CN102623416B - 一种射频功放模块的功率器件无封装结构及其组装方法 - Google Patents

一种射频功放模块的功率器件无封装结构及其组装方法 Download PDF

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CN102623416B
CN102623416B CN201210122141.1A CN201210122141A CN102623416B CN 102623416 B CN102623416 B CN 102623416B CN 201210122141 A CN201210122141 A CN 201210122141A CN 102623416 B CN102623416 B CN 102623416B
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马强
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Innogration Suzhou Co Ltd
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Abstract

本发明公开了一种射频功放模块的功率器件无封装结构及其组装方法，所述射频功放模块包括功率器件、散热板以及印刷线路板，功率器件嵌在印刷线路板内，散热板设于功率器件与印刷线路板下方，所述功率器件包括载体法兰、若干电子元件以及引线，电子元件按设计要求直接焊接在载体法兰上，功率器件与印刷线路板焊接固定在散热板上，功率器件上的电子元件通过引线互相联接，所述电子元件通过引线直接连接与印刷线路板相连。本发明可很好地避免封装器件所带来的问题，极大地放宽了用户使用器件的灵活性，在节省了成本的同时，获得了设计的自由度和性能提升，同时可实现客户定制化设计需要。

Description

一种射频功放模块的功率器件无封装结构及其组装方法
技术领域
本发明涉及无线通信领域的射频功放设计，具体涉及一种射频功放模块的功率器件无封装结构以及针对该结构的组装方法。
背景技术
目前在无线通信领域，主流的大功率射频功放模块的结构如图1所示，其包括封装功率器件、印刷线路板以及设于封装功率器件和印刷线路板下方的散热板。封装功率器件带有陶瓷封装，用户在使用的时候，封装器件内部对用户是屏蔽的，用户不能对内部预匹配做任何改动，器件的性能极大部分由器件提供厂家的设计所限定。另外，如图2所示，由于传统的封装功率器件有输入输出引脚，用户在使用的时候，封装功率器件上的电子元件通过引线（Bond-wire）与输入输出引脚连接，输入输出引脚再焊接固定在印刷线路板上使得功率器件与印刷线路板构成电联接，因而用户的印刷线路板的导电宽度就不能窄于封装器件的宽度，这与当前对设备小型化要求的趋势产生了矛盾。同时，由于封装器件的封装必然带来寄生电容影响，而输入输出引脚必然有其自身的电感，当输入输出引脚与印刷线路板之间的焊接工艺所带来的误差也较大，这会对器件的匹配电路带来直接影响，从而影响器件性能指标。
发明内容
本发明目的在于提供一种射频功放模块的功率器件无封装结构及其组装方法，本发明可很好地避免封装器件所带来的问题，极大地放宽了用户使用器件的灵活性，较大地节省了成本的同时，获得了设计的自由度和性能提升，同时可实现客户定制化设计需要。
为了解决现有技术中的这些问题，本发明提供的技术方案是：
一种射频功放模块的功率器件无封装结构，所述射频功放模块包括功率器件、散热板以及印刷线路板，功率器件嵌在印刷线路板内，散热板设于功率器件与印刷线路板下方，所述功率器件包括载体法兰、若干电子元件以及引线，电子元件按设计要求贴在载体法兰上，功率器件与印刷线路板焊接固定在散热板上，功率器件上的电子元件通过引线互相联接，所述电子元件通过引线直接连接与印刷线路板相连。
进一步的，所述射频功放模块还包括屏蔽框，所述屏蔽框用于保护印刷线路板的内部元器件以及设于印刷线路板上的功率器件。
进一步，所述电子元件包括管芯、MOS电容，管芯以及MOS电容通过晶片焊接设备直接焊接在载体法兰上，所述载体法兰再焊接在散热板上，所述功率器件上的电子元件的上表面与印刷线路板的上表面平齐。电子元件的上表面与印刷线路板平齐那么在后期打线时，管芯与印刷线路板间的引线的角度则更为平缓，降低了引线所引入的电感。此处电子元件的上表面与印刷线路板的上表面平齐为优选方案，电子元件的上表面并不仅限于与印刷线路板的上表面平齐。另外，有些场合下功率器件上的电子元件还包括集成无源器件，所述集成无源器件与其余电子元件间的连接以及与PCB板的连接，均通过引线直接连接。
进一步，所述功率器件外设有保护盖，所述保护盖固定在印刷线路板上，所述保护盖完全覆盖功率器件构成封闭腔体，用于保护功率器件防止杂物进入功率器件。保护盖可有效保护功率器件表面的电子元件及引线，防止外部杂物（例如脱落的焊锡膏）进入功率器件表面，同时防止外来微分子物质的污染以及外力引起的破坏。另外，保护盖通过卡槽连接固定或者螺栓固定在印刷线路板上，可以方便地拆卸安装，便于功率器件后期的调试与检查。
更进一步，所述保护盖与印刷线路板相连的边缘打有胶水。通过打胶将保护盖与印刷线路板间的连接缝隙填补之后，使得保护盖的密闭保护效果更佳。
对于散热板，目前一般采用铜、铜钨合金或者铜钼铜金属进行制备，有利于热量散发。
本发明还提供了一种射频功放模块无封装结构的组装方法，具体包括下列组装步骤：
首先根据设计需要选择载体法兰材料及尺寸，将电子元件通过设备焊接在载体法兰上；
