TWI634595B - Substrate processing method - Google Patents

Abstract

A substrate processing system includes: a first processing unit that continuously applies a first process to a substrate conveyed at a speed V1; and a second processing unit that transports a substrate that has been processed by a first processing unit at a speed V2 and continuously applies the substrate The second process is characterized in that, depending on the performance of each of the first and second processing units, the speed relationship can be set to V1> V2, a plurality of second processing units are provided, and a cutting mechanism is further provided. Select the input mechanism; depending on the performance of each of the first and second processing units, the speed relationship can be set to V1 <V2, a plurality of first processing units are set up, and further equipped with a plurality of first processing units The plurality of substrates subjected to the first process are sequentially bonded and put into a bonding mechanism of the second processing unit.

Description

Substrate processing method

Aspects of the present invention relate to a cutting mechanism, a bonding mechanism, a substrate processing system, a substrate processing apparatus, and a substrate processing method.

This application claims priority based on US Provisional Application 61/650712 filed on May 23, 2012 and US Provisional Application 61/654500 filed on June 1, 2012, the contents of which are incorporated herein by reference.

On a large-screen display element such as a liquid crystal display element, a transparent electrode such as ITO (Indium Tin Oxide) or a semiconductor substance such as Si is deposited on a flat glass substrate, a metal material is vapor-deposited, a photoresist is applied, and a circuit pattern is transferred. Then, after developing the photoresist, a circuit pattern or the like is formed by etching. However, as the size of glass substrates of display devices has also increased, substrate transportation has become difficult. Therefore, a roll-to-roll method (hereinafter referred to as a roll-to-roll method) has been proposed in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, metal foil, or an extremely thin glass sheet). (Only described as "reel system") (for example, refer to Patent Document 1).

Further, in Patent Document 2, a flexible long sheet (substrate) wound around a conveying roller and moving is arranged close to the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuously exposed on the substrate. Technology.

Further, in Patent Document 3, it is proposed to temporarily hold a pattern forming area of a flexible long sheet (substrate) conveyed by a roll on a flat stage, so as to transmit light projected through a magnifying projection lens. The pattern of the mask is scanned and exposed to the pattern forming area.

Patent Document 1: International Publication No. 2008/129819

Patent Document 2: Japanese Publication No. 60-019037

Patent Document 3: Japanese Patent Application Laid-Open No. 2011-22584

However, the above conventional techniques have the following problems.

When sequentially processing a plurality of long sheet substrates, the conveying speed of the substrate suitable for processing varies according to the performance of each processing unit in each unit (each processing content). For example, in the case of the exposure process in Patent Document 2, the sensitivity of the photosensitive layer applied on the surface of the substrate, the brightness of the exposure illumination light, and the like limit the transport speed (working time) of the substrate. In addition, the wet processing such as etching or plating, or the drying and heating steps after the wet processing can also provide advantages such that the liquid tank or the drying / heating furnace can be miniaturized by slowly transferring the substrate.

In addition, in the process of depositing functional materials, or the steps of printing or inkjet printing, etc., in order to maintain high precision (thinning) while ensuring productivity, there is also an optimal substrate transfer speed. However, these optimal substrate transfer speeds often differ depending on the processing unit.

In the case of a reel-type production line (processing system) in which such a combination of a plurality of processing units is constructed to sequentially pass a long sheet of substrate and to continuously perform a series of processes, the substrate transfer speed (speed of the production line) has to be matched with the processing The processing unit with the lowest substrate transfer speed.

Therefore, a processing unit with a high processing speed, although not fully utilized in performance, also carries the substrate at a slow speed. Therefore, the efficiency of the processing unit is deteriorated and the productivity of the entire production line may not be improved.

The purpose of the aspect of the present invention is to provide a cutting mechanism, Combination mechanism, substrate processing system, and substrate processing method.

Further, in Patent Document 1, a flexible sheet substrate is conveyed in a roll method, and an electronic element is formed on the sheet substrate mainly by a printing (inkjet) method. However, at the general printing site, when the remaining amount of the sheet substrate wound on the supply roll becomes small, the printing device is temporarily stopped, and the sheet substrate is cut between the printing device and the recycling roll, and it will be used as a recycling roll. The wound printed sheet substrate is sent to the next step. In this case, in the printing path from the entrance to the exit of the printing apparatus, the sheet substrates in the middle of printing remain, and all of them are discarded as defective products. When printing with color ink on paper or film, the printing cost is extremely low. However, in the case of forming electronic components in the form of a roll, the manufacturing cost per unit length (m) of the chip substrate is still high. If the chip substrate remaining in the device is discarded like a general printing site, it is too wasteful and costly. increase.

In particular, when a medium-sized or large-sized display panel composed of an organic EL is formed on a sheet substrate, the sheet substrate is continuously passed through a series of processing devices such as a photosensitive layer printing device, an exposure device of Patent Document 3, and a wet type. After a processing apparatus, a drying apparatus, etc., it winds up on a collection reel. Therefore, it is presumed that the sheet substrate that passes through a plurality of processing devices (processing steps) from the supply reel to the recovery reel is extremely long, and once the sheet substrate is stopped from being transported, it will waste a considerable distance of the sheet substrate.

An object of another aspect of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing an increase in cost and improving productivity.

A substrate processing system according to a first aspect of the present invention includes: a first processing unit that continuously applies a first process to a substrate that is transported at a speed of V1 in a longitudinal direction; and a second processing unit that transports a first process unit at a speed of V2 After the processed substrate, a second treatment is continuously applied to the substrate; It is characterized in that depending on the performance of each of the first and second processing units, the speed relationship can be set to V1> V2, a plurality of second processing units are set, and after the first processing unit is further equipped with The cutting mechanism for cutting the substrate to be processed at a predetermined length in the long-side direction, and the selection input mechanism for putting the cut substrate into any one of a plurality of second processing units; depending on each of the first and second processing units For the performance, the relationship between speed can be set to V1 <V2, a plurality of first processing units are provided, and the second processing unit is further provided with a plurality of first processing units to be applied with a plurality of first processing units before the second processing unit. The individual substrates are sequentially bonded in the long-side direction and put into a bonding mechanism of the second processing unit.

A substrate processing method according to a second aspect of the present invention includes: the first processing unit continuously applies the first processing to a substrate transported at a speed of V1 in the longitudinal direction; and the first processing unit is transported at a speed of V2 and processed by the first processing unit. For the substrate, the second processing operation is continuously applied to the substrate by the second processing unit. It is characterized in that, depending on the performance of each of the first and second processing units, the speed relationship can be set to V1> V2. A plurality of second processing units are used, and after the first processing unit, a step of cutting the substrate to which the first treatment has been applied to a predetermined length in a long side direction, and putting the cut substrate into the plurality of second processing units are further provided. According to the performance of each of the first and second processing units, the speed relationship can be set to V1 <V2, using a plurality of first processing units, and further before the second processing unit There is a bonding step of sequentially bonding a plurality of substrates to which the first processing is applied by each of the plurality of first processing units in the long side direction and putting them into the second processing unit.

A cutting mechanism according to a third aspect of the present invention includes: a cutting section that cuts a substrate that has been subjected to a predetermined process; and a buffer section that can store the substrate in accordance with a base to which the predetermined process has been applied. The conveyance amount of the board is changed, and the conveyance amount of the board conveyed toward the cutting section is adjusted.

A bonding mechanism according to a fourth aspect of the present invention includes: a bonding portion that joins substrates to which a predetermined process is applied; and a buffer portion, in which a storage amount of the substrate can be changed according to a transport amount of the substrate to which the predetermined process is applied, and adjusts the input from the bonding portion to the predetermined process. The amount of substrate transport.

A substrate processing system according to a fifth aspect of the present invention is that a substrate transported in a long direction passes through a first processing unit and then passes through a second processing unit, and is characterized by including a cutting mechanism, and the cutting mechanism When the substrate transfer speed of the processing unit is lower than the substrate transfer speed of the first processing unit, the substrate is cut between the first processing unit and the second processing unit by a predetermined length in the longitudinal direction; In the bonding mechanism, when the substrate transfer speed of the second processing unit is increased relative to the substrate transfer speed of the first processing unit, the substrate is bonded in the longitudinal direction between the first processing unit and the second processing unit.

A substrate processing apparatus according to a sixth aspect of the present invention includes a first mounting section for mounting a first roller on which a long substrate is wound around a first substrate, and a second mounting section for mounting a second substrate on which a long substrate is wound around a second substrate. Roller; a processing mechanism that transports one of the first substrate and the second substrate as a processing substrate to the long side and applies a predetermined process at the same time; a buffer mechanism is disposed between the processing mechanism and the first mounting portion, and starts from the first roller The first substrate supplied is temporarily stored within a predetermined longest storage range, and then sent to a processing mechanism; and a substrate connection replacement mechanism, which cuts the first substrate between the buffer mechanism and the first mounting portion, and supplies it from the second roller The front end portion of the second substrate is bonded to the terminal portion of the cut first substrate, and is sent to the buffer mechanism.

A substrate processing apparatus according to a seventh aspect of the present invention includes: a first mounting section for mounting a first roller on which a first substrate is wound with a long tape; and a second mounting section for mounting a second substrate on which a long tape is wound The second roller; the processing mechanism, which transports one of the first substrate and the second substrate to the long side as a processing substrate and applies predetermined processing at the same time; the buffer mechanism is disposed between the processing mechanism and the first mounting portion, and After the first substrate supplied by the first roller is temporarily stored within the predetermined longest storage range, it is sent to the processing mechanism; and the substrate connection and replacement mechanism cuts the first substrate between the buffer mechanism and the first mounting portion, and will cut the first substrate from the first The front end of the second substrate supplied by the two rolls is connected to a predetermined portion of the buffer mechanism side of the cut first substrate and sent to the buffer mechanism.

A substrate processing apparatus according to an eighth aspect of the present invention includes a first mounting section for detachably mounting a first roller of a first substrate wound with a long tape, and a holding section for holding a predetermined length equal to that of the first substrate. The second substrate; the processing mechanism, which transports one of the first substrate and the second substrate to the long side as a processing substrate and applies predetermined processing at the same time; the buffer mechanism is arranged between the processing mechanism and the first mounting portion, and After the first substrate supplied by the first roller is temporarily stored within the predetermined longest storage range, it is sent to the processing mechanism; and the substrate connection and replacement mechanism cuts the first substrate between the buffer mechanism and the first mounting portion, and will keep the An end portion of the second substrate supplied before the first substrate is connected to a predetermined portion of the buffer mechanism side of the cut first substrate, and is sent to the buffer mechanism.

The substrate processing method of the ninth aspect of the present invention is to transport a long-length substrate that has been put into the long-side direction as a processing substrate and apply a predetermined treatment to the processing mechanism at the same time. The method includes the following steps: 1 roll mounted on the first roll mounting section; 2 roll mounted on the long roll substrate is mounted on the 2 roll mounting section; a buffer mechanism arranged between the processing mechanism and the 1 roll mounting section, The operation of sending out the first substrate supplied from the first roller to the processing mechanism after temporarily storing it within the predetermined longest storage range; and mounting the buffering mechanism with the first roller while the temporarily stored first substrate is sent to the processing mechanism. Cut the first substrate between parts The first end of the second substrate supplied from the second roll is connected to a predetermined portion of the buffering mechanism side of the first substrate to be cut.

The tenth aspect of the substrate processing method of the present invention is to transport a long-length substrate that has been put into the long-side direction as a processing substrate and apply a predetermined treatment to the processing mechanism at the same time. The method includes the following steps: One roller is mounted on the first roller mounting portion; the second substrate having the same specifications as the first substrate is held in the holding portion by a predetermined length; a buffer mechanism disposed between the processing mechanism and the first roller mounting portion, The operation of sending out the first substrate supplied from the first roller to the processing mechanism after temporarily storing it within the predetermined longest storage range; and mounting the buffering mechanism with the first roller while the temporarily stored first substrate is sent to the processing mechanism. The operation of cutting the first substrate between the parts and connecting the end portion before the second substrate supplied from the holding part to a predetermined portion of the buffer mechanism side of the cut first substrate.

In the form of the present invention, the processing unit used in each of the plurality of processing steps can be efficiently used, so that the overall yield of the substrate processing line can be improved.

Moreover, in another aspect of the present invention, it is possible to significantly reduce the waste of the substrate, and it is possible to effectively suppress an increase in cost.

BF1‧‧‧The first buffer mechanism (the first buffer unit, the buffer mechanism)

BF2‧‧‧Second buffer mechanism (second buffer section)

CSa‧‧‧The first tape connector unit (substrate connection replacement mechanism)

CSb‧‧‧Second Tap Adapter Unit (Second Substrate Connection Replacement Mechanism)

CU10‧‧‧ Cut-off mechanism

FS‧‧‧ substrate

P‧‧‧ substrate

PK, PK2‧‧‧Introduced substrate (3rd substrate)

PU10‧‧‧Joint mechanism

RR1‧‧‧Supply Roller (Roll 1)

RR2‧‧‧Supply roller (second roller)

RR3‧‧‧Recycling roller (3rd roller)

RR4‧‧‧Recycling roller (4th roller)

RS1‧‧‧The first mounting section

RS2‧‧‧Second Mounting Section

RS3‧‧‧The third mounting section

RS4‧‧‧Fourth Mounting Section

ST‧‧‧Select input institution

SYS‧‧‧component manufacturing system (substrate processing device)

UA, UB, UB1 ~ UB3, UC‧‧‧Processing unit

U1 ~ Un‧‧‧processing device (processing mechanism)

FIG. 1 is a view schematically showing a substrate processing system according to the first embodiment.

Fig. 2 is a schematic perspective view of a cutting mechanism according to the first embodiment.

Fig. 3 is a perspective view showing a schematic appearance of a first taper section of the first embodiment.

Fig. 4 is a perspective view showing a schematic appearance of a second taper section of the first embodiment.

Fig. 5 is a control block diagram of the substrate processing system of the first embodiment.

Fig. 6 is a diagram showing a part of the structure of a component manufacturing system according to the first embodiment.

Fig. 7 is a diagram illustrating a model arrangement example of a plurality of processing units constituting the production line of the first embodiment.

FIG. 8 is a timing chart illustrating the improvement of the operation time of the production line of the first embodiment.

Fig. 9 is a diagram showing a part of a component manufacturing system of a substrate processing apparatus according to a second embodiment.

FIG. 10 is a diagram showing a schematic configuration of a first tape receiver section and a first buffer mechanism of the second embodiment.

Fig. 11 is a diagram showing a schematic configuration of a second tape receiver unit and a second buffer mechanism of the second embodiment.

FIG. 12 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 13 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 14 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 15 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 16 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 17 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 18 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 19 is a diagram showing a substrate bonding / cutting operation on the substrate supply side of the second embodiment.

FIG. 20 is a diagram showing a substrate bonding / cutting operation on the substrate collection side of the second embodiment.

FIG. 21 is a diagram showing a substrate bonding / cutting operation on a substrate recovery side of the second embodiment.

FIG. 22 is a diagram showing a substrate bonding / cutting operation on a substrate recovery side of the second embodiment.

FIG. 23 is a diagram showing a substrate bonding / cutting operation on the substrate collection side of the second embodiment.

FIG. 24 is a diagram showing a substrate bonding / cutting operation on the substrate collection side of the second embodiment.

FIG. 25 is a diagram showing a substrate bonding / cutting operation on the substrate collection side of the second embodiment.

(First Embodiment)

Hereinafter, embodiments of the cutting mechanism, the bonding mechanism, the substrate processing system, and the substrate processing method according to the present invention will be described with reference to FIGS. 1 to 6.

FIG. 1 is a diagram schematically showing, as an example, a substrate processing system SYS of a roller system in which a sheet substrate P is sequentially passed through three processing steps A, B, and C.

The main body of the substrate processing system is a processing unit UA (first processing unit) that applies a process A (first process) to the substrate P, and a processing unit that applies a process B (first process, second process) to step B. UB (first processing unit, second processing unit), processing unit UC (second processing unit) to apply process C (second process) as step C, cutting mechanism CU10, joint mechanism PU10, selection input mechanism ST1, ST2 Control unit CT (refer to FIG. 5).

The processing unit UA includes a roller mounting section RSA for mounting the supply roller RRA, and sends the substrate P to which the processing A has been applied to the cutting mechanism CU10. The processing unit UB is composed of the processing units UB1 to UB3 to which the same processing B is applied, for example, the processing unit UA is arranged on the downstream side of the substrate conveying direction of the processing unit UA in three vertical rows or three horizontal rows.

Each of the processing units UB1 to UB3 includes a mounting portion RSB11 to RSB31 for mounting the roller to which the substrate P has been applied, and a mounting portion RSB12 to RSB32 for mounting the roller to which the substrate P has been applied, from the mounting portion. The substrate P of the rollers RRB11 to RRB31 (hereinafter referred to as the sub-rollers RRB11 to RRB31) of RSB11 to RSB31 is wound to the installation after applying the process B Rollers RRB12 to RRB32 (hereinafter referred to as sub-rollers RRB12 to RRB32 as appropriate) in the mounting sections RSB12 to RSB32.

Further, in FIG. 1, a roller RR1 for winding the substrate P to which the process A has been applied is provided after the cutting mechanism CU10 at the rear stage of the processing unit UA. After the roller RR1 is wound around a predetermined length of the substrate P, the substrate P is cut, and the roller RR1 is mounted on any one of the mounting sections RSB11 to RSB31 of each of the processing units UB1 to UB3 as the sub-rollers RRB11 to RRB31.

The processing unit UC may install any one of the child rollers RRB12 to RRB32 after the processing B is applied to the processing units UB1 to UB3 as the roller RR2. The substrate P (intermediate product to which treatments A and B have been applied) wound around this roller RR2 is carried into the processing unit UC through the bonding mechanism PU10 and is subjected to the treatment C. The substrate P that has undergone the process C is wound and recovered to a recovery roller RRC mounted on the roller mounting section RSC.

In this embodiment, the processing speed VA (transport speed of the substrate P) in the processing unit UA, the processing speed VB (transport speed of the substrate P) in the processing B in the processing units UB1 to UB3, and the processing speed UC in the processing unit UC. The relationship between the processing speed VC (transfer speed of the substrate P) of the process C is as follows.

VA ≒ VC> VB

In addition, between the processing unit UA and any one of the processing units UB1 to UB3, the transfer speed of the substrate P is VA> VB. Therefore, the processing unit UA corresponds to the first processing unit with a high transfer speed (V1), and the processing units UB1 to UB1 ~ Any of UB3 corresponds to the second processing unit having a low conveying speed (V2). On the other hand, between any one of the processing units UB1 to UB3 and the processing unit UC, the transfer speed of the substrate P is VB <VC, so any of the processing units UB1 to UB3 is lower than the transfer speed (V1). The first processing unit corresponds, and the processing unit UC corresponds to the second processing unit having a high conveyance speed (V2).

In this embodiment, the processing speeds VA and VC can be set to approximately three times the processing speed VB. As in the past, in the case where there is one processing unit UB that implements processing step B, one substrate P connected from the supply roller RRA to the recovery roller RRC passes through the processing units UA, UB, and UC in sequence, so its transfer speed is the slowest. The processing speed VB is consistent. That is, the operating time (line speed, yield) of the entire production line is limited by the slowest processing unit.

In this embodiment, the processing unit UB, which has a slow processing speed, is double-lined (here, three units are juxtaposed), so that it can have an unlimited configuration. In order to achieve this re-threading (or multiple installations), the mechanism CU10 that cuts the substrate P without temporarily stopping the processing step A and the processing step B after winding the substrate P to a predetermined length of the roller RR1 is necessary.

The cutting mechanism CU10 mainly cuts the substrate P to which the process A has been applied at a predetermined length. As shown in FIG. 1 and FIG. 2, the cutting mechanism CU10 includes a first buffer mechanism (first buffer portion) BF1 and a first tape feeder portion CSa (cutting). unit). Further, the cutting mechanism CU10 further includes an interlocking control unit that interlocks the operation of the first tape receiver section CSa (cutting section) with the storage amount of the substrate P in the first buffering mechanism BF1 (first buffering section).

The first buffer mechanism BF1 includes a tension reel mechanism DR1 which is provided between the unit UA which implements the process A as the first process and the first tape receiver unit CSa, and returns the substrate P with a plurality of rollers and the like to store a predetermined length. By the tension reel mechanism DR1 moving up and down, the storage length of the substrate P is variably adjusted, and the substrate P is carried in / out at the same time. The first buffer mechanism BF1 is provided with a clamping drive roll which is disposed adjacent to the downstream side of the substrate P in the processing direction of the processing unit UA and adjusts the transfer amount (or transfer speed) of the substrate P to the first tape receiver section CSa. NR1 (refer to the figure 5). The driving of the tension reel mechanism DR1 and the driving of the clamp driving reel NR1 are controlled by the control unit CT.

Here, the structure will be described with reference to FIG. 3 which shows a schematic three-dimensional appearance of the first tape connector portion CSa.

The first belt adapter section CSa includes a slider 2 on which the suction pad 1 formed of, for example, a porous material is provided on the upper surface and can be moved freely in the transport direction of the substrate P (hereinafter, simply referred to as the transport direction). The lifting platform 3 with guide rail supported by the direction, the driving part 4 for lifting the lifting platform 3, and the lifting platform 3 is moved to the width direction of the substrate P when the lifting platform 3 is in the rising position, and can be adsorbed on the adsorption pad 1 of the sliding member 2. The cutter part 5 for cutting the substrate P, the adhesive part 6 for adhering the adhesive tape TP to the substrate P, and the winding for the roller RR1 provided above the lifting platform 3 and holding the substrate P to which the treatment A has been applied on both sides Holding portion 8 of shaft 7 (movable up and down).

In addition, the winding shaft 7 is adhered with a resin film or a material having a high adhesive force to a part (or the entire peripheral surface) of the outer peripheral surface. After the front end of the substrate P contacts the outer peripheral surface of the winding shaft 7, the The substrate P can be automatically wound by rotating around the shaft 7.

These sliders 2, the lifting table 3, the driving section 4, the cutter section 5, the sticking section 6, and the holding section 8 constitute an integrated work station section SN, which can be carried on casters, etc., and can be positioned at a predetermined position. .

Each drive of these sliders 2, the drive part 4, the cutter part 5, and the sticking part 6 is controlled by the control part CT (refer FIG. 5).

The workstation unit SN includes a moving unit that can move the substrate P in the longitudinal direction while holding the substrate P, and a cutting unit that moves the moving unit to the cutting mechanism CU10. Zone or the movement control unit of the joint area of the joint mechanism PU10.

In addition, although the adhesive part 6 in this embodiment adheres the board | substrate P by the adhesive tape TP, it can also be another adhesive method (mechanism). For example, a method in which the adhesive is applied to the substrate P in a width direction orthogonal to the conveying direction in a strip shape and pressure-bonded, and when the substrate P is a resin film, the portion to be bonded to the substrate P is heated and pressure-bonded. Or ultrasonic bonding.

In addition, although the suction pad 1 provided on the slider 2 holds the substrate P by vacuum pressure, the substrate P is locked on the slider 1 by a mechanical opening and closing mechanism (opening and closing hands) other than vacuum pressure. Yes.

In addition, the selection and input mechanism ST1 shown in FIG. 1, under the control of the control unit CT, rolls the substrate P to which the process A has been applied onto a roll RR1 (hereinafter, referred to as a sub-roller RR1) of the winding shaft 7 as a sub-roller. Any one of RRB11, RRB21, and RRB31 is selectively put into any of the mounting sections RSB11 to RSB31, and the prepared winding shaft 7 is transported to the holding section 8 of the first belt take-up section CSa which is vacated by the sub-roller RR1. .

In this embodiment, the processing speeds VA and VC are about three times the processing speed VB, and three processing units UB are also provided. Therefore, the sub-rollers RR1 (that is, the sub-rollers RRB11 to RRB31, RRB12 to RRB32, and RR2 described later) are wound. The length of the substrate P is set to approximately 1/3 of the length of the substrate P wound around the supply roll RRA which becomes a parent roll.

Therefore, the cutting mechanism CU10 cuts the substrate P to a predetermined length of approximately one-third of the total length of the substrate P wound around the supply roller RRA.

In addition, under the control of the control unit CT, the selection and input mechanism ST2 in FIG. 1 selects a substrate P to be wound around a predetermined length by applying processing B to any of the processing units UB1 to UB3. Any of the mounting sections RSB12 ~ RSB32 of the sub-rollers RRB12 ~ RRB32 is put into the joint mechanism PU10 (roller conveyance), and any of the sub-rollers RRB12 ~ RRB32 is transported and vacated. The mounting section RSB12 ~ RSB32 is prepared for winding axis.

The bonding mechanism PU10 mainly uses any one of the sub-rollers RRB12 to RRB32 to which the process B is applied and transported as the sub-roller RR2, and is bonded to the vicinity of the terminal of the substrate that was previously cut off. As shown in FIG. 1, the second belt connector CSb is provided. (Joint portion) and the second buffer mechanism (second buffer portion) BF2. In addition, the bonding mechanism PU10 includes a second tape taker section CSb (bonding section) for bonding the substrate to which the process B has been applied, and the storage amount with the substrate can be changed according to the amount of the substrate to which the process B is applied, and the input from the bonding section can be adjusted. The second buffering mechanism (buffering portion) BF2 to the amount of substrates transferred to process B.

As shown in FIG. 4, the second tape receiver section CSb is provided in a state where the work station section SN provided in the first tape adapter section CSa has the substrate P in the opposite direction. That is, the second belt adapter section CSb includes a slider 2 having an upper surface of the suction pad 1 and capable of moving freely in the conveying direction, and a lifting platform 3 with a guide rail that supports the slider 2 to move freely in the conveying direction. 3 Lifting driving part 4, Lifting table 3 When moving to the width direction of the substrate P when the lifting platform 3 is in the rising position, the cutter part that can cut the substrate P adsorbed on the suction pad 1 of the slider 2 5. Adhesive tape can be adhered to the substrate P The adhesive portion 6 of the TP and the holding portion 8 of the winding shaft 7 provided on the lifting platform 3 and holding the winding roller 7 for winding the sub-roller RR2 of the substrate P to which the process B has been applied are held on both sides.

The second buffer mechanism BF2 has the same structure as the first buffer mechanism BF1. The substrate P carried into the processing unit UC is variably stored within an adjustable length range, and is disposed adjacent to the upstream side of the substrate P of the processing unit UC in the conveying direction.

The second buffer mechanism BF2 is provided with a tension reel mechanism DR2 capable of variably adjusting the storage amount of the substrate P while a plurality of reels adjacent to each other in the conveying direction of the substrate P are moved upward and downward in opposite directions. The clamping drive roll NR2 (refer to FIG. 5) of the amount of conveyance (conveying speed) of the substrate P that is transferred from the portion CSb to the tension roll mechanism DR2. The driving of the tension reel mechanism DR2 and the driving of the clamp driving reel NR2 are controlled by the control unit CT.

FIG. 5 is a control block diagram of the substrate processing system shown in FIGS. 1 to 4.

As shown in FIG. 5, the control unit CT controls the operations of the processing units UA, UB (UB1 to UB3), and UC, and controls the sliders 2, the driving unit 4, and the cutters provided in each of the cutting mechanism CU10 and the coupling mechanism PU10 in an integrated manner. Part 5, Adhesive part 6, Selective input mechanism ST1, ST2, tension reel mechanism DR1, DR2, clamping drive reels NR1, NR2 and so on. In addition, the control unit CT counts and manages the rotation driving of the supply roller RRA and the recovery roller RRC, and the conveyance length of the substrate P in each step (each processing unit). The winding amount of the substrates of the rolls on the recovery side of the substrate P is also managed by the management of the overall operating time of processing steps A to C, the management of each roll, whether there is a problem or the degree or location of the problem. The control unit CT includes an interlocking control unit that interlocks the operation of the cutting mechanism CU10 with the storage amount of the substrate P in the first buffer unit BF1. Similarly, the control unit CT includes an interlocking control unit that interlocks the operation of the bonding mechanism PU10 with the storage amount of the substrate P in the second buffer portion BF2.

Next, the operation of the substrate processing system configured as described above will be described.

Here, as shown in FIG. 1, immediately after the processing unit UB1 completes processing B, the sub-roller RRB12 is transported to the holding section 8 of the second belt receiver section CSb by the selection and input mechanism ST2. In the processing unit UB2, a process B is applied to the substrate P drawn out from the sub-roller RRB21 mounted on the mounting portion RSB21. The processing unit UB3 waits until the sub-roller RRB31 to be processed next is mounted to the mounting portion RSB31.

In the following description, since the operations of the respective constituent devices are controlled by the control unit CT, the description thereof is omitted.

First, the sub-roller RR1 held by the holding section 8 of the first tape receiver section CSa winds the substrate P to which the process A has been applied at a predetermined length, and then stops and drives the driving roller NR1 in the first buffer mechanism BF1. The supply of the substrate P to the first tape receiver section CSa is stopped. At this time, the processing unit UA continues to perform the process A, and the substrate P is sent to the first buffer mechanism BF1. Therefore, the tension reel mechanism DR1 in the first buffer mechanism BF1 is driven in a direction to increase the storage amount of the substrate P.

In conjunction with the stoppage of the supply of the substrate P from the first buffer mechanism BF1, the substrate P is cut in the first tape receiver portion CSa.

Specifically, first, after the slider 2 is moved to a position facing the cutter section 5, the lift table 3 and the slider 2 are raised together by the operation of the drive section 4. As the slider 2 rises, the suction pad 1 sucks and holds the substrate P from the back surface (lower surface), and positions the cutting position of the cutter portion 5. Thereafter, the cutter section 5 moves in the width direction of the substrate P and cuts the substrate P. After the substrate P is cut, the selection and input mechanism ST1 puts the sub-roller RR1 as the sub-roller RRB31 into the mounting portion RSB31 of the processing unit UB3. In addition, the selection and input mechanism ST1 is configured to hold the prepared winding shaft 7 in the holding section 8 of the first belt receiver section CSa which becomes empty after the sub-roller RR1 is discharged.

In the first taper section CSa, after the winding shaft 7 is mounted on the holding section 8, the slider 2 moves (at the same time, the driving roller NR1 is simultaneously rotated and the predetermined amount is rotated) to keep the suction on the slider 2. The front end portion of the substrate P is located below the winding shaft 7, the holding portion 8 supporting the winding shaft 7 is lowered a certain distance, and the front end portion of the substrate P is closely adhered to the adhesive portion on the outer peripheral surface of the winding shaft 7. In this way, after the front end portion of the substrate P extending from the side of the first buffer mechanism BF1 is connected to the new winding shaft 7, the suction holding of the suction pad 1 is released, and then the holding portion 8 returns to the original height position, and the driving portion 4 This action lowers the lifting platform 3 together with the slider 2.

After that, the rotation driving of the clamp driving reel NR1 and the new winding shaft 7 starts again, the supply of the substrate P from the first buffer mechanism BF1 starts again, and the substrate P is wound on the new winding shaft 7. After the supply of the substrate P is started again, the grip driving roll NR1 is slightly faster than the conveyance speed of the substrate P corresponding to the processing speed VA in the processing unit UA (that is, the speed at which the substrate P is sent to the first buffer mechanism BF1). Speed. The tension reel mechanism DR1 is driven in a direction corresponding to the driving of the clamp driving reel NR1 to decrease the storage amount of the substrate P.

After the length of the substrate P stored in the first buffer mechanism BF1 is approximately the minimum, the grip driving roller NR1 is driven at the same speed as the conveyance speed of the substrate P in the processing unit UA.

