DE10334798A1 - Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten - Google Patents
Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten Download PDFInfo
- Publication number
- DE10334798A1 DE10334798A1 DE10334798A DE10334798A DE10334798A1 DE 10334798 A1 DE10334798 A1 DE 10334798A1 DE 10334798 A DE10334798 A DE 10334798A DE 10334798 A DE10334798 A DE 10334798A DE 10334798 A1 DE10334798 A1 DE 10334798A1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- computer components
- cooling heat
- generating computer
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Die Erfindung betrifft eine Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten in einem Computergehäuse mit einem zweiten Gehäuse, das einen ersten Kühllüfter aufweist, wobei ein Wärmetauscher, der in einen Kühlmittelstrom integriert ist, so in oder an dem zweiten Gehäuse angeordnet ist, daß ein Kühlluftstrom vor dem Austritt aus dem zweiten Gehäuse den Wärmetauscher durchströmt.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10334798A DE10334798B4 (de) | 2003-07-30 | 2003-07-30 | Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten |
TW093119033A TWI275924B (en) | 2003-07-30 | 2004-06-29 | Arrangement for cooling generating the heat-dissipating computer-components |
FR0407350A FR2858435B1 (fr) | 2003-07-30 | 2004-07-02 | Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur |
GB0415655A GB2405033A (en) | 2003-07-30 | 2004-07-13 | Cooling computer components |
US10/901,819 US20050024824A1 (en) | 2003-07-30 | 2004-07-29 | Arrangement for cooling heat-generating computer components |
CNA2004100588325A CN1584780A (zh) | 2003-07-30 | 2004-07-30 | 冷却发热的计算机部件的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10334798A DE10334798B4 (de) | 2003-07-30 | 2003-07-30 | Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10334798A1 true DE10334798A1 (de) | 2005-03-10 |
DE10334798B4 DE10334798B4 (de) | 2005-06-23 |
Family
ID=32892473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10334798A Expired - Fee Related DE10334798B4 (de) | 2003-07-30 | 2003-07-30 | Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050024824A1 (de) |
CN (1) | CN1584780A (de) |
DE (1) | DE10334798B4 (de) |
FR (1) | FR2858435B1 (de) |
GB (1) | GB2405033A (de) |
TW (1) | TWI275924B (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7509999B2 (en) | 2002-09-28 | 2009-03-31 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Arrangement and method for removing heat from a component which is to be cooled |
US8739406B2 (en) | 2012-09-13 | 2014-06-03 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
US9386728B2 (en) | 2011-08-04 | 2016-07-05 | Fujitsu Technology Solutions Intellectual Property Gmbh | Server and method for cooling a server |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004042034A1 (de) * | 2004-08-26 | 2006-03-16 | Laing, Oliver | Energieversorgungsvorrichtung für ein elektrisches Gerät und Verfahren zur Bereitstellung elektrischer Energie an Komponenten eines elektrischen Geräts |
WO2006021359A1 (de) * | 2004-08-26 | 2006-03-02 | Laing, Oliver | Kühlungsanordnung für eine elektrisches gerät und verfahren zur flüssigkeitskühlung |
KR100744903B1 (ko) * | 2006-02-22 | 2007-08-01 | 삼성전기주식회사 | 디커플링 기능을 갖는 다층 기판 |
US8453467B2 (en) * | 2006-10-13 | 2013-06-04 | Dell Products, Lp | Hybrid heat exchanger |
CN101460039B (zh) * | 2007-12-13 | 2011-04-13 | 纬创资通股份有限公司 | 电子装置 |
DE102013217615B4 (de) * | 2012-09-13 | 2015-02-26 | International Business Machines Corporation | Dampfkondensator mit dreidimensional gefalzter Struktur |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
DE4125528C2 (de) * | 1990-08-01 | 1997-04-17 | Hitachi Ltd | Elektronisches Gerät und dessen Kühlung |
US6094345A (en) * | 1996-05-14 | 2000-07-25 | Hewlett-Packard Company | Component cooling arrangement in electronic equipment with internal power supply |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6333849B1 (en) * | 1996-07-01 | 2001-12-25 | Compaq Computer Corporation | Apparatus for liquid cooling of specific computer components |
