KR102108498B1 - Substrate processing system - Google Patents

Abstract

The substrate processing system includes a first processing unit that continuously performs a first processing on a substrate conveyed at a speed V1, and a substrate processed by the first processing unit at a speed V2, and continuously performs a second processing on the substrate. When a second processing unit is provided, and the speed relationship can be set to V1> V2 according to the performance of each of the first and second processing units, a plurality of second processing units are provided and cut. When the speed relationship can be set to V1 < V2 according to the performance of each of the first and second processing units, the mechanism and a selection input mechanism are further provided, and a plurality of first processing units are provided. A joining mechanism is further provided for joining a plurality of substrates to be subjected to first processing by the first processing unit in order, and then putting them into the second processing unit.

Description

Substrate processing system {SUBSTRATE PROCESSING SYSTEM}

The aspect of this invention relates to a cutting mechanism, a bonding mechanism, a substrate processing system, a substrate processing apparatus, and a substrate processing method.

This application claims priority based on United States provisional application 61 / 650,712 filed on May 23, 2012 and United States provisional application 61 / 654,500 filed on June 1, 2012, the contents of which are incorporated herein by reference.

In a large screen display element such as a liquid crystal display element, a metal material is deposited after depositing a semiconductor material such as Si or a transparent electrode such as ITO (Indium Tin Oxide) on a flat glass substrate, and photoresist (photoresist) ) To transfer the circuit pattern. Thereafter, after developing the photoresist, a circuit pattern or the like is formed by etching. However, since the glass substrate is enlarged in accordance with the large screen of the display element, it is also difficult to transport the substrate. Therefore, the roll-to-roll method (hereinafter simply) for forming a display element on a flexible substrate (for example, a film member such as polyimide, PET, metal foil, or ultra-thin glass sheet) A technique called "roll system" has been proposed (for example, see Patent Document 1).

In addition, in Patent Document 2, a flexible, elongated sheet (substrate) wound around the outer surface of a rotatable cylindrical mask and wound around a transport roller is disposed, and the mask pattern is formed. A technique for continuously exposing a substrate to a substrate has been proposed.

In addition, in Patent Document 3, the pattern formation region of the flexible long sheet (substrate) sent by the roll method is temporarily held on a flat stage, and a pattern image of a mask projected via an enlarged projection lens is provided. Techniques have been proposed for scanning exposure to the pattern formation region.

Patent Document 1: International Publication No. 2008/129819 Patent Document 2: Japanese Utility Model Publication No. 60-019037 Patent Document 3: Japanese Patent Publication No. 2011-22584

However, the following problems exist in the prior art as described above.

When a plurality of processes are sequentially performed on a long sheet-like substrate, depending on the performance of each processing unit, the conveyance speed of the substrate suitable for processing is different for each unit (for each processing content). For example, in the case of exposure treatment such as Patent Document 2, the conveyance speed (tact) of the substrate is limited by the sensitivity of the photosensitive layer applied to the substrate surface, the luminance of the illumination light for exposure, and the like. In addition, in wet processing such as etching and plating, and in the drying / heating process after the wet processing, advantages such as miniaturization of the liquid tank and the drying / heating furnace are obtained by slowly conveying the substrate.

In addition, there is an optimum substrate transfer speed in order to secure productivity while maintaining high precision (micronization) in the deposition processing of functional materials, in the process of printing or inkjet printing, and the like. However, the optimum substrate transfer speeds are often different depending on the processing unit.

When a plurality of such processing units are combined to form a roll-type manufacturing line (processing system) in which a series of processes are continuously performed by sequentially passing through a long sheet-like substrate, the conveyance speed (speed of the manufacturing line) of the substrate is: During processing, the substrate transport speed is adjusted to the lowest processing unit.

Therefore, the processing unit having a high processing speed carries the substrate at a slow speed, although there is room for performance. Therefore, there is a possibility that the efficiency of the processing unit is deteriorated and the productivity of the entire production line is not improved.

It is an object of the present invention to provide a cutting mechanism, a bonding mechanism, a substrate processing system, and a substrate processing method that can contribute to the improvement of productivity.

Moreover, in patent document 1, an electronic device is formed on a sheet substrate mainly using a printing (ink jet) method, conveying a flexible sheet substrate by a roll method. However, in a typical printing site, when the remaining amount of the sheet substrate wound on the supply roll becomes small, the printing apparatus is temporarily stopped, the sheet substrate is cut between the printing apparatus and the recovery roll, and the wound printing is finished with the recovery roll. The sheet substrate is being sent to the next process. In that case, in the printing path from the inlet to the outlet of the printing apparatus, the sheet substrate during printing remains, and all of these are discarded as defective products. When printing with color ink on paper or film, the printing cost is very low. However, in the case of forming the electronic device in a roll method, the manufacturing cost per unit length (m) of the sheet substrate is still expensive, and when the sheet substrate remaining in the apparatus is discarded, as in a typical printing site, waste is increased and costs increase. Becomes.

Particularly, when a medium-sized and large-sized display panel made of organic EL is formed on a sheet substrate, the sheet substrate is a series of a plurality of processing devices, for example, a photosensitive layer printing device, an exposure device such as Patent Document 3, and a wet processing device. After passing continuously through a drying apparatus or the like, it is wound up on a recovery roll. Therefore, it is thought that the sheet substrate hanging from a plurality of processing apparatuses (processing steps) from the supply roll to the recovery roll is considered to be very long, and once conveyance of the sheet substrate is stopped, the sheet substrate is wasted over a considerably long distance. do.

Another aspect of the present invention aims to provide a substrate processing apparatus and a substrate processing method that increase productivity by suppressing cost increase.

According to the first aspect of the present invention, a first processing unit that continuously performs a first processing on a substrate conveyed at a velocity V1 in a long direction (longitudinal direction) and a substrate processed in the first processing unit As a substrate processing system equipped with a second processing unit that conveys at a speed V2 and continuously performs a second processing on the substrate, according to the performance of each of the first and second processing units, the relationship of speed is V1> When it can be set to V2, a plurality of second processing units are provided, and a cutting mechanism for cutting the substrate subjected to the first processing to a predetermined length in the elongated direction and a plurality of cut substrates behind the first processing unit. A first input processing mechanism is further provided to select one of the second processing units. When the speed relationship can be set to V1 < V2 according to the performance of each of the first and second processing units, the first processing is performed. Arrange multiple units and ah However, in front of the second processing unit, further comprising a joining mechanism for joining a plurality of substrates to which the first processing is performed by each of the plurality of first processing units, in turn, in a long direction, and inputting it to the second processing unit. A substrate processing system characterized by the above is provided.

According to the second aspect of the present invention, the first processing is continuously performed by the first processing unit on the substrate conveyed at the speed V1 in the long direction, and the substrate processed by the first processing unit is conveyed at the speed V2. As a substrate processing method comprising continuously performing a second processing on a substrate by a second processing unit, the relationship of speed can be set to V1> V2 according to the performance of each of the first and second processing units. When there is, a plurality of second processing units are used, and a process of cutting the substrate on which the first processing is performed to a predetermined length in the elongated direction is provided behind the first processing unit, and the plurality of second processing units are used to cut the cut substrate. When there is a selective input process to be input to any one of the first and second processing units, and the relationship between speeds can be set to V1 < V2, multiple first processing units are used and 2 treatment A substrate processing method further comprising a bonding process in which a plurality of substrates, each of which is subjected to first processing by each of the plurality of first processing units, is sequentially joined in a long direction in front of the unit to be input to the second processing unit. Is provided.

According to the third aspect of the present invention, the accumulation amount of the substrate is variable according to the amount of conveyance of the cutting portion for cutting the substrate on which the predetermined processing has been performed, and the amount of transfer of the substrate conveyed toward the cutting portion. A cutting mechanism is provided with a buffer portion for adjustment.

According to the fourth aspect of the present invention, a junction portion for joining a substrate on which a predetermined process is performed and a substrate accumulation amount is variable depending on a conveyance amount of a substrate on which a predetermined treatment is performed, and a substrate input to a predetermined process from the junction portion It is provided with a bonding mechanism having a buffer portion for adjusting the conveying amount of.

According to a fifth aspect of the present invention, in a substrate processing system for passing a substrate conveyed in a long direction through a first processing unit and then passing it through a second processing unit, the substrate processing speed of the substrate in the first processing unit is On the other hand, when reducing the conveyance speed of the substrate in the second processing unit, a cutting mechanism is provided between the first processing unit and the second processing unit to cut the substrate into a predetermined length in the elongated direction, and the first processing is performed. Regarding the conveyance speed of the substrate in the unit, when increasing the conveyance speed of the substrate in the second processing unit, a bonding mechanism is provided between the first processing unit and the second processing unit to join the substrate in a long direction. A substrate processing system is provided.

According to a sixth aspect of the present invention, a first mounting portion for mounting a first roll on which a long first substrate is wound, a second mounting portion for mounting a second roll on which a long second substrate is wound, and a first substrate A first substrate that is disposed between a processing mechanism and a processing mechanism and a first mounting portion that performs predetermined processing while sending either one of the second substrate and the processing substrate in a long direction, and is supplied from the first roll The first substrate to be cut while the first substrate is cut between the buffer mechanism and the buffer mechanism and the first mounting portion, which are temporarily accumulated within a predetermined longest accumulation range and then sent to the processing mechanism. There is provided a substrate processing apparatus comprising a substrate joint replacement mechanism for bonding a distal end portion of a second substrate supplied from a second roll to a terminal portion thereof and sending it to a buffer mechanism.

According to a seventh aspect of the present invention, a first mounting portion for mounting a first roll on which a long first substrate is wound, a second mounting portion for mounting a second roll on which a long second substrate is wound, and a first substrate A first substrate that is disposed between a processing mechanism and a processing mechanism and a first mounting portion that performs predetermined processing while sending either one of the second substrate and the processing substrate in a long direction, and is supplied from the first roll A buffer mechanism that temporarily accumulates within a predetermined longest accumulation range, and then sends it to the processing mechanism, cuts the first substrate between the buffer mechanism and the first mounting portion, and also cuts the buffer mechanism side of the first substrate to be cut. There is provided a substrate processing apparatus including a substrate joint replacement mechanism for connecting a distal end of a second substrate supplied from a second roll to a predetermined portion of the substrate and sending it to a buffer mechanism.

According to an eighth aspect of the present invention, a first mounting portion detachably mounting a first roll on which a long first substrate is wound, and a holding portion maintaining a second substrate of the same standard as the first substrate at a predetermined length. , Which is disposed between the processing mechanism and the processing mechanism and the first mounting portion to perform predetermined processing while sending either one of the first substrate and the second substrate as a processing substrate in a long direction, and is supplied from the first roll The first substrate to be cut while the first substrate to be cut is temporarily stored within a predetermined longest accumulation range and then sent to the processing mechanism, and the first substrate is cut between the buffer mechanism and the first mounting portion. A substrate processing apparatus is provided that includes a substrate joint replacement mechanism for connecting a distal end of the second substrate supplied from the holding portion to a predetermined portion on the buffer mechanism side of the apparatus, and sending it to the buffer mechanism.

According to a ninth aspect of the present invention, as a substrate processing method in which a predetermined processing is performed by a processing mechanism while sending an inputted long substrate as a processing substrate in the direction of the long length, the first roll wound around the first roll on which the long substrate is wound The first substrate supplied from the first roll is predetermined by mounting on the plate, attaching a second roll on which a long substrate is wound, and attaching the second roll to the second roll mounting portion, and a buffer mechanism disposed between the processing mechanism and the first mounting portion. The first substrate is cut between the buffer mechanism and the first mounting portion while temporarily accumulating within the longest accumulation range and then being sent to the processing mechanism and while temporarily transmitting the first substrate that has been accumulated to the processing mechanism. In addition, a substrate processing method is provided that includes connecting a distal end portion of a second substrate supplied from a second roll to a predetermined portion on the buffer mechanism side of the first substrate to be cut. .

According to a tenth aspect of the present invention, as a substrate processing method in which a predetermined processing is performed by a processing mechanism while sending an inputted long substrate as a processing substrate in the direction of a long length, the first roll on which a long substrate is wound is a first roll mounting unit First, supplied from the first roll in a buffer mechanism disposed between the processing mechanism and the first mounting portion, and a second substrate of the same standard as the first substrate, held at a predetermined length. The substrate is temporarily accumulated within a predetermined longest accumulation range, and then sent to the processing mechanism, and while the temporarily accumulated first substrate is being sent to the processing mechanism, the first between the buffer mechanism and the first mounting portion. Substrate processing including cutting a substrate and connecting a tip portion of a second substrate supplied from a holding portion to a predetermined portion of the first substrate to be cut on the buffer mechanism side This method is provided.

In the aspect of the present invention, the processing units used in each of the plurality of processing steps can be efficiently operated, and productivity of the entire production line related to substrate processing can be improved.

Moreover, in another aspect of the present invention, it is possible to greatly reduce the waste of the substrate, and it is possible to effectively suppress the increase in cost.

1 is a diagram schematically showing a substrate processing system according to a first embodiment.
2 is a schematic perspective view of a cutting mechanism according to the first embodiment.
3 is a schematic external perspective view of a first splicer unit according to the first embodiment.
4 is a schematic external perspective view of a second splice portion according to the first embodiment.
5 is a control block diagram of the substrate processing system according to the first embodiment.
It is a figure which shows the structure of a part of device manufacturing system concerning 1st embodiment.
It is a figure explaining the model arrangement example of the some processing unit which comprises a manufacturing line which concerns on 1st Embodiment.
8 is a time chart for explaining tact improvement by the manufacturing line according to the first embodiment.
9 is a diagram showing a configuration of a part of a device manufacturing system as a substrate processing apparatus according to the second embodiment.
It is a figure which shows schematic structure of the 1st splicer part and 1st buffer mechanism which concerns on 2nd embodiment.
It is a figure which shows schematic structure of the 2nd splicer part and 2nd buffer mechanism which concerns on 2nd embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate at the board | substrate supply side which concerns on 2nd Embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate at the board | substrate supply side which concerns on 2nd Embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate at the board | substrate supply side which concerns on 2nd Embodiment.
15 is a view showing a joining and cutting operation of the substrate on the substrate supply side according to the second embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate on the board | substrate supply side which concerns on 2nd Embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate at the board | substrate supply side which concerns on 2nd Embodiment.
18 is a view showing a joining and cutting operation of the substrate on the substrate supply side according to the second embodiment.
Fig. 19 is a diagram showing a joining and cutting operation of a substrate on the substrate supply side according to the second embodiment.
Fig. 20 is a diagram showing a joining and cutting operation of the substrate on the substrate recovery side according to the second embodiment.
Fig. 21 is a diagram showing a joining and cutting operation of a substrate on the substrate recovery side according to the second embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate on the board | substrate collection side concerning 2nd Embodiment.
Fig. 23 is a view showing the joining and cutting operation of the substrate on the substrate recovery side according to the second embodiment.
24 is a diagram showing a joining and cutting operation of the substrate on the substrate recovery side according to the second embodiment.
It is a figure which shows the joining and cutting operation | movement of the board | substrate on the board | substrate collection side concerning 2nd Embodiment.

First embodiment

Hereinafter, embodiments of the cutting mechanism, bonding mechanism, substrate processing system, and substrate processing method of the present invention will be described with reference to FIGS. 1 to 6.

FIG. 1 is a diagram schematically showing a roll-type substrate processing system SYS that, for example, passes sheet-like substrates P through three processing steps A, B, and C sequentially.

The substrate processing system includes a processing unit (UA) (a first processing unit) that performs processing A (a first processing) as a processing A on a substrate P, and a processing B (a first processing, a second processing) as a processing B Processing unit UB (first processing unit, second processing unit) for performing processing, processing unit UC (second processing unit) for processing processing C (second processing) as process C, cutting mechanism CU10 , The bonding mechanism PU10, the selection input mechanisms ST1, ST2, and the control unit CT (see FIG. 5) are mainly composed.

The processing unit UA includes a roll mounting portion RSA on which the supply roll RRA is mounted, and sends the substrate P subjected to the processing A to the cutting mechanism CU10. The processing unit UB is composed of processing units UB1 to UB3, each of which performs the same processing B, for example, three steps vertically or horizontally on the downstream side of the substrate conveying direction of the processing unit UA. It is arranged in three rows.

Each of the processing units UB1 to UB3 includes mounting portions RSB11 to RSB31 on which the roll of the substrate P on which processing A is performed is mounted, and mounting portions RSRS12 to RSB32 on which the roll of the substrate P subjected to processing B is mounted. ), And the substrate P from the rolls RRB11 to RRB31 mounted on the mounting portions RSB11 to RSB31 (hereinafter appropriately referred to as `` rolls (RRB11 to RRB31) '') is processed B After it is carried out, it is wound up on rolls RRB12 to RRB32 (hereinafter, referred to as 'self-rolls RRB12 to RRB32'), which are mounted on the mounting portions RSB12 to RSB32.

In addition, in FIG. 1, behind the cutting mechanism CU10 at the rear end of the processing unit UA, a roll RR1 for winding the substrate P on which the processing A has been performed is provided. When the predetermined length of the substrate P is wound on the roll RR1, the substrate P is cut there, and the roll RR1 is provided with mounting portions RSB11 to each of the processing units UB1 to UB3. RSB31) is mounted as any one of the jar rolls RRB11 to RRB31.

The processing unit UC can attach any one of the child rolls RRB12 to RRB32 to which the processing B has been performed in the processing units UB1 to UB3 as the roll RR2. The substrate P (intermediate products subjected to processing A and B) wound on the roll RR2 is brought into the processing unit UC via the bonding mechanism PU10, and processing C is performed. The board | substrate P which received the process C is wound up on the recovery roll RRC attached to the roll mounting part RSC, and is recovered.

Processing speed VA of processing A in processing unit UA in this embodiment VA (transfer speed of substrate P), processing speed VB of processing B in processing units UB1 to UB3 (transfer of substrate P) Speed) and the relationship between the processing speed VC of the processing C in the processing unit UC (transfer speed of the substrate P) is as follows.

VA ≒ VC ＞ VB

In addition, since the transfer speed of the substrate P is VA> VB between the processing unit UA and any one of the processing units UB1 to UB3, the processing unit UA has a high transfer speed V1. Corresponds to the first processing unit, and any one of the processing units UB1 to UB3 corresponds to the second processing unit having a low transport speed V2. On the other hand, between any one of the processing units UB1 to UB3 and the processing unit UC, since the transfer speed of the substrate P is VB <VC, any one of the processing units UB1 to UB3 The conveying speed V1 corresponds to the first processing unit having a low conveyance speed, and the processing unit UC corresponds to the second processing unit having a high conveying speed V2.

In this embodiment, the processing speeds VA and VC have a configuration that can be set to about three times the processing speed VB. When there is one processing unit UB performing the processing step B as in the prior art, the substrate P connected to one from the supply roll RRA to the recovery roll RRC turns the processing units UA, UB, and UC sequentially. As it passes, the conveying speed is set to the slowest processing speed VB. That is, the tact (line speed, productivity) of the entire production line is regulated by the slowest processing unit.

In this embodiment, a configuration not limited to the regulation can be achieved by double-processing (here, three are installed in parallel) the processing unit UB having a slow processing speed. In order to double-track (or provide multiple), when the substrate P is wound on the roll RR1 for a predetermined length, the processing steps A and B are not temporarily stopped, and the substrate P is cut. Mechanism CU10 is required.

The cutting mechanism CU10 mainly cuts the substrate P on which the processing A has been performed to a predetermined length, and as shown in FIGS. 1 and 2, the first buffer mechanism (first buffer portion) BF1 and It has a 1st splicer part (CSa) (cutting part). In addition, the cutting mechanism CU10 further includes an interlocking control unit interlocking the operation of the first splicer unit CSa (cutting unit) with the accumulation amount of the substrate P in the first buffer mechanism BF1 (buffer unit). do.

The 1st buffer mechanism BF1 is provided between the unit UA which performs process A as a 1st process, and the 1st splicer part CSa, and folds the board | substrate P with several rollers, etc., and has a predetermined length. It has a dancer roller mechanism DR1 for accumulating powder, and the substrate P is carried in and out while the accumulation length of the substrate P is variably adjusted by vertical movement of the dancer roller. The first buffer mechanism BF1 is provided adjacent to each other on the downstream side in the conveying direction of the substrate P of the processing unit UA, and the conveyance amount of the substrate P carried out to the first splicer part CSa A nip driving roller NR1 (see Fig. 5) for adjusting (or conveying speed) is provided. The drive of the dancer roller mechanism DR1 and the drive of the nip drive roller NR1 are controlled by the control unit CT.

Here, the structure will be described with reference to Fig. 3, which shows a schematic external perspective view of the first splice unit CSa.

The first splicer portion CSa has a suction pad 1 formed of, for example, a porous material on its upper surface, and is a slider movable in the conveying direction of the substrate P (hereinafter simply referred to as a 'conveying direction') (2), a platform (3) with a guide rail movably supporting the slider (2) in a transport direction, a driving unit (4) for lifting the platform (3), and a platform (3) in an elevated position When present, it moves in the width direction of the substrate P and adheres to the cutter portion 5 and the substrate P capable of cutting the substrate P adsorbed on the suction pad 1 of the slider 2 The winding shaft (7) for the roll (RR1) for winding the substrate (P), which is provided on the upper part of the attaching section (6) and the platform (3) to which the tape (TP) can be attached, and which has been subjected to the processing A, is provided on both sides. It is equipped with the holding | maintenance part 8 (movable up and down) to hold.

Moreover, after the winding shaft 7 is attached with a resin film or material with high adhesion to a part (or the entire circumferential surface) of its outer circumferential surface, after contacting the leading end of the substrate P with the outer circumferential surface of the winding shaft 7, By rotating the winding shaft 7, the board | substrate P can be wound up automatically.

The slider 2, the platform 3, the driving unit 4, the cutter unit 5, the attaching unit 6, and the holding unit 8 are configured as an integrated station unit SN, and a caster unit It can be transported by being placed on a table, etc., and can be positioned at a predetermined position.

Each drive of the slider 2, the driving unit 4, the cutter unit 5, and the attaching unit 6 is controlled by the control unit CT (see Fig. 5).

In addition, the station portion SN is capable of moving in the elongate direction while holding the substrate P, and the moving portion including the slider 2, the platform 3, the driving portion 4, and the like, and the cutting mechanism CU10 It is provided with a movement control part for moving the moving portion to the cutting region by or the bonding region by the bonding mechanism (PU10).

In addition, although the attaching part 6 in this embodiment is made to bond the board | substrate P by adhesive tape TP, other pasting methods (mechanism) may be sufficient. For example, the adhesive is applied in a belt shape in a width direction orthogonal to the conveying direction of the substrate P, and is pressurized to be bonded. When the substrate P is a resin film or the like, the substrate P is bonded. It may be a method of heating and compressing a desired portion, or a method such as ultrasonic bonding.

In addition, although the suction pad 1 provided on the upper surface of the slider 2 is supposed to hold the substrate P by vacuum pressure, the substrate P is not supported by a mechanical clamp mechanism (such as a clamp band) other than vacuum pressure. ) May be configured to engage the upper surface of the slider 1.

By the way, in the selection input mechanism ST1 shown in FIG. 1, under the control of the control unit CT, the roll PRR1 on which the substrate P on which the processing A has been subjected is wound is wound around the winding shaft 7 (hereinafter referred to as the 'self-roll ( RR1) 'to one of the mounting portions RSB11 to RSB31, as one of the magnetic rolls RRB11, RRB21, and RRB31, as well as the first spline through which the magnetic roll RR1 is taken out and is empty The preliminary take-up shaft 7 is conveyed to the holding part 8 of the western part CSa.

In the present embodiment, since the processing speeds VA and VC are approximately three times the processing speed VC, and three processing units UB are also provided, the child rolls RR1 (that is, child rolls RRB11 to RRB31, RRB12 to RRB32, described later) The length of the substrate P taken up by the magnetic roll RR2 is set to about one third of the length of the substrate P wound on the supply roll RRA serving as a roll.

Therefore, the cutting mechanism CU10 cuts the board | substrate P for every predetermined length which divide | segments the whole length of the board | substrate P wound on the supply roll RRA into almost three equal parts.

In addition, the selection input mechanism ST2 of FIG. 1 is a roll of the mounting portions RSB12 to RSB32, which is wound up by a predetermined length of the substrate P on which processing B has been performed in any one of the processing units UB1 to UB3 ( Any one of the RRB12 to RRB32 is selected under the control of the control unit CT, put into the joining mechanism PU10 (roll conveying), and any one of the child rolls RRB12 to RRB32 is conveyed to the empty mounting part ( RSB12 to RSB32) are equipped with a preliminary take-up shaft.

The joining mechanism PU10 mainly attaches any one of the magnetic rolls RRB12 to RRB32 subjected to process B and conveyed as a magnetic roll RR2, and is joined to the vicinity of the end of the cut-in substrate. As described above, the second splicer portion CSb (joint portion) and the second buffer mechanism (second buffer portion) BF2 are provided. Further, the bonding mechanism PU10 has a second splicer part (CSb) (joining part) for joining the substrate on which the processing B is performed, and an accumulation amount of the substrate is variable according to the conveyance amount of the substrate on which the processing B is performed. And a second buffer mechanism (buffer portion) BF2 that adjusts the conveyance amount of the substrate to be input to the process B.

As shown in FIG. 4, the 2nd splicer part CSb is provided in the state which the station part SN provided in the 1st splicer part CSa mentioned above reversed the conveyance direction of the board | substrate P have. That is, the 2nd splicer part CSb has the adsorption pad 1 on the upper surface, and the slider 2 movable in the conveyance direction and the guide rail movably supporting the slider 2 in the conveyance direction are attached. When the hoistway 3, the drive unit 4 for hoisting the hoistway 3, and the hoistway 3 are in a raised position, moves in the width direction of the substrate P, and the adsorption pad of the slider 2 ( 1) provided on the upper portion of the platform (3), the cutter portion (5) capable of cutting the substrate (P) adsorbed to it, and the adhesive portion (6) to which the adhesive tape (TP) can be attached to the substrate (P) It is provided with the holding part 8 which holds the winding shaft 7 for the magnetic roll RR2 which winds up the board | substrate P to which process B was performed from both sides.

The second buffer mechanism BF2 is configured in the same manner as the first buffer mechanism BF1 and variably accumulates the substrate P carried into the processing unit UC in an adjustable length range, and the processing unit UC ) Are provided adjacent to each other on the upstream side of the conveyance direction of the substrate P.

The second buffer mechanism BF2 includes a dancer roller mechanism DR2 capable of variably adjusting the accumulation amount of the substrate P by a plurality of rollers adjacent to each other moving up and down in the opposite direction in the transport direction of the substrate P, and A nip driving roller NR2 (refer to FIG. 5) for adjusting the conveyance amount (conveying speed) of the substrate P conveyed from the splicer portion CSb to the dancer roller mechanism DR2 is provided. The drive of the dancer roller mechanism DR2 and the drive of the nip drive roller NR2 are controlled by the control unit CT.

5 is a control block diagram of the substrate processing system shown in FIGS. 1 to 4.

As shown in FIG. 5, the control unit CT controls the operation of the processing units UA, UB (UB1 to UB3), and UC, and is provided in each of the cutting mechanism CU10 and the bonding mechanism PU10. Slider 2, driving part 4, cutter part 5, attaching part 6, selection input mechanisms ST1, ST2, dancer roller mechanisms DR1, DR2, nip driving rollers NR1, NR2, etc. It controls the driving of the vehicle. In addition, the control unit CT manages the rotation of the supply roll RRA, the recovery roll RRC, and the conveyance length of the substrate P in each process (each processing unit) by counting or managing the substrate. Counting and managing the remaining amount of the substrate of each roll serving as the supply side of (P) and the amount of substrate winding up of each roll serving as the recovery side of the substrate P, or managing the overall tact from processing steps A to C, each roll Each time, information such as the presence or absence of a problem in processing or the degree or place of occurrence of a defect is also managed. The control unit CT includes an interlocking control unit interlocking the operation of the cutting mechanism CU10 with the accumulation amount of the substrate P in the first buffer unit BF1. Similarly, the control unit CT includes an interlocking control unit interlocking the operation of the bonding mechanism PU10 with the accumulation amount of the substrate P in the second buffer unit BF2.

Next, the operation of the substrate processing system having the above structure will be described.

Here, as shown in Fig. 1, the processing unit UB1 immediately after the processing B is completed, the child roll RRB12 is held by the selection input mechanism ST2, and the holding portion 8 of the second splicer section CSb. ). Further, in the processing unit UB2, processing B is performed on the substrate P drawn out from the magnetic roll RRB21 attached to the mounting portion RSB21. In addition, it is assumed that the processing unit UB3 is waiting for the next processing target roll RRB31 to be attached to the mounting portion RSB31.

In addition, in the following description, since the operation of each constituent device is controlled by the control unit CT, description indicating it is omitted.

First, when the substrate P on which the process A has been subjected to a predetermined length is wound on the magnetic roll RR1 held by the holding portion 8 of the first splicer portion CSa, in the first buffer mechanism BF1, The nip driving roller NR1 stops driving to stop supply of the substrate P to the first splicer part CSa. At this time, the processing A continues in the processing unit UA, and the substrate P is sent to the first buffer mechanism BF1. Therefore, the dancer roller mechanism DR1 in the first buffer mechanism BF1 is driven in the direction of increasing the accumulation amount of the substrate P.

In connection with the stoppage of the supply of the substrate P from the first buffer mechanism BF1, the first splicer portion CSa cuts the substrate P.

Specifically, first, after the slider 2 is moved to a position facing the cutter portion 5, the platform 3 is raised together with the slider 2 by the operation of the driving portion 4. As the slider 2 rises, the adsorption pad 1 holds and holds the substrate P from the back side (lower surface), and positions it at the cutting position by the cutter portion 5. Thereafter, the cutter portion 5 moves in the width direction of the substrate P to cut the substrate P. When the substrate P is cut, the selection input mechanism ST1 injects the magnetic roll RR1 into the mounting portion RSB31 of the processing unit UB3 as the magnetic roll RRB31. Moreover, the selection input mechanism ST1 loads the preliminary winding shaft 7 in the holding part 8 of the 1st splicer part CSa from which the magnetic roll RR1 was discharged and emptied.

When the take-up shaft 7 is attached to the holding portion 8 in the first splice portion CSa, the tip portion of the substrate P that is adsorbed and held on the upper surface of the slider 2 is wound around the take-up shaft 7. The slider 2 is moved so as to be located at the bottom of the (the nip drive roller NR1 is also synchronously rotated by a predetermined amount at the same time), and the holding portion 8 supporting the winding shaft 7 descends by a certain distance. (降下), the tip portion of the substrate (P) is in close contact with the adhesive portion of the outer peripheral surface of the winding shaft (7). In this way, when the tip portion of the substrate P extending from the first buffer mechanism BF1 side is connected to the new take-up shaft 7, after release of the adsorption holding by the adsorption pad 1, the holding part ( 8) is returned to the original height position, and the platform 3 is lowered together with the slider 2 by the operation of the driving unit 4.

Then, rotational drive of the nip drive roller NR1 and the new take-up shaft 7 is resumed, and supply of the substrate P from the first buffer mechanism BF1 is resumed, and the substrate P is a new take-up shaft. (7) It is wound up. After resuming the supply of the substrate P, the nip driving roller NR1 transfers the substrate P to the first buffer mechanism BF1 (ie, the first buffer mechanism BF1) according to the processing speed VA in the processing unit UA. ) Is rotated at a slightly faster speed than the speed at which it is sent. In the dancer roller mechanism DR1, it is driven in the direction of reducing the accumulation amount of the board | substrate P according to the drive of the nip drive roller NR1.

After the length of the substrate P accumulated in the first buffer mechanism BF1 becomes almost minimum, the nip driving roller NR1 is driven at the same speed as the transfer speed of the substrate P in the processing unit UA. do.

On the other hand, from the magnetic roll RRB31 attached to the mounting portion RSB31 of the processing unit UB3, the substrate P is taken out, sent at a speed corresponding to the processing speed VB, and processing B is carried out, and mounted on the mounting part RSB32 It is wound up on a jar roll (RRB32).

In the processing unit UB3, while the processing B for the substrate P drawn out from the magnetic roll RRB31 is being performed, the processing unit UB2 processes B for the substrate P drawn from the magnetic roll RRB21. Is completed and the magnetic roll RRB2 on which the substrate P is wound is waiting in the mounting portion RSB22.

When the processing C by the processing unit UC is completed for the substrate P from the magnetic roll RRB12 attached to the bonding mechanism PU10 as the magnetic roll RR2 by the selective input mechanism ST2, the bonding is performed. The driving of the nip driving roller NR2 in the second buffer mechanism BF2 of the mechanism PU10 is stopped, and the supply of the substrate P to the dancer roller mechanism DR2 is stopped.

At this time, processing C continues to be performed in the processing unit UC. Therefore, the dancer roller mechanism DR2 is operated, and the substrate accumulated in the second buffer mechanism BF2 at a constant speed according to the transfer amount (processing speed VC) of the substrate P in the processing unit UC ( P) is sent to the processing unit UC.

In the second splicer part CSb, as in the cutting process in the first splicer part CSa, after the slider 2 moves to a position facing the cutter part 5, the drive part 4 is operated. By this, the platform 3 rises with the slider 2. As the slider 2 rises, the adsorption pad 1 holds and holds the substrate P from the magnetic roll RRB12 from the rear surface (lower surface) and positions it at the cutting position by the cutter portion 5. Thereafter, the cutter portion 5 moves in the width direction of the substrate P to cut the substrate P. When the board | substrate P is cut | disconnected, the selection input mechanism ST2 takes out the take-up shaft 7 on which the magnetic roll RR2 (RRB12) was wound, from the holding part 8, and the empty holding part 8 is equipped with a mounting part. The sleeping roll RRB22 waiting in (RSB22) is mounted as the sleeping roll RR2.

When the magnetic roll RRB22 as the magnetic roll RR2 is attached to the holding portion 8 in the second splicer portion CSb, the tip portion of the substrate P drawn out from the magnetic roll RR2 is cut first. Positioned with the rear end of the substrate P on the buffer mechanism BF2 side, the two substrates P are simultaneously held by the adsorption pad 1. In this state, the two substrates P are bonded by the adhesive tape TP. When the substrate P is bonded, after lifting the adsorption holding by the adsorption pad 1, the platform 3 is lowered together with the slider 2 by the operation of the driving unit 4. Thereafter, the supply of the substrate P from the second splicer portion CSb to the second buffer mechanism BF2 is resumed by the driving of the nip driving roller NR2.

After resuming the supply of the substrate P, the nip driving roller NR2 is rotated at a speed slightly higher than the transfer speed of the substrate P according to the processing speed VC in the processing unit UC. The dancer roller mechanism DR2 is driven in the direction of increasing the accumulation amount of the substrate P according to the driving of the nip driving roller NR2.

After the length of the substrate P accumulated in the second buffer mechanism BF2 becomes almost maximum, the nip driving roller NR2 is driven at the same speed as the transfer speed of the substrate P in the processing unit UC. do. Then, the process C is performed at the processing speed VC of the substrate P taken out from the magnetic roll RRB22 (magnetic roll RR2) sent to the processing unit UC via the second buffer mechanism BF2.

In this way, the substrate P on which the processing A has been performed in the processing unit UA is wound up as a roll RR1 of a length divided according to the number of processing units UB, and then to the processing units UB1 to UB3. After being sequentially input and processing B is performed, processing C is performed from the processing units UB1 to UB3 in turn into the processing unit UC as a child roll RR2. Three processing units UB1 to UB3 are provided for the processing unit UB whose processing speed VB is slower than the processing speed VC according to the ratio of the processing speed. The jar roll RR2 is input to the processing unit VC at the same cycle as when the processing B is performed at the processing speed of the ship.

As described above, in the present embodiment, according to the performance of each of the processing units UA and UB, when it is possible to set the processing speed VA> processing speed VB, the number n of processing units UA and the processing unit UB ), The relationship with the logarithm m is set to n &lt; m, and the substrate P is cut into a roll having a length corresponding to the logarithm m, and is selectively put into any one of the m processing units UB1 to UBm. Therefore, it is not regulated by the low processing speed VB, and when it looks at the whole production line, it becomes possible to process the board | substrate P at the processing speed VA.

In addition, depending on the performance of each of the processing units UB and UC, when the processing speed VB &lt; processing speed VC can be set, the process roll B is processed in a plurality of (m) processing units UB1 to UBm ( The substrates P of RR2) are sequentially joined, and are fed into n units (n <m) of the processing unit UC. Therefore, the waiting time until the substrate P is carried from the processing unit UB to the processing unit UC can be substantially suppressed.

Therefore, also in this case, it is not restricted to the low processing speed VB, and it becomes possible to process the board | substrate P at the processing speed VC (#VA).

Therefore, in the present embodiment, it is possible to improve productivity even when a plurality of processes A to C having different processing speeds are sequentially performed. In addition, in the present embodiment, the number of processing units UB is set according to the ratio of the processing speed. For this reason, efficient substrate processing can be realized without excessively installing equipment. Moreover, in this embodiment, when the processing units UB1 to UB3 to be double-tracked are provided in multiple steps in the vertical direction, efficient substrate processing can be performed without increasing the installation area (footprint).

Moreover, in this embodiment, the cutting part CU10 with a buffer mechanism and the bonding mechanism PU10 with a buffer mechanism can be used for either cutting or bonding, and have a common configuration, and the station part ( SN). Therefore, it is not necessary to separately install heterogeneous devices, and it is also possible to reduce the cost of production equipment.

That is, if the processing speed of the processing unit on the downstream side is lower than the processing unit on the upstream side in the conveyance direction of the substrate P among the processing units adjacent to each other among the series of processing units, the station portion is therebetween. If (SN) is provided as the cutting mechanism CU10, and the relationship between the processing speeds is reversed, the station portion SN may be provided as the bonding mechanism PU10 between adjacent processing units.

That is, the substrate processing system of the present embodiment is a substrate P in a processing unit (first processing unit) on the upstream side in the conveying direction of the substrate P among adjacent processing units among a plurality of series of processing units. With respect to the conveyance speed of), when reducing the conveyance speed of the substrate P in the downstream processing unit (second processing unit), between the first processing unit and the second processing unit, the substrate P It has a cutting mechanism (CU10) for cutting a long length in a predetermined length, and with respect to the conveying speed of the substrate P in the first processing unit, to increase the conveying speed of the substrate P in the second processing unit At this time, between the first processing unit and the second processing unit, a bonding mechanism PU10 for bonding the substrate P in the long direction can be provided.

(Device manufacturing system)

Next, a device manufacturing system to which the substrate processing system is applied will be described with reference to FIG. 6.

6 is a diagram showing a configuration of a part of a device manufacturing system (flexible display manufacturing line) as a substrate processing system. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll RR1, in turn, is recovered through n processing units U1, U2, U3, U4, U5, ..., Un An example is shown until it is wound up on the roll RR2. The upper level control unit CONT (control unit) comprehensively controls each processing unit U1 to Un constituting the production line.

Further, the processing units U1 to Un shown in FIG. 6 may be any one of the processing units UA to UC shown in FIG. 1, and two or more consecutive processing units among the processing units U1 to Un are combined to process. Any one of the units (UA to UC) may be used.

In Fig. 6, the Cartesian coordinate system XYZ is set such that the surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is in the Y-axis direction. It is assumed to be set. Further, the substrate P may be activated by modifying its surface by a predetermined pretreatment in advance, or a fine partition structure (irregularity structure) for fine patterning on the surface may be used. .

The board | substrate P wound on the supply roll RR1 is conveyed to the processing apparatus U1 taken out by the nip drive roller DR10. The center of the Y-axis direction (width direction) of the substrate P is servo-controlled by the edge position controller EPC1 so as to enter a range of about ± 10s to 10s of µm with respect to the target position.

The processing apparatus U1 is a photosensitive functional liquid (photoresist, photosensitive silane coupling material, photosensitive coupling material, photosensitive lyophilic modifier, photosensitive material) on the surface of the substrate P by a printing method It is a coating device which continuously or selectively applies a plating reducing agent, a UV cured resin solution, etc. with respect to the transport direction (long direction) of the substrate P. In the processing apparatus U1, a cylinder roller DR20 on which the substrate P is wound, a coating roller for uniformly applying a photosensitive functional liquid on the surface of the substrate P on the cylinder roller DR20, or photosensitive A coating mechanism (Gp1) including a plate body roller of a convex plate or a concave plate for printing a pattern using the functional liquid as an ink, a solvent contained in a photosensitive functional liquid applied to the substrate P, or A drying mechanism (Gp2) for rapidly removing moisture is provided.

The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C) to stably fix the photosensitive functional layer applied to the surface. For heating devices. In the processing apparatus U2, a plurality of rollers for folding and conveying the substrate P, an air turn bar, a heating chamber portion HA1 for heating the substrate P which has been brought in, and a heated substrate P A cooling chamber portion HA2, a nip drive roller DR3, and the like, which lower the temperature to match the environmental temperature of the post-process (processing device U3) are provided.

The processing apparatus U3 is an exposure apparatus that irradiates patterning light of ultraviolet rays corresponding to a circuit pattern or a wiring pattern for a display with respect to the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2. In the processing apparatus U3, the edge position controller (EPC) which controls the center of the Y-axis direction (width direction) of the board | substrate P to a fixed position, the nip drive roller DR4, and the board | substrate P predetermined tension Two sets (組) to partially wind the rotary drum DR5 supporting the part exposed to the pattern on the substrate P in the same cylindrical shape, and to give the substrate P a predetermined sag (free) DL ) Are provided with driving rollers DR6 and DR7.

Further, in the processing device U3, a transmissive cylindrical mask DM, a lighting device IU provided in the cylindrical mask DM and illuminating the mask pattern formed on the outer peripheral surface of the cylindrical mask DM, and a rotating drum ( In order to relatively position (align) the image of a portion of the mask pattern of the cylindrical mask DM and the substrate P with a portion of the substrate P supported by the cylindrical surface by DR5), Alignment microscopes AM1 and AM2 for detecting alignment marks or the like previously formed in (P) are provided.

The processing device U4 is at least one of various types of wet processing, such as developing by wet processing and electroless plating processing, for the photosensitive functional layer of the substrate P conveyed from the processing device U3. It is a wet processing apparatus for performing. In the processing apparatus U4, three processing tanks (BT1, BT2, BT3) layered in the Z-axis direction, a plurality of rollers for bending and conveying the substrate P, and a nip driving roller DR8 ) Etc. are provided.

Although the processing apparatus U5 is a heat drying apparatus which warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wet in the wet process to a predetermined value, the details are omitted. do. Subsequently, the substrate P that has passed through several processing devices and has passed through the last processing device Un of a series of processes is wound up on a recovery roll RR2 via a nip driving roller DR10. Driven by the edge position controller (EPC2) so that the center of the Y-axis direction (width direction) of the substrate P or the substrate end in the Y-axis direction does not deviate in the Y-axis direction, even when it is raised. The relative position of the roller DR10 and the recovery roll RR2 in the Y-axis direction is sequentially corrected and controlled.

In the device manufacturing system of FIG. 6, according to the processing speed of each processing apparatus (U1, U2, U3, U4, U5, ..., Un), processing units with a slow processing speed are doubled to place multiple units in parallel. In addition, a cutting mechanism CU10 is provided in front of this processing apparatus, and a selection input mechanism ST1 for feeding a substrate into any one of the plurality of processing apparatuses is provided.

In addition, by providing a bonding mechanism PU10 for joining a plurality of substrates sequentially ejected from each processing apparatus, a plurality of processing apparatuses having different processing speeds are sequentially provided after a plurality of processing apparatuses having a slow processing speed. , It is possible to improve productivity without being restricted to the processing step with the lowest processing speed.

In the case of the manufacturing line shown in FIG. 6, the processing apparatus U2 that performs heat treatment can reduce the volume of the chamber portions HA1 and HA2 by suppressing the conveyance speed of the substrate P as low as possible, and that amount It has the advantage of reducing power consumption and reducing the footprint of the device installation.

