JPS5742154A - Heat pipe type heat sink - Google Patents

Heat pipe type heat sink

Info

Publication number
JPS5742154A
JPS5742154A JP11760680A JP11760680A JPS5742154A JP S5742154 A JPS5742154 A JP S5742154A JP 11760680 A JP11760680 A JP 11760680A JP 11760680 A JP11760680 A JP 11760680A JP S5742154 A JPS5742154 A JP S5742154A
Authority
JP
Japan
Prior art keywords
fins
block
heat pipe
flanges
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11760680A
Other languages
Japanese (ja)
Other versions
JPS634351B2 (en
Inventor
Shinichi Ishida
Hideo Sakurai
Susumu Ogiwara
Takashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP11760680A priority Critical patent/JPS5742154A/en
Publication of JPS5742154A publication Critical patent/JPS5742154A/en
Publication of JPS634351B2 publication Critical patent/JPS634351B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the heat sink which can be readily assembled, by providing a concave groove in a block for mounting heat radiating body, coupling a part of a circumference of a heat pipe with the groove, and fixing the rest of the heat pipe to the block by fins having flanges and their pushing plates. CONSTITUTION:The pushing plate 8 is inverted and the fins 1 are inserted in holes 9. Pushing parts 10 of the plate 8 and the flanges 7 of the fins 1 are aligned, and the heat pipe 2 is mounted on the semicircular parts of the flanges 7. When the block 6 for mounting heat radiating bodies is fixed to the protruded parts of the pipe 2 by screws 11, the device is completed. In this constitution, machining of a comb shaped part is not required in the block 6, and cost is reduced. The adjustment of the pitch is completed by only inserting the fins to the openings having a specified pitch, and the assembly is very simple.
JP11760680A 1980-08-26 1980-08-26 Heat pipe type heat sink Granted JPS5742154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11760680A JPS5742154A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11760680A JPS5742154A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Publications (2)

Publication Number Publication Date
JPS5742154A true JPS5742154A (en) 1982-03-09
JPS634351B2 JPS634351B2 (en) 1988-01-28

Family

ID=14715929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11760680A Granted JPS5742154A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Country Status (1)

Country Link
JP (1) JPS5742154A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140447U (en) * 1983-03-08 1984-09-19 古河電気工業株式会社 Heat pipe type heat sink
US5964285A (en) * 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US6009936A (en) * 1997-04-17 2000-01-04 Sanyo Electric Co., Ltd. Heat exchanger
WO2001013430A1 (en) * 1999-08-18 2001-02-22 Sony Computer Entertainment Inc. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
GB2393327A (en) * 2002-09-17 2004-03-24 Hewlett Packard Development Co Heatsink with heat pipe and fins
US6742573B2 (en) 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
JP2004228484A (en) * 2003-01-27 2004-08-12 Toshiba Corp Cooling device and electronic device
US7140422B2 (en) 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US7143819B2 (en) 2002-09-17 2006-12-05 Hewlett-Packard Development Company, L.P. Heat sink with angled heat pipe
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US7347251B2 (en) 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US20110000648A1 (en) * 2009-07-01 2011-01-06 Chao-Nan Chien Heat dissipation module
US8230908B2 (en) 2006-01-05 2012-07-31 International Business Machines Corporation Heat sink for dissipating a thermal load

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140447U (en) * 1983-03-08 1984-09-19 古河電気工業株式会社 Heat pipe type heat sink
US6009936A (en) * 1997-04-17 2000-01-04 Sanyo Electric Co., Ltd. Heat exchanger
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
US5964285A (en) * 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
WO2001013430A1 (en) * 1999-08-18 2001-02-22 Sony Computer Entertainment Inc. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US6357514B1 (en) 1999-08-18 2002-03-19 The Furukawa Electric Co. Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US6742573B2 (en) 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US7143819B2 (en) 2002-09-17 2006-12-05 Hewlett-Packard Development Company, L.P. Heat sink with angled heat pipe
US6894900B2 (en) 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
GB2393327B (en) * 2002-09-17 2006-01-25 Hewlett Packard Development Co Heat sink with heat pipe and base fins
US7140422B2 (en) 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
GB2393327A (en) * 2002-09-17 2004-03-24 Hewlett Packard Development Co Heatsink with heat pipe and fins
JP2004228484A (en) * 2003-01-27 2004-08-12 Toshiba Corp Cooling device and electronic device
US7347251B2 (en) 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US8230908B2 (en) 2006-01-05 2012-07-31 International Business Machines Corporation Heat sink for dissipating a thermal load
US9230881B2 (en) 2006-01-05 2016-01-05 International Business Machines Corporation Heat sink for dissipating a thermal load
US20110000648A1 (en) * 2009-07-01 2011-01-06 Chao-Nan Chien Heat dissipation module

Also Published As

Publication number Publication date
JPS634351B2 (en) 1988-01-28

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