然后将贴有电子元件的载体法兰焊接在散热板上，再将印刷线路板与载体法兰的位置相对匹配（在印刷线路板开口且开口与载体法兰形状、位置匹配）后焊接固定在散热板上；
最后根据设计要求通过打线设备进行与匹配电路的打线工作，管芯、MOS电容直接通过引线与印刷线路板相连。
对于上述组装方法，作为优化，所述功率器件外设有保护盖，所述保护盖固定在印刷线路板上，所述保护盖完全覆盖功率器件构成封闭腔体，所述保护盖与印刷线路板的连接处打有胶水。
相对于现有技术中的方案，本发明的优点是：
本发明中所采用的功率器件与传统封装功率器件相比较没有陶瓷封装以及输入输出引脚，本发明可通过引线直接将功率器件的元器件与印刷线路板联接。由于本发明中的功率器件对用户是开放的，提高了本发明设计的自由度，另外，由于采用的功率器件没有输入输出引脚、焊料以及设于输入输出引脚与载体法兰之间的陶瓷窗框，因而避免了不必要的电感引入，缩短了管芯与印刷线路板之间的水平距离，降低了引线电感，可增加功率器件与印刷线路板间的集成精准度，提高了射频功放模块的性能。
附图说明
下面结合附图及实施例对本发明作进一步描述：
图1为现有射频功放模块的结构示意图；
图2为现有射频功放模块中封装功率器件的打线示意图；
图3为本发明实施例射频功放模块的结构示意图；
图4为本发明实施例射频功放模块中功率器件的打线示意图；
图5为本发明实施例射频功放模块的另一种结构示意图；
图6为本发明实施例射频功放模块的再一种结构示意图；
其中：1、功率器件；2、印刷线路板；3、散热板；4、输入输出引脚；5、载体法兰；6、管芯；7、引线；8、MOS电容；9、封装外壳；10、电磁波干扰屏障；11、保护盖；12、驱动管芯；13、集成无源器件；14、集成无源器件。
具体实施方式
以下结合具体实施例对上述方案做进一步说明。应理解，这些实施例是用于说明本发明而不限于限制本发明的范围。实施例中采用的实施条件可以根据具体厂家的条件做进一步调整，未注明的实施条件通常为常规实验中的条件。
实施例：
本实施例所描述的射频功放模块的功率器件无封装结构如图3所示，所述射频功放模块包括功率器件1、散热板3、印刷线路板2以及电磁波干扰屏障10，功率器件1嵌在印刷线路板2内，散热板3设于功率器件1与印刷线路板2下方，所述功率器件1包括载体法兰5、若干电子元件以及引线7，电子元件按设计要求贴在载体法兰5上，功率器件1与印刷线路板2焊接固定在散热板3上，功率器件1上的电子元件通过引线7互相联接，所述管芯6、MOS电容8通过引线7直接连接与印刷线路板2相连，所述电磁波干扰屏障10完全覆盖印刷线路板2，用于保护印刷线路板2的内部元器件以及设于印刷线路板2上的功率器件1。
功率器件1上的电子元件包括管芯6、MOS电容8，管芯6以及MOS电容8通过晶片焊接设备焊接在载体法兰5上，所述载体法兰5再焊接在散热板3上，所述功率器件1上的电子元件的上表面与印刷线路板2的上表面平齐。所述功率器件1上的管芯6、MOS电容8通过引线7直接连接在印刷线路板2上。
所述功率器件外设有保护盖11，所述保护盖11固定在印刷线路板2上，所述保护盖11完全覆盖功率器件1构成封闭腔体，用于保护功率器件1防止杂物进入功率器件1。保护盖11通过卡槽连接固定在印刷线路板2上，可以方便地拆卸安装，便于功率器件1后期的调试与检查。
所述保护盖11与印刷线路板2相连的边缘打有胶水。通过打胶将保护盖11与印刷线路板2间的连接缝隙填补之后，使得保护盖11的密闭保护效果更佳。
本实施例还提供了一种射频功放模块无封装结构的组装方法，该组装方法基于上述射频功放模块的功率器件无封装结构，具体包括下列组装步骤：
首先根据设计需要选择载体法兰5材料及尺寸，将管芯6及MOS电容8通过设备焊接在载体法兰5上；
然后将贴有管芯6及MOS电容8的载体法兰5焊接在散热板3上，再将印刷线路板2与载体法兰5的位置相对匹配（在印刷线路板2开口且开口与载体法兰5形状、位置匹配）后焊接固定在散热板3上；
最后根据设计要求通过打线设备进行与匹配电路的打线工作，管芯6、MOS电容8直接通过引线7与印刷线路板2相连。
本实施例中所采用的功率器件1与传统封装功率器件相比较没有陶瓷封装以及输入输出引脚4，本发明可通过引线7直接将功率器件1的元器件与印刷线路板2联接。由于本实施例中的功率器件1对用户是开放的因而可在装配完成后在后期测试基础上进行微调，而传统封装功率器件采用封装外壳9罩住内部功率器件，并且封装外壳9是呈盒状固定在输入输出引脚4上且不可自由打开。基于以上特点，本发明提高了设计自由度，另外，由于采用的功率器件1没有输入输出引脚4，因而避免了不必要的电感引入，提高了射频功放模块的性能。
当功率器件1的载体法兰5较厚时，载体法兰5的设置如图5所示，设计人员可在散热板3上挖出与载体法兰5相配的容腔，将载体法兰5焊接固定在容腔之中，以保持载体法兰5上的电子元件保持与印刷线路板2表面平齐。其余部分的设置连接方式与上述实施例相同。
如图6所示的结构为功率放大模块，为本发明组装方法又一具体使用。图6所示的功率器件1上的电子元件包括管芯6、MOS电容8、驱动管芯12、集成无源器件13、集成无源器件14，管芯6作为输出管芯使用。同样，所述电子元件均通过晶片焊接设备焊接在载体法兰5上，所述载体法兰5再焊接在散热板3上，所述功率器件1上的电子元件的上表面与印刷线路板2的上表面平齐。电子元件间的连接均通过引线7直接连接，与印刷线路板相连的电子元件直接通过引线7实现互联。
上述实例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人是能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所做的等效变换或修饰，都应涵盖在本发明的保护范围之内。

Claims (7)

1.一种射频功放模块，所述射频功放模块包括功率器件、散热板以及印刷线路板，功率器件嵌在印刷线路板内，散热板设于功率器件与印刷线路板下方，其特征在于，所述功率器件为无封装结构功率器件且无输入输出引脚，其包括载体法兰；所述载体法兰内贴装有通过引线连接的若干电子元件，电子元件上表面高于载体法兰上表面，所述载体法兰两端的电子元件直接与印刷线路板打线连接；所述载体法兰嵌在印刷线路板开口中，且与所述开口形状、位置匹配，所述散热板上设置有与载体法兰相配的容腔，载体法兰底部焊接在所述容腔内，所述印刷线路板焊接固定在散热板上，所述功率器件上的电子元件的上表面与印刷线路板的上表面平齐。
2.根据权利要求1 所述的一种射频功放模块，其特征在于，所述电子元件包括管芯，管芯通过晶片焊接设备直接焊接在载体法兰上，管芯通过引线与印刷线路板直接连接。
3.根据权利要求2 所述的一种射频功放模块，其特征在于，所述电子元件包括MOS 电容、集成无源器件，MOS 电容、集成无源器件通过晶片焊接设备直接焊接在载体法兰上，所述电子元件采用引线互相连接，MOS 电容、集成无源器件通过引线与印刷线路板直接连接。
4.根据权利要求1 所述的一种射频功放模块，其特征在于，所述功率器件外设有保护盖，所述保护盖固定在印刷线路板上，所述保护盖完全覆盖功率器件构成封闭腔体，用于保护功率器件防止杂物进入功率器件。
5.根据权利要求4 所述的一种射频功放模块，其特征在于，所述保护盖与印刷线路板相连的边缘打有胶水。
6.一种用于制备权利要求1 所述的射频功放模块的组装方法，其特征在于，具体包括下列组装步骤：
首先根据设计需要选择载体法兰材料及尺寸，将电子元件通过设备焊接在载体法兰上；
然后将贴有电子元件的载体法兰焊接在散热板上，再将印刷线路板与载体法兰的位置相对匹配后焊接固定在散热板上；
最后根据设计要求通过打线设备进行与匹配电路的打线工作，电子元件直接通过引线与印刷线路板相连。
7.根据权利要求6 所述的组装方法，其特征在于，在所述功率器件外设置保护盖，所述保护盖固定在印刷线路板上，所述保护盖完全覆盖功率器件构成封闭腔体，所述保护盖与印刷线路板的连接处打有胶水。
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