On the other hand, the substrate P is pulled out from the sub-roller RRB31 mounted on the mounting section RSB31 of the processing unit UB3, conveyed and applied with the processing B at a speed corresponding to the processing speed VB, and wound around the sub-roller RRB32 mounted on the mounting section RSB32.

In the processing unit UB3, while the process B is applied to the substrate P drawn out from the sub-roller RRB31, the processing unit UB2 completes the process B of the substrate P drawn out from the sub-roller RRB21, and the sub-roller RRB2 wound with the substrate P is installed. The RSB22 is on standby.

By selecting the input mechanism ST2, the After the processing C of the processing unit UC of the substrate P of the sub-roller RRB12 of the bonding mechanism PU10 is completed, the driving of the clamping drive roll NR2 of the second buffer mechanism BF2 of the bonding mechanism PU10 stops, and the drive of the substrate P of the tension roll mechanism DR2 Supply stopped.

At this time, processing C is continuously performed in the processing unit UC. Therefore, the tension reel mechanism DR2 operates to send the substrate P stored in the second buffer mechanism BF2 to the processing unit UC at a constant speed corresponding to the conveyance amount (processing speed VC) of the substrate P in the processing unit UC.

In the second belt-receiver section CSb, similar to the cutting process in the first belt-receiver section CSa, the slider 2 is moved to a position opposite to the cutter section 5, and then the lifting table is moved by the operation of the drive section 4. 3 rises with slider 2. As the slider 2 rises, the suction pad 1 sucks and holds the substrate P from the sub-roller RRB12 from the back surface (lower surface), and positions the cutting position of the cutter portion 5. Thereafter, the cutter section 5 moves in the width direction of the substrate P and cuts the substrate P. After the substrate P is cut, the selection mechanism ST2 takes out the winding shaft 7 wound with the sub-roller RR2 (RRB12) from the holding section 8 and mounts the empty holding section 8 on the sub-roller RRB22 waiting for the mounting section RSB22 as the sub-roller RR2.

As the sub-roller RR2, after the sub-roller RRB22 is mounted on the holding portion 8 of the second belt receiver section CSb, the front end portion of the substrate P led out from the sub-roller RR2 and the rear end of the substrate P on the side of the second buffer mechanism BF2 cut off before The two substrates P are held by the suction pad 1. In this state, the two substrates P are bonded by the adhesive tape TP. After the substrate P is bonded, the suction and holding of the suction pad 1 is released, and thereafter, the lifter 3 and the slider 2 are lowered together by the operation of the driving unit 4. After that, the reel NR2 is driven and driven to supply the substrate P from the second tape receiver section CSb to the second buffer mechanism BF2 again.

After the supply of the substrate P is started again, the grip driving roll NR2 is compared with the existing one. The processing speed VC of the processing unit UC rotates at a speed slightly higher than the conveying speed of the substrate P. The tension reel mechanism DR2 is driven in a direction that increases the storage amount of the substrate P in correspondence with the driving of the clamp driving reel NR2.

After the length of the substrate P stored in the second buffer mechanism BF2 is approximately the maximum, the grip driving roller NR2 is driven at the same speed as the conveyance speed of the substrate P in the processing unit UC. Next, the substrate P drawn from the sub-roller RRB22 (sub-roller RR2) conveyed to the processing unit UC through the second buffer mechanism BF2 is applied with the process C at the processing speed VC.

As described above, the substrate P after the processing A is applied by the processing unit UA is wound into a sub-roller RR1 of a length divided according to the number of the processing unit UB, and is sequentially input into the processing units UB1 to UB3 and the processing B is applied. UB1 to UB3 are sequentially put into the processing unit UC as the sub-rollers RR2, and process C is applied. Regarding the processing unit UB whose processing speed VB is slower than the processing speed VC, there are three processing units based on the processing speed ratio. Therefore, from the three processing units UB1 to UB3, processing is applied at a processing speed three times the processing speed VB. The sub-roller RR2 is put into the processing unit VC at the same period after B.

As described above, in this embodiment, according to the performance of each of the processing units UA and UB, the processing speed VA> processing speed VB can be set, and the relationship between the number n of the processing units UA and the number m of the processing units UB can be set. It is set to n <m, and the substrate P is cut into sub-rollers having a length corresponding to the number m, and is selectively put into any one of the m processing units UB1 to UBm. Therefore, it is not limited to the low processing speed VB, and the production line as a whole can process the substrate P at the processing speed VA.

In addition, depending on the performance of each of the processing units UB and UC, the processing speed VB <processing speed VC can be set, and processing B will be applied to a plurality of (m) processing units UB1 to UBm. The substrates P of the subsequent child rolls RR2 are sequentially bonded and put into n (n <m) processing units UC. Therefore, the waiting time until the substrate P is carried in from the processing unit UB to the processing unit UC can be substantially suppressed.

Therefore, this situation is not limited to the low processing speed VB, and the substrate P can be processed at the processing speed VC (≒ VA).

Therefore, in this embodiment, even if a plurality of processes A to C with different processing speeds are sequentially applied, the productivity can be improved. In this embodiment, the number of processing units UB is set according to the ratio of processing speed. Therefore, high-efficiency substrate processing can be realized without excessively setting the equipment. In addition, in the present embodiment, when the multi-line processing units UB1 to UB3 are installed in multiple stages in the up-down direction, high-efficiency substrate processing can be performed without increasing the footprint.

Moreover, in this embodiment, the cutting mechanism CU10 with a buffer mechanism and the coupling mechanism PU10 with a buffer mechanism have a common structure that can be used for either cutting or joining, and are provided as the work station section SN. Therefore, it is not necessary to separately install different kinds of devices, and the cost of production equipment can be reduced.

That is, if the processing speed of the processing unit on the downstream side is lower than that of the processing unit on the upstream side relative to the transport direction of the substrate P in a series of a plurality of processing units, a workstation unit is set in between. If the SN is the cutting mechanism CU10 and the relationship between the processing speeds is reversed, it is sufficient to provide a workstation SN as the joining mechanism PU10 between adjacent processing units.

That is, the substrate processing system of this embodiment transfers the substrate P of the processing unit (the first processing unit) upstream of the processing unit (the first processing unit) in the upstream direction of the substrate P in a series of a plurality of processing units. Speed to enable downstream processing unit (second processing unit) When the transfer speed of the substrate P is reduced, a cutting mechanism CU10 for cutting the substrate P by a predetermined length in the long-length direction is provided between the first processing unit and the second processing unit. When the transfer speed increases the transfer speed of the substrate P of the second processing unit, a bonding mechanism PU10 for bonding the substrate P in the longitudinal direction is provided between the first processing unit and the second processing unit.

(Component Manufacturing System)

Next, a component manufacturing system to which the substrate processing system is applied will be described with reference to FIG. 6.

FIG. 6 is a diagram showing the structure of a part of a component manufacturing system (flexible display production line) as a substrate processing system. Here, an example is shown in which the flexible substrate P (sheet, film, etc.) drawn out from the supply roll RR1 is sequentially wound onto the recovery roll RR2 through n processing devices U1, U2, U3, U4, ... Un. The upper-level control device CONT (control unit) controls the processing devices U1 to Un constituting the production line.

In addition, the processing devices U1 to Un shown in FIG. 6 may be any one of the processing units UA to UC shown in FIG. 1, and two or more consecutive processing devices among the processing devices U1 to Un may correspond to the processing units together. Either UA ~ UC can be used.

In FIG. 6, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long belt direction) of the substrate P is set to the Y-axis direction. In addition, the substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or a fine partition wall structure (concave-convex structure) for precise patterning may be formed on the surface.

The substrate P wound on the supply roll RR1 is drawn out by a driven driving roll DR10 and transferred to the processing device U1. The center of the Y-axis direction (width direction) of the substrate P is The edge position controller EPC1 performs servo control in a manner ranging from ± decades to several tens of μm relative to the target position.

The processing device U1 is a method for printing the photosensitive functional liquid (photoresist, photosensitive silane coupling material, photosensitive coupling material, photosensitive liquid-repellent modifier, and photosensitive plating) in the conveying direction (long side direction) of the substrate P by printing. A coating device that applies a reducing agent, a UV curing resin solution, or the like continuously or selectively to the surface of the substrate P. The processing unit U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 that rapidly removes the solvent or moisture contained in the photosensitive functional liquid coated on the substrate P. The coating mechanism Gp1 includes a compact body roll around which the substrate P is wound. Drum DR20, a coating roll in which a photosensitive functional fluid is uniformly coated on the surface of the substrate P on this compact roll DR20, or a plate roll in which a photosensitive functional fluid is used as an ink printing pattern for a relief or gravure.

The processing device U2 is a heating device that heats the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) and stabilizes the photosensitive functional layer applied on the surface. The processing device U2 is provided with a plurality of reels and air rotating rods for returning and conveying the substrate P, a heating chamber portion HA1 for heating the substrate P carried in, and reducing the temperature of the heated substrate P to subsequent steps. (Processing unit U3) The cooling chamber portion HA2 with the same ambient temperature, and the driving drum DR3 held by it.

The processing device U3 is an exposure device that irradiates the photosensitive functional layer of the substrate P transported from the processing device U2 with the patterned light of ultraviolet rays corresponding to the display circuit pattern or wiring pattern. The processing device U3 is provided with an edge position controller EPC that controls the center of the Y-axis direction (width direction) of the substrate P to a certain position, a driving roll DR4 that is clamped, and the substrate P is partially wound with a predetermined tension and The pattern exposure portion on the substrate P is supported in a uniform cylindrical surface. The two sets of rotary drums DR5 and DR6, DR7, etc., which provide a predetermined slack (gap) DL to the substrate P.

Further, a transmissive cylindrical mask DM, an illumination mechanism IU provided in the cylindrical mask DM and illuminating a mask pattern formed on the outer peripheral surface of the cylindrical mask DM are provided in the processing device U3, and The quasi-microscopes AM1 and AM2, and the alignment microscopes AM1 and AM2, are arranged so that an image of a portion of the mask pattern of the cylindrical mask DM and a portion of the substrate P are opposed to a portion of the substrate P supported by the rotating barrel DR5 in a cylindrical surface. Ground alignment, detection of alignment marks and the like formed on the substrate P in advance.

The processing device U4 is a wet processing device that performs at least one of various wet processing such as wet development processing and chemical plating processing on the photosensitive functional layer of the substrate P transferred from the processing device U3. The processing unit U4 is provided with three processing tanks BT1, BT2, and BT3, which are layered in the Z-axis direction, a plurality of rolls that are bent and conveyed by the substrate P, and a driving roll DR8 that is clamped.

The processing device U5 is a heating and drying device that heats the substrate P carried from the processing device U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but detailed description is omitted. After that, the substrate P, which passes through several processing apparatuses and passes through the last processing apparatus Un of the series of processes, is wound by the driven driving roll DR10 to the recovery roll RR2. When winding, the center of the Y-axis direction (width direction) of the substrate P, or the Y-axis direction of the substrate end does not deviate in the Y-axis direction, and the edge-position controller EPC2 sequentially corrects and controls the driving roll DR10. Relative position to the Y-axis direction of the recovery roll RR2.

In the component manufacturing system of FIG. 6 described above, corresponding to the processing speed of each processing device U1, U2, U3, U4, U5, ... Un, the processing unit with slow processing speed is multi-lined and a plurality of sets are juxtaposed, and it is set before the processing device The cutting mechanism CU10 is provided to put the substrate into a plurality of processes A selection input mechanism ST1 of any one of the devices.

In addition, a bonding mechanism PU10 for sequentially bonding a plurality of substrates carried out from each processing device is provided after a plurality of processing devices with a slow processing speed, so that even if a plurality of processings with greatly different processing speeds are sequentially applied, the situation does not occur. Limited by the processing step with the lowest processing speed, the productivity can be improved.

In the case of the production line shown in FIG. 6, the processing device U2 that performs the heat treatment suppresses the substrate P conveying speed as low as possible, and can reduce the volume of the chambers HA1 and HA2. Correspondingly, it can reduce the use of power and can also The advantage of reducing the installation area of the device.

On the other hand, when the processing device U1 immediately before the processing device U2 patterns and prints the photosensitive functional liquid on the surface of the substrate P, a plate body (gravure or letterpress) for pattern printing is used. After the cylinder is coated with the photosensitive functional liquid as the ink, the substrate P is brought into contact with the plate roll to transfer the pattern. In this case, in order to make the pattern transfer characteristics from the plate roll to the substrate P good, it is necessary to transport the substrate P at a certain speed.

As described above, the processing apparatus U1 and the processing apparatus U2 differ greatly in the substrate transfer speed (processing speed) depending on the device performance. Therefore, in this case, if the processing unit U1 is set as the processing unit UA in FIG. 1, and the processing unit U2 is rewired like the processing units UB1 to UB3 in FIG. 1, a high efficiency and high yield can be constructed. production line.

Here, in the case of the previous processing system (production line) of FIG. 1, compared to the conventional single-line processing, how much work time is expected to improve. According to the model example shown in FIG. 7, refer to the timing diagram of FIG. 8. Be explained.

Fig. 7 (a) shows a processing unit that makes each of the three steps A, B, and C process UA, UB, and UC are examples of a model in which one line is processed. Here, a substrate P having a total length of 1200 m is wound around a supply roll RRA. The performance of the devices of each processing unit UA ~ UC is assumed to have the following processing capabilities. That is, the processing unit UA has the ability to transport and process the substrate P at a maximum of 15 cm / s, the processing unit UB has the capability to transport and process the substrate P at a maximum of 5 cm / s, and the processing unit UC has the capability to transport the substrate at a maximum of 15 cm / s P and ability to process.

In the case of the single line, the conveying speed of the substrate P in the entire production line is consistent with the speed of the slowest processing unit UB 5cm / s, so the production operation time (the time for applying steps A, B, and C to the 1200m substrate) It is 400 minutes (6 hours and 40 minutes).

In contrast, FIG. 7 (b) shows a model example of a production line that has been re-lined as in FIG. 1 before. The performance of each processing unit UA, UB (UB1 ~ UB3), UC is the same as that described in Fig. 7 (a). As in FIG. 1 described above, the processing unit UB of the processing step B is doubled, three processing units UB1 to UB3 are provided, and the cutting processing time of the cutting mechanism CU10 including the processing unit UA is performed with the selection and input mechanism ST1. The preparation time for the replacement time of the child roller is 3 minutes, and the preparation time including the replacement processing time of the bonding mechanism PU10 before the processing unit UC and the replacement time of the child roller by the selection input mechanism ST2 is 3 minutes.

As shown in FIG. 7 (b), the processing unit UB, which has a slow processing speed, is double-lined. Therefore, the processing units UA and UC are set to transport the substrate P at a maximum speed of 15 cm / s guaranteed by their performance.

The timing diagram of FIG. 8 estimates the operation time of the model example of FIG. 7 (b), and the production lines S1, S2, and S3 are assumed to correspond to each of the three processing units UB1 to UB3, and each processing time is displayed. At the start of processing, although the substrate P from the supply roller RRA is processed by the processing unit UA, The substrate P is divided into 1/3 of a total length of 1200 m by the cutting mechanism CU10. Therefore, the first 400m of the substrate put into the processing unit UA, as shown in the production line S1, is processed to about 44.4 minutes, and after the cutting mechanism CU10 has passed the preparation time of 3 minutes, it is sent to the processing unit UB1.

The processing time of the processing unit UB1 for processing 400 m of the substrate P is 133.3 minutes. Then, after about 3 minutes as a predetermined preparation time (installation of the sub-roller, etc.), the first 400m substrate is put into the processing unit UC and processed at a transfer speed of 15cm / s. The working time of the 400m substrate of the processing unit UC is 44.4 minutes.

During this period, as shown in the production line S2, the processing unit UA continued to process the second 400m substrate of about 44.4 minutes, and then, as shown in the production line S3, the third 400m of about 44.4 minutes was continued at a transfer speed of 15cm / s. Substrate processing. The second 400m substrate was transported to the processing unit UB2 after 3 minutes of the preparation time of the cutting mechanism CU10, where it was processed for about 133.3 minutes.

In the processing unit UC, the processing of the first 400m substrate is counted after 228.1 minutes from the beginning. However, before that, the processing of the second 400m substrate was completed in the processing unit UB2, and the second 400m substrate was bonded to the first 400m through the bonding mechanism PU10 and the selection input mechanism ST2 after about 3 minutes of preparation time. The terminal part of the substrate.

After that, the processing unit UC continuously processes the second 400m substrate bonded to the first 400m substrate at a transfer speed of 15 cm / s.

Similarly, as shown in the production line S3, the third (last) 400m substrate cut by the cutting mechanism CU10 is put into the processing unit UB3 after the processing of the processing unit UA is completed, and is wound to the child after 133.3 minutes. Roller RRB32. The processing of the third 400m substrate in the processing unit UC is completed before the processing of the second 400m substrate in the processing unit UC is completed.

While the second 400m substrate of the processing unit UC is being processed, the third 400m substrate is bonded to the terminal portion of the second 400m substrate through the bonding mechanism PU10 and the selection input mechanism ST2 after a preparation time of about 3 minutes. After that, the processing unit UC continuously processes the third 400m substrate bonded to the second 400m substrate at a transfer speed of 15 cm / s.

As described above, by linearizing the unit of the processing step B, the processing of the 1200-meter substrate P is completed at 317 minutes (5 hours and 17 minutes). Compared with the example of the single-line processing model shown in Fig. 7 (a), the operation time is increased by about 20% (the production time is shortened).

In the model example shown in FIG. 7 (b), although the total length of the substrate P wound around the supply roll RRA as a parent roll is 1200 m, even for a longer length, the cutting mechanism CU10 is performed every 400 m. The division of the substrate can continuously convey the substrate put into the production line to the final processing step C.

In addition, in the model example shown in FIG. 7 (b), although the three processing units UB1 to UB3 are operated together at the same processing speed (5 cm / s), the substrate transfer speed of each unit UB1 to UB3 is adjusted within the adjustable range. Minor differences are also possible.

As mentioned above, although preferred embodiment of this invention was described with reference to drawings, this invention is not limited to this. The shapes, combinations, and the like of the constituent members shown in the above examples are examples, and various changes can be made according to design requirements and the like without departing from the spirit of the present invention.

For example, in the above embodiment, the configuration is provided with three processing units UB1 to UB3, but as long as it is set according to the processing speed ratio, it may be configured with two or more than four.

Moreover, in the above-mentioned embodiment, a part of the steps of a production line constituted by a single line is multi-lined. However, even the original production line (producing the same product, type) from the initial steps to In the case where the final step is re-threaded, the above-mentioned embodiment may be used.

For example, originally, in the case where two single-line processing production lines were placed side by side in FIG. 7 (a), a cutting mechanism CU10 (CU101, CU102) was installed after each of the two processing units UA (UA1, UA2), and the second two were low. The processing unit UB of the working time is added to three units as five units UB1 to UB5 and then re-wired. Then, two joint units PU10 (PU101, PU102) are set up later, and two processing units UC (UC1, UC2) are set up later. Yes.

In the above configuration, the selection input mechanism ST2 is constituted so that a substrate of a unit length (for example, 400 m) cut by any of the cutting mechanisms CU101 and CU102 is conveyed to any one of the five processing units UB1 to UB5. Each of the bonding mechanisms PU101 and PU102 accepts a substrate having a unit length (for example, 400 m) of one of the five processing units UB1 to UB5 to form a selection input mechanism ST2.

In addition, in the processing of the first processing units UA1 and UA2, in order for the processing unit UA to process the substrate from the supply roll RRA in a unit length (for example, 400 m), the processing unit UA2 starts processing of the substrate from the supply roll RRA, intentionally giving a time difference. Better.

In this way, it is possible to avoid the roll replacement operation (the temporary interruption of production) of the two roll units (UAA, UA2) installed at the same time, and to make each process unit operate efficiently.

(Second Embodiment)

Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to FIGS. 9 to 25. In this embodiment, the same reference numerals are given to the same constituent elements as those in the above-mentioned embodiment to simplify or omit their description.

FIG. 9 is a diagram showing the structure of a part of a component manufacturing system (flexible display production line) SYS which is a substrate processing apparatus of this embodiment. Here, an example is shown. The component manufacturing system SYS includes a first mounting section RS1 for mounting a supply roller (first roller) RR1, a second mounting section RS2 (holding section) for mounting a supply roller (second roller) RR2, and mounting. The third mounting portion RS3 of the recovery roller (third roller) RR3, the fourth mounting portion RS4 of the recovery roller (fourth roller) RR4, and the flexible substrate P (sheet, (Film, etc.) sequentially pass through the first tape receiver unit (substrate connection replacement mechanism) CSa, the first buffer mechanism BF1, n processing devices U1, U2, U3, U4, U5, ... Un, the second buffer mechanism BF2, the first 2 The belt take-up unit (second substrate connection replacement mechanism) CSb is wound around one of the recovery rollers RR3 and RR4.

In addition, in this embodiment, the substrates which are put into the first, second buffer mechanisms BF1, BF2, and the processing devices U1 ... Un as processing substrates are appropriately referred to as a substrate P and described. The substrates taken out from the supply rollers RR1 and RR2 before being put in are appropriately referred to as substrates P1 and P2. The substrates recovered by the processing units U1 ... Un and processed by the recovery rollers RR3 and RR4 are appropriately referred to as substrates P3 and P4.

The upper control device CONT (control unit, second control unit) controls the processing units U1 to Un, the first and second belt adapter units CSa, CSb, and the first and second buffer mechanisms BF1 and BF2. The higher-level control device CONT controls the rotational drive of the motor shaft MT1 mounted on the supply roller RR1 in the first mounting section RS1 and the rotational drive of the motor shaft MT2 mounted on the supply roller RR2 in the second mounting section RS2. The higher-level control device CONT includes an interlocking control unit that interlocks the cutting operation of the substrate P1 (the first substrate) with the storage amount of the substrate P1 in the first buffer mechanism BF1 (the buffer mechanism). The high-level control device CONT includes cutting of the substrate P (processing substrate). An interlocking control unit that operates in accordance with the storage amount of the substrate P in the second buffer mechanism BF2.

As shown in FIG. 10, a supply sensor S1 is provided near the first mounting portion RS1 to detect the supply status of the substrate P1 on the supply roller RR1. When the supply sensor S1 detects the end of the supply of the substrate P1, it outputs an end signal to the higher-level control device CONT. Similarly, a supply sensor S2 is provided near the second mounting portion RS2 to detect the supply condition of the substrate P2 on the supply roller RR2. When the supply sensor S2 detects the end of the supply of the substrate P2, it outputs an end signal to the higher-level control device CONT.

In FIG. 9, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long belt direction) of the substrate P is set to the Y-axis direction. In addition, the substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or a fine partition wall structure (concave-convex structure) for precise patterning may be formed on the surface.

FIG. 10 is a diagram showing a schematic configuration of the first tape receiver portion CSa and the first buffer mechanism BF1.

The first belt take-up section CSa is taken out from one of the supply rollers RR1 and RR2 and is sent to the first buffer mechanism BF1. The substrate is taken out from the other of the supply rollers RR1 and RR2 and has a clamping drive roll NR1. 1. Cut off the joint units CU1 and CU2. In addition, the first tape receiver portion CSa (substrate connection replacement mechanism) includes a substrate P1 (first substrate) which is bonded to the front end of the substrate P2 (second substrate) supplied from the supply roller RR2 (second roller). ) Is a control unit that controls the cutting operation and the joining operation to cut the substrate P1 (the first substrate) after the terminal portion is positioned.

Under the control of the upper control device CONT, the clamp driving roll NR1 holds the substrate P1 or the substrate P2 and conveys it to the first buffer mechanism BF1 or stops the conveyance of the substrate P. The axial direction is arranged at a substantially intermediate position between the first mounting portion RS1 and the second mounting portion RS2.

The cutting and joining units CU1 and CU2 are symmetrically arranged in the Z-axis direction with the imaginary joining surface VF1 parallel to the XY plane at the position in the Z-axis direction of the NR1 by the clamp drive. The cutting and joining unit CU1 includes a suction pad 1A, a cutter 2A, and a tension reel 3A at positions facing the virtual joining surface VF1. In addition, the cutting and joining unit CU1 uses a rotating mechanism (not shown) to indicate the joining position of the cutting and joining unit CU2 opposite to the suction pad 1A shown in solid lines in FIG. 10 and the two-dot chain line shown in FIG. 10. The suction pad 1A rotates (oscillates) between the attachment position facing the first attachment portion RS1. Furthermore, the cutting and joining unit CU1 is moved in a direction away from and approaching the virtual joining surface VF1 (that is, the cutting and joining unit CU2) by a moving mechanism (not shown) at the joining position. The suction pad 1A is disposed on the downstream side (+ X-axis side) of the substrate P (substrate P1) in the transport direction of the substrate 2 (the substrate P1) when the cutting and joining unit CU1 is located at the joining position.

Similarly, the cutting and joining unit CU2 includes a suction pad 1B, a cutter 2B, and a tension roll 3B at positions facing the virtual joining surface VF1. In addition, the cutting and joining unit CU2 has a rotation mechanism (not shown), and the joining position of the cutting and joining unit CU1 and the adsorption pad 1B shown by the solid line in FIG. 10 is the same as the two-dot chain line shown in FIG. 10. The suction pad 1B rotates (oscillates) between the attachment position facing the first mounting portion RS2. In addition, the cutting and joining unit CU2 is moved in a direction away from and approaching the virtual joining surface VF1 (that is, the cutting and joining unit CU1) by a moving mechanism (not shown) at the joining position. The suction pad 1B is arranged on the downstream side (+ X-axis side) of the substrate P (substrate P2) in the conveying direction when the cutting and joining unit CU2 is located at the joining position.

The movement of these cut-off joint units CU1, CU2 is controlled by the upper control device CONT.

The first buffer mechanism BF1 is disposed between the processing device (processing mechanism) U1 and the first tape feeder section CSa, and temporarily stores the substrate P transported from the first tape feeder section CSa within a predetermined longest storage range and then transfers it to the processing device. U1 is sent out and includes a tension reel mechanism DR1 and a clamp drive reel NR2.

The grip driving reel NR2 holds the substrate P stored by the first buffer mechanism BF1 and conveys it to the processing unit U1. The grip driving reel NR2 is disposed at approximately the same position as the grip driving reel NR1 on the downstream side of the substrate P in the transport direction of the tension reel mechanism DR1. Z-axis position.

The tension reel mechanism DR1 has a plurality of upper reels RJ1 whose lifting range is relatively above and a lower reel RK1 which is relatively below the lifting range is arranged in the X direction alternately, and each of the reels RJ1 and RK1 can independently go to Z Move in the axis direction. The upper dead point position JU1 and the lower dead point position JD1 of the upper reel RJ1 are set at positions above the upper dead point position JU2 and the lower dead point position JD2 of the lower reel RK1. The operation of these tension reel mechanisms DR1 is also controlled by the upper control device CONT.

FIG. 11 is a diagram showing a schematic configuration of the second tape receiver section CSb and the second buffer mechanism BF2.

The second buffer mechanism BF2 is disposed between the processing device (processing mechanism) Un and the second tape feeder section CSb, and temporarily stores the substrate P transported from the processing device Un within the predetermined longest storage range to the second tape feeder section. The CSb is sent out, and includes a nip drive reel NR3 and a tension reel mechanism DR2.

The tension reel mechanism DR2 has a plurality of upper reels RJ2 whose lifting range is relatively above and a lower reel RK2 which is relatively below the lifting range is arranged alternately in the X-axis direction, and each of the reels RJ2 and RK2 can be moved independently. Move in the Z axis direction. Above the reel RJ2 The dead point position JU3 and the lower dead point position JD3 are set at positions above the dead point position JU4 and the lower dead point position JD4 above the lower roll RK2. The operation of these tension reel mechanisms DR2 is also controlled by the upper control device CONT.

The second belt taker unit CSb replaces the substrate P transported from the second buffer mechanism BF2 and recovered by one of the recovery rollers RR3 and RR4 to the other of the recovery rollers RR3 and RR4, and includes a clamping drive roll NR4, Disconnect the joint units CU3, CU4.

The grip drive roll NR4 is controlled by the upper control device CONT to make the substrate P conveyed from the second buffer mechanism BF2 toward the cutting and bonding unit CU3, CU4 or stop the conveyance of the substrate P. The position in the Z axis direction is arranged at The position of an imaginary joint surface VF2 of the third mounting portion RS3 and the fourth mounting portion RS4 at an approximately intermediate position and parallel to the XY plane.

The cutting joining units CU3 and CU4 are symmetrically arranged in the Z-axis direction with the virtual joining surface VF2 as a center. The cutting and joining unit CU3 includes a suction pad 1C, a cutter 2C, and a tension roll 3C at positions facing the virtual joining surface VF2. In addition, the cutting and joining unit CU3 uses a rotating mechanism (not shown) to indicate the joining position of the cutting and joining unit CU4 opposite to the suction pad 1C shown by the solid line in FIG. 11 and the two-dot chain line shown in FIG. 11. The suction pad 1C rotates (oscillates) between the attachment position facing the third mounting portion RS3. Further, the cutting and joining unit CU3 is moved in a direction away from and approaching the virtual joining surface VF2 (ie, the cutting and joining unit CU4) by a moving mechanism (not shown) at the joining position.

When the cutting and joining unit CU3 is located at the joining position, the suction pad 1C is disposed on the upstream side (-X axis side) of the substrate P in the conveying direction of the substrate 2 relative to the tool 2C.

Similarly, the cutting and joining unit CU4 faces the virtual joining surface VF2. Equipped with suction pad 1D, cutter 2D, and tension roll 3D. In addition, the cutting and joining unit CU4 has a rotation mechanism (not shown), and the joining position of the cutting and joining unit CU3 and the suction pad 1D shown by the solid line in FIG. 11 is the same as the two-dot chain line shown in FIG. 11. The suction pad 1D rotates (oscillates) between the attachment position facing the fourth attachment portion RS4. Further, the cutting and joining unit CU4 is moved in a direction of leaving / approaching with respect to the virtual joining surface VF2 (that is, the cutting and joining unit CU3) by a not-shown moving mechanism at the joining position. When the cutting and joining unit CU4 is located at the joining position, the suction pad 1D is arranged on the upstream side (-X axis side) of the substrate P in the conveying direction with respect to the tool 2D.

The movement of these cut-off joint units CU3, CU4 is controlled by the upper control device CONT.

As shown in FIG. 11, the recovery reel RR3 is mounted on the motor shaft MT3 in the third mounting portion RS3. The recovery roll RR4 is mounted on the motor shaft MT4 in the fourth mounting section RS4. The rotation drive of the motor shaft MT3 and the rotation drive of the motor shaft MT4 are controlled by the upper control device CONT.

As shown in FIG. 11, a winding sensor S3 is provided near the third mounting portion RS3 to detect the winding state of the substrate P3 on the recovery roll RR3. The winding sensor S3 outputs an end signal to the host controller CONT when the winding end of the substrate P3 is detected. Similarly, a winding sensor S4 is provided near the fourth mounting portion RS4 to detect the winding state of the substrate P4 on the recovery roll RR4. When the winding sensor S4 detects the end of winding of the substrate P4, it outputs an end signal to the host controller CONT.

The take-up rolls RR3 and RR4 are provided with a lead-in introduction substrate (third base) PK whose lead end is connected to the roller core and the end part is joined with the substrate P3 or the substrate P4 (only the base plate PK of the take-up roll RR4 is shown in FIG. 11). . The substrate PK may be the same material as the substrate P that is processed by the processing devices U1 to Un, and may be substantially the same thickness and different in material from the substrate P.

The processing device U5 of this embodiment is to heat the substrate P carried from the processing device U4 and adjust the moisture content of the substrate P wetted by the wet process to a predetermined value or apply crystallization of a semiconductor material or include metal nanometers. A heating and drying device for thermal tempering (200 ° C or lower) used for removing the solvent of particles of ink, etc., but detailed description is omitted. After that, the substrate P, which has passed through several processing devices and passed through the last processing device Un of the series of processes, is temporarily stored in the second buffer mechanism BF2, and is appropriately replaced with the second belt taker section CSb, and is wound onto the recovery roller RR3. Or recovery roller RR4.

Next, operations of the first tape receiver unit CSa and the first buffer mechanism BF1 in the processing of the substrate P of the component manufacturing system SYS configured as described above will be described with reference to FIGS. 12 to 19. In addition, although the operations of various processing devices, components, and the like constituting the component manufacturing system SYS are controlled by the high-level control device CONT, the description of the high-level control device CONT control is omitted in the following description.

FIG. 12 shows that the substrate P1 drawn from the supply roller RR1 passes through the reel 3A and the clamping drive reel NR1 of the cutting and joining unit CU1 as the first substrate and is transported to the first buffer mechanism BF1 and temporarily stored in the first buffer mechanism BF1. Illustration. As shown in FIG. 12, in the first buffer mechanism BF1, the upper reel RJ1 is located at the upper dead center position JU1, and the lower reel RK1 is located at the lower dead center position JD2, whereby the substrate P is stored in the first buffer mechanism BF1 near the longest length. .

In the second mounting portion RS2, the supply roller RR2, which is replaced by the substrate P1 of the supply roller RR1 when the substrate P1 runs out, is mounted on the motor shaft MT2, and the cutting and joining unit CU2 is rotated to move the suction pad 1B. To the placement. The front end of the substrate P2 is sucked (connected or connected) and fixed to the suction pad 1B located at the mounting position, and then it is mounted on the surface opposite to the suction side. T on both sides.

The attachment of the substrate P2 to the adsorption pad 1B and the double-sided tape is performed by an operator or a robot.

After the substrate P2 with T on both sides is attached to the adsorption pad 1B, as shown in FIG. 13, the cutting and joining unit CU2 is rotated to move the substrate P2 to the joining position, and the motor shaft MT2 is rotated. The driving causes the supply roller RR2 to rotate in a direction opposite to the supply direction of the substrate P2 (counterclockwise in FIG. 13), thereby applying a predetermined tension to the substrate P2.

On the other hand, after the supply sensor S1 detects the completion of the supply of the substrate P1 from the supply roller RR1, the driving of the nip driving reel NR1 is stopped, and the motor shaft MT1 is rotationally driven in a direction opposite to the conveying direction of the substrate P1. This applies a weak tension to the substrate P1 between the nip drive roll NR1 and the supply roller RR1.

After the driving of the clamp driving reel NR1 is stopped, the clamp driving reel NR2 is continuously driven. Therefore, the tension reel mechanism DR1 operates corresponding to the driving of the clamp driving reel NR2, and appropriately lowers the upper reel RJ1 and lowers the lower reel RK1. Thereby, the substrate P stored in the first buffer mechanism BF1 is continuously conveyed to the processing device U1 at a constant speed by the clamp driving roller NR2.

Next, as shown in FIG. 14, the cutting and bonding units CU1 and CU2 are moved toward each other, and the substrates P1 and P2 are crimped between the suction pads 1A and 1B for a certain period of time with the T on both sides. Thereby, the board | substrate P2 is cut | disconnected in a subsequent step, and it is bonded to the board | substrate P1 through the both-surface tape T at the position of the terminal part of the board | substrate P1, and is bonded.

In addition, during the bonding process of the substrates P1 and P2, the driving roll is clamped and driven. The NR2 and the tension reel mechanism DR1 are also continuously driven. The substrate P stored in the first buffer mechanism BF1 is continuously driven to the processing device U1 at a certain speed by clamping and driving the reel NR2.

After the substrate P1 and the substrate P2 are bonded, the adsorption pad 1B of the cutting and bonding unit CU2 is opened to the atmosphere. Then, as shown in FIG. 15, the cutting and bonding unit CU2 is moved away from the cutting and bonding unit CU1 (+ Z axis). Direction). Thereby, the front end of the substrate P2 drawn from the supply roller RR2 is sucked and held on the suction pad 1A of the cutting and joining unit CU1 in a state of being bonded (connected or connected) to the substrate P1 by the double-sided tape T.

Thereafter, in a state where tension is applied to the substrate P1 between the cutting and joining unit CU1 and the supply roller RR1, the opposing substrate P1 is cut by the cutter 2A of the cutting and joining unit CU1. As the cutter 2A, for example, a configuration can be adopted in which the cutting edge is slid in the width direction (Y-axis direction) of the substrate P1 to cut the substrate P1.

During the cutting process of the substrate P1, the clamp driving reel NR2 and the tension reel mechanism DR1 are continuously driven, and the substrate P stored in the first buffer mechanism BF1 is clamped to drive the reel NR2 to the processing device U1 to Continuous delivery at a certain speed.

After the substrate P1 is cut, the suction pad 1A of the cutting and joining unit CU1 is opened to the atmosphere, and then, as shown in FIG. 16, the cutting and joining unit CU1 is moved away from the cutting and joining unit CU2 (imaginary joining surface VF1). (-Z axis direction). Thereby, the substrate P1 drawn out from the supply roll RR1 is wound around the supply roll RR1 by rotation in a direction opposite to the conveying direction of the supply roll RR1.

Regarding the supply roller RR2, the substrate P2 is rotated by the rotation roller RR2 and the nip drive roll NR1 (and the roll 3B) by a rotation torque in a direction opposite to the conveying direction of the supply roll RR2. Tension is given between. Thereby, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P2 as the second substrate drawn out from the supply roller RR2. The substrate P2 as the second substrate may have the same specifications as the substrate P1 (the first substrate).

After that, the clamp driving reel NR1 rotates at a slightly faster speed than the clamp driving reel NR2. As shown in FIG. 17, the tension reel mechanism DR1 corresponds to the driving of the clamp driving reel NR1, and the upper stage is appropriately performed. The reel RJ1 rises and the lower reel RK1 falls. In addition, the motor shaft MT2 is driven to rotate in the conveying direction, and the substrate P2 drawn out from the supply roller RR2 is fed in, and the storage length of the substrate P in the first buffer mechanism BF1 is increased.

Next, after the storage length of the substrate P of the first buffer mechanism BF1 becomes approximately the maximum, the grip driving roll NR1 rotates at the same speed as the grip driving roll NR2, thereby storing the substrate P in the first buffer mechanism BF1. Balanced length. Further, the supply roller RR1 of the substrate P1 that is almost exhausted is removed (detachable) from the first mounting portion RS1, and as shown in FIG. 18, another supply roller RR5 on which the substrate P5 is wound is mounted.

After the supply roller RR5 is installed, according to the detection result of the supply sensor S2, before the substrate P2 of the supply roller RR2 is used up, as shown in FIG. 18, the cutting and joining unit CU1 is rotated to move the suction pad 1A to the placement position. The front end of the substrate P5 is suction-fixed (connected or connected) to the suction pad 1A located at the mounting position, and then, two-sided tape T is attached to the surface opposite to the suction side.

Thereafter, the supply roller RR5 is rotated in a direction opposite to the supply direction of the substrate P5 (counterclockwise in FIG. 18) by the rotational driving of the motor shaft MT1, thereby applying a predetermined tension to the substrate P5 and rotating the cutting and joining unit CU1 at the same time. As shown in FIG. 19, it moves to the engagement position.

Next, the supply sensor S2 detects the supply of the substrate P2 on the supply roller RR2. After the completion, stop the driving of the clamp driving reel NR1, and move the cutting and joining units CU1 and CU2 toward each other in the same manner as the above steps, with the two sides with T on the suction pads 1A, 1B. The substrates P2 and P5 are crimped together for a certain period of time, and the substrate P2 is cut by the cutter 2B of the cutting unit CU2. Thereby, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P5 pulled out from the supply roller RR5.

As described above, the substrates P sequentially switched are applied with the photosensitive functional liquid of the processing device U1, the heating processing of the processing device U2, the pattern exposure processing of the processing device U3, the wet processing of the processing device U4, and the processing device. After the heating and drying process of U5, it is sequentially sent to the second buffer mechanism BF2, the second belt receiver section CSb, and recovered to the recovery roll RR3 or the recovery roll RR4.

Next, the operations of the second belt receiver CSb and the second buffer mechanism BF2 on the recovery roller side in the processing of the substrate P of the component manufacturing system SYS configured as described above will be described with reference to FIGS. 20 to 25.

FIG. 20 shows that the substrate P, which is a processing substrate, is conveyed to the second buffer mechanism BF2 through the clamp driving reel NR3 and stored, and the substrate P conveyed (discharged) from the second buffer mechanism BF2 through the clamp driving reel NR4 is transmitted through the cutting and bonding unit. The roll 3C of CU3 is recovered to the recovery roll RR3 mounted on the third mounting portion RS3. As shown in FIG. 20, in the second buffer mechanism BF2, the upper reel RJ2 is located at the lower dead center position JD3, and the lower reel RK2 is located at the upper dead center position JU4, so that the substrate P is stored in the second shortest length in the second Buffer mechanism BF2.

In the fourth mounting portion RS4, after the winding recovery of the recovery roller RR3 is completed, the recovery roller RR4 of the recovery substrate P is mounted on the motor shaft MT4, and then the cutting and joining unit CU4 is rotated to move the suction pad 1D to the placement position. The leading end is connected to the lead-in board of the recovery roller RR4. The terminal portion of the PK (hereinafter, simply referred to as the substrate PK) is suction-fixed (connected or connected) to the suction pad 1D located at the mounting position, and then, two sides of the tape T are mounted on the surface opposite to the suction side. After attaching T on both sides of the substrate PK, the cutting and joining unit CU4 is rotated to move to the joining position, and the rotation of the motor shaft MT4 drives the recovery roller RR4 to the recovery direction of the substrate PK (substrate P) (Fig. 20 center clockwise), thereby giving the substrate PK a predetermined tension.

Next, after the winding sensor S3 detects the recovery of the substrate P of the recovery roller RR3, the driving of the clamp driving reel NR4 is stopped, and the tension reel mechanism DR2 is actuated, and the ascent of the upper reel RJ2 and the lower reel Reel of RK2 drops. As a result, the substrate P conveyed from the processing device U5 by the grip driving roll NR3, and the storage length of the second buffer mechanism BF2 is increased by a certain amount (the conveyance amount corresponding to the conveyance speed of the substrate P on the production line) and increased. Also stored.

On the other hand, after the recovery of the substrate P of the recovery roller RR3 is completed, as shown in FIG. 21, the cutting and joining units CU3 and CU4 are moved toward each other, and in a state of having T on both sides, the suction pad 1C, The substrates P and PK are crimped for a certain time between 1D. Thereby, the terminal portion of the substrate PK becomes the position of the end portion before the substrate P is cut in the subsequent step, and is bonded (joined or connected) to the substrate P through the two-sided tape T.

After the substrate P and the substrate PK are bonded, the suction pad 1D of the cutting and bonding unit CU4 is opened to the atmosphere. Then, as shown in FIG. 22, the cutting and bonding unit CU4 is moved away from the cutting and bonding unit CU3 (+ Z axis). Direction). Thereby, the front end portion of the substrate PK is sucked and held on the suction pad 1C of the cutting and bonding unit CU in a state of being bonded to the substrate P by the double-sided tape T.

After that, in a state where tension is applied to the substrate P between the cutting and joining unit CU3 and the recovery roll RR3, the opposing substrate P is cut by the cutter 2C of the cutting and joining unit CU3. Off. After the substrate P is cut, the suction pad 1C of the cutting and joining unit CU3 is opened to the atmosphere, and then, as shown in FIG. 23, the cutting and joining unit CU3 is moved away from the cutting and joining unit CU4 (-Z axis direction). mobile. Thereby, the recovery target of the substrate P transported from the second buffer mechanism BF2 (that is, the substrate P processed in the processing devices U1 to Un) is switched to the recovery roller RR4.

During the above-mentioned joining process and cutting process of the second taper section CSb, the rising of the upper roll RJ2 and the lower of the lower roll RK2 in the second buffer mechanism BF2 are appropriately performed, and borrowed from the processing device U5. The length of the substrate P conveyed by the grip driving roll NR3 is increased by a certain amount in the second buffer mechanism BF2 and stored at the same time.

Next, after the switching of the recovery target of the substrate P to the recovery roll RR4 is completed, the grip driving roll NR4 rotates at a slightly faster speed than the grip driving roll NR3, and the tension roll mechanism DR2 and the grip driving roll NR4 In response to the driving, the lower roll RJ2 and the lower roll RK2 are appropriately raised, and the substrate P stored in the second buffer mechanism BF2 is made during the bonding process and the cutting process of the second tape receiver section CSb. The length is reduced, and it becomes the initial minimum storage length (refer to FIG. 24). After the length of the substrate P stored in the second buffer mechanism BF2 has been substantially minimized, the grip drive roll NR4 is rotated at the same speed as the grip drive roll NR3.

On the other hand, after the recovery of the substrate P is completed at the third mounting portion RS3, the recovery roller RR3 is removed. As shown in FIG. 24, the connection (connection or bonding) is introduced into the substrate PK2 (hereinafter, simply referred to as the substrate PK2). The recovery roller RR6 at the front end is mounted on the motor shaft MT3, and the terminal portion of the substrate PK2 is sucked and fixed at the suction pad 1C of the cutting and joining unit CU3 which is rotated at the mounting position, and then is stuck on the surface opposite to the suction side Let T be on both sides.

After attaching T on both sides of the substrate PK2, the cutting and joining unit CU3 is rotated to move to the joining position, and the recovery roller RR6 is moved to the recovery direction of the substrate PK2 (substrate P) by the rotation driving of the motor shaft MT3 (FIG. 25) (Clockwise in the middle), thereby waiting in a state where a predetermined tension is applied to the substrate PK2 until the winding sensor S4 detects that the recovery of the recovery roller RR3 is completed.

As described above, in the present embodiment, while the first buffer mechanism BF1 temporarily stores the substrate P and sends it to the processing apparatus U1, the substrate P2 drawn from the new supply roller RR2 takes over the substrate P and transfers it to the first buffer mechanism BF1. Therefore, the roller as a source of supply can be changed without stopping each process of the processing devices U1 to Un. Therefore, in the present embodiment, it is possible to avoid a situation in which the substrate P that is put into the processing apparatuses U1 to Un is wasted at the time of the change of the supply roller and the cost is increased.

Furthermore, in the present embodiment, while the substrate P transported from the processing apparatus Un is temporarily stored in the second buffering mechanism BF2, the target for recovery of the substrate is switched. Therefore, when changing the collection target of the substrate P, it is also possible to avoid a situation in which the substrate P that is put into the processing devices U1 to Un at the time of the change is wasted and the cost is increased.

In the present embodiment, a new substrate is bonded to a previously used substrate in the first and second tape receiver portions CSa and CSb, and the previous substrate is cut. Therefore, in the case where the cutting is performed first, the substrate tension can be prevented from causing defects such as the joint separation during cutting due to the applied tension, and the substrate processing can be performed stably.

As mentioned above, although preferred embodiment of this invention was described with reference to drawings, this invention is not limited to the said example. The shapes, combinations, and the like of the constituent members shown in the above examples are examples, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

For example, in the embodiment described above, the processing mechanism is exemplified by a configuration including a plurality of processing devices U1 to Un. However, the present invention is not limited to this, and a configuration in which the above-mentioned substrate connection replacement mechanism is provided in one processing device may be used.

Moreover, in the said embodiment, it is a structure provided with the recovery roll to which the lead-in board | substrate PK was connected separately. However, for example, a configuration in which a supply roller that has been used and the substrate at the front end portion is cut may be used.

Moreover, in the said embodiment, it was a structure which provided the two roll mounting parts on the supply side and the collection side, respectively. However, it is also possible to provide three or more roller mounting portions.

In the above embodiment, before the substrate supplied from one of the two supply rollers becomes the roller terminal, the substrate from the other roller is automatically taken over, and the processing can be continued without stopping the production line. If there is a defect in a pattern formed on a substrate or a defect in a manufacturing device somewhere in a production line, there is a risk of making a large number of defective products.

Therefore, it is also possible to constitute a production line (factory), that is, the production line before the completion of the final product, divides the majority of steps of the process of the long-band substrate into several blocks, and performs roll-to-roll in each block. For continuous processing, in the next step block, it is transported in units of rollers on which the substrate forming the semi-finished product is wound, and is mounted on the predetermined mounting section (RS1 or RS2). In this case, the substrate transfer can be performed continuously in units of step blocks. Even if a problem (pattern defect, device defect, etc.) occurs in a certain step block, only the step block can be temporarily stopped, which can reduce defective products. Produced in large numbers.

In the above embodiment, the supply rollers RR1 and RR2 mounted on each of the two mounting portions RS1 and RS2, and the sheet substrate for product manufacturing are wound by the same amount of Immediately before the supply of the substrate of the roller RR1 (roller end), the substrate of the other roller RR2 is replaced, and the substrate of the roller RR2 is continuously processed until it is used up. However, the supply rollers installed in one of the mounting sections RS1 and RS2 can only be used while the substrates are continuously supplied to the processing units U1 to Un while the supply rollers at the other end of the rollers are replaced with new ones.

In this case, for example, suppose that the supply roller serving as the roller terminal is RR2, remove the roller RR2 from the mounting section RS2, install a new supply roller on the mounting section RS2, and complete the preparation for joining the first belt receiver section CSa. The preparation time before the state (state of FIG. 13) is 180 seconds. During this period, the length of the substrate (P1) from the other supply roller RR1 into the processing device U1 (production line) is set as the substrate conveying speed during processing. When it is 50 mm / second, it becomes 9 m.

Therefore, after the substrate (P1) of the 9m quantity is supplied from the other supply roller RR1, the substrate (P2) from the new supply roller RR2 installed in the mounting portion RS2 is immediately transferred by the first tape receiver portion CSa. The front end is bonded (connected or connected) at a position where only the substrate (P1) from the supply roller RR1 is fed into the processing unit U1 only about 9m, and the substrate (P1) is cut and replaced with the substrate (P2) from the supply roller RR2. can.

As described above, when the substrate (P1) from the supply roller RR1 mounted on the mounting portion RS1 is used as a temporary replacement substrate (for example, about 9m), the processing performed on the substrate (P1) is set as each processing. The conditions of the devices U1 ~ Un are determined or guided for maintenance and management. The components formed here may not be used as final products.

In addition, in the case of temporarily replacing a substrate (for example, about 9m), it is not necessary to wind the substrate (P1) on the supply roller RR1 in advance, and to fold and store a leaf-type substrate cut to a length of 10m, for example, Boxes, etc., take out substrates (10m) one by one from this box and supply them to the first tape receiver CSa is also available.

The technical scope of the present invention is not limited to the embodiments described above. For example, one or more of the elements described in the above embodiments may be omitted. The elements described in each of the above embodiments can be appropriately combined.

Claims (4)

A substrate processing method, in which a long first sheet substrate is continuously carried into a processing device along the long direction, and a processing for forming an electronic component on the first sheet substrate is performed by the processing device, and is characterized in that: In the bonding stage, a second sheet substrate is bonded to a portion of the first sheet substrate that becomes an end portion in the long direction by a bonding mechanism arranged on the carrying-in side of the first sheet substrate; In the processing stage, while the second sheet-like substrate is bonded to the first sheet-like substrate, the second sheet-like substrate passes through the processing device with a predetermined length from the bonding portion, and a guiding process is performed for condition determination or maintenance management of the processing device. For example, the substrate processing method according to the scope of application for the patent, wherein the bonding stage includes the first sheet substrate or the first substrate to be carried into the processing device by a buffer mechanism disposed between the bonding mechanism and the processing device. Two pieces of substrate are stored in such a way that the length in the strip direction is changed within a predetermined longest storage range. For example, the method for processing a substrate according to item 2 of the patent application includes temporarily stopping the loading of the first sheet-shaped substrate to the buffer mechanism before the bonding stage, and arranging the buffer mechanism with the bonding mechanism together with the buffer mechanism. A step of cutting in the carrying-in side to cut the first sheet substrate in a long direction, and the second sheet substrate is bonded to the end of the first sheet substrate after the cutting by the bonding mechanism; unit. For example, the substrate processing method of the second scope of the patent application, wherein the bonding stage includes temporarily stopping the loading of the first sheet-shaped substrate to the buffer mechanism, and is disposed on the loading side of the buffer mechanism together with the bonding mechanism. The cutting mechanism is a cutting step for cutting the first sheet substrate in a long direction. Before cutting, the end portion of the second sheet substrate is bonded to the cutting substrate by the bonding mechanism. After cutting, a portion of the first sheet substrate that is intended to be an end portion is subjected to the aforementioned cutting step.