DK3324716T3 - System til køling af varmeproducerende elektroniske komponenter - Google Patents

System til køling af varmeproducerende elektroniske komponenter Download PDF

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Publication number
DK3324716T3
DK3324716T3 DK17196858.9T DK17196858T DK3324716T3 DK 3324716 T3 DK3324716 T3 DK 3324716T3 DK 17196858 T DK17196858 T DK 17196858T DK 3324716 T3 DK3324716 T3 DK 3324716T3
Authority
DK
Denmark
Prior art keywords
electronic components
cooling heat
producing electronic
producing
cooling
Prior art date
Application number
DK17196858.9T
Other languages
English (en)
Inventor
Rodolfo Caciolli
Original Assignee
Rodolfo Caciolli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodolfo Caciolli filed Critical Rodolfo Caciolli
Application granted granted Critical
Publication of DK3324716T3 publication Critical patent/DK3324716T3/da

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
DK17196858.9T 2016-10-27 2017-10-17 System til køling af varmeproducerende elektroniske komponenter DK3324716T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102016000108608A IT201600108608A1 (it) 2016-10-27 2016-10-27 Sistema di raffreddamento di componenti elettronici produttori di calore

Publications (1)

Publication Number Publication Date
DK3324716T3 true DK3324716T3 (da) 2022-04-04

Family

ID=58163010

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17196858.9T DK3324716T3 (da) 2016-10-27 2017-10-17 System til køling af varmeproducerende elektroniske komponenter

Country Status (5)

Country Link
EP (1) EP3324716B1 (da)
DK (1) DK3324716T3 (da)
ES (1) ES2910707T3 (da)
IT (1) IT201600108608A1 (da)
PL (1) PL3324716T3 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109874275B (zh) * 2019-01-18 2024-03-12 广东西江数据科技有限公司 一种干湿分离式机箱及使用该机箱的网络设备
IT201900023076A1 (it) * 2019-12-05 2021-06-05 Provides Metalmeccanica S R L Sistema di raffreddamento per data center
US11871546B2 (en) 2019-12-05 2024-01-09 Wieland Provides SRL Cooling system of electronic systems, in particular for data centre
CN112018635B (zh) * 2020-07-09 2022-05-24 安徽金御科技发展有限公司 电器设备防潮装置
FR3113221B1 (fr) * 2020-07-30 2023-04-07 Calyos Sa Système pour refroidir des cartes serveurs dans un centre de données
EP4181642A1 (en) * 2021-11-16 2023-05-17 JJ Cooling Innovation Sàrl Cooling system for electronic component racks
WO2023225092A1 (en) * 2022-05-20 2023-11-23 Seguente, Inc. Manifold systems, devices, and methods for thermal management of hardware components
CN115086520B (zh) * 2022-06-07 2023-04-18 江西师范高等专科学校 一种思政远程教学用录像设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7133283B2 (en) * 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
JP2010212533A (ja) * 2009-03-12 2010-09-24 Fujikura Ltd 局部冷却装置
TWI419641B (zh) * 2010-10-29 2013-12-11 Ind Tech Res Inst 電子裝置之散熱結構
US20150233619A1 (en) * 2011-06-27 2015-08-20 Ebullient, Llc Method of providing stable pump operation in a two-phase cooling system
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
EP2812769B1 (en) * 2012-02-09 2018-11-07 Hewlett-Packard Enterprise Development LP Heat dissipating system
CA2863198C (en) * 2012-02-14 2018-08-14 Nec Corporation Cooling apparatus and cooling system
US9144179B2 (en) * 2013-02-01 2015-09-22 Dell Products, L.P. System and method for powering multiple electronic devices operating within an immersion cooling vessel
JP6344385B2 (ja) * 2013-05-28 2018-06-20 日本電気株式会社 冷却システム及び冷却方法
JP2015012282A (ja) * 2013-07-02 2015-01-19 富士通株式会社 電子装置
US10231357B2 (en) * 2015-03-20 2019-03-12 International Business Machines Corporation Two-phase cooling with ambient cooled condensor

Also Published As

Publication number Publication date
EP3324716A3 (en) 2018-08-08
PL3324716T3 (pl) 2022-05-16
EP3324716B1 (en) 2022-01-19
EP3324716A2 (en) 2018-05-23
IT201600108608A1 (it) 2018-04-27
ES2910707T3 (es) 2022-05-13

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