需使防磁盖30的固持片322脱离散热器20的收容槽220,便可拆卸散热器20,这样就可更换或维修电子元件52。换而言之,不需要拆卸防磁盖30就可更换或维修电子元件52,使得电子元件52的更换或维修变得更容易。
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US11/308,587 US20070086170A1 (en) | 2005-10-18 | 2006-04-10 | Heat sink device with shielding member |
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