JP6472796B2 - 一体型熱伝導ユニットを持つ遠心ファン - Google Patents

一体型熱伝導ユニットを持つ遠心ファン Download PDF

Info

Publication number
JP6472796B2
JP6472796B2 JP2016526883A JP2016526883A JP6472796B2 JP 6472796 B2 JP6472796 B2 JP 6472796B2 JP 2016526883 A JP2016526883 A JP 2016526883A JP 2016526883 A JP2016526883 A JP 2016526883A JP 6472796 B2 JP6472796 B2 JP 6472796B2
Authority
JP
Japan
Prior art keywords
centrifugal fan
fan unit
unit
computing device
air flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016526883A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016536788A (ja
JP2016536788A5 (enExample
Inventor
ディー． デラーノ，アンドリュー
ディー． デラーノ，アンドリュー
ステルマン，テイラー
ダブリュー． ヒル，アンドリュー
ダブリュー． ヒル，アンドリュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsoft Corp
Microsoft Technology Licensing LLC
Original Assignee
Microsoft Corp
Microsoft Technology Licensing LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Corp, Microsoft Technology Licensing LLC filed Critical Microsoft Corp
Publication of JP2016536788A publication Critical patent/JP2016536788A/ja
Publication of JP2016536788A5 publication Critical patent/JP2016536788A5/ja
Application granted granted Critical
Publication of JP6472796B2 publication Critical patent/JP6472796B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016526883A 2013-10-31 2014-10-28 一体型熱伝導ユニットを持つ遠心ファン Expired - Fee Related JP6472796B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/068,715 2013-10-31
US14/068,715 US9639125B2 (en) 2013-10-31 2013-10-31 Centrifugal fan with integrated thermal transfer unit
PCT/US2014/062486 WO2015065926A1 (en) 2013-10-31 2014-10-28 Centrifugal fan with integrated thermal transfer unit

Publications (3)

Publication Number Publication Date
JP2016536788A JP2016536788A (ja) 2016-11-24
JP2016536788A5 JP2016536788A5 (enExample) 2017-11-02
JP6472796B2 true JP6472796B2 (ja) 2019-02-20

Family

ID=51932576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016526883A Expired - Fee Related JP6472796B2 (ja) 2013-10-31 2014-10-28 一体型熱伝導ユニットを持つ遠心ファン

Country Status (12)

Country Link
US (1) US9639125B2 (enExample)
EP (1) EP3063600B1 (enExample)
JP (1) JP6472796B2 (enExample)
KR (1) KR102277432B1 (enExample)
CN (1) CN105765481B (enExample)
AU (1) AU2014342659B2 (enExample)
BR (1) BR112016007144A8 (enExample)
CA (1) CA2924909C (enExample)
MX (1) MX359663B (enExample)
RU (1) RU2666632C2 (enExample)
TW (1) TWI636356B (enExample)
WO (1) WO2015065926A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9746888B2 (en) 2014-09-12 2017-08-29 Microsoft Technology Licensing, Llc Uniform flow heat sink
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
WO2017139923A1 (en) * 2016-02-16 2017-08-24 Siemens Aktiengesellschaft Radiator and electric device
IL270856B2 (en) 2017-05-30 2023-12-01 Magic Leap Inc Power supply assembly with fan assembly for electronic device
US10545546B2 (en) * 2018-02-23 2020-01-28 Intel Corporation Reversible direction thermal cooling system
US11304334B2 (en) * 2018-06-14 2022-04-12 Microsoft Technology Licensing, Llc Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same
EP3628872B1 (en) 2018-09-27 2023-01-25 INTEL Corporation Volumetric resistance blowers
US10584717B1 (en) 2019-04-25 2020-03-10 Dell Products, Lp Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems
US11109509B2 (en) * 2019-05-03 2021-08-31 Dell Products, Lp Cooling module with blower system having dual opposite outlets for information handling systems
US11028857B2 (en) 2019-09-18 2021-06-08 Dell Products, Lp Cooling module with blower system having opposite, blower and impeller outlets for information handling systems
CN112817409A (zh) 2019-11-15 2021-05-18 英业达科技有限公司 散热系统
TWI711367B (zh) * 2019-11-28 2020-11-21 英業達股份有限公司 散熱系統
US12055149B2 (en) 2020-07-16 2024-08-06 Dell Products Lp Blower fan with through hole and fan support rod
US11240931B1 (en) 2020-07-16 2022-02-01 Dell Products, Lp Variable height fan
US11994144B2 (en) 2020-10-30 2024-05-28 Dell Products Lp Blower system with an inner axial fan blade set and an outer centrifugal fan blade set
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US12376257B2 (en) * 2022-01-19 2025-07-29 Dell Products Lp System and method for a radio module on premise of a cooling fan
CN117215379A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215380A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215377A (zh) * 2022-06-02 2023-12-12 英业达科技有限公司 散热系统
CN117215378A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 气冷系统
TWI890096B (zh) * 2023-07-24 2025-07-11 華碩電腦股份有限公司 散熱模組

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785116A (en) 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
TWI222344B (en) 1999-12-09 2004-10-11 Advanced Rotary Systems Llc Cooler for electronic devices
TWM285188U (en) 2000-03-01 2006-01-01 Delta Electronics Inc Heat dissipating device of centrifugal fan blades
US6778390B2 (en) 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US7312985B2 (en) 2002-03-08 2007-12-25 Lg Electronics Inc. Cooler of notebook personal computer and fabrication method thereof
US6571862B1 (en) * 2002-06-25 2003-06-03 Waffer Technology Corp. Heat dissipating fin
JP2004044962A (ja) * 2002-07-15 2004-02-12 Matsushita Ecology Systems Co Ltd 冷却装置
JP2005191452A (ja) * 2003-12-26 2005-07-14 Toshiba Corp 放熱器、冷却装置および冷却装置を有する電子機器
US7280358B2 (en) * 2004-04-19 2007-10-09 Hewlett-Packard Development Company, L.P. Liquid loop with multiple heat exchangers for efficient space utilization
JP4330015B2 (ja) * 2005-03-29 2009-09-09 古河電気工業株式会社 電子機器用冷却装置
US20070047200A1 (en) * 2005-08-23 2007-03-01 Tai-Chi Huang Fan cartridge assembly
US20080106171A1 (en) 2005-09-30 2008-05-08 Mongia Rajiv K Self-focusing acoustic transducers to cool mobile devices
US7317614B2 (en) 2005-10-19 2008-01-08 Hewlett-Packard Development Company, L.P. Computer device cooling system
US7508662B2 (en) 2006-04-05 2009-03-24 Apple Inc. Handle arrangement with integrated heat pipe
CN100584171C (zh) * 2006-07-12 2010-01-20 富准精密工业(深圳)有限公司 散热装置
US20080043431A1 (en) * 2006-08-16 2008-02-21 The Texas A&M University System Methods and Systems Employing Tailored Dimples to Enhance Heat Transfer
JP2008071800A (ja) * 2006-09-12 2008-03-27 Mitsubishi Electric Corp 放熱板、冷却構造体およびヒートシンク
RU2416180C2 (ru) * 2007-06-21 2011-04-10 Андрей Леонидович Шпади Устройство теплоотвода от электронных приборов и вентилятор устройства теплоотвода от электронных приборов (варианты)
JP4564991B2 (ja) * 2007-07-10 2010-10-20 株式会社ソニー・コンピュータエンタテインメント ヒートシンク及び冷却装置
US8837139B2 (en) * 2007-09-29 2014-09-16 Biao Qin Flat heat pipe radiator and application thereof
US7969730B1 (en) 2008-02-08 2011-06-28 Motion Computer, Inc. Portable computer with thermal control and power source shield
US20110194252A1 (en) 2008-02-27 2011-08-11 Nxp B.V. Mobile electronic devices with integrated personal cooling fan
TWI425742B (zh) 2008-11-14 2014-02-01 Metal Ind Res & Dev Ct Integrated in the electronic device of the motor
TWM366878U (en) 2009-01-23 2009-10-11 Wistron Corp Thermal module with airflow-guided effect
JP5314481B2 (ja) * 2009-04-02 2013-10-16 株式会社ソニー・コンピュータエンタテインメント 電子機器
CN102290389B (zh) * 2010-06-18 2013-04-10 晶致半导体股份有限公司 具散热风扇的半导体封装件及其堆叠结构
US9249803B2 (en) 2010-06-30 2016-02-02 Intel Corporation Integrated crossflow blower motor apparatus and system
CN201766803U (zh) * 2010-09-03 2011-03-16 纬创资通股份有限公司 散热器及具有该散热器的散热装置
US8432696B2 (en) 2010-12-01 2013-04-30 Apple Inc. Using a battery pack to facilitate thermal transfer in a portable electronic device
US8477490B2 (en) 2011-05-02 2013-07-02 Apple Inc. Cooling system for mobile electronic devices
KR20130025635A (ko) 2011-09-02 2013-03-12 삼성전기주식회사 냉각장치

