ITTO20030284A1 - Procedimento per la realizzazione di dispositivi optoelettronici incapsulati e dispositivo incapsulato cosi' ottenuto. - Google Patents
Procedimento per la realizzazione di dispositivi optoelettronici incapsulati e dispositivo incapsulato cosi' ottenuto.Info
- Publication number
- ITTO20030284A1 ITTO20030284A1 IT000284A ITTO20030284A ITTO20030284A1 IT TO20030284 A1 ITTO20030284 A1 IT TO20030284A1 IT 000284 A IT000284 A IT 000284A IT TO20030284 A ITTO20030284 A IT TO20030284A IT TO20030284 A1 ITTO20030284 A1 IT TO20030284A1
- Authority
- IT
- Italy
- Prior art keywords
- encapsulated
- implementation
- procedure
- electronic devices
- opto
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000284A ITTO20030284A1 (it) | 2003-04-11 | 2003-04-11 | Procedimento per la realizzazione di dispositivi optoelettronici incapsulati e dispositivo incapsulato cosi' ottenuto. |
US10/924,014 US7141871B2 (en) | 2003-04-11 | 2004-08-23 | Method for manufacturing encapsulated opto-electronic devices and encapsulated device thus obtained |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000284A ITTO20030284A1 (it) | 2003-04-11 | 2003-04-11 | Procedimento per la realizzazione di dispositivi optoelettronici incapsulati e dispositivo incapsulato cosi' ottenuto. |
Publications (1)
Publication Number | Publication Date |
---|---|
ITTO20030284A1 true ITTO20030284A1 (it) | 2004-10-12 |
Family
ID=43723155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000284A ITTO20030284A1 (it) | 2003-04-11 | 2003-04-11 | Procedimento per la realizzazione di dispositivi optoelettronici incapsulati e dispositivo incapsulato cosi' ottenuto. |
Country Status (2)
Country | Link |
---|---|
US (1) | US7141871B2 (it) |
IT (1) | ITTO20030284A1 (it) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013152362A1 (en) * | 2012-04-07 | 2013-10-10 | Axlen, Inc. | High flux high brightness led lighting devices |
US9941242B2 (en) | 2012-04-24 | 2018-04-10 | Innogration (Suzhou) Co., Ltd. | Unpacked structure for power device of radio frequency power amplification module and assembly method therefor |
CN102623416B (zh) * | 2012-04-24 | 2015-09-02 | 苏州远创达科技有限公司 | 一种射频功放模块的功率器件无封装结构及其组装方法 |
WO2016069901A1 (en) | 2014-10-29 | 2016-05-06 | Acacia Communications, Inc. | Optoelectronic ball grid array package with fiber |
CN109346926A (zh) * | 2018-09-29 | 2019-02-15 | 北京凯普林光电科技股份有限公司 | 一种扇形密排激光器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2943760B2 (ja) * | 1997-04-18 | 1999-08-30 | 日本電気株式会社 | 光ファイバ導入部の気密封止方法及び気密封止構造 |
US6585427B2 (en) * | 1999-01-11 | 2003-07-01 | Intel Corporation | Flexure coupled to a substrate for maintaining the optical fibers in alignment |
US6467972B2 (en) * | 2000-02-29 | 2002-10-22 | Kyocera Corporation | Optical interconnection module |
US6883977B2 (en) * | 2000-12-14 | 2005-04-26 | Shipley Company, L.L.C. | Optical device package for flip-chip mounting |
JP2002359426A (ja) * | 2001-06-01 | 2002-12-13 | Hitachi Ltd | 光モジュール及び光通信システム |
-
2003
- 2003-04-11 IT IT000284A patent/ITTO20030284A1/it unknown
-
2004
- 2004-08-23 US US10/924,014 patent/US7141871B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20050093013A1 (en) | 2005-05-05 |
US7141871B2 (en) | 2006-11-28 |
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