JP4132680B2 (ja) * | 1999-02-26 | 2008-08-13 | 日本サーモスタット株式会社 | 電子機器の冷却装置 |
JP3037323B1 (ja) * | 1999-03-02 | 2000-04-24 | 群馬日本電気株式会社 | コンピュータの冷却装置 |
ATE462999T1 (de) * | 1999-10-04 | 2010-04-15 | Asetek As | Rechnersystem, das ein kühlsystem beinhaltet und kühlsystem für ein rechnersystem |
US6196003B1 (en) * | 1999-11-04 | 2001-03-06 | Pc/Ac, Inc. | Computer enclosure cooling unit |
AU2001262761A1 (en) * | 2000-05-25 | 2001-12-03 | Ki-Oan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
US6537019B1 (en) * | 2000-06-06 | 2003-03-25 | Intel Corporation | Fan assembly and method |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US20020105779A1 (en) * | 2001-02-02 | 2002-08-08 | Pei-Chih Lei | Cooling system of a computer chassis |
US6504719B2 (en) * | 2001-03-30 | 2003-01-07 | Intel Corporation | Computer system that can be operated without a cooling fan |
US6526768B2 (en) * | 2001-07-24 | 2003-03-04 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an integrated circuit device |
TW588823U (en) * | 2002-05-13 | 2004-05-21 | Shuttle Inc | CPU heat dissipation apparatus having heat conduction pipe |
US6600649B1 (en) * | 2002-05-24 | 2003-07-29 | Mei-Nan Tsai | Heat dissipating device |
US6721180B2 (en) * | 2002-07-31 | 2004-04-13 | Infineon Technologies Ag | Cooling hood for circuit board |
US6760221B2 (en) * | 2002-10-23 | 2004-07-06 | International Business Machines Corporation | Evaporator with air cooling backup |
US6809928B2 (en) * | 2002-12-27 | 2004-10-26 | Intel Corporation | Sealed and pressurized liquid cooling system for microprocessor |
-
2003
- 2003-07-30 DE DE10334798A patent/DE10334798B4/de not_active Expired - Fee Related
-
2004
- 2004-06-29 TW TW093119033A patent/TWI275924B/zh not_active IP Right Cessation
- 2004-07-02 FR FR0407350A patent/FR2858435B1/fr not_active Expired - Fee Related
- 2004-07-13 GB GB0415655A patent/GB2405033A/en not_active Withdrawn
- 2004-07-29 US US10/901,819 patent/US20050024824A1/en not_active Abandoned
- 2004-07-30 CN CNA2004100588325A patent/CN1584780A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
DE4125528C2 (de) * | 1990-08-01 | 1997-04-17 | Hitachi Ltd | Elektronisches Gerät und dessen Kühlung |
US6094345A (en) * | 1996-05-14 | 2000-07-25 | Hewlett-Packard Company | Component cooling arrangement in electronic equipment with internal power supply |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7509999B2 (en) | 2002-09-28 | 2009-03-31 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Arrangement and method for removing heat from a component which is to be cooled |
US9386728B2 (en) | 2011-08-04 | 2016-07-05 | Fujitsu Technology Solutions Intellectual Property Gmbh | Server and method for cooling a server |
US8739406B2 (en) | 2012-09-13 | 2014-06-03 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
US8941994B2 (en) | 2012-09-13 | 2015-01-27 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
Also Published As
Publication number | Publication date |
---|---|
FR2858435B1 (fr) | 2005-11-25 |
GB0415655D0 (en) | 2004-08-18 |
US20050024824A1 (en) | 2005-02-03 |
FR2858435A1 (fr) | 2005-02-04 |
TW200515125A (en) | 2005-05-01 |
TWI275924B (en) | 2007-03-11 |
DE10334798B4 (de) | 2005-06-23 |
CN1584780A (zh) | 2005-02-23 |
GB2405033A (en) | 2005-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
R084 | Declaration of willingness to licence | ||
R081 | Change of applicant/patentee |
Owner name: FUJITSU TECHNOLOGY SOLUTIONS INTELLECTUAL PROP, DE Free format text: FORMER OWNER: FUJITSU SIEMENS COMPUTERS GMBH, 80807 MUENCHEN, DE Effective date: 20111229 |
|
R082 | Change of representative |
Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE Effective date: 20111229 |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |