CN104681552B - 封装rf功率晶体管器件和rf功率放大器 - Google Patents
封装rf功率晶体管器件和rf功率放大器 Download PDFInfo
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- CN104681552B CN104681552B CN201410693875.4A CN201410693875A CN104681552B CN 104681552 B CN104681552 B CN 104681552B CN 201410693875 A CN201410693875 A CN 201410693875A CN 104681552 B CN104681552 B CN 104681552B
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- 239000003990 capacitor Substances 0.000 claims abstract description 51
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- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
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Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/56—Modifications of input or output impedances, not otherwise provided for
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
- H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
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- H—ELECTRICITY
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
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- H—ELECTRICITY
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- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/665—Bias feed arrangements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/222—A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/387—A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Amplifiers (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13195160.0A EP2879174B1 (en) | 2013-11-29 | 2013-11-29 | Packaged RF power transistor device having next to each other ground leads and a video lead for connecting decoupling capacitors, RF power amplifier |
EP13195160.0 | 2013-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104681552A CN104681552A (zh) | 2015-06-03 |
CN104681552B true CN104681552B (zh) | 2018-04-27 |
Family
ID=49680885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410693875.4A Active CN104681552B (zh) | 2013-11-29 | 2014-11-26 | 封装rf功率晶体管器件和rf功率放大器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9820401B2 (zh) |
EP (1) | EP2879174B1 (zh) |
CN (1) | CN104681552B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3142252B1 (en) * | 2015-09-10 | 2018-11-14 | Ampleon Netherlands B.V. | Video bandwidth in rf amplifiers |
KR101785417B1 (ko) | 2016-04-25 | 2017-10-16 | 이상훈 | 웨이퍼 레벨에서 온도 및 알에프 특성 모니터링이 가능한 알에프 파워 소자 |
NL2017349B1 (en) * | 2016-08-23 | 2018-03-06 | Ampleon Netherlands Bv | Packaged RF power amplifier having a high power density |
CN109891580B (zh) * | 2016-09-22 | 2023-03-28 | 史密斯互连美洲股份有限公司 | 集成弹簧安装芯片终端 |
CN107919351B (zh) * | 2016-10-11 | 2024-08-20 | 苏州远创达科技有限公司 | 一种射频功放模块及其组装方法 |
EP3657186B1 (en) * | 2017-07-18 | 2024-03-27 | Sang-Hun Lee | Rf power device capable of monitoring temperature and rf characteristics at wafer level |
NL2020069B1 (en) * | 2017-12-12 | 2019-06-21 | Ampleon Netherlands Bv | Packaged RF power amplifier |
NL2021545B1 (en) * | 2018-09-03 | 2020-04-30 | Ampleon Netherlands Bv | Power amplifier with decreased RF return current losses |
CN109959861B (zh) * | 2019-02-19 | 2021-02-19 | 昆山微电子技术研究院 | 一种微波键合线寄生效应自适应消除系统 |
CN111478672B (zh) * | 2020-04-10 | 2024-06-11 | 四川和芯微电子股份有限公司 | 射频功率放大器 |
CN114695332A (zh) * | 2020-12-30 | 2022-07-01 | 上海华为技术有限公司 | 一种射频放大器 |
US20230170340A1 (en) * | 2021-11-30 | 2023-06-01 | Qorvo Us, Inc. | Electronic package with interposer between integrated circuit dies |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1623232A (zh) * | 2002-01-24 | 2005-06-01 | 皇家飞利浦电子股份有限公司 | 带有补偿的射频放大器装置 |
CN1750262A (zh) * | 2004-09-16 | 2006-03-22 | 松下电器产业株式会社 | 功率放大器模块 |
CN1909363A (zh) * | 2005-07-26 | 2007-02-07 | 英飞凌科技股份公司 | 半导体功率器件和rf信号放大器 |
CN102570992A (zh) * | 2010-12-10 | 2012-07-11 | Nxp股份有限公司 | 射频放大器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1250717A2 (en) * | 2000-01-28 | 2002-10-23 | Ericsson Inc. | Ldmos power package with a plurality of ground signal paths |
US6734728B1 (en) | 2002-12-19 | 2004-05-11 | Infineon Technologies North America Corp. | RF power transistor with internal bias feed |
US7372334B2 (en) * | 2005-07-26 | 2008-05-13 | Infineon Technologies Ag | Output match transistor |
US20080231373A1 (en) * | 2007-03-20 | 2008-09-25 | Hafizur Rahman | Output Circuit |
US8299856B2 (en) * | 2010-12-20 | 2012-10-30 | Infineon Technologies Ag | Power transistor output match network with high Q RF path and low Q low frequency path |
US8836433B2 (en) * | 2011-05-10 | 2014-09-16 | Skyworks Solutions, Inc. | Apparatus and methods for electronic amplification |
EP2760130B1 (en) * | 2013-01-28 | 2015-07-01 | Nxp B.V. | Bias circuit |
-
2013
- 2013-11-29 EP EP13195160.0A patent/EP2879174B1/en active Active
-
2014
- 2014-10-29 US US14/527,138 patent/US9820401B2/en active Active
- 2014-11-26 CN CN201410693875.4A patent/CN104681552B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1623232A (zh) * | 2002-01-24 | 2005-06-01 | 皇家飞利浦电子股份有限公司 | 带有补偿的射频放大器装置 |
CN1750262A (zh) * | 2004-09-16 | 2006-03-22 | 松下电器产业株式会社 | 功率放大器模块 |
CN1909363A (zh) * | 2005-07-26 | 2007-02-07 | 英飞凌科技股份公司 | 半导体功率器件和rf信号放大器 |
CN102570992A (zh) * | 2010-12-10 | 2012-07-11 | Nxp股份有限公司 | 射频放大器 |
Also Published As
Publication number | Publication date |
---|---|
US20150156910A1 (en) | 2015-06-04 |
EP2879174B1 (en) | 2021-09-08 |
CN104681552A (zh) | 2015-06-03 |
EP2879174A1 (en) | 2015-06-03 |
US9820401B2 (en) | 2017-11-14 |
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