FR2858435B1 - Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur - Google Patents

Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur

Info

Publication number
FR2858435B1
FR2858435B1 FR0407350A FR0407350A FR2858435B1 FR 2858435 B1 FR2858435 B1 FR 2858435B1 FR 0407350 A FR0407350 A FR 0407350A FR 0407350 A FR0407350 A FR 0407350A FR 2858435 B1 FR2858435 B1 FR 2858435B1
Authority
FR
France
Prior art keywords
computer elements
cooling computer
disengaging heat
elements disengaging
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0407350A
Other languages
English (en)
Other versions
FR2858435A1 (fr
Inventor
Michael Fiebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Technology Solutions GmbH
Original Assignee
Fujitsu Technology Solutions GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Technology Solutions GmbH filed Critical Fujitsu Technology Solutions GmbH
Publication of FR2858435A1 publication Critical patent/FR2858435A1/fr
Application granted granted Critical
Publication of FR2858435B1 publication Critical patent/FR2858435B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0407350A 2003-07-30 2004-07-02 Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur Expired - Fee Related FR2858435B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10334798A DE10334798B4 (de) 2003-07-30 2003-07-30 Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten

Publications (2)

Publication Number Publication Date
FR2858435A1 FR2858435A1 (fr) 2005-02-04
FR2858435B1 true FR2858435B1 (fr) 2005-11-25

Family

ID=32892473

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0407350A Expired - Fee Related FR2858435B1 (fr) 2003-07-30 2004-07-02 Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur

Country Status (6)

Country Link
US (1) US20050024824A1 (fr)
CN (1) CN1584780A (fr)
DE (1) DE10334798B4 (fr)
FR (1) FR2858435B1 (fr)
GB (1) GB2405033A (fr)
TW (1) TWI275924B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004031588A1 (fr) 2002-09-28 2004-04-15 Ebm-Papst St. Georgen Gmbh & Co. Kg Dispositif et procede de dissipation de la chaleur d'un composant a refroidir
DE102004042034A1 (de) * 2004-08-26 2006-03-16 Laing, Oliver Energieversorgungsvorrichtung für ein elektrisches Gerät und Verfahren zur Bereitstellung elektrischer Energie an Komponenten eines elektrischen Geräts
EP1782665B1 (fr) * 2004-08-26 2013-01-16 Xylem IP Holdings LLC Systeme de refroidissement pour appareil electrique et procede de refroidissement de liquide
KR100744903B1 (ko) * 2006-02-22 2007-08-01 삼성전기주식회사 디커플링 기능을 갖는 다층 기판
US8453467B2 (en) * 2006-10-13 2013-06-04 Dell Products, Lp Hybrid heat exchanger
CN101460039B (zh) * 2007-12-13 2011-04-13 纬创资通股份有限公司 电子装置
DE102011109476B9 (de) * 2011-08-04 2014-04-10 Fujitsu Technology Solutions Intellectual Property Gmbh Server sowie Verfahren zum Kühlen eines Servers
DE102013217615B4 (de) * 2012-09-13 2015-02-26 International Business Machines Corporation Dampfkondensator mit dreidimensional gefalzter Struktur
US8941994B2 (en) 2012-09-13 2015-01-27 International Business Machines Corporation Vapor condenser with three-dimensional folded structure

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
DE69630677T2 (de) * 1996-05-14 2004-09-30 Hewlett-Packard Co. (N.D.Ges.D.Staates Delaware), Palo Alto Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit
US6333849B1 (en) * 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
AU2641799A (en) * 1999-02-26 2000-09-21 Nippon Thermostat Co., Ltd. Cooling device of electronic device
JP3037323B1 (ja) * 1999-03-02 2000-04-24 群馬日本電気株式会社 コンピュータの冷却装置
DE60044093D1 (de) * 1999-10-04 2010-05-12 Asetek As Rechnersystem, das ein kühlsystem beinhaltet und kühlsystem für ein rechnersystem
US6196003B1 (en) * 1999-11-04 2001-03-06 Pc/Ac, Inc. Computer enclosure cooling unit
EP1305700A1 (fr) * 2000-05-25 2003-05-02 Kioan Cheon Ordinateur a refroidisseur et echangeur thermique de ce refroidisseur
US6537019B1 (en) * 2000-06-06 2003-03-25 Intel Corporation Fan assembly and method
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US20020105779A1 (en) * 2001-02-02 2002-08-08 Pei-Chih Lei Cooling system of a computer chassis
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
US6526768B2 (en) * 2001-07-24 2003-03-04 Kryotech, Inc. Apparatus and method for controlling the temperature of an integrated circuit device
TW588823U (en) * 2002-05-13 2004-05-21 Shuttle Inc CPU heat dissipation apparatus having heat conduction pipe
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
US6721180B2 (en) * 2002-07-31 2004-04-13 Infineon Technologies Ag Cooling hood for circuit board
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
US6809928B2 (en) * 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor

Also Published As

Publication number Publication date
CN1584780A (zh) 2005-02-23
US20050024824A1 (en) 2005-02-03
DE10334798B4 (de) 2005-06-23
TW200515125A (en) 2005-05-01
TWI275924B (en) 2007-03-11
FR2858435A1 (fr) 2005-02-04
GB2405033A (en) 2005-02-16
DE10334798A1 (de) 2005-03-10
GB0415655D0 (en) 2004-08-18

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Year of fee payment: 12

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Effective date: 20170331