CN201336790Y - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN201336790Y CN201336790Y CN 200820303134 CN200820303134U CN201336790Y CN 201336790 Y CN201336790 Y CN 201336790Y CN 200820303134 CN200820303134 CN 200820303134 CN 200820303134 U CN200820303134 U CN 200820303134U CN 201336790 Y CN201336790 Y CN 201336790Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- grounding parts
- radiating
- electronic component
- electronic components
- Prior art date
Links
- 239000002184 metals Substances 0.000 claims abstract description 9
- 229910052751 metals Inorganic materials 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims description 2
- 210000000614 Ribs Anatomy 0.000 abstract 2
- 230000002452 interceptive Effects 0.000 abstract 1
- 239000000463 materials Substances 0.000 description 2
- 239000011257 shell materials Substances 0.000 description 2
- 229910003726 AI2O3 Inorganic materials 0.000 description 1
- 206010063832 Electromagnetic interference Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound 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[O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000011957 aluminium oxide Substances 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 230000001627 detrimental Effects 0.000 description 1
- 238000010586 diagrams Methods 0.000 description 1
- 238000005516 engineering processes Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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Abstract
一种散热装置，设置于包括电子元件的电路板上，用于防电磁干扰及散发电子元件产生的热量。散热装置包括散热器和多个接地部。散热器包括底板、多个散热片和多个通孔，所述通孔贯穿所述底板并分布于所述散热片的四周。所述接地部为金属弹片，用于电性连接散热器和电路板。每一个接地部包括弹压片和收容片，所述收容片分别收容于所述通孔中，所述弹压片用于电性连接散热器和电路板。因散热装置不仅包括能防电磁干扰的接地部而且包括散热器，从而使得安装于其中的电子元件既可以防止外部电子元件产生的电磁波干扰其本身，又可以防止其本身产生的电磁波干扰外部电子元件，同时可有效降低所述电子元件的温度，进而保证了所述电子元件的性能。
Description
技术领域
本实用新型涉及一种散热装置，尤其涉及一种能防电磁干扰的散热装置。 背景技术随着高科技的蓬勃发展，电子元件如CPU的体积趋于微小化，而且单位面积上的密集度也越来越高，其效能更是不断增强，在这些因素之下，电子元件的总发热量几乎逐年升高， 倘若没有良好的散热方式来排除电子元件所产生的热量，过高的温度将导致电子元件产生电子游离（Thermal Runaway)与热应力（Thermal Stress)等现象，造成整体稳定性降低，以及縮短电子元件本身的寿命。为了散发电子元件产生的热量，通常借助散热器来散发上述热量请参照图l，揭示了一种传统的散热器IO。所述散热器10安装于电子元件上，其包括多个散热片12，用于散发电子元件产生的热量。然而，因现有的电子元件通常整合了各种高频电路、数字电路和模拟电路，电子元件在工作会产生大量的电磁波，且这种散热器10没有其它结构以屏蔽所述电子元件产生的电磁波，也不能屏蔽其它电子元件产生的电磁波。故所述电子元件和其它电子元件会互相产生电磁干扰（Electromagnetic Interference, EMI)， 其不仅影响电子元件的功能，而且危害人体健康。因而如何协调防EMI和散热两者的关为， 成为散热器制作中亟待解决的问题。
实用新型内容有鉴于此，需提供提供一种既能防电磁干扰又能散热的散热装置。
一种散热装置，设置于包括电子元件的电路板上，用于防电磁干扰及散发电子元件产生的热量。散热装置包括散热器和多个接地部。散热器包括底板、多个散热片和多个通孔，所述通孔贯穿所述底板并分布于所述散热片的四周。所述接地部为金属弹片，用于电性连接所述散热器和所述电路板。每一接地部包括弹压片和收容片，所述收容片分别收容于所述通孔中，所述弹压片用于电性连接所述散热器和所述电路板。
因本实用新型的散热装置，不仅包括能防电磁干扰的接地部而且包括散热器，从而使得安装于其中的电子元件既可以防止外部电子元件产生的电磁波干扰其本身，又可以防止其本身产生的电磁波干扰外部电子元件，同时可有效降低所述电子元件的温度，进而保证了所述电子元件的性能。
附图说明
图l为现有散热器的立体图。
图2为本实用新型的散热装置的立体分解图。
图3为图2的立体组装图。
具体实施方式
请参照图2，揭示了本实用新型实施方式的散热装置100。散热装置100既能防电磁干扰 (Electromagnetic Interference, EMI)又能散热，其设置于电路板50上。 电路板50包括电子元件52和一对第一安装孔54。
散热装置100既可以散发电子元件52产生的热量又可以防电磁干扰（Electromagnetic Interference, EMI)，其固定于电路板50上。所述散热装置100包括散热器20、多个接地部 30及导热片40。
散热器20包括底板22和多个散热片24。所述散热片24呈长方体分布并垂直于底板22的一表面，且互相平行。所述散热片24和底板22为一体成型。
底板22包括多个排通孔220和一对第二安装孔222，所述通孔220呈矩形并分布于所述散热片24的四周。所述第二安装孔222位于底板22的一对角并与电路板50的第一安装孔54—一对应。
所述接地部30为金属弹片，用于电性连接散热器20和电路板50以防电磁干扰。每一接地部30的截面呈S形，其包括多个弹压片32、本体34及多个收容片36，所述弹压片32和所述收容片36分别从本体34的两侧边相对弯曲延伸，且所述弹压片32和所述收容片36的延伸方向相反。所述弹压片32、所述收容片36及本体34为一体成型。所述弹压片32和所述收容片36均具有一定的弹性。
每一接地部30可以为单个金属弹片或多个金属弹片的组合体。在使用时，可以根据具体情况使用单个或多个金属弹片。而且可以视需要选择散热器20的通孔220安装单个金属弹片或多个金属弹片，在使用和设计上均具有弹性，以满足各种不同的需求，从而降低成本。
导热片40可贴于散热器20的底板22的底部，其为硅胶片或具相变化的氧化铝或铝箔等材质，也可为其它能够导热的材质。
请参照图3，组装时，将导热片40贴于散热器20的底板22的底部，使接地部30的收容片 36分别收容于散热器20的收容槽220中， 一对固持件60分别穿过第二装孔220锁固于第一装孔 54中。这样，导热片40、散热器20及所述接地部30便组装为一体。组装后，所述弹压片32分别与电路板50的接地电性连接，从而，安装于散热装置100中的电子元件52既可以屏蔽其它电子元件产生的电磁波，又可以防止电子元件52产生的电磁波干扰其它电子元件，同时可有效降低电子元件52的温度，进而保证了电子元件52的性能。
当需要更换电子元件52或维修电子元件52时，只需使接地部30的固持片322脱离散热器 20的收容槽220，便可拆卸散热器20，这样就可更换或维修电子元件52，使得电子元件52的更换或维修变得更容易。
Claims (3)
1. 一种散热装置，设置于包括电子元件的电路板上，用于防电磁干 扰及散发电子元件产生的热量，其特征在于，所述散热装置包括：
散热器，包括底板、多个散热片和多个通孔，所述通孔贯穿所述底板并分布于所述散 热片的四周；及
多个接地部，用于电性连接所述散热器和所述电路板，所述接地部为金属弹片，每一 个接地部包括弹压片和收容片，所述收容片分别收容于所述通孔中，所述弹压片用于电性连 接所述散热器和所述电路板。
2.如权利要求l所述的散热装置，其特征在于，每一个接地部还包括 本体，所述弹压片和所述收容片分别从所述本体的两侧边相对弯曲延伸，且所述弹压片和所 述收容片的延伸方向相反。
3.如权利要求l所述的散热装置，其特征在于，每一个接地部的截面
呈S形。
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| CN 200820303134 CN201336790Y (zh) | 2008-12-05 | 2008-12-05 | 散热装置 |
| US12/494,259 US7924568B2 (en) | 2008-12-05 | 2009-06-29 | Heat sink device with a shielding member |
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| CN104066290A (zh) * | 2013-03-21 | 2014-09-24 | 三星电机株式会社 | 外壳及具有该外壳的电源模块 |
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| TWI439190B (zh) * | 2012-07-13 | 2014-05-21 | Wistron Corp | 電路板及其散熱裝置 |
| TWI566673B (zh) * | 2012-08-20 | 2017-01-11 | 鴻準精密工業股份有限公司 | 散熱器組合 |
| US9357677B2 (en) * | 2012-09-26 | 2016-05-31 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device with efficient heat radiation structure for electronic components |
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| CN105849897B (zh) * | 2014-10-17 | 2019-09-27 | 华为技术有限公司 | 散热屏蔽结构及通信产品 |
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| DE102015001148B4 (de) * | 2015-01-30 | 2019-04-11 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
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| CN104066290A (zh) * | 2013-03-21 | 2014-09-24 | 三星电机株式会社 | 外壳及具有该外壳的电源模块 |
| CN104066290B (zh) * | 2013-03-21 | 2017-04-12 | 三星电机株式会社 | 外壳及具有该外壳的电源模块 |
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| US20100142153A1 (en) | 2010-06-10 |
| US7924568B2 (en) | 2011-04-12 |
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