On the other hand, in the processing apparatus U1 immediately before the processing apparatus U2, when patterning and coating the photosensitive functional liquid on the surface of the substrate P, a plate body (concave or convex plate) roller for pattern printing is used, After the photosensitive functional liquid is applied as ink to the rollers, the substrate P is pressed against the plate body rollers so that the pattern is transferred. In this case, in order to improve the pattern transfer characteristics from the plate body roller to the substrate P, it is necessary to send the substrate P at a somewhat high speed.

As described above, in the processing apparatus U1 and the processing apparatus U2, there is a possibility that the required substrate transfer speed (processing speed) varies greatly depending on the device performance. Therefore, in this case, if the processing unit U1 is the processing unit UA in FIG. 1 and the processing unit U2 is doubled as the processing units UB1 to UB3 in FIG. 1, the production is efficient and efficient. Lines can be built.

Here, based on the model example shown in FIG. 7, in the case of the processing system (manufacturing line) shown in FIG. 1, how much tact improvement is expected compared to the processing by the conventional disconnection. This will be described with reference to the time chart.

7 (a) shows an example of a model in the case of disconnecting the processing units (UA, UB, and UC) in charge of each of the three processes A, B, and C, one by one. Here, it is assumed that the substrate P having a total length of 1200 m is wound on the supply roll RRA. In addition, it is assumed that each processing unit (UA to UC) has the following processing capabilities as the performance of the device. That is, the processing unit UA has the ability to send the substrate P at a maximum of 15 cm / s for processing, and the processing unit UB has the ability to send the substrate P at a maximum of 5 cm / s for processing, It is assumed that the processing unit UC has the ability to send and process the substrate P at a maximum of 15 cm / s.

In the case of such a single line, since the conveyance speed of the substrate P throughout the line is matched to the speed of 5 cm / s of the slowest processing unit UB, production tact time (process processing A, B, C on a substrate of 1200 m) The time to conduct all of) is 400 minutes (6 hours and 40 minutes).

On the other hand, an example of a model of a production line doubled as shown in Fig. 1 is shown in Fig. 7B. The performance of each processing unit UA, UB (UB1 to UB3), and UC is the same as that described in Fig. 7A. As in the previous FIG. 1, the processing unit UB in charge of the processing step B is doubled to provide three units UB1 to UB3, and is cut in the cutting mechanism CU10 behind the processing unit UA. The preparation time including the processing time and the self-roll exchange time by the selection input mechanism ST1 is set to 3 minutes, and the bonding processing time and the selection input mechanism ST2 in the bonding mechanism PU10 in front of the processing unit UC are set. The preparation time, including the time for replacing the roll by), is set to 3 minutes.

Further, as shown in Fig. 7 (b), since the processing units UB having a slow processing speed are double-tracked, the processing units UA and UC have a maximum speed of 15 cm / s, which is guaranteed according to each performance. P).

The time chart in FIG. 8 is a guess of tact according to the model example in FIG. 7B, and the lines S1, S2, and S3 are virtually associated with each of the three processing units UB1 to UB3. , Each treatment time is shown. At the start of the processing, the substrate P from the supply roll RRA is processed in the processing unit UA, but the substrate P is divided every 1/3 of the total length 1200 m in the cutting mechanism CU10. Therefore, as shown in line S1, the first 400m portion of the substrate to be fed into the processing unit UA is processed in about 44.4 minutes, and then passed through a preparation time of 3 minutes in the cutting mechanism CU10. , Sent to the processing unit UB1.

The tact time for the processing unit UB1 to process the 400m-minute substrate P is 133.3 minutes. Subsequently, after about 3 minutes have elapsed as a predetermined preparation time (e.g., mounting of a roll), the first 400 m substrate is fed into the processing unit UC and processed at a conveying speed of 15 cm / s. The tact time of the 400 m-minute substrate by the processing unit UC is 44.4 minutes.

Meanwhile, as shown in line S2, the processing unit UA continues processing of the second 400 m-minute substrate over about 44.4 minutes, and subsequently, as shown in line S3, the third 400 m substrate The treatment is continued over about 44.4 minutes at a conveyance rate of 15 cm / s. The second 400-m substrate is sent to the processing unit UB2 after 3 minutes of preparation time by the cutting mechanism CU10, where it takes about 133.3 minutes to process.

In the processing unit UC, it is 228.1 minutes after the start time that the processing of the first 400 m-minute substrate is completed. However, prior to that, the processing of the second 400 m portion of the substrate was completed in the processing unit UB2, and the second 400 m portion of the substrate was mediated by the bonding mechanism PU10 and the selective input mechanism ST2C, After about 3 minutes of preparation time, the first 400 m portion of the substrate is bonded to the end.

Thereafter, the processing unit UC continues to process the second 400 m portion of the substrate bonded to the first 400 m substrate at a transfer speed of 15 cm / s.

Similarly, as shown in line S3, the third (last) 400-m substrate cut by the cutting mechanism CU10 is put into the processing unit UB3 when the processing in the processing unit UA is completed. After 133.3 minutes, it is wound on a jar roll (RRB32). In the third 400 m portion of the substrate, the processing in the processing unit UC is completed before the second 400 m portion of the substrate is processed in the processing unit UC.

While the second 400 m portion of the substrate is being processed in the processing unit UC, the third 400 m portion of the substrate is prepared for about 3 minutes through the bonding mechanism PU10 and the optional input mechanism ST2C. Later, it is joined to the end portion of the second 400-m substrate. Thereafter, the processing unit UC continuously processes the third 400 m portion of the substrate bonded to the second 400 m substrate at a transfer speed of 15 cm / s.

As described above, by double-tracking the unit of the processing step B, the processing of the substrate P of 1200 m is 317 minutes (5 hours and 17 minutes). This results in a tact improvement of about 20% (shortening of production time) compared to the model example of the disconnection processing shown in Fig. 7A.

In the model example shown in Fig. 7B, although the total length of the substrate P wound on the supply roll RRA as a roll is 1200 m, even if it is longer than that, the cutting mechanism CU10 When the substrate is divided every 400 m, the substrate fed into the production line can be continuously sent to the final treatment step C.

In the example of the model shown in Fig. 7B, three processing units UB1 to UB3 were simultaneously operated at the same processing speed (5 cm / s), but within the adjustable range, each unit UB1 to UB3 ), The substrate transport speed may be varied by a small amount.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to related examples. All shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various changes can be made based on design requirements and the like without departing from the spirit of the present invention.

For example, in the above-described embodiment, a configuration is provided in which three processing units UB1 to UB3 are provided. However, a configuration in which two or more than four processing units may be provided may be used when set according to the ratio of the processing speed.

In addition, in the said embodiment, it is supposed that the process of a part of the manufacturing line which consists of disconnection is doubled. However, even if the original production line (producing the same product and varieties) is double-tracked from the first step to the last step, a configuration using the above embodiment is possible.

For example, in the case where two production lines of the single wire processing as shown in Fig. 7 (a) are arranged in parallel, the cutting mechanism (behind each of the two processing units UA (UA1, UA2)) CU10 (CU101, CU102) is provided, and the two low-tact processing units UB thereafter add three, and double track as five units UB1 to UB5, followed by 2 Four bonding mechanisms PU10 (PU101, PU102) may be provided, and then two processing units UC (UC1, UC2) may be provided.

In this configuration, a substrate of unit length (for example, 400 m) cut by any one of the cutting mechanisms CU101 and CU102 is sent to any one of the five processing units UB1 to UB5, which is empty. The input mechanism ST2 is configured, and each of the bonding mechanisms PU101 and PU102 accepts a substrate having a unit length (for example, 400m) processed by any one of the five processing units UB1 to UB5, The selective input mechanism ST2 is configured.

Further, in the processing of the first processing units UA1 and UA2, if the processing unit UA1 processes the substrate from the supply roll RRA for a unit length (for example, 400 m), the processing unit UA2 supplies the supply roll. When starting the processing of the substrate from (RRA), it is good to give an intentional time difference.

In this way, it is possible to avoid a roll exchange operation (which causes temporary interruption of production) to simultaneously mount a morroll (RRA) to each of the two processing units UA1 and UA2, as well as each treatment. The unit can be operated efficiently.

Second embodiment

Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to FIGS. 9 to 25. In this embodiment, the same reference numerals are given to the same components as those in the above embodiment, and the description thereof is simplified or omitted.

9 is a diagram showing a configuration of a part of a device manufacturing system (flexible display manufacturing line) SYS as a substrate processing apparatus of the present embodiment. Here, the device manufacturing system SYS, the 1st mounting part RS1 which mounts the supply roll (1st roll) RR1, and the 2nd mounting part RS2 which mounts the supply roll (2nd roll) RR2 (Retaining part), a third mounting part RS3 for mounting a recovery roll (third roll) RR3, and a fourth mounting part RS4 for mounting a recovery roll (fourth roll) RR4, and a supply roll The flexible substrates P (sheets, films, etc.) drawn out from any one of (RR1, RR2), in turn, are first splicer portions (substrate joint replacement mechanism) CSa, first buffer mechanism (BF1), Through the n processing units (U1, U2, U3, U4, U5, ..., Un), the second buffer mechanism (BF2), and the second splice unit (second substrate joint replacement mechanism) (CSb), the recovery roll ( RR3, RR4) shows an example until it is wound up on either side.

In addition, in this embodiment, the board | substrate input as a processing board | substrate to the 1st, 2nd buffer mechanism BF1, BF2, and the processing apparatus U1 ... Un is called suitably as the board | substrate P, and it demonstrates. The substrates taken out from the supply rolls RR1 and RR2 before being put in will be described appropriately as substrates P1 and P2. The substrates recovered from the recovery rolls RR3 and RR4 after treatment by the processing apparatus U1 ... Un are appropriately referred to as substrates P3 and P4 and described.

The upper control unit (CONT) (control unit, second control unit) includes processing units (U1 to Un) constituting the manufacturing line, and first and second splicer units (CSa, CSb), first and second buffers The mechanisms BF1 and BF2 are collectively controlled. In addition, the upper control device CONT is driven by rotation of the motor shaft MT1 mounted on the supply roll RR1 in the first mounting portion RS1, and mounted on the supply roll RR2 in the second mounting portion RS2. Control the rotational drive of the motor shaft MT2. In addition, the upper level control device CONT includes an interlocking control unit interlocking the cutting operation of the substrate P1 (first substrate) with the accumulation amount of the substrate P1 in the first buffer mechanism BF1 (buffer mechanism). . Further, the upper level control device CONT includes an interlocking control unit interlocking the cutting operation of the substrate P (processing substrate) with the accumulation amount of the substrate P in the second buffer mechanism BF2.

10, the supply sensor S1 which detects the supply state of the board | substrate P1 in the supply roll RR1 is provided in the vicinity of the 1st mounting part RS1. When the supply end of the substrate P1 is detected, the supply sensor S1 outputs an end signal to the upper level control device CONT. Similarly, the supply sensor S2 which detects the supply state of the board | substrate P2 in the supply roll RR2 is provided in the vicinity of the 2nd mounting part RS2. When the supply end of the substrate P2 is detected, the supply sensor S2 outputs an end signal to the upper level control device CONT.

In Fig. 9, in the Cartesian coordinate system XYZ, the surface (or back surface) of the substrate P is set to be perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is in the Y-axis direction. It is assumed to be set. Moreover, the substrate P may be activated by modifying its surface by a predetermined pretreatment in advance, or a fine partition structure (irregularity structure) of fine patterning formed on the surface.

10 is a diagram showing a schematic configuration of the first splice unit CSa and the first buffer mechanism BF1.

The 1st splicer part CSa is the board | substrate pulled out from either one of the supply rolls RR1 and RR2, and is sent to the 1st buffer mechanism BF1, and the board | substrate drawn out from the other of the supply rolls RR1 and RR2 As a subsequent change, the nip driving roller NR1 and the cutting joint units CU1 and CU2 are provided. Moreover, the 1st splicer part CSa (substrate joint replacement mechanism) is the board | substrate supplied from the supply roll RR2 (2nd roll) to the position which becomes the terminal part of the board | substrate P1 (1st board | substrate) to be cut | disconnected ( After joining the tip of P2) (second substrate), a control unit is provided to control the cutting operation and the bonding operation to cut the substrate P1 (first substrate).

The nip driving roller NR1 holds the substrate P1 or the substrate P2 under the control of the upper control device CONT, sends it to the first buffer mechanism BF1, or stops the transfer of the substrate P In the Z-axis direction, it is disposed at an approximately intermediate position between the first mounting portion RS1 and the second mounting portion RS2.

The cutting joint units CU1 and CU2 are symmetrically arranged in the Z-axis direction around the virtual joint surface VF1 parallel to the XY plane passing through the position in the Z-axis direction of the nip drive roller NR1. The cutting-bonding unit CU1 is provided with the suction pad 1A, the cutter 2A, and the tension roller 3A at the position facing the virtual bonding surface VF1. Moreover, as shown by the solid line in FIG. 10 by the rotating mechanism not shown, the cutting-bonding unit CU1 is a bonding position where the cutting-bonding unit CU2 and the suction pad 1A oppose, and 2 in FIG. 10. As indicated by a dashed-dotted line, the adsorption pad 1A rotates (flushes) between the first mounting portion RS1 and an opposite position. In addition, the cutting-bonding unit CU1 moves at a bonding position in a direction away from and approaching the virtual bonding surface VF1 (that is, the cutting-bonding unit CU2) by a movement mechanism not shown. The adsorption pad 1A is disposed on the downstream side (+ X-axis side) of the conveyance direction of the substrate P (substrate P1) than the cutter 2A when the cutting and bonding unit CU1 is in the joining position.

Similarly, the cutting-bonding unit CU2 is equipped with the suction pad 1B, the cutter 2B, and the tension roller 3B at the position facing the virtual bonding surface VF1. Moreover, as shown by the solid line in FIG. 10 by the rotating mechanism not shown, the cutting-bonding unit CU2 is the bonding position where the cutting-bonding unit CU1 and the suction pad 1B oppose, and 2 in FIG. 10. As indicated by the dashed-dotted line, the adsorption pad 1B rotates (shakes) between the first mounting portion RS2 and the opposite position. Moreover, the cutting bonding unit CU2 moves in the direction of being spaced apart and approaching the virtual bonding surface VF1 (that is, the cutting bonding unit CU1) by a moving mechanism not shown at the bonding position. The adsorption pad 1B is disposed on the downstream side (+ X-axis side) of the transfer direction of the substrate P (substrate P2) than the cutter 2B when the cutting and bonding unit CU2 is in the bonding position.

The movement of these cut-and-join units CU1 and CU2 is controlled by an upper level control device CONT.

The 1st buffer mechanism BF1 is arrange | positioned between the processing apparatus (processing mechanism) U1 and the 1st splicer part CSa, and predetermined | prescribes the board | substrate P sent from the 1st splicer part CSa. It temporarily accumulates within the longest accumulation range of, and is then sent to the processing apparatus U1, and is provided with a dancer roller mechanism DR1 and a nip driving roller NR2.

The nip driving roller NR2 holds the substrate P accumulated in the first buffer mechanism BF1 and sends it to the processing device U1, which is downstream of the transfer direction of the substrate P than the dancer roller mechanism DR1. In the nip driving roller (NR1) is disposed at the same position as the Z axis.

In the dancer roller mechanism DR1, a plurality of upper rollers RJ1 having a vertically rising range and a lower roller RK1 having a lowering range relatively lower alternately in the X direction. ), And each roller (RJ1, RK1) is independently movable in the Z-axis direction. The top dead center position (JU1) and the bottom dead center position (JD1) of the upper roller (RJ1) are the top dead center position (JU2) and bottom dead center position (JD2) of the bottom roller (RK1). It is set at the upper position. The operation of these dancer roller mechanisms DR1 is also controlled by the upper level control device CONT.

11 is a diagram showing a schematic configuration of the second splice unit CSb and the second buffer mechanism BF2.

The 2nd buffer mechanism BF2 is arrange | positioned between the processing apparatus (processing mechanism) Un and the 2nd splicer part CSb, and accumulates the board | substrate P sent from the processing apparatus Un by predetermined longest. After temporarily accumulating within the range, it is sent to the second splice unit CSb, and includes a nip driving roller NR3 and a dancer roller mechanism DR2.

In the dancer roller mechanism DR2, a plurality of upper rollers RJ2 having a vertically rising range and a lower roller RK2 having a lowering range relatively lower are alternately arranged in the X-axis direction, In addition, each roller (RJ2, RK2) is independently movable in the Z-axis direction. The top dead center position (JU3) and the bottom dead center position (JD3) of the upper roller (RJ2) are set at positions higher than the top dead center position (JU4) and bottom dead center position (JD4) of the lower roller (RK2). The operation of these dancer roller mechanisms DR2 is also controlled by the upper level control device CONT.

The 2nd splicer part CSb is sent from the 2nd buffer mechanism BF2, and the board | substrate P collect | recovered by either one of the recovery rolls RR3 and RRR4 is the other of the recovery rolls RR3 and RRR4. It is provided with a nip drive roller NR4 and cutting and joining units CU3 and CU4 as the subsequent replacement so as to be recovered.

The nip drive roller NR4 sends the board | substrate P sent from the 2nd buffer mechanism BF2 to the cutting bonding units CU3 and CU4 under the control of the upper control device CONT, or the board | substrate P ) Is stopped, the position in the Z-axis direction is arranged at the position of the virtual bonding surface VF2 parallel to the XY plane at a substantially intermediate position between the third mounting portion RS3 and the fourth mounting portion RS4. .

The cutting joint units CU3 and CU4 are arranged symmetrically in the Z-axis direction around the virtual joint surface VF2. The cutting and bonding unit CU3 is provided with a suction pad 1C, a cutter 2C, and a tension roller 3C at a position facing the virtual bonding surface VF2. Moreover, as shown by the solid line in FIG. 11, the cutting bonding unit CU3 is shown in FIG. 11 by the rotating mechanism not shown, and the bonding position which the cutting bonding unit CU4 and the adsorption pad 1C oppose, and 2 in FIG. As indicated by the dotted chain, the adsorption pad 1C rotates (shakes) between the third mounting portion RS3 and the opposite position. In addition, the cutting-bonding unit CU3 moves at a bonding position in a direction away from and approaching the virtual bonding surface VF2 (that is, the cutting-bonding unit CU4) by a movement mechanism not shown.

The adsorption pad 1C is disposed on the upstream side (-X-axis side) of the transfer direction of the substrate P than the cutter 2C when the cutting and bonding unit CU3 is in the bonding position.

Similarly, the cutting-bonding unit CU4 is equipped with the suction pad 1D, the cutter 2D, and the tension roller 3D at the position facing the virtual bonding surface VF2. Moreover, as shown by the solid line in FIG. 11, the cutting bonding unit CU4 is shown in FIG. 11 by the rotating mechanism not shown, and the bonding position which the cutting bonding unit CU3 and the adsorption pad 1D oppose, and 2 in FIG. As indicated by a dashed-dotted line, the adsorption pad 1D rotates (shakes) between the fourth mounting portion RS4 and the opposite position. In addition, the cutting-bonding unit CU4 moves at a bonding position in a direction away from and approaching the virtual bonding surface VF2 (that is, the cutting-bonding unit CU3) by a movement mechanism not shown. The adsorption pad 1D is disposed on the upstream side (-X-axis side) of the transfer direction of the substrate P than the cutter 2D when the cutting and bonding unit CU4 is in the bonding position.

The movement of these cut-and-join units CU3 and CU4 is controlled by an upper level control device CONT.

11, the recovery roller RR3 is attached to the motor shaft MT3 in the 3rd attachment part RS3. The recovery roller RR4 is attached to the motor shaft MT4 in the fourth mounting portion RS4. The rotational drive of the motor shaft MT3 and the rotational drive of the motor shaft MT4 are controlled by a higher level control device CONT.

Moreover, as shown in FIG. 11, in the vicinity of the 3rd mounting part RS3, the hoisting sensor S3 which detects the hoisting state of the board | substrate P3 in the recovery roller RR3 is provided. The hoist sensor S3 outputs an end signal to the upper level control device CONT when the end of hoisting of the substrate P3 is detected. Similarly, in the vicinity of the fourth mounting portion RS4, a hoisting sensor S4 for detecting the hoisting situation of the substrate P4 in the recovery roller RR4 is provided. The hoist sensor S4 outputs an end signal to the upper level control device CONT when the end of hoisting of the substrate P4 is detected.

The recovery rollers RR3 and RR4 have a lead-in substrate (third substrate) (PK) for lead-in, in which a tip portion is connected to a roll core and a substrate P3 or a substrate 4 is joined to the end portion. In 11, only the substrate PK of the recovery roller RR4 is shown). As the substrate PK, the same material as the substrate P to be processed by the processing devices U1 to Un may be used, or a material having a substantially same thickness as the substrate P may be different.

The processing apparatus U5 of the present embodiment warms the substrate P conveyed from the processing apparatus U4 to adjust the moisture content of the substrate P wet in the wet process to a predetermined value, or It is a heat-drying device that performs thermal annealing (200 ° C. or less) for crystallization or solvent removal of ink containing metal nanoparticles, but details are omitted. Subsequently, the substrate P that has passed through several processing devices and passed through the last processing device Un of a series of processes is temporarily accumulated in the second buffer mechanism BF2, and the second splicer part CSb ), The joint is properly replaced, and wound up on the recovery roll RR3 or the recovery roll RR4.

Next, during the processing of the substrate P in the device manufacturing system SYS having the above-described configuration, refer to FIGS. 12 to 19 for operations of the first splicer unit CSa and the first buffer mechanism BF1. Will be explained. In addition, although the operation of the various processing devices, components, and the like constituting the device manufacturing system SYS are controlled by the upper control device CONT, in the following description, descriptions regarding control by the upper control device CONT Omitted.

Fig. 12 shows that the substrate P1 taken out from the supply roll RR1 is a first buffer mechanism (1) as a first substrate via the roller 3A and the nip driving roller NR1 of the cutting and bonding unit CU1. It is sent to BF1) and is temporarily accumulated in the first buffer mechanism BF1. As shown in FIG. 12, in the first buffer mechanism BF1, the upper roller RJ1 is located at the top dead center position JU1, and the lower roller RK1 is located at the bottom dead center position JD2, so that the substrate ( P) is the longest length accumulated in the first buffer mechanism BF1.

In the second mounting part RS2, when the substrate P1 of the supply roll RR1 is exhausted, when the supply roll RR2 on which the substrate P2 to be replaced is wound is mounted on the motor shaft MT2, it is cut and joined The unit CU2 is rotated to move the adsorption pad 1B to the occupied position. With respect to the adsorption pad 1B in the occupied position, the front end of the substrate P2 is adsorbed (connected or connected) and fixed, and then double-sided tape T is attached to the surface opposite to the adsorption side.

Adsorption of the substrate P2 to the adsorption pad 1B and adhesion of the double-sided tape T is performed by an operator or by using a robot or the like.

When the adsorption fixing of the substrate P2 on which the double-sided tape T is attached to the adsorption pad 1B is completed, as shown in FIG. 13, the cutting bonding unit CU2 is rotated to move the substrate P2 to the bonding position. In addition, by rotating the motor shaft MT2 by rotation driving, the supply roll RR2 is rotated in a direction opposite to the supply direction of the substrate P2 (counterclockwise rotational direction in FIG. 13), thereby allowing the substrate P2 to be rotated. ) Is given a predetermined tension.

On the other hand, when the supply sensor S1 detects the end of the supply of the substrate P1 from the supply roll RR1, the driving of the nip driving roller NR1 is stopped, and the motor shaft MT1 is mounted on the substrate P1. ) By applying rotational driving in the direction opposite to the conveying direction, weak tension is applied to the substrate P1 between the nip driving roller NR1 and the supply roll RR1.

Even after the nip driving roller NR1 is stopped, the nip driving roller NR2 continues to drive. Therefore, the dancer roller mechanism DR1 is operated, and the lowering of the upper roller RJ1 and the lowering of the lower roller RK1 are appropriately performed in accordance with the driving of the nip driving roller NR2. Thereby, the board | substrate P accumulated in the 1st buffer mechanism BF1 is continuously sent to the processing apparatus U1 by the nip drive roller NR2 at a constant speed.

Next, as shown in FIG. 14, the cutting bonding units CU1 and CU2 are moved in a direction approaching each other, and the substrate P1 is sandwiched between the adsorption pads 1A and 1B with the double-sided tape T interposed therebetween. P2) is compressed for a period of time. Thereby, the board | substrate P2 is affixed and bonded to the board | substrate P1 via the double-sided tape T at the position which becomes the terminal part of the board | substrate P1 by being cut | disconnected in a post process.

Moreover, the nip driving roller NR2 and the dancer roller mechanism DR1 continue to be driven and the substrate P accumulated in the first buffer mechanism BF1 even while the bonding processing of the substrates P1 and P2 is being performed. ) Is continuously being sent to the processing apparatus U1 by the nip drive roller NR2 at a constant speed.

When the board | substrate P1 and the board | substrate P2 are bonded, after opening the adsorption pad 1B in the cutting bonding unit CU2 to the atmosphere, as shown in FIG. 15, cutting the cutting bonding unit CU2. It moves in the direction away from the bonding unit CU1 (+ Z-axis direction). Thereby, the distal end of the substrate P2 taken out from the supply roll RR2 is the adsorption pad of the cutting and bonding unit CU1 while being bonded (connected or connected) to the substrate P1 by the double-sided tape T It remains adsorbed at (1A).

Thereafter, in the state where tension is applied to the substrate P1 between the cutting-bonding unit CU1 and the supply roll RR1, the opposing substrate P1 by the cutter 2A in the cutting-bonding unit CU1 ). As the cutter 2A, for example, a configuration of cutting the substrate P1 by sliding the tip of the knife in the width direction (Y-axis direction) of the substrate P1 can be adopted.

The nip driving roller NR2 and the dancer roller mechanism DR1 continue to be driven while the substrate P1 is being cut, and the substrate P accumulated in the first buffer mechanism BF1 is the nip. The drive roller NR2 continues to be sent to the processing apparatus U1 at a constant speed.

When the substrate P1 is cut, after opening the adsorption pad 1A in the cutting bonding unit CU1 to the atmosphere, the cutting bonding unit CU1 is cut to the cutting bonding unit CU2 (virtual bonding) as shown in FIG. 16. It moves in the direction away from the surface VF1 (-Z-axis direction). Thereby, the board | substrate P1 pulled out from the supply roll RR1 is wound up to this supply roll RR1 by rotation of the supply roll RR1 in the direction opposite to the conveyance direction.

In addition, with respect to the supply roll RR2, the substrate P2 is provided with a rotation roll RR2 and a nip driving roller NR1 (and roller 3B) by rotation torque in a direction opposite to the feed direction of the supply roll RR2. ) And tension is given. Thereby, the board | substrate connected to the board | substrate P accumulated in the 1st buffer mechanism BF1 is switched to the board | substrate P2 as a 2nd board | substrate taken out from the supply roll RR2. The board | substrate P2 as a 2nd board | substrate may have the same specification as the board | substrate P1 (1st base).

Thereafter, the nip driving roller NR1 rotates at a slightly faster speed than the nip driving roller NR2, and in the dancer roller mechanism DR1, as shown in FIG. 17, according to the driving of the nip driving roller NR1, The upper roller RJ1 is raised and the lower roller RK1 is appropriately lowered. Moreover, the substrate P2 taken out from the supply roll RR2 is sent by rotationally driving the motor shaft MT2 in the transport direction, and the accumulation length of the substrate P in the first buffer mechanism BF1 is reduced. Increases.

Then, when the accumulation length of the substrate P in the first buffer mechanism BF1 becomes almost the maximum, the nip driving roller NR1 rotates at the same speed as the nip driving roller NR2, so that the first buffer mechanism BF1 ), The accumulation length of the substrate P is balanced. In addition, the supply roll RR1 whose substrate P1 has almost run out is detached from the first mounting portion RS1 (detachable) and, as shown in FIG. 18, another supply roll (a rolled with the substrate P5) ( RR5) is mounted.

When the supply roll RR5 is mounted, based on the detection result of the supply sensor S2, before the substrate P2 in the supply roll RR2 runs out, as shown in Fig. 18, the cutting and bonding unit CU1 Is rotated to move the adsorption pad 1A to the occupied position. With respect to the adsorption pad 1A in the occupied position, the front end of the substrate P5 is adsorbed and fixed (connected or connected), and then double-sided tape T is attached to the surface opposite to the adsorption side.

Subsequently, the substrate P5 is rotated by rotating the motor shaft MT1 in the opposite direction to the supply direction of the substrate P5 (counterclockwise rotation in FIG. 18). While the predetermined tension is applied to the cut joint unit CU1, the cut joint unit CU1 is rotated and moved to the joint position as shown in FIG.

Then, when the supply sensor S2 detects the end of the supply of the substrate P2 from the supply roll RR2, the driving of the nip driving roller NR1 is stopped, and similarly to the above-described procedure, the cutting joint unit is cut. (CU1, CU2) are moved in a direction approaching each other, and the substrates P2 and P5 are pressed for a certain time between the adsorption pads 1A and 1B in a state in which the double-sided tape T is interposed, and the cutting and bonding unit is also used. The substrate P2 is cut by the cutter 2B in (CU2). Thereby, the board | substrate connected to the board | substrate P accumulated in the 1st buffer mechanism BF1 is switched to the board | substrate P5 taken out from the supply roll RR5.

In this way, the substrates P that are switched in turn include the coating processing of the photosensitive functional liquid in the processing device U1, the heating processing in the processing device U2, the pattern exposure processing in the processing device U3, and the processing device ( After the wet treatment in U4) and the heat drying treatment in the processing apparatus U5 are performed, it is sequentially sent to the second buffer mechanism BF2, the second splicer portion CSb, and the recovery roll RR3, or It is collected in the recovery roll RR4.

Next, during the processing of the substrate P in the device manufacturing system SYS having the above-described configuration, the operations of the second splicer part CSb and the second buffer mechanism BF2 on the recovery roll side are shown in FIGS. This will be described with reference to 25.

20, the substrate P, which is a processing substrate, is sent to and accumulated in the second buffer mechanism BF2 via the nip driving roller NR3, and the nip driving roller NR4 is obtained from the second buffer mechanism BF2. A drawing in which the substrate (P) sent (discharged) through the medium is recovered on the recovery roll RR3 mounted on the third mounting portion RS3 via the roller 3C of the cutting joint unit CU3. to be. In addition, as shown in FIG. 20, in the second buffer mechanism BF2, the upper roller RJ2 is located at the bottom dead center position JD3, and the lower roller RK2 is located at the top dead center position JU4, The length of the substrate P closest to the shortest in the second buffer mechanism BF2 is accumulated.

When the recovery roll RR4 for recovering the substrate P is mounted on the motor shaft MT4 after the winding-up of the recovery roll RR3 is completed in the fourth mounting portion RS4, the cutting joint unit CU4 Is rotated to move the adsorption pad 1D to the occupied position. For the adsorption pad 1D in the occupied position, the distal end of the lead-in substrate PK (hereinafter simply referred to as the 'substrate PK') connected to the recovery roll RR4 is adsorbed and fixed (connected or connected) ), And then, a double-sided tape T is attached to the side opposite to the adsorption side. When the double-sided tape T is attached to the substrate PK, the cutting and bonding unit CU4 is rotated to move to the bonding position, and the recovery roll RR4 is rotated by the rotational drive of the motor shaft MT4. A predetermined tension is given to the substrate PK by rotating in the collection direction of the PK (substrate P) (clockwise rotational direction in Fig. 20).

Then, when the hoisting sensor S3 detects the end of the recovery of the substrate P by the recovery roll RR3, the driving of the nip driving roller NR4 is stopped, and the dancer roller mechanism DR2 is operated. The upper roller RJ2 is raised, and the lower roller RK2 is lowered appropriately. Thereby, the board | substrate P sent from the processing apparatus U5 by the nip drive roller NR3 conveys the accumulation length in the 2nd buffer mechanism BF2 by a fixed amount (substrate P of a manufacturing line) It accumulates while increasing at the speed).

On the other hand, when the recovery of the substrate P by the recovery roll RR3 ends, as shown in FIG. 21, the cutting and bonding units CU3 and CU4 are moved in a direction approaching each other, and the double-sided tape T is interposed. The substrates P and PK are compressed for a predetermined time between the adsorption pads 1C and 1D in the state of being prepared. Thereby, the terminal part of the board | substrate PK is attached to the board | substrate P via the double-sided tape T at the position which becomes the front-end | tip part when the board | substrate P was cut | disconnected in a post process, and is joined (connected or Connection).

When the substrate P and the substrate PK are joined, after the adsorption pad 1D in the cutting bonding unit CU4 is opened to the atmosphere, the cutting bonding unit CU4 is cut into a cutting bonding unit ( Move away from CU3) (+ Z axis direction). Thereby, the front-end | tip part of the board | substrate PK is adsorb | stained and hold | maintained by the adsorption pad 1C of the cutting-bonding unit CU3 in the state bonded to the board | substrate P by the double-sided tape T.

Thereafter, in the state in which tension is applied to the substrate P between the cutting and bonding unit CU3 and the recovery roll RR3, the opposing substrate P by the cutter 2C in the cutting and bonding unit CU3 ). When the substrate P is cut, after opening the adsorption pad 1C in the cutting bonding unit CU3 to the air, the cutting bonding unit CU3 is separated from the cutting bonding unit CU4 as shown in FIG. 23. Move in the direction (-Z axis direction). Thereby, the recovery destination of the substrate P (that is, the substrate P that has been processed in the processing devices U1 to Un) sent from the second buffer mechanism BF2 is switched to the recovery roll RR4.

Even while the above-described second splicer section CSb is being joined and cut, the rise of the upper roller RJ2 in the second buffer mechanism BF2 and the lowering of the lower roller RK2 are properly performed. , The substrate P sent from the processing device U5 by the nip driving roller NR3 is accumulated while increasing the accumulation length in the second buffer mechanism BF2 by a predetermined amount.

Then, when switching of the recovery destination of the substrate P to the recovery roll RR4 is completed, the nip driving roller NR4 rotates at a slightly faster speed than the nip driving roller NR3, and in the dancer roller mechanism DR2, the nip According to the driving of the driving roller NR4, the lowering of the upper roller RJ2 and the raising of the lower roller RK2 are appropriately performed, and the second buffer during the bonding process and the cutting process in the second splicer part CSb. The length of the substrate P accumulated in the mechanism BF2 is reduced, and it is set as the almost minimum accumulation length in the initial state (see Fig. 24). After the length of the substrate P accumulated in the second buffer mechanism BF2 becomes almost minimum, the nip driving roller NR4 is rotated at the same speed as the nip driving roller NR3.

On the other hand, in the third mounting portion RS3 where the recovery of the substrate P is completed, the recovery roll RR3 is removed, and as shown in FIG. 24, the incoming substrate PK2 (hereinafter simply referred to as the 'substrate PK2') The recovery roll (RR6), which is connected (connected or joined) to the tip of the end, is attached to the motor shaft MT3, and the substrate (1C) is attached to the adsorption pad 1C of the cutting joint unit CU3 rotated to the occupied position. The end portion of the PK2) is adsorbed and fixed, and thereafter, a double-sided tape T is attached to the surface opposite to the adsorption side.

When the double-sided tape T is attached to the substrate PK2, the cutting bonding unit CU3 is rotated to move to the bonding position, and the recovery roll RR6 is rotated by the rotational drive of the motor shaft MT3. PK2) (substrate P) is rotated in the recovery direction (clockwise direction in Fig. 25), the substrate PK2 is given a predetermined tension, and the roll roll RR3 by the winding sensor S4 Wait until detection of the end of recovery.

As described above, in the present embodiment, while the substrate P is temporarily accumulated in the first buffer mechanism BF1 and sent to the processing device U1, it is withdrawn from the new supply roll RR2 to the substrate P. The joint is replaced with one substrate P2, and is sent to the first buffer mechanism BF1. Therefore, it is possible to change the roll serving as a supply source without stopping each process by the processing devices U1 to Un. Therefore, in this embodiment, the situation in which the board | substrate P inputted to the processing apparatuses U1-Un at the time of change of a supply roll becomes a waste and raises cost can be avoided.

Moreover, in this embodiment, the substrate recovery destination is switched while the substrate P sent from the processing apparatus Un is temporarily accumulated in the second buffer mechanism BF2. Therefore, even when changing the recovery destination of the substrate P, it is possible to avoid the situation that the substrate P that has been input to the processing devices U1 to Un at the time of the change is wasted and causes an increase in cost.

Moreover, in this embodiment, after bonding a new board | substrate to the board | substrate previously used in the 1st splicer part CSa and the 2nd splicer part CSb, the previous board | substrate is cut. For this reason, when cutting is performed first, stable substrate processing can be performed without causing problems such as separation of the substrate at the time of cutting with the applied tension and causing trouble in bonding.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to related examples. All shapes, combinations, and the like of the respective constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the spirit of the present invention.

For example, in the above-described embodiment, a configuration in which the processing mechanism includes a plurality of processing devices U1 to Un has been exemplified. However, the present invention is not limited to this, and a structure in which the above-described substrate joint replacement mechanism is provided in one processing device may be provided.

Moreover, in the said embodiment, it was set as the structure provided with the recovery roll with which the lead-in board PK was connected separately. However, for example, a configuration using a supply roll in which the substrate at the tip end is cut at the end of use may be used.

Moreover, in the said embodiment, it was set as the structure provided with two roll mounting parts on the supply side and the recovery side, respectively. However, three or more roll mounting portions may be provided, respectively.

In the above-described embodiment, before the substrate supplied from one of the two supply rolls becomes the roll end, the substrate is automatically added from the other roll to continue processing without stopping the manufacturing line. If there is a defect in the pattern formed on the substrate somewhere in the manufacturing line or a problem occurs in the manufacturing apparatus, there is a concern that a large number of defective products may be produced.

Therefore, in the production line until the final product is produced, a number of processes for performing a process while being a long substrate are divided into several blocks, and in each block, continuous processing by roll-to-roll is performed. The process block may have a production line (factory) configuration in which the substrate on which the semi-finished product is formed is conveyed in roll units, and is set in a predetermined mounting portion (RS1 or RS2). In this case, the substrate transfer can be performed continuously in units of process blocks, and even when a problem (pattern defect, device defect, etc.) occurs in any process block, it is only necessary to temporarily stop the process block, and Mass production can be reduced.

In the above-described embodiment, the supply rolls RR1 and RR2 attached to each of the two mounting portions RS1 and RS2 assume that the sheet-like substrate for product manufacturing is wound with the same length, and one supply roll. Just before the supply of the substrate from (RR1) was finished (roll end), the joint was replaced with the substrate of the other supply roll RR2, and processing was continued until the end of the substrate of the supply roll RR2. However, the supply roll attached to one of the mounting portions RS1 and RS2 may use a method of continuously supplying the substrate to the processing units U1 to Un only while replacing the other supply roll serving as the roll end with a new roll. .

In that case, for example, the feed roll serving as the roll end is set to RR2, the roll RR2 is removed from the mounting portion RS2, a new supply roll is mounted to the mounting portion RS2, and the first splice portion ( If the preparation time until the state in which the preparation for bonding in CSa) is completed (state in FIG. 13) is 180 seconds, the substrate supplied from the other supply roll RR1 to the processing device U1 (manufacturing line) in the meantime ( The length of P1) is 9 m when the transfer speed of the substrate during processing is 50 mm / sec.

Here, when the substrate P1 of about 9 m is supplied from the other supply roll RR1, the substrate from the new supply roll RR2 attached to the mounting part RS2 by the first splicer part CSa immediately The front end of (P2) is joined (connected or connected) to the position of the substrate P1 that has been fed into the processing device U1 by approximately 9 m from the supply roll RR1, and then the substrate P1 is cut and supplied. You may replace the joint with the board P2 from the roll RR2.

In addition, when the substrate P1 from the supply roll RR1 loaded in the mounting portion RS1 is used as a temporary joint substrate (for example, about 9 m or so), it is performed on the substrate P1. Regarding the processing, it is set as a pilot processing for condition setting or maintenance management of each processing unit U1 to Un, and the device formed there may not be used as a final product.

Moreover, when used as a temporary joint substrate (for example, about 9 m), it is not necessary to wind the substrate P1 around the supply roll RR1, for example, a single leaf cut into a length of about 10 m. You may fold the substrates of the above and store them in a case or the like, and take out the substrates 10m one by one from the case and supply them to the first splice section CSa.

Moreover, the technical scope of the present invention is not limited to the above-described respective embodiments. For example, one or more of the elements described in the above-described embodiments may be omitted. Moreover, the elements demonstrated in each embodiment mentioned above can be combined suitably.

BF1-First buffer mechanism (first buffer unit, buffer mechanism)
BF2-Second buffer mechanism (second buffer part)
CSa-first splice section (substrate joint replacement mechanism)
CSb-2nd splicer part (2nd board joint replacement mechanism)
CU-Cutting Mechanism FS-Board
P-substrate
PK, PK2-lead-in board (third board)
PU10-Joining mechanism RR1-Feed roll (first roll)
RR2-Supply roll (2nd roll) RR3-Recovery roll (3rd roll)
RR4-Recovery roll (4th roll) RS1-1st mounting part
RS2-2nd mounting part RS3-3rd mounting part
RS4-4th mounting part ST-Selection input mechanism
SYS-device manufacturing system (substrate processing equipment)
UA, UB, UB1 to UB3, UC-processing units
U1 ~ Un-Processing device (processing mechanism)

Claims (7)

A long sheet substrate having flexibility is conveyed at a first speed in the first processing unit, and is subjected to a first processing for electronic device manufacturing, and then, in the second processing unit, is slower than the first speed. A substrate processing system for conveying at a second speed to perform a second process for manufacturing the electronic device different from the first process,
The second processing unit is provided with a plurality of two or more per one (台) of the first processing unit,
A first supply roll provided for the first processing unit, in which the sheet substrate before the first processing is wound to a predetermined total length, and the sheet substrate after the first processing is wound up A first mounting portion for detachably attaching one recovery roll,
The second supply roll is provided for each of the plurality of second processing units, and the sheet substrate before the second processing is wound to a predetermined length, and the sheet substrate after the second processing is wound. A second mounting portion for detachably attaching the raised second recovery roll;
The sheet substrate is disposed between the first processing unit and the first recovery roll, and the sheet substrate is removed by a predetermined unit length shorter than the total length of the sheet substrate wound on the first supply roll. It has a cutting mechanism to cut the sheet substrate when it is processed in one processing unit and wound up on the first recovery roll,
The second supply to the second mounting portion provided on any one of the plurality of second processing units, the first recovery roll mounted on the first mounting portion and wound up the sheet substrate by the predetermined unit length. A substrate processing system mounted as a roll. The method according to claim 1,
When the first speed is VA and the second speed is VB, the number of units of the second processing unit is provided according to the ratio VA / VB of the speed. The method according to claim 2,
After the sheet substrate is cut by the cutting mechanism, the first recovery roll on which the sheet substrate subjected to the first treatment is wound up to the predetermined unit length is removed from the first mounting portion, and the plurality of sheets are removed. A substrate processing system further comprising a selection input mechanism for mounting as the second supply roll to the second mounting portion provided for any one of the two processing units. The method according to any one of claims 1 to 3,
When the number of installation units of the first processing unit is two or more n units, the number of m units is greater than n, and the cutting mechanism is provided to the n units of the first processing units. Substrate processing system is provided in n corresponding to each. The method according to any one of claims 1 to 3,
The cutting mechanism is configured to hold the sheet substrate between a buffer portion for temporarily accumulating the sheet substrate carried out from the first processing unit to a predetermined length, and the first recovery roll and the buffer portion. A substrate processing system including a splicer portion for cutting. The method according to any one of claims 1 to 3,
The first processing unit, or the second processing unit,
An application device for forming a photosensitive functional layer on the surface of the sheet substrate to be carried; an exposure apparatus for bringing in the sheet substrate on which the photosensitive functional layer is formed and irradiating patterning light on the photosensitive functional layer; and the patterning light is irradiated A substrate processing system including a wet processing apparatus for carrying out wet processing by bringing in the sheet substrate. The method according to any one of claims 1 to 3,
The first processing unit includes a coating device for forming a photosensitive functional layer on the surface of the sheet substrate to be carried,
The second processing unit includes a substrate processing system including an exposure device that carries the sheet substrate on which the photosensitive functional layer is formed by the coating device and irradiates patterning light on the photosensitive functional layer.

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