Also Published As

Publication number Publication date
MX359663B (es) 2018-10-05
US20150116928A1 (en) 2015-04-30
CN105765481A (zh) 2016-07-13
US9639125B2 (en) 2017-05-02
CN105765481B (zh) 2020-02-14
EP3063600B1 (en) 2020-08-05
RU2016116986A3 (enExample) 2018-07-09
TW201518917A (zh) 2015-05-16
BR112016007144A8 (pt) 2020-03-03
AU2014342659A1 (en) 2016-03-31
RU2016116986A (ru) 2017-11-02
KR20160082238A (ko) 2016-07-08
CA2924909A1 (en) 2015-05-07
WO2015065926A1 (en) 2015-05-07
RU2666632C2 (ru) 2018-09-11
AU2014342659B2 (en) 2019-09-12
BR112016007144A2 (pt) 2017-08-01
MX2016005427A (es) 2016-08-11
JP2016536788A (ja) 2016-11-24
CA2924909C (en) 2021-05-04
EP3063600A1 (en) 2016-09-07
KR102277432B1 (ko) 2021-07-13
TWI636356B (zh) 2018-09-21

Similar Documents

Publication Publication Date Title
JP6472796B2 (ja) 一体型熱伝導ユニットを持つ遠心ファン
JP2016536788A5 (enExample)
CN104105381B (zh) 散热模块
TWI463939B (zh) 電子裝置
CN110017293B (zh) 离心式风扇
CN101351109A (zh) 散热装置
CN102654790A (zh) 散热系统
CN201422226Y (zh) 散热器组合
CN109860134B (zh) 一种强化散热导流装置及散热模块
CN103702542A (zh) 电子装置
US9131626B2 (en) Electronic device including a jet flow generator
CN104105379B (zh) 散热组件及显示卡模块
US9409264B2 (en) Interleaved heat sink and fan assembly
TWI564699B (zh) 散熱組件及顯示卡模組
TWM460321U (zh) 風扇葉輪、離心軸流風扇、散熱裝置及顯示卡模組
JP2013186865A (ja) 送風装置及びそれを備えた電子機器
CN104238597A (zh) 电子设备
TW201427582A (zh) 擴充底座散熱裝置
TWM494220U (zh) 風扇之扇葉氣流引流結構
US8922990B1 (en) Active cooling fin pack
TWI468101B (zh) 散熱器
CN103079383B (zh) 散热器
TWI686124B (zh) 散熱裝置
CN106155192A (zh) 计算机
CN103186209A (zh) 电子装置散热结构

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170925

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170925

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180830

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180904

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190123

R150 Certificate of patent or registration of utility model

Ref document number: 6472796

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees