CN105479737B - Cutting mechanism, engaging mechanism and cut-out engagement device - Google Patents

Cutting mechanism, engaging mechanism and cut-out engagement device Download PDF

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Publication number
CN105479737B
CN105479737B CN201510795438.8A CN201510795438A CN105479737B CN 105479737 B CN105479737 B CN 105479737B CN 201510795438 A CN201510795438 A CN 201510795438A CN 105479737 B CN105479737 B CN 105479737B
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China
Prior art keywords
substrate
processing unit
processing
cut
roller
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Active
Application number
CN201510795438.8A
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Chinese (zh)
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CN105479737A (en
Inventor
鬼头义昭
铃木智也
堀正和
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Nikon Corp
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Nikon Corp
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/745—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool
    • B29C65/7451—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool the severing tool and the welding tool being movable with respect to one-another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8221—Scissor or lever mechanisms, i.e. involving a pivot point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B29C66/83221—Joining or pressing tools reciprocating along one axis cooperating reciprocating tools, each tool reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8324—Joining or pressing tools pivoting around one axis
    • B29C66/83241—Joining or pressing tools pivoting around one axis cooperating pivoting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/853—Machines for changing web rolls or filaments, e.g. for joining a replacement web to an expiring web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1857—Support arrangement of web rolls
    • B65H19/1873—Support arrangement of web rolls with two stationary roll supports carrying alternately the replacement and the expiring roll
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/461—Processing webs in splicing process
    • B65H2301/4615—Processing webs in splicing process after splicing
    • B65H2301/4617—Processing webs in splicing process after splicing cutting webs in splicing process
    • B65H2301/46172—Processing webs in splicing process after splicing cutting webs in splicing process cutting expiring web only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
    • B65H2301/4631—Adhesive tape
    • B65H2301/46312—Adhesive tape double-sided
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2408/00—Specific machines
    • B65H2408/20—Specific machines for handling web(s)
    • B65H2408/21—Accumulators
    • B65H2408/217—Accumulators of rollers type, e.g. with at least one fixed and one movable roller
    • B65H2408/2171—Accumulators of rollers type, e.g. with at least one fixed and one movable roller the position of the movable roller(s), i.e. the web loop, being positively actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Replacement Of Web Rolls (AREA)
  • Advancing Webs (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

A kind of cutting mechanism, has：Cutting portion cuts off the substrate for the strip for carrying out predetermined processing；And buffer part, so that the storage capacity of the substrate is changed according to the computed carrier amount on the long side direction for the substrate for implementing the predetermined processing, and adjust the computed carrier amount of the substrate transported towards the cutting portion.

Description

Cutting mechanism, engaging mechanism and cut-out engagement device
The present invention is that international application no is PCT/JP2013/060705, and international filing date is on 04 09th, 2013, preferentially Quan is on May 23rd, 2012 and on 06 01st, 2012, and application No. is 201380025725.X, denominations of invention for China national For the divisional application of " cutting mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same ".
Technical field
The form of the present invention is related to cutting mechanism, engaging mechanism, base plate processing system, substrate board treatment and processing substrate Method.
The application is proposed based on the U.S. Provisional Application 61/650712 proposed on May 23rd, 2012 and on June 1st, 2012 U.S. Provisional Application 61/654500 and CLAIM OF PRIORITY, and its content is quoted so far.
Background technology
In the big picture display elements such as liquid crystal display element, ITO (Indium are deposited on planar glass substrate Tin Oxide) etc. after the semiconductor substances such as transparent electrodes or Si evaporation metal material, coating photoresistance simultaneously transfer circuit pattern.So Afterwards, after so that photoresist is developed, circuit pattern etc. is formed by etching.But with the large screen of display element, glass substrate Also enlarged, substrate conveyance as a result, becomes difficult.It is therefore proposed that it is a kind of flexible substrate (for example, polyimides, The film structural components such as PET, metal foil or very thin sheet glass etc.) on formed display element, be referred to as roll-to-roll mode (below only Referred to as " roll fashion ") technology (for example, referring to patent document 1).
In addition, proposing a kind of technology in patent document 2, that is, the peripheral part with the cylindric light shield that can be rotated Closely configuration is wound in conveying roller and the flexible strip sheet (substrate) of movement, and mask pattern is made continuously to be exposed to substrate.
In addition, proposing a kind of technology in patent document 3, that is, the flexible strip sheet that will be come with roll fashion conveying The pattern forming region of (substrate) is temporarily retained on plane microscope carrier, makes the mask pattern picture projected via amplification projecting lens Scan exposure is in the pattern forming region.
Citation
Patent document 1：International Publication No. 2008/129819
Patent document 2：Japanese Unexamined Patent Publication 60-019037
Patent document 3：Japanese Unexamined Patent Publication 2011-22584
But there are the following problems in the above prior art.
In the case where implementing multiple processing successively to strip plate shape substrates, according to the performance of each processing unit, it is suitable for place The conveyance speed of the substrate of reason is respectively different in each unit (each process content).For example, at the exposure as patent document 2 In the case of reason, the brightness etc. of sensitivity and exposure illumination light because applying photosensitive layer on the surface of the substrate makes removing for substrate Speed (activity duration) is sent to be restricted.In addition, drying after the wet processeds such as etching or plating or the wet processed plus In hot step, by slowly transporting substrate, and the advantage that can make liquid bath or drying/heating furnace miniaturization etc. is obtained.
In addition, in the deposition processes of functional material or printing or the step of ink jet printing etc., in order to maintain high-precision Change (miniaturization) and ensure productivity simultaneously, it may have best substrate transports speed.But these best substrate conveyance speed Degree is mostly different due to processing unit.
This multiple processing units of combination are being constructed, so that strip plate shape substrates is passed sequentially through and continues to carry out a succession of processing Roll fashion production line (processing system) in the case of, the conveyance speed (speed of production line) of substrate must not mismatch processing In the minimum processing unit of substrate conveyance speed.
Therefore, the fast processing unit of processing speed although do not play, also to carry out substrate conveyance at a slow speed completely in performance. Therefore, the deterioration of efficiency of processing unit, and be possible to that the productivity of production line entirety can not be promoted.
The purpose of form of the present invention is, provides one kind and can aid in and carries large-duty cutting mechanism, jointing machine Structure, base plate processing system and substrate processing method using same.
In addition, in patent document 1, with the flexible plate shape substrates of roll fashion conveyance and mainly using printing (ink-jet) side Formula forms electronic component on plate shape substrates.But at general printing scene, when remaining for the plate shape substrates in supply roller Surplus tails off, then temporarily ceases printing equipment, cuts off plate shape substrates between printing equipment and recycling roll, will be used as recycling roll And the plate shape substrates of the completion printing wound are sent to next step.In this case, from the entrance of printing equipment to outlet It prints in path, printing can remain plate shape substrates on the way, these can all be discarded as defective products.With colour on paper or film In the case that ink prints, printing cost is extremely cheap.But in the case where forming electronic component with roll fashion, sheet The manufacturing cost of the per unit length (m) of substrate is still expensive, if printing scene will remain in the device like that as Plate shape substrates are discarded, then excessively waste and cost increase.
In particular, in the case where medium-sized, the larger display panels that are constituted based on organic EL are formed on plate shape substrates, piece Shape substrate is continually by a series of multiple processing units, such as the such exposure dress of photosensitive layer printing equipment, patent document 3 It sets, after wet type processing device, drying device etc., in recycling roll.Therefore, it can speculate and pass through from supply roller to recycling roll The plate shape substrates of multiple processing units (processing step) can extremely be grown, once stopping the conveyance of plate shape substrates, then can be wasted quite The plate shape substrates of long range.
The purpose of other forms of the present invention is, provides a kind of inhibition cost increase and puies forward large-duty processing substrate Device and substrate processing method using same.
Invention content
1st form according to the present invention, provides a kind of base plate processing system, has：1st processing unit, to along long side side Continuously implement the 1st processing to the substrate transported with speed V1；And the 2nd processing unit, it is single by the 1st processing with speed V2 conveyances Member treated substrate continuously implements substrate the 2nd processing, which is characterized in that respective according to the 1st, the 2nd processing unit In the case of can the relationship of speed being set to V1 > V2, multiple 2nd processing units are arranged, and in the 1st processing unit in performance Later, also have：The cutting mechanism that the substrate for implementing the 1st processing is cut off with the specific length of long side direction；With will cut off Substrate afterwards is put into the selection injection mechanism of either one or two of multiple 2nd processing units, according to the 1st, the 2nd processing unit respectively Performance, in the case of can the relationship of speed being set to V1 < V2, multiple 1st processing units are set, and single in the 2nd processing Before member, multiple substrates of the 1st processing will be implemented respectively by multiple 1st processing units by also having, and be engaged successively along long side direction And it puts into the engaging mechanism of the 2nd processing unit.
2nd form according to the present invention, provides a kind of substrate processing method using same, has：By the 1st processing unit to along long side The substrate that direction is transported with speed V1 continuously implements the action of the 1st processing；It is transported by the 1st processing unit processes with speed V2 Substrate afterwards, and continuously implement by the 2nd processing unit the action of the 2nd processing to substrate, which is characterized in that according to the 1st, The 2nd respective performance of processing unit, it is single using multiple 2nd processing in the case of can the relationship of speed being set to V1 > V2 Member, and after the 1st processing unit, also have：The substrate for implementing the 1st processing is cut off with the specific length of long side direction Cut off step；Step is put into the selection for putting into the substrate after cut-out to either one or two of multiple 2nd processing units, according to the 1, the 2nd respective performance of processing unit in the case of can the relationship of speed being set to V1 < V2, is handled using multiple 1 Unit, and before the 2nd processing unit, multiple substrates of the 1st processing will be implemented respectively by multiple 1st processing units by also having, It engages and puts into the engagement step of the 2nd processing unit successively along long side direction.
3rd form according to the present invention, provides a kind of cutting mechanism, has：Cutting portion will carry out predetermined processing Substrate is cut off；And buffer part, so that the storage capacity of substrate is changed according to the computed carrier amount for the substrate for implementing predetermined processing, And adjust the computed carrier amount of the substrate transported towards cutting portion.
4th form according to the present invention, provides a kind of engaging mechanism, has：Joint portion will implement the base of predetermined processing Plate engages；And buffer part, so that the storage capacity of substrate is changed according to the computed carrier amount for the substrate for implementing predetermined processing, and adjust It is whole to be put into from joint portion to the computed carrier amount of the substrate of predetermined processing.
5th form according to the present invention, provides a kind of base plate processing system, makes the substrate transported along long side direction from the 1st After processing unit passes through, pass through from the 2nd processing unit, makes in the conveyance speed relative to the substrate in the 1st processing unit There is cutting mechanism, the cutting mechanism is in the 1st processing unit and the 2nd when the conveyance speed of substrate in 2nd processing unit reduces Between processing unit, substrate is cut off with the specific length of long side direction, in the conveyance relative to the substrate in the 1st processing unit Speed and make that there is engaging mechanism when the conveyance speed increase of substrate in the 2nd processing unit, the engaging mechanism is single in the 1st processing Between member and the 2nd processing unit, substrate is engaged along long side direction.
6th form according to the present invention, provides a kind of substrate board treatment, has：1st mounting portion, installation are wound with 1st roller of the 1st substrate of strip；2nd mounting portion, installation are wound with the 2nd roller of the 2nd substrate of strip；Processing mechanism, , using some of the 1st substrate and the 2nd substrate as processing substrate, predetermined processing is implemented in an edge long side direction conveying on one side for it； Buffer gear configures between processing mechanism and the 1st mounting portion, the 1st substrate supplied from the 1st roller is stored up in defined longest It deposits after temporarily being stored in range, is sent out to processing mechanism；Mechanism is replaced with substrate connection, in buffer gear and the 1st mounting portion Between cut off the 1st substrate, and the front end of the 2nd substrate supplied from the 2nd roller is bonded on to the terminal of the 1st substrate of cut-out Portion, and sent out to buffer gear.
7th form according to the present invention, provides a kind of substrate board treatment, has：1st mounting portion, installation are wound with 1st roller of the 1st substrate of strip；2nd mounting portion, installation are wound with the 2nd roller of the 2nd substrate of strip；Processing mechanism, It is using some of the 1st substrate and the 2nd substrate as processing substrate, and an edge long side direction conveying is implemented at regulation on one side Reason；Buffer gear configures between processing mechanism and the 1st mounting portion, in the 1st substrate that will be supplied from the 1st roller defined Longest stores in range after temporarily storage, to processing mechanism submitting；Mechanism is replaced with substrate connection, in buffer gear and the 1st The 1st substrate is cut off between mounting portion, and the front end of the 2nd substrate supplied from the 2nd roller is attached to the 1st substrate of cut-out In the prescribed portion of buffer gear side, and sent out to buffer gear.
8th form according to the present invention, provides a kind of substrate board treatment, has：1st mounting portion, removably pacifies Dress is wound with the 1st roller of the 1st substrate of strip；Maintaining part keeps the 2nd with the 1st substrate equivalent specifications with specific length Substrate；Processing mechanism, using some of the 1st substrate and the 2nd substrate as processing substrate, an edge long side direction conveying is on one side Implement predetermined processing；Buffer gear configures between processing mechanism and the 1st mounting portion, and the 1st base that will be supplied from the 1st roller After plate temporarily stores in defined longest storage range, sent out to processing mechanism；Mechanism is replaced with substrate connection, is being buffered The 1st substrate is cut off between mechanism and the 1st mounting portion, and the front end of the 2nd substrate supplied from maintaining part is connected to cut-out The 1st substrate buffer gear side prescribed portion on, and to buffer gear send out.
9th form according to the present invention, provides a kind of substrate processing method using same, using the substrate of input strip as place It manages substrate and an edge long side direction conveying implements predetermined processing by processing mechanism on one side, including acts as follows：It will be wound with 1st roller of the 1st substrate of strip is mounted on the action on the 1st roller mounting portion；The 2nd of the 2nd substrate of strip the will be wound with Roller is mounted on the action on the 2nd roller mounting portion；It, will be from by configuring the buffer gear between processing mechanism and the 1st mounting portion The action that 1st substrate of the 1st roller supply is sent out after temporarily being stored in defined longest storage range to processing mechanism；With will During the 1st substrate temporarily stored is sent out to processing mechanism, the 1st substrate is cut off between buffer gear and the 1st mounting portion, And it will be attached at from the front end for the 2nd substrate that the 2nd roller supplies in the prescribed portion of the buffer gear side of the 1st substrate of cut-out Action.
10th form according to the present invention, provides a kind of substrate processing method using same, using the substrate of input strip as It handles one edge long side direction conveying of substrate and predetermined processing is implemented by processing mechanism on one side, including act as follows：
Action of the 1st roller of the 1st substrate of strip on the 1st roller mounting portion will be wound with；It will be same with the 1st substrate 2nd substrate of equal-specification is maintained at the action in maintaining part with specific length；By configure processing mechanism and the 1st mounting portion it Between buffer gear, to processing mechanism after temporarily being stored in defined longest storage range from the 1st substrate that the 1st roller supplies The action of submitting；With during the 1st substrate that will temporarily store is sent out to processing mechanism, installed in buffer gear and the 1st The 1st substrate is cut off between portion, and the front end of the 2nd substrate supplied from maintaining part is attached at cut-out the 1st substrate it is slow Action in the prescribed portion of punch mechanism side.
The effect of invention
In the form of the present invention, it can be effectively used in the processing unit used respectively in multiple processing steps, made The productivity of the production line entirety of processing substrate is promoted.
In addition, in other forms of the present invention, substrate waste can be greatly decreased, cost increasing can be effectively inhibited Add.
Description of the drawings
Fig. 1 is the figure for the base plate processing system that illustration indicates the 1st embodiment.
Fig. 2 is the approximate stereogram of the cutting mechanism of the 1st embodiment.
Fig. 3 is the outline stereoscopic figure in the 1st splicer portion of the 1st embodiment.
Fig. 4 is the outline stereoscopic figure in the 2nd splicer portion of the 1st embodiment.
Fig. 5 is the control block diagram in the base plate processing system of the 1st embodiment.
Fig. 6 is the figure for indicating a part for the device manufacturing system of the 1st embodiment and constituting.
Fig. 7 is the figure for the model configuration example for illustrating to constitute multiple processing units of the production line of the 1st embodiment.
Fig. 8 is the sequence diagram promoted the activity duration for the production line for illustrating the 1st embodiment.
Fig. 9 is the figure for being denoted as a part for the device manufacturing system that the processing substrate of the 2nd embodiment is set and constituting.
Figure 10 is the figure of the 1st splicer portion for indicating the 2nd embodiment and the schematic configuration of the 1st buffer gear.
Figure 11 is the figure of the 2nd splicer portion for indicating the 2nd embodiment and the schematic configuration of the 2nd buffer gear.
Figure 12 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 13 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 14 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 15 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 16 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 17 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 18 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 19 is the figure of engagement/cutoff action of the substrate for the substrate supply side for indicating the 2nd embodiment.
Figure 20 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Figure 21 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Figure 22 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Figure 23 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Figure 24 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Figure 25 is the figure of engagement/cutoff action of the substrate for the substrate recycling side for indicating the 2nd embodiment.
Specific implementation mode
1st embodiment
Hereinafter, illustrating at cutting mechanism of the invention, engaging mechanism, base plate processing system and substrate referring to figs. 1 to Fig. 6 The embodiment of reason method.
Fig. 1 is the reel for indicating that plate shape substrates P is made to pass sequentially through 3 processing steps A, B, C as an example in a schematic way The figure of the base plate processing system SYS of mode.
The main body of base plate processing system is configured to implement to handle the processing list of A (the 1st processing) as step A to substrate P First UA (the 1st processing unit) implements to handle processing unit UB (the 1st processing lists of B (the 1st processing, the 2nd processing) as step B Member, the 2nd processing unit), implement as step C to handle processing unit UC (the 2nd processing unit), the cutting machine of C (the 2nd processing) Structure CU10, engaging mechanism PU10, selection injection mechanism ST1, ST2, control unit CT (with reference to Fig. 5).
Processing unit UA has roller mounting portion RSA for installing supply roller RRA, will have been carried out the substrate P after processing A to Cutting mechanism CU10 is sent out.Processing unit UB is made of the processing unit UB1~UB3 for implementing identical processing B respectively, for example, It is configured to 3 layers or the row of level 3 up and down in the downstream side of the substrate conveyance direction of processing unit UA.
The mounting portion RSB11 of roller installations of each processing unit UB1~UB3 with the substrate P for having been carried out processing A~ Mounting portion RSB12~RSB32 of the roller installation of RSB31 and the substrate P for having been carried out processing B, from mounted on mounting portion The substrate P of roller RRB11~RRB31 (hereinafter, properly termed as sub- roller RRB11~RRB31) on RSB11~RSB31 is at implementation After managing B, roller RRB12~RRB32 on mounting portion RSB12~RSB32 is wound in (hereinafter, properly termed as sub- roller RRB12~RRB32) on.
In addition, in Fig. 1, after the cutting mechanism CU10 of processing unit UA rear classes, equipped with the base for having been carried out processing A The roller RR1 of plate P windings.When winding the specific length amount of substrate P on roller RR1, then substrate P is cut off, roller RR1 is as sub- roller Any of RRB11~RRB31 and mounted on each processing unit UB1~UB3 either one or two of mounting portion RSB11~RSB31 On.
Processing unit UC can will be implemented any of sub- roller RRB12~RRB32 of processing B by processing unit UB1~UB3 It is a to be installed as roller RR2.Substrate P (intermediate products for implementing processing A, B) on roller RR2 is via engaging mechanism PU10 is moved in processing unit UC and is implemented to handle C.Substrate P after receiving processing C is wound on roller mounting portion RSC Recycling roll RRC on and recycle.
Processing speed VA (the conveyance speed of substrate P), the processing unit of processing A in the processing unit UA of present embodiment The processing speed of processing C in processing speed VB (the conveyance speed of substrate P), the processing unit UC of processing B in UB1~UB3 The relationship of VC (the conveyance speed of substrate P) is as follows.
VA ≈ VC > VB
In addition, between either one or two of processing unit UA and processing unit UB1~UB3, the conveyance speed of substrate P becomes VA > VB, processing unit UA is corresponding with the 1st processing unit that conveyance speed (V1) is high as a result, any of processing unit UB1~UB3 A 2nd processing unit low with conveyance speed (V2) is corresponding.On the other hand, in either one or two of processing unit UB1~UB3 and processing Between unit UC, the conveyance speed of substrate P becomes VB < VC, as a result, either one or two of processing unit UB1~UB3 and conveyance speed (V1) the 1st low processing unit corresponds to, and processing unit UC is corresponding with the 2nd processing unit that conveyance speed (V2) is high.
In the present embodiment, processing speed VA, VC can be set as about 3 times of processing speed VB.As in the past, In the case where it is 1 to implement the processing unit UB of processing step B, 1 substrate P is linked to be from supply roller RRA to recycling roll RRC Processing unit UA, UB, UC are passed sequentially through, it is consistent with most slow processing speed VB to transport speed for it as a result,.That is, production line is whole Activity duration (line speed, productivity) limited by most slow processing unit.
In the present embodiment, by the processing unit UB polytenizations (being set up in parallel 3 herein) for keeping processing speed slow, and It can constitute without restriction.Following cutting mechanism CU10 is needed in order to realize the polytenization (or setting is multiple), After substrate P is only wound to specific length amount on roller RR1, processing step A and processing step B are not temporarily ceased and cuts off base Plate P.
The substrate P that cutting mechanism CU10 mainly implements processing A with specific length cut-out has as shown in Figures 1 and 2 1st buffer gear (the 1st buffer part) BF1 and the 1st splicer portion CSa (cutting portion).In addition, cutting mechanism CU10 further has What the storage capacity of the action for making the 1st splicer portion CSa (cutting portion) and the substrate P in the 1st buffer gear BF1 (buffer part) interlocked Connecting move control portion.
1st buffer gear BF1 has tension reel mechanism DR1, by substrate P bys the up and down motion etc. of tension reel Storage length is variably adjusted and simultaneously by substrate P move-in/move-out, wherein tension reel mechanism DR1 is located at implementation as the Between the unit UA and the 1st splicer portion CSa of the processing A of 1 processing, substrate P is set to turn back by multiple rollers etc. long to store regulation Measurement.1st buffer gear BF1 has clamping driving reel NR1, the downstream with the conveyance direction of the substrate P of processing unit UA Side is disposed adjacent, and adjusts the computed carrier amount (or conveyance speed) (with reference to Fig. 5) to the 1st splicer portion CSa substrate Ps moved out. The driving of tension reel mechanism DR1 and the driving of clamping driving reel NR1 are controlled by control unit CT.
Here, illustrating its composition by Fig. 3 of the diagrammatic perspective appearance of the 1st splicer portion CSa of expression.
1st splicer portion CSa has：Saddle 2 has the absorption layer 1 formed by for example porous material in upper surface, and It can be moved freely along the conveyance direction (hereinafter simply referred to as conveyance direction) of substrate P；Lifting platform 3 with guide rail, by saddle 2 It is movably supported along conveyance direction；The driving portion 4 for making lifting platform 3 lift；Cutter part 5 is in upper raise-position in lifting platform 3 When setting, moves and the substrate P being adsorbed on the absorption layer 1 of saddle 2 can be cut off along the width direction of substrate P；Paste section 6, It can paste adhesive band TP to substrate P；It (can move up and down) with maintaining part 8, be located at the top of lifting platform 3, and pass through Both sides come keep will have been carried out processing A substrate P winding roller RR1 wireline reel 7.
In addition, wireline reel 7 pastes the high resin film of cohesively in a part (or entire circumferential surface) for its peripheral surface Or material makes wireline reel 7 rotate, thereby, it is possible to automatic after the front end for making substrate P is contacted with the peripheral surface of wireline reel 7 Ground winds substrate P.
These saddles 2, lifting platform 3, driving portion 4, cutter part 5, paste section 6 and maintaining part 8 are used as integrated work station Portion SN and constitute, castor platform etc. can be placed in transport, and specified position can be positioned at.
Each driving of these saddles 2, driving portion 4, cutter part 5, paste section 6 is by control unit CT controls (with reference to Fig. 5).
In addition, work station portion SN has：Moving portion can keep substrate P and be moved along long side direction, and include saddle 2, lifting platform 3, driving portion 4 etc.；And mobile control division, make moving portion be moved to cut-out region based on cutting mechanism CU10, Or the engaging zones based on engaging mechanism PU10.
In addition, substrate P is bonded by the paste section 6 in present embodiment by adhesive band TP, but may be others Bonding method (mechanism).Such as or, by bonding agent along the width direction orthogonal with the conveyance direction of substrate P with band-like painting The mode of simultaneously pressurizing attaching is applied, in the case that substrate P is resin film etc., the part the to be bonded heating of substrate P is crimped The modes such as mode or ultrasonic engagement.
In addition, the absorption layer 1 for being located at the upper surface of saddle 2 keeps substrate P by vacuum pressure, but can also be configured to, Mechanical clamping device (clamp arm etc.) other than being pressed by vacuum is locking by substrate P and the upper surface of saddle 1.
In addition, selection injection mechanism ST1 shown in FIG. 1 under the control of control unit CT, will have been carried out the substrate P of processing A The roller RR1 (hereinafter referred to as sub- roller RR1) for being wound in wireline reel 7 is selected as either one or two of sub- roller RRB11, RRB21, RRB31 Property either one or two of put into mounting portion RSB11~RSB31, and the prepared conveyance of wireline reel 7 to sub- roller RR1 moved out and The maintaining part 8 for the 1st splicer portion CSa being available.
In the present embodiment, processing speed VA, VC is about 3 times of processing speed VC, and processing unit UB also is provided with 3 and sets It sets, therefore, the length for the substrate P that sub- roller RR1 (that is, sub- roller RRB11~RRB31, RRB12~RRB32, aftermentioned RR2) is wound Degree, is set as 1/3 or so of the length of the substrate P on the supply roller RRA as female roller.
Therefore, cutting mechanism CU10 is by as by about 3 decile of the overall length of the substrate P on supply roller RRA Specific length cuts off substrate P.
In addition, the selection injection mechanism ST2 of Fig. 1 is under the control of control unit CT, selection will be by processing unit UB1~UB3 Either one or two of implement the substrate P of processing B is only wound with specific length amount, the sub- roller RRB12 of mounting portion RSB12~RSB32 Either one or two of~RRB32, and put into engaging mechanism PU10 (roller conveyance), and to any of sub- roller RRB12~RRB32 A transported and the wireline reel of mounting portion RSB12~RSB32 installation preparation being available.
Engaging mechanism PU10 will mainly implement either one or two of sub- roller RRB12~RRB32 of processing B and conveyance as sub- roller RR2, and put into before being engaged near the terminal of cut-off substrate, as shown in Figure 1, with the 2nd splicer portion CSb (engagements Portion) and the 2nd buffer gear (the 2nd buffer part) BF2.In addition, engaging mechanism PU10 includes：The substrate engagement of processing B will be implemented The 2nd splicer portion CSb (joint portion)；With the 2nd buffer gear (buffer part) BF2, enable the storage capacity of substrate according to reality It has applied the computed carrier amount of the substrate of processing B and has changed, and adjusted by the computed carrier amount of the substrate from joint portion of processing B inputs.
As shown in figure 4, the 2nd splicer portion CSb is, make base in the work station portion SN in above-mentioned 1st splicer portion CSa What the conveyance direction of plate P was arranged in the state of becoming opposite.That is, the 2nd splicer portion CSb has：Saddle 2, in upper table mask There is absorption layer 1, and can be moved freely along conveyance direction；Lifting platform 3 with guide rail moves saddle 2 certainly along conveyance direction Such as support；The driving portion 4 for making lifting platform 3 lift；Cutter part 5, when lifting platform 3 is in lifting position, along the width of substrate P Degree direction is mobile and can cut off the substrate P being adsorbed on the absorption layer 1 of saddle 2；Paste section 6 can paste substrate P Adhesive band TP；With maintaining part 8, it is located at the top of lifting platform 3, and by both sides keep that the substrate P volume of processing B will be had been carried out Around roller RR2 wireline reel 7.
It constitutes in the same manner as 2nd buffer gear BF2 and the 1st buffer gear BF1, exists moving in the substrate P of processing unit UC It changeably stores in the length range that can be adjusted, is disposed adjacent with the upstream side of the conveyance direction of the substrate P of processing unit UC.
2nd buffer gear BF2 has：Tension reel mechanism DR2, by making along adjacent more of the conveyance direction of substrate P Opposite direction lifts a roller to each other, and can be variably adjusted the storage capacity of substrate P；Reel NR2 is driven with clamping, is adjusted The whole computed carrier amount (conveyance speed) (with reference to Fig. 5) from the 2nd splicer portion CSb to the tension reel mechanism DR2 substrate Ps transported.? The driving of power drum mechanism built DR2 and the driving of clamping driving reel NR2 are controlled by control unit CT.
Fig. 5 is the control block diagram in Fig. 1~base plate processing system shown in Fig. 4.
As shown in figure 5, the action of control unit CT control process unit UA, UB (UB1~UB3), UC, and plan as a whole control point Saddle 2, driving portion 4, cutter part 5, paste section 6, the selection input machine not being located on cutting mechanism CU10 and engaging mechanism PU10 The driving of structure ST1, ST2, tension reel mechanism DR1, DR2, clamping driving reel NR1, NR2 etc..In addition, control unit CT is counted simultaneously Manage supply roller RRA, the rotation driving of recycling roll RRC, substrate P in each step (each processing unit) conveyance length, and count The substrate winding of each roller of substrate surplus of the number management as each roller of the supply side of substrate P and the recycling side as substrate P Amount, the management of the overall operation time until also carrying out processing step A~C, whether have on each roller problem in processing or The management etc. of the information such as degree or the position of unfavorable condition occurs.Control unit CT includes the action and the 1st for making cutting mechanism CU10 The connecting move control portion that the storage capacity of substrate P in buffer part BF1 interlocks.Similarly, control unit CT includes making engaging mechanism PU10 Action with the 2nd buffer part BF2 in substrate P storage capacity interlock connecting move control portion.
Next, illustrating the action of the base plate processing system of above-mentioned composition.
Here, as shown in Figure 1, handling the next of B completions in processing unit UB1, sub- roller RRB12, which passes through, selects input machine Structure ST2 and transport to the maintaining part 8 of the 2nd splicer portion CSb.In addition, in processing unit UB2, to from mounted on mounting portion The substrate P that sub- roller RRB21 on RSB21 is drawn implements processing B.In addition, in processing unit UB3, until it becomes next place The sub- roller RRB31 of reason object is standby until being mounted on mounting portion RSB31.
In addition, in the following description, since the action of each constitution equipment is controlled by control unit CT, so omitting its note It carries.
First, when being wound with implementation on the sub- roller RR1 of maintaining part 8 for being held in the 1st splicer portion CSa with specific length After the substrate P of processing A, in the 1st buffer gear BF1, clamping driving reel NR1 stops driving and stops substrate P and connect to the 1st Supply with device portion CSa.It is persistently carried out at this point, handling A in processing unit UA, substrate P is sent to the 1st buffer gear BF1.Cause This, tension reel mechanism DR1 in the 1st buffer gear BF1 drives to making the increased direction of the storage capacity of substrate P.
Supply with the substrate P from the 1st buffer gear BF1 stops linkedly, base being carried out in the 1st splicer portion CSa The cutoff process of plate P.
Specifically, first, saddle 2 is moved to after the position opposite with cutter part 5, is made by the action of driving portion 4 Lifting platform 3 rises together with saddle 2.By the rising of saddle 2, absorption layer 1 is adsorbed from the back side (lower surface) keeps substrate P, fixed The position extremely off-position based on cutter part 5.Then, cutter part 5 moves along the width direction of substrate P and cuts off substrate P.Work as substrate After P is cut off, injection mechanism ST1 is selected to be put into the mounting portion of processing unit UB3 using sub- roller RR1 as sub- roller RRB31 RSB31.In addition, maintaining parts 8 of the selection injection mechanism ST1 in the 1st splicer portion CSa that sub- roller RR1 is discharged and is available fills Fill out prepared wireline reel 7.
In the 1st splicer portion CSa, after wireline reel 7 is mounted in maintaining part 8, saddle 2 moves so that absorption is maintained at (while driving reel NR1 also only synchronous rotations are clamped in the lower section that the fore-end of the substrate P of the upper surface of saddle 2 is located at wireline reel 7 Turn specified amount), the maintaining part 8 of bearing wireline reel 7 only declines certain distance, the peripheral surface of the fore-end and wireline reel 7 of substrate P Adhesive part be in close contact.In this way, when the fore-end of the substrate P extended from the 1st sides buffer gear BF1 is connected to new winding After axis 7, releases the absorption based on absorption layer 1 and keep, then, maintaining part 8 is back to the height and position of script, passes through driving portion 4 Action and so that lifting platform 3 is declined together with saddle 2.
Then, clamping driving reel NR1 and the rotation driving of new wireline reel 7 start again at, and come from the 1st buffer gear The supply of the substrate P of BF1 starts again at, and substrate P is wound in new wireline reel 7.After the supply of substrate P starts again at, clamping is driven Movable reel NR1 is with the conveying speed of substrate P more corresponding than with the processing speed VA in processing unit UA (that is, substrate P is to the 1st The speed of buffer gear BF1 conveying) slightly fast speed rotation.In tension reel mechanism DR1, with clamping driving reel NR1's Driving accordingly, drives to the direction for the storage capacity reduction for making substrate P.
After the length of the substrate P in being stored in the 1st buffer gear BF1 becomes substantially minimum, with processing unit UA In substrate P conveying speed identical speed driving clamping driving reel NR1.
On the other hand, from the sub- roller RRB31 extraction substrate Ps on the mounting portion RSB31 of processing unit UB3, and with Speed corresponding with processing speed VB come convey and implement processing B, be wound to the sub- roller RRB32 on mounting portion RSB32.
It is single in processing during implementing processing B to the substrate P drawn from sub- roller RRB31 in processing unit UB3 In first UB2, the processing B implemented to the substrate P drawn from sub- roller RRB21 is completed, and the sub- roller RRB2 for being wound with substrate P is being installed Portion RSB22 is standby.
By selecting injection mechanism ST2, to being mounted on the sub- roller on engaging mechanism PU10 as sub- roller RR2 from before The substrate P of RRB12, after completing the processing C implemented based on processing unit UC, in the 2nd buffer gear BF2 of engaging mechanism PU10 The driving of clamping driving reel NR2 stop, stopping supply of the substrate P to tension reel mechanism DR2.
At this point, in processing unit UC, processing C is persistently carried out.Therefore, tension reel mechanism DR2 is acted, with single with processing The corresponding certain speed of conveying capacity (processing speed VC) of substrate P in first UC, will be stored in the base in the 2nd buffer gear BF2 Plate P is conveyed to processing unit UC.
In the 2nd splicer portion CSb, in the same manner as the cutoff process in the 1st splicer portion CSa, when saddle 2 be moved to After on the opposite position of cutter part 5, lifting platform 3 is set to increase together with saddle 2 by the action of driving portion 4.Pass through saddle 2 Rising, absorption layer 1 is adsorbed from the back side (lower surface) keeps the substrate P from sub- roller RRB12, and positioning is to based on cutter part 5 Off-position.Then, cutter part 5 moves along the width direction of substrate P and cuts off substrate P.After cutting off substrate P, input machine is selected Structure ST2 takes out the wireline reel 7 for being wound with sub- roller RR2 (RRB12) from maintaining part 8, and mounting portion is mounted in empty maintaining part 8 Standby RSB22 roller RRB22 and as sub- roller RR2.
After group roller RRB22 is mounted on as sub- roller RR2 in the maintaining part 8 in the 2nd splicer portion CSb, from sub- roller RR2 The fore-end of the substrate P of extraction is aligned with the rear end of the substrate P of the 2nd sides buffer gear BF2 cut off before, 2 plate base P It is kept by absorption layer 1.In this state, 2 plate base P are engaged by adhesive band TP.After substrate P engagement, releases and be based on absorption layer 1 Absorption keep, then, so that lifting platform 3 is declined together with saddle 2 by the action of driving portion 4.Then, it is clamped by driving Reel NR2 is driven, is started again at from the 2nd splicer portion CSb to the supply of the substrate P of the 2nd buffer gear BF2.
After the supply of substrate P starts again at, clamping driving reel NR2 with than with the processing speed VC in processing unit UC The slightly fast speed rotation of the conveying speed of corresponding substrate P.In tension reel mechanism DR2, the drive with clamping driving reel NR2 It moves accordingly, is driven to the increased direction of the storage capacity of substrate P is made.
After the length of storage to the substrate P in the 2nd buffer gear BF2 becomes substantially maximum, with processing unit UC In substrate P conveying speed identical speed driving clamping driving reel NR2.Then, from defeated via the 2nd buffer gear BF2 It send to the substrate P of sub- roller RRB22 (the sub- roller RR2) extractions of processing unit UC, processing C is carried out with processing speed VC.
As described above, the substrate P for implementing processing A by processing unit UA is wound as being divided according to the number of units of processing unit UB After the sub- roller RR1 for the length cut, is put into successively to processing unit UB1~UB3 and implement to handle B, then, from processing unit UB1 ~UB3 is put into successively as sub- roller RR2 to be implemented to handle C to processing unit UC.About processing speed VB than processing speed VC Slow processing unit UB is equipped with 3 according to the ratio of processing speed, as a result, on the surface, from 3 processing unit UB1 ~UB3 with the period identical with the case where implementing processing B with 3 times of processing speeds of processing speed VB, by sub- roller RR2 put into Processing unit VC.
As explained above ground, in the present embodiment, according to the respective performance of processing unit UA, UB, and can In the case of being set as processing speed VA > processing speeds VB, by the number of units m's of the number of units n of processing unit UA and processing unit UB Relationship is set as n < m, and substrate P is cut to the sub- roller of length corresponding with number of units m and is selectively put into the processing list of m platforms Either one or two of first UB1~UBm.Being not limited by reduction process speed VB as a result, can if integrally being observed with production line Substrate P is handled with processing speed VA.
In addition, according to the respective performance of processing unit UB, UC, it can be set as processing speed VB < processing speeds VC's In the case of, the substrate P for the sub- roller RR2 that processing B is implemented by the processing unit UB1~UBm of more (m) is engaged and put into successively To the processing unit UC of n platforms (n < m).Therefore, it is possible to substantially inhibit substrate P to be moved in from processing unit UB to processing unit UC Until stand-by period.
Therefore, in this case, it will not be limited to reduction process speed VB, base can be handled with processing speed VC (≈ VA) Plate P.
Therefore, in the present embodiment, the case where implementing the different multiple processing A~C of processing speed successively, can also seek It seeks survival the promotion of yield.In addition, in the present embodiment, according to the ratio of processing speed come the number of units of setting processing unit UB. Therefore, efficient processing substrate will not be realized equipment is excessively set.On this basis, in the present embodiment, by polytenization Processing unit UB1~UB3 along the vertical direction multilayer be arranged the case where, with not will increase setting area (footprint) can Implement efficient processing substrate.
In addition, in the present embodiment, making the cutting mechanism CU10 with buffer gear and the engaging mechanism with buffer gear PU10 is that can be used in the general composition of either one of cut-out with engagement, and be set as work station portion SN.Therefore, it is not required to Different types of device is individually set, the cost of production equipment can be reduced.
That is, between processing unit adjacent in a succession of multiple processing units, if conveyance direction relative to substrate P The processing speed of the processing unit of upstream side, the processing unit in downstream side is relatively low, and setting work station portion SN conducts are cut therebetween Work station portion SN works are arranged in the case where the relationship of processing speed is opposite in breaking mechanism CU10 between adjacent processing unit For engaging mechanism PU10.
That is, the base plate processing system of present embodiment can be, the adjacent processing in a series of multiple processing units Between unit, the conveyance of the substrate P in the processing unit (the 1st processing unit) of the upstream side of the conveyance direction relative to substrate P Speed, make the substrate P in the processing unit (the 2nd processing unit) in downstream side conveyance speed reduce when, the 1st processing unit with Between 2nd processing unit, there is the cutting mechanism CU10 for cutting off substrate P with the specific length of long side direction, relative to the 1st The conveyance speed of substrate P in processing unit, and when making the conveyance speed increase of substrate P in the 2nd processing unit, at the 1st There is the engaging mechanism PU10 for engaging substrate P along long side direction between reason unit and the 2nd processing unit.
(device manufacturing system)
Next, illustrating the device manufacturing system for being applicable in aforesaid substrate processing system with reference to Fig. 6.
Fig. 6 is that a part for the device manufacturing system (flexible display production line) for being denoted as base plate processing system is constituted Figure.Here, indicate the flexible substrate P (piece, film etc.) drawn from supply roller RR1 pass through successively n platform processing units U1, U2, U3, U4, U5 ... Un and be wound to the example on recycling roll RR2.Host control device CONT (control unit) plans as a whole control and constitutes production Device U1~Un is managed everywhere in line.
In addition, processing unit U1~Un shown in fig. 6 can be either one or two of processing unit UA~UC shown in FIG. 1, Can be that 2 or more continuous processing units in processing unit U1~Un is made to come together any of alignment processing unit UA~UC It is a.
In figure 6, orthogonal coordinate system XYZ be set as substrate P surface (or back side) it is vertical with the faces XZ, with substrate P The orthogonal width direction of conveyance direction (long side direction) is set as Y direction.In addition, the substrate P is by before prespecified Processing and its surfaction is activated or subtle next door that precise pattern is formed on surface construct (concave-convex structure Make) substrate.
Substrate P on supply roller RR1 is drawn by the driving reel DR10 of clamping and is transported to processing unit U1.The Y direction (width direction) of substrate P centrally through marginal position controller EPC1, and to be received relative to target location Hold back the mode SERVO CONTROL in the range of ± more than ten μm~tens μm or so.
Processing unit U1 be with mode of printing in the conveyance direction (long side direction) of substrate P by photonasty functional liquid (light Resistance, photonasty silicon alkane couple material, and photonasty couples material, the close and distant liquid modification agent of photonasty, photonasty plating reducing agent, UV solidification trees Fat liquid etc.) continuously or the applying device that is optionally applied on the surface of substrate P.Winding is equipped in processing unit U1 There are laminate reel DR20, the applying mechanism Gp1 of substrate P and rapidly removes coated in institute in the photonasty functional liquid in substrate P Drier Gp2 of solvent or moisture contained etc., wherein applying mechanism Gp1 includes on laminate reel DR20 by photonasty Functional liquid is evenly coated at the painting application reel on the surface of substrate P or using photonasty functional liquid as ink print Relief printing plate or intaglio plate version body reel etc..
Processing unit U2 be for by the substrate P moved from processing unit U1 be heated to set point of temperature (for example, tens~ 120 DEG C or so) and the photonasty functional layer coated in surface is made to stablize fixed heating device.Being equipped in processing unit U2 makes Substrate P turn back and transport multiple reels and air swingle, by heating cavity portion HA1 that the substrate P moved in heats, make heating after Substrate P at a temperature of be reduced to the cooling cavity portion HA2 consistent with the environment temperature of subsequent step (processing unit U3) and clamped Driving reel DR3 etc..
Processing unit U3 is the photonasty functional layer relative to the substrate P moved from processing unit U2, irradiation and display The exposure device of the patterning light of the corresponding ultraviolet light of circuit pattern or wiring pattern of device.Being equipped in processing unit U3 will The center control of the Y direction (width direction) of substrate P is the marginal position controller EPC on certain position, clamped drive Movable reel DR4, substrate P is locally wound and by the pattern exposure part bearing in substrate P with providing tension for uniform cylinder The rotating cylinder DR5 of planar and 2 groups of driving reels DR6, DR7 etc. that regulation relaxation (gap) DL is paid to substrate P.
Moreover, being equipped in processing unit U3：Infiltration type cylinder light shield DM；It is located in cylinder light shield DM and will be formed in The lighting mechanism IU that the mask pattern of the peripheral surface of cylinder light shield DM is shone；With the aligming microscope AM1 of detection alignment mark etc., AM2, the alignment mark are that the picture of a part for the mask pattern in order to make cylinder light shield DM and substrate P are propped up with by rotating cylinder DR5 The opposite alignment (Alignment) of a part for holding the substrate P for cylinder planar is previously formed in substrate P.
Processing unit U4 is the photonasty functional layer relative to the substrate P moved from processing unit U3, carries out such as wet type At least one wet type processing device of various wet processeds as development treatment, electroless plating processing etc..It is filled in processing It sets in U4 and is equipped with along 3 treatment trough BT1, BT2 of Z-direction form a social stratum, BT3, multiple reels that substrate P warpage is transported, institute Driving reel DR8 of clamping etc..
Processing unit U5 is the substrate that the substrate P moved from processing unit U4 is heated and will be got wet by wet type flow The moisture amount of P is adjusted to the heating and drying device of specified value, but omits and illustrate.Then, by several processing units And the substrate P of the last processing unit Un by a series of flow, by the driving reel DR10 of clamping wound on recycling On roller RR2.In the winding, the center of the Y direction (width direction) of substrate P or the edge of substrate of Y direction will not be made Will not deviation in the Y-axis direction mode, by marginal position controller EPC2, sequentially Correction and Control driving reel DR10 with return Receive the relative position in the Y-axis direction of roller RR2.
In the device manufacturing system of above-mentioned Fig. 6, according to each processing unit U1, U2, U3, U4, U5 ... the processing of Un speed Degree, makes the processing unit polytenization that processing speed is slow and is set up in parallel more, also, cutting machine is arranged before the processing unit Structure CU10, and be arranged for putting into substrate to the selection injection mechanism ST1 of either one or two of multiple processing units.
In addition, after more slow processing units of processing speed, the multiple substrates that will be moved out from each processing unit are set The engaging mechanism PU10 engaged successively, even if as a result, in the case where implementing processing speed substantially different multiple processing successively, It will not be limited to the minimum processing step of processing speed, it is possible to realize the promotions of productivity.
In the case of production line shown in Fig. 6, the processing unit U2 heated strongly inhibits the conveyance of substrate P Speed, thereby, it is possible to reduce the volume of cavity portion HA1, HA2, correspondingly, having can cut down using electric power and can reduce The advantages of setting area of device.
On the other hand, in the tight preceding processing unit U1 of processing unit U2, photonasty functional liquid is patterned and is printed Situation on surface coated in substrate P is configured to, and using version body (intaglio plate or relief printing plate) reel of pattern printing, rolls up herein After photonasty functional liquid is applied on cylinder as ink, substrate P is made to be connected to edition body reel to transfer pattern.In this case, In order to keep the pattern transfer characteristics from version body reel to substrate P good, and must be with faster speed conveying substrate to a certain degree P。
In this way, in processing unit U1 and processing unit U2, desirable substrate conveyance is possible to according to device performance Speed (processing speed) is substantially different.Therefore, in this case, if processing unit U1 is set as the processing unit UA in Fig. 1, Make processing unit U2 polytenizations as processing unit UB1~UB3 in Fig. 1, then can construct efficiently and productivity is high Production line.
Here, illustrating based on model example shown in Fig. 7 and with reference to the sequence diagram of Fig. 8 (raw in the processing system of Fig. 1 before Producing line) in the case of, in the past based on the processing of single line compared with, can it is expected how many degree activity duration promoted.
Fig. 7 (a) expressions make processing unit UA, UB, UC for handling 3 steps A, B, C respectively respectively carry out single line for 1 The model example of the case where processing.Here, being wound with the substrate P that overall length is 1200m on supply roller RRA.In addition, each processing unit UA~UC assumes there is processing capacity below as the performance of device.That is, processing unit UA is with defeated with maximum 15cm/s The ability sent substrate P and handled, processing unit UB have with maximum 5cm/s conveying substrates P and the ability that is handled, place Reason unit UC has with maximum 15cm/s conveying substrates P and the ability that is handled.
In the case of this single line, the conveyance speed of the substrate P of production line entirety is with most slow processing unit UB's Speed 5cm/s is consistent, and the production operation time, (implementing the time that Overall Steps handle A, B, C to the substrate of 1200m) was as a result, 400 minutes (40 minutes 6 hours).
In contrast, Fig. 7 (b) indicates the model example of the production line of polytenization Fig. 1 as before.Each processing unit UA, UB (UB1~UB3), UC each performance be identical with the case where explanation in Fig. 7 (a).In the same manner as Fig. 1 before, make The processing unit UB polytenizations of processing step B are carried out, 3 unit UB1~UB3 are set, it will be including the cut-out after processing unit UA Time including cutoff process time in mechanism CU10 and sub- roller replacing construction based on selection injection mechanism ST1 etc. Be set as 3 minutes, by including in the engaging mechanism PU10 before processing unit UC the joining process time, with based on selection injection mechanism Time including sub- roller replacing construction of ST2 etc. is set as 3 minutes.
In addition, as shown in Fig. 7 (b), make the processing unit UB polytenizations that processing speed is slow, therefore, processing unit UA, UC are set It is set to the maximum speed 15cm/s to be ensured by respective performance to transport substrate P.
The sequence diagram of Fig. 8 is the activity duration for the model example for estimating Fig. 7 (b), makes production line S1, S2, S3 hypothetically with 3 A processing unit UB1~UB3 is corresponded to respectively to indicate the figure of each processing time.At the beginning of processing, from supply roller RRA's Substrate P is by processing unit UA processing, and still, substrate P is split in cutting mechanism CU10 by every the 1/3 of overall length 1200m.By This puts into as shown in production line S1 to the 1st 400m amount of the substrate of processing unit UA after with processing in about 44.4 minutes, Cutting mechanism CU10 passes through 3 minutes times, and is delivered to processing unit UB1.
The activity duration of the substrate P of processing unit UB1 processing 400m amounts is 133.3 minutes.Then, as defined preparation Time (installation etc. of sub- roller) and pass through about 3 minutes after, the substrate of the 1st 400m amount is put into processing unit UC, with transport Speed 15cm/s processing.The activity duration of the substrate of 400m amounts based on processing unit UC is 44.4 minutes.
In the process, as shown in production line S2, processing unit UA persistently carries out the 2nd 400m amount in about 44.4 minutes The processing of substrate as shown in production line S3, the 3rd is persistently then carried out to transport speed 15cm/s in about 44.4 minutes The processing of the substrate of 400m.The substrate of 2nd 400m amount is delivered to place after 3 minutes times based on cutting mechanism CU10 Unit UB2 is managed, about 133.3 minutes is consumed herein and is handled.
In processing unit UC, the processing of the substrate of the 1st 400m amount complete be from the beginning of time 228.1 minutes it Afterwards.But before this, the processing of the substrate of the 2nd 400m amount is completed by processing unit UB2, the substrate warp of the 2nd 400m amount By engaging mechanism PU10, selection injection mechanism ST2C, after about 3 minutes times, with the substrate of the 1st 400m amount Terminal part engages.
Then, processing unit UC constantly handles the 2nd engaged with the substrate of the 1st 400m to transport speed 15cm/s The substrate of 400m amounts.
Similarly, as shown in production line S3, the substrate by the 3rd (last) 400m amount after cutting mechanism CU10 cut-outs is complete After the processing in processing unit UA, put into processing unit UB3, after 133.3 minutes on sub- roller RRB32. The substrate of 3rd 400m amount also in processing unit UC, before the processing of the substrate of the 2nd 400m amount is completed, completes Processing in processing unit UB32.
During handling the substrate of the 2nd 400m amount by processing unit UC, the substrate of the 3rd 400m amount is via engagement Mechanism PU10, selection injection mechanism ST2C and after about 3 minutes times, the terminal with the substrate of the 2nd 400m amount Part engages.Then, processing unit UC constantly handles the engaged with the substrate of the 2nd 400m the 3rd to transport speed 15cm/s The substrate of a 400m amounts.
As described above, by making the unit polytenization of processing step B, and make the processing of the substrate P of 1200m amounts with 317 points Clock terminates for (17 minutes 5 hours).The situation improves about 20% compared with the model example that single line shown in Fig. 7 (a) is handled Activity duration (shortening of production time).
In the model example shown in Fig. 7 (b), although by the overall length of the substrate P on the supply roller RRA as female roller It is set as 1200m, still, even if for the length on herein, as long as carrying out the substrate in cutting mechanism CU10 with every 400m Segmentation, you can until making input continuously persistently be delivered to last processing step C to the substrate of production line.
In addition, in the model example shown in Fig. 7 (b), 3 processing units are operated with identical processing speed (5cm/s) UB1~UB3, but it is also possible in the range of can adjust, make the conveyance speed of the substrate in each unit UB1~UB3 only with Small quantity is different.
More than, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned examples.Upper It is an example to state each shape of each constituting portion material shown in example and combination etc., can be in the range not being detached from from the purport of the present invention It is interior, it is made various changes based on design requirement etc..
For example, in the above-described embodiment, being configured to be equipped with 3 processing unit UB1~UB3, but it is also possible to constitute For according to the ratio setting 2 of processing speed or setting 4 or more.
In addition, in the above-described embodiment, making the step polytenization of the part in the production line being made of single line.But It is, even if in step polytenization of the production line (production like products, same to category) from initial step to the end of script In the case of, it can also apply the above embodiment.
For example, in the case that the production line handled in single line as script Fig. 7 (a) is set side by side with 2, it can also Cutting mechanism CU10 (CU101, CU102) to be respectively set after 2 processing unit UA (UA1, UA2), by 2 works later Industry time low processing unit UB adds 3 conducts, 5 unit UB1~UB5 and then then 2 jointing machines are arranged in polytenization Then 2 processing unit UC (UC1, UC2) are arranged in structure PU10 (PU101, PU102).
In this composition so that by after any one cut-out of cutting mechanism CU101, CU102 unit length (such as Substrate 400m), the mode for being delivered to any one unit being available in 5 processing unit UB1~UB5 constitute selection input machine Structure ST2, and receive with engaging mechanism PU101, PU102 that treated is single by either one or two of 5 processing unit UB1~UB5 respectively The mode of the substrate of bit length (such as 400m) constitutes selection injection mechanism ST2.
In addition, in the processing of initial processing unit UA1, UA2, preferably, in order to make processing unit UA1 only with unit After length (such as 400m) handles the substrate from supply roller RRA, processing unit UA2 starts the substrate from supply roller RRA Processing, and intentionally pay the time difference.
So, it is possible to avoid 2 processing units UA1, UA2 it is each in and meanwhile the roller of female roller (RRA) is installed replaces and make Industry (the temporary interruption of production development), and each processing unit is made effectively to operate.
2nd embodiment
Hereinafter, illustrating the substrate board treatment of the present invention and the embodiment of substrate processing method using same with reference to Fig. 9 to Figure 25. In the present embodiment, it for inscape same as above-mentioned embodiment, marks identical reference numeral and is said Bright simplification or omission.
Fig. 9 is the device manufacturing system (flexible display production line) set as processing substrate for indicating present embodiment The figure that a part of SYS is constituted.Here, illustrating following example, that is, device manufacturing system SYS has installation supply roller the (the 1st Roller) the 1st mounting portion RS1 of RR1, the 2nd mounting portion RS2 (maintaining part) for installing supply roller (the 2nd roller) RR2, installation recycling roll (the 3 rollers) RR3 the 3rd mounting portion RS3 and install recycling roll (the 4th roller) RR4 the 4th mounting portion RS4, from supply roller RR1, RR2 Some flexible substrate P (piece, film etc.) drawn passes through the 1st splicer portion (substrate connection replacement mechanism) CSa, the 1st successively Processing unit U1, U2 of buffer gear BF1, n platform, U3, U4, U5 ... Un, the 2nd buffer gear BF2, the 2nd splicer portion (the 2nd base Plate connection replace mechanism) CSb and be wound in some of recycling roll RR3, RR4.
In addition, in the present embodiment, for being put into the 1st, the 2nd buffer gear BF1, BF2, place as processing substrate The substrate in device U1 ... Un is managed, is properly termed as substrate P to illustrate.For what is drawn from supply roller RR1, RR2 before input Substrate, properly termed as substrate P 1, P2 illustrate.For being based on after the processing of processing unit U1 ... Un by recycling roll RR3, RR4 The substrate of recycling is properly termed as substrate P 3, P4 to illustrate.
Host control device CONT (control unit, the 2nd control unit) plan as a whole control constitute reason device U1 everywhere in production line~ Un and the 1st, the 2nd splicer portion CSa, CSb, the 1st, the 2nd buffer gear BF1, BF2.In addition, host control device CONT controls The rotation for the motor drive shaft MT1 being mounted on supply roller RR1 in the 1st mounting portion RS1 drives and is installed in the 2nd mounting portion RS2 The rotation of motor drive shaft MT2 on supply roller RR2 drives.In addition, host control device CONT includes making substrate P 1 (the 1st substrate) Cutoff action and the 1st buffer gear BF1 (buffer gear) in substrate P 1 the connecting move control portion that interlocks of storage capacity.In addition, Host control device CONT includes the storage of the cutoff action and the substrate P in the 2nd buffer gear BF2 that make substrate P (processing substrate) The connecting move control portion that storage interlocks.
In addition, as shown in Figure 10, the supply of the substrate P 1 in detection supply roller RR1 is equipped near the 1st mounting portion RS1 The supply sensor S1 of situation.Sensor S1 is supplied at the end of detecting the supply of substrate P 1, to host control device CONT End of output signal.Similarly, the state of supply of the substrate P 2 in detection supply roller RR2 is equipped near the 2nd mounting portion RS2 Supply sensor S2.Supply sensor S2 is exported at the end of the supply for detecting substrate P 2 to host control device CONT End signal.
In fig.9, orthogonal coordinate system XYZ be set as substrate P surface (or back side) it is vertical with the faces XZ, with substrate P The orthogonal width direction of conveyance direction (long side direction) is set as Y direction.In addition, the substrate P is by before prespecified Processing and its surfaction is activated or subtle next door that precise pattern is formed on surface construct (concave-convex structure Make) substrate.
Figure 10 is the figure for the schematic configuration for indicating the 1st splicer portion CSa and the 1st buffer gear BF1.
1st splicer portion CSa will be from some base drawn and conveyed to the 1st buffer gear BF1 of supply roller RR1, RR2 Plate connection is changed to another substrate drawn from supply roller RR1, RR2, and with clamping driving reel NR1, cut-out engagement Unit CU1, CU2.In addition, the 1st splicer portion CSa (substrate connection replacement mechanism) has control unit, control unit control cut-out Action and joint action, so that when the front end of the substrate P 2 (the 2nd substrate) supplied from supply roller RR2 (the 2nd roller) to be bonded to After on the position of the terminal part for the substrate P 1 (the 1st substrate) cut off, substrate P 1 (the 1st substrate) is cut off.
Reel NR1 is under the control of host control device CONT for clamping driving, keeps substrate P 1 or substrate P 2 and to the 1st Buffer gear BF1 conveyings, or stop the conveying of substrate P, and configured in the Z-axis direction in the 1st mounting portion RS1 and the 2nd mounting portion The approximately mid way between of RS2.
Cut-out engagement unit CU1, CU2 with the position with the Z-direction from clamping driving reel NR1 by X/Y plane it is flat Centered on capable virtual joint surface VF1, symmetrically configured along Z-direction.Cut-out engagement unit CU1 with virtual joint surface VF1 There is absorption layer 1A, cutter 2A and tension reel 3A on the position faced.In addition, cut-out engagement unit CU1 pass through it is (not shown) Rotating mechanism cuts off by shown in solid the engagement unit CU2 bonding stations opposite with absorption layer 1A and as schemed in such as Figure 10 Moving in rotation (swing) between the position that is sticked opposite with the 1st mounting portion RS1 absorption layer 1A shown in double dot dash line in 10.And And cut-out engagement unit CU1, in bonding station, edge (is cut relative to virtual joint surface VF1 by mobile mechanism (not shown) Unit CU2 is closed in disconnecting) leave/close direction movement.Absorption layer 1A cut-out engagement unit CU1 be in bonding station when, with Cutter 2A is compared to configuration in the downstream side (+X-axis side) of the conveying direction of substrate P (substrate P 1).
Similarly, cut-out engagement unit CU2 has absorption layer 1B, cutter on the position faced with virtual joint surface VF1 2B and tension reel 3B.In addition, cut-out engages unit CU2 by rotating mechanism (not shown), by shown in solid in such as Figure 10 Ground cut-out engages the unit CU1 bonding stations opposite with absorption layer 1B and such as the absorption layer 1B shown in double dot dash line in Figure 10 Moving in rotation (swing) between the position that is sticked opposite with the 1st mounting portion RS2.Moreover, cut-out engagement unit CU2 is in engagement position Set, by mobile mechanism (not shown) along left relative to virtual joint surface VF1 (i.e. cut-out engagement unit CU1)/it is close It moves in direction.For absorption layer 1B when cut-out engagement unit CU2 is in bonding station, configuration is in substrate P (substrate compared with cutter 2B P2 the downstream side (+X-axis side) of conveying direction).
The movement of these cut-out engagement units CU1, CU2 are controlled by host control device CONT.
1st buffer gear BF1 configuration is between processing unit (processing mechanism) U1 and the 1st splicer portion CSa, and will be from The substrate P of 1st splicer portion CSa conveyings is sent out after temporarily being stored in defined longest storage range to processing unit U1, and With tension reel mechanism DR1 and clamping driving reel NR2.
Clamping driving reel NR2 keeps from the substrate P of the 1st buffer gear BF1 storages and is conveyed to processing unit U1, with Power drum mechanism built DR1 is compared by the configuration of the conveyance direction downstream side of substrate P in the Z axis roughly the same with clamping driving reel NR1 Position.
Tension reel mechanism DR1 is alternately arranged multiple upper layers volume that range is located opposite from top along X-direction Cylinder RJ1 and range are located opposite from the lower layer reel RK1 of lower section, and each reel RJ1, RK1 can be separately along Z Axis direction moves.The upper dead center position of the upper dead center position JU1 and lower dead point position JD1 and lower layer reel RK1 of upper layer reel RJ1 JU2 and lower dead point position JD2 compares the position for being set as top.These tension reel mechanisms are controlled by host control device CONT The action of DR1.
Figure 11 is the figure for the schematic configuration for indicating the 2nd splicer portion CSb and the 2nd buffer gear BF2.
2nd buffer gear BF2 configurations, will be from processing between processing unit (processing mechanism) Un and the 2nd splicer portion CSb The substrate P of device Un conveyings is sent out after temporarily being stored in defined longest storage range to the 2nd splicer portion CSb, and is had Clamping driving reel NR3 and tension reel mechanism DR2.
Tension reel mechanism DR2 is alternately arranged multiple upper layers volume that range is located opposite from top along X-direction Cylinder RJ2 and range are located opposite from the lower layer reel RK2 of lower section, and each reel RJ2, RK2 can be separately along Z Axis direction moves.The upper dead center position of the upper dead center position JU3 and lower dead point position JD3 and lower layer reel RK2 of upper layer reel RJ2 JU4 and lower dead point position JD4 compares the position for being set as top.These tension reel machines are controlled by host control device CONT The action of structure DR2.
2nd splicer portion CSb will be from the 2nd buffer gear BF2 conveyings and by some recycling of recycling roll RR3, RRR4 Substrate P connection is changed to another for being recycled to recycling roll RR3, RRR4, and single with clamping driving reel NR4, cut-out engagement First CU3, CU4.
Reel NR4 is under the control of host control device CONT for clamping driving, the base that will be conveyed from the 2nd buffer gear BF2 Plate P is towards cut-out engagement unit CU3, CU4 conveying or the conveying of stopping substrate P, and the position configuration of Z-direction is in the 3rd installation Portion RS3 is with the approximately mid way between of the 4th mounting portion RS4 and the position of the virtual joint surface VF2 parallel with X/Y plane.
Cut-out engagement unit CU3, CU4 are symmetrically configured centered on virtual joint surface VF2 along Z-direction.Cut-out connects Close unit CU3 has absorption layer 1C, cutter 2C and tension reel 3C on the position faced with virtual joint surface VF2.In addition, Unit CU3 is by rotating mechanism (not shown) for cut-out engagement, cuts off engagement unit CU4 by shown in solid in such as Figure 11 and inhales The opposite bonding stations of attached pad 1C, with such as patch opposite with the 3rd mounting portion RS3 absorption layer 1C shown in double dot dash line in Figure 11 If moving in rotation (swing) between position.Moreover, cut-out engagement unit CU3 passes through mobile mechanism (not shown) in bonding station And along left relative to virtual joint surface VF2 (i.e. cut-out engagement unit CU4)/close direction moves.
Absorption layer 1C is when cut-out engagement unit CU3 is located at bonding station, conveying of the configuration in substrate P compared with cutter 2C The upstream side (- X-axis side) in direction.
Similarly, cut-out engagement unit CU4 has absorption layer 1D, cutter on the position faced with virtual joint surface VF2 2D and tension reel 3D.In addition, cut-out engages unit CU4 by rotating mechanism (not shown), by shown in solid in such as Figure 11 Ground cut-out engages the unit CU3 bonding stations opposite with absorption layer 1D and such as the absorption layer 1D shown in double dot dash line in Figure 11 Moving in rotation (swing) between the position that is sticked opposite with the 4th mounting portion RS4.Moreover, cut-out engagement unit CU4 is in engagement position Set, by mobile mechanism (not shown) along left relative to virtual joint surface VF2 (i.e. cut-out engagement unit CU3)/it is close It moves in direction.For absorption layer 1D when cut-out engagement unit CU4 is in bonding station, configuration is in the defeated of substrate P compared with cutter 2D Send the upstream side (- X-axis side) in direction.
The movement of these cut-out engagement units CU3, CU4 are controlled by host control device CONT.
As shown in figure 11, in the 3rd mounting portion RS3, recycling reel RR3 is mounted on motor drive shaft MT3.In the 4th mounting portion In RS4, recycling reel RR4 is mounted on motor drive shaft MT4.The rotation driving and the rotation of motor drive shaft MT4 driving of motor drive shaft MT3 It is controlled by host control device CONT.
In addition, as shown in figure 11, near the 3rd mounting portion RS3, being equipped with the substrate P 3 in detection recycling reel RR3 The winding sensor S3 of winding situation.Winding sensor S3 is at the end of detecting the winding of substrate P 3, to host control device CONT end of output signals.Similarly, the volume of the substrate P 4 in detection recycling reel RR4 is equipped near the 4th mounting portion RS4 Around the winding sensor S4 of situation.Winding sensor S4 is at the end of the winding for detecting substrate P 4, to host control device CONT end of output signals.
There is front end to be connect with roller core and be bonded to substrate P 3 or substrate 4 in terminal part by recycling reel RR3, RR4 Introducing substrate (the 3rd substrate) PK (in fig. 11, the only substrate P K of diagram recycling reel RR4) of introducing.It, can as substrate P K Think material identical with the substrate P for carrying out the processing based on processing unit U1~Un, or roughly the same with substrate P Thickness and material difference.
The processing unit U5 of present embodiment is to heat the substrate P moved from processing unit U4, and will be because of wet type stream The moisture amount for the substrate P that journey is got wet is adjusted to specified value, or implements the crystallization of semi-conducting material or include metal nano The heating and drying device of the thermal annealing (200 ° or less) of the solvent removal of the ink of particle etc., but omit and illustrate.Then, It is temporarily stored up by the 2nd buffer gear BF2 by several processing units and by the substrate P of the last processing unit Un of a succession of flow It deposits, and replacement is suitably attached by the 2nd splicer portion CSb, and be wound to recycling roll RR3 or recycling roll RR4.
Next, the processing of the substrate P in 2 to Figure 19 device manufacturing system SYS to illustrate above-mentioned composition referring to Fig.1 In, the action of the 1st splicer portion CSa and the 1st buffer gear BF1.In addition, the various processing dress of constituent element manufacture system SYS Set, the action of constitution equipment etc. is controlled by host control device CONT, but in the following description, omit and filled about upper control Set the record that CONT is controlled.
Figure 12 is that the substrate P 1 drawn from supply roller RR1 drives volume via the reel 3A and clamping of cut-out engagement unit CU1 Cylinder NR1 and the figure for conveying to the 1st buffer gear BF1 as the 1st substrate and temporarily being stored in the 1st buffer gear BF1.Such as Figure 12 Shown, in the 1st buffer gear BF1, upper layer reel RJ1 is located at upper dead center position JU1, and lower layer reel RK1 is located at bottom dead centre position JD2 is set, substrate P is stored in the 1st buffer gear BF1 close to longest length as a result,.
In the 2nd mounting portion RS2, to be attached more when being wound in the case where the substrate P 1 of supply roller RR1 is used up After the supply roller RR2 for the substrate P 2 changed is mounted on motor drive shaft MT2, rotation cut-out engages unit CU2 and absorption layer 1B is made to move It moves to the position that is sticked.So that the front end of substrate P 2 is adsorbed (connection or connection) and is fixed on the absorption layer positioned at the position that is sticked Then 1B is sticked double faced adhesive tape T on the face of absorption side opposite side.
Absorption and being sticked of double faced adhesive tape T of the above-mentioned substrate P 2 to absorption layer 1B carry out by operator or use machine The progress such as tool hand.
It is sticked after the completion of thering is the substrate P 2 of double faced adhesive tape T to be fixed to the absorption of absorption layer 1B, as shown in figure 13, rotation cut-out It engages unit CU2 and substrate P 2 is made to be moved to bonding station, and driven by the rotation of motor drive shaft MT2 by make supply roller RR2 To the supplying party with substrate P 2, (being in fig. 13 direction of rotation counterclockwise) rotates in the opposite direction, pays as a result, substrate P 2 With defined tension.
On the other hand, after supply sensor S1 detects the supply of the substrate P 1 from supply roller RR1, stop clamping The driving of reel NR1 is driven, and motor drive shaft MT1 is made to rotate driving to the direction opposite with the conveying direction of substrate P 1, as a result, The substrate P 1 between reel NR1 and supply roller RR1 is driven to pay weak tension clamping.
After the driving of clamping driving reel NR1 stops, clamping driving reel NR2 also persistently drives.Therefore, tension reel Mechanism DR1 is acted, and driving with clamping driving reel NR2 accordingly, makes decline and the lower layer reel RK1 of upper layer reel RJ1 Rising suitably carries out.The substrate P being stored in as a result, in the 1st buffer gear BF1 drives reel NR2 to be filled to processing by clamping U1 is set persistently to convey with certain speed.
Next, as shown in figure 14, make cut-out engagement unit CU1, CU2 close direction movements to each other, it is double accompanying Substrate P 1, P2 are crimped on certain time between absorption layer 1A, 1B in the state of the adhesive tape T of face.Substrate P 2 is will be rear as a result, Continuous step is cut off as on the position of the terminal part of substrate P 1, is bonded and engages with substrate P 1 via double faced adhesive tape T.
In addition, during carrying out substrate P 1, the joining process of P2, clamping driving reel NR2 and tension reel mechanism DR1 also persistently drives, be stored in substrate P in the 1st buffer gear BF1 by clamping drive reel NR2 to processing unit U1 with Certain speed persistently conveys.
After substrate P 1 is engaged with substrate P 2, make the absorption layer 1B in cut-out engagement unit CU2 to atmosphere opening, then, As shown in figure 15, cut-out is made to engage unit CU2 to the direction (+Z-direction) movement left from cut-out engagement unit CU1.As a result, The front end for the substrate P 2 drawn from supply roller RR2 is in the shape by double faced adhesive tape T and the engagement of substrate P 1 (connection is connect) Under state, absorption is maintained on the absorption layer 1A of cut-out engagement unit CU1.
Then, in the state of paying tension to substrate P 1 between cut-out engages unit CU1 and supply roller RR1, by cutting The cutter 2A in unit CU1 is closed in disconnecting, and opposite substrate P 1 is cut off.As cutter 2A, can use for example by making point of a knife The composition for cutting off substrate P 1 along width direction (Y direction) sliding of substrate P 1.
During carrying out the cutoff process of substrate P 1, clamping driving reel NR2 and tension reel mechanism DR1 also continues Driving, the substrate P being stored in the 1st buffer gear BF1 drive reel NR2 to be held to processing unit U1 with certain speed by clamping Continuous conveying.
After substrate P 1 is cut off, make the absorption layer 1A in cut-out engagement unit CU1 to atmosphere opening, then, such as Figure 16 institutes Show, so that cut-out is engaged unit CU1 and moved to from the direction (- Z-direction) that cut-out engagement unit CU2 (virtual joint surface VF1) leaves It is dynamic.The substrate P 1 drawn as a result, from supply roller RR1 using the conveying direction with supply roller RR1 as the rotation of opposite direction wound on On supply roller RR1.
In addition, about supply roller RR2, by the torque with the conveying direction of supply roller RR2 for opposite direction, substrate P 2 exists Tension is paid between rotating roller RR2 and clamping driving reel NR1 (and reel 3B).As a result, be stored in the 1st buffer gear The substrate of substrate P connection in BF1 is switched to the substrate P 2 as the 2nd substrate drawn from supply roller RR2.As the 2nd substrate Substrate P 2 can also have the specification same with substrate P 1 (the 1st substrate).
Then, clamping driving reel NR1 is rotated with the speed slightly faster than clamping driving reel NR2, in tension reel mechanism In DR1, as shown in figure 17, the driving with clamping driving reel NR1 accordingly makes rising and the lower layer's reel of upper layer reel RJ1 The decline of RK1 suitably carries out.In addition, driving by making motor drive shaft MT2 rotate to conveying direction, and make to draw from supply roller RR2 The substrate P 2 gone out is admitted to, and the storage length of the substrate P in the 1st buffer gear BF1 is made to increase.
Moreover, after the storage length of the substrate P in the 1st buffer gear BF1 becomes substantially maximum, clamping driving reel NR1 is rotated with speed identical with clamping driving reel NR2, and the storage length of the substrate P in the 1st buffer gear BF1 is equal as a result, Weighing apparatus.In addition, the supply roller RR1 that substrate P 1 is substantially used up removes (can dismount) from the 1st mounting portion RS1, and as shown in figure 18, installation It is wound with other supply roller RR5 of substrate P 5.
After installing supply roller RR5, based on the testing result of supply sensor S2, the substrate P 2 in supply roller RR2 is used Before to the greatest extent, as shown in figure 18, rotation cut-out engages unit CU1 and absorption layer 1A is made to be moved to the position that is sticked.Before making substrate P 5 End is adsorbed and fixes (connection or connection) on the absorption layer 1A positioned at the position that is sticked, then, with absorption side opposite one Be sticked double faced adhesive tape T on the face of side.
Then, it is driven by the rotation of motor drive shaft MT1 by makes supply roller RR5 to the side opposite with the direction of the supply of substrate P 5 It is rotated to (being in figure 18 direction of rotation counterclockwise), defined tension is paid to substrate P 5 as a result, while keeping cut-out engagement single First CU1 rotations, as shown in figure 19, are moved to bonding station.
Moreover, after the supply of the substrate P 2 in supply sensor S2 detection supply rollers RR2, stop clamping driving volume The driving of cylinder NR1 makes cut-out engagement unit CU1, CU2 close direction movement to each other and in the same manner as above-mentioned steps, Accompanying makes substrate P 2, P5 certain times be crimped between absorption layer 1A, 1B in the state of double faced adhesive tape T, then, is connect by cut-out The cutter 2B closed in unit CU2 cuts off substrate P 2.The substrate being connect as a result, with the substrate P being stored in the 1st buffer gear BF1 It is switched to the substrate P 5 drawn from supply roller RR5.
In this way, coating processing, the processing of photonasty functional liquid of the substrate P switched successively in implementing processing unit U1 Pattern exposure processing in heat treatment, processing unit U3 in device U2, the wet processed in processing unit U4 and processing dress After setting the heat drying processing in U5, it is delivered to the 2nd buffer gear BF2, the 2nd splicer portion CSb successively, and be recycled to recycling Roller RR3 or recycling roll RR4.
Next, the processing of the substrate P in illustrating the device manufacturing system SYS of above-mentioned composition with reference to Figure 20 to Figure 25 In, the 2nd splicer portion CSb of recycling roll side and the action of the 2nd buffer gear BF2.
Figure 20 is that processing substrate i.e. substrate P is delivered to the 2nd buffer gear BF2 via clamping driving reel NR3 and stores, from 2nd buffer gear BF2 conveys the substrate P of (discharge) via the reel of cut-out engagement unit CU3 via clamping driving reel NR4 3C is recycled to the figure on the recycling roll RR3 of the 3rd mounting portion RS3.In addition, as shown in figure 20, in the 2nd buffer gear BF2 In, upper layer reel RJ2 is located at lower dead point position JD3, and lower layer reel RK2 is located at upper dead center position JU4, and substrate P is with close as a result, It is stored in the 2nd buffer gear BF2 in shortest length.
In the 4th mounting portion RS4, after the completion of the winding recycling of recycling roll RR3, by the recycling roll RR4 peaces of substrate P recycling On motor drive shaft MT4, then, rotation cut-out engages unit CU4 and absorption layer 1D is made to be moved to the position that is sticked.Make front end with The terminal part of the introducing substrate P K (hereinafter simply referred to as substrate P K) of recycling roll RR4 connections adsorbs and fixes (connection or connection) On the absorption layer 1D positioned at the position that is sticked, then, it is sticked double faced adhesive tape T on the face of absorption side opposite side.When in base It is sticked on plate PK after double faced adhesive tape T, makes cut-out engagement unit CU4 rotations and be moved to bonding station, and pass through motor drive shaft MT4 Rotation driving and make direction of recession (in fig. 20 be clockwise) rotations of the recycling roll RR4 to substrate P K (substrate P), by This, defined tension is paid to substrate P K.
Moreover, after the recycling of substrate P of the winding sensor S3 detections based on recycling roll RR3, stop clamping driving The driving of reel NR4, and tension reel mechanism DR2 is made to act, make under rising and the lower layer reel RK2 of upper layer reel RJ2 Drop suitably carries out.Make to pass through the substrate P of clamping driving reel NR3 conveyings in the 2nd buffer from processing unit U5 on one side as a result, Storage length in structure BF2 is increased on one side with a certain amount of (conveying capacity corresponding with the conveyance speed of the substrate P in production line) It is stored.
On the other hand, after the recycling of the substrate P based on recycling roll RR3, as shown in figure 21, cut-out is made to engage unit CU3, CU4 close direction movement to each other, make substrate P, PK certain times be crimped on suction in the state of accompanying double faced adhesive tape T Between attached pad 1C, 1D.As a result, the terminal part of substrate P K when substrate P is cut off in subsequent step as on the position of front end, It is bonded with substrate P via double faced adhesive tape T and engages (connection is connect).
After substrate P is engaged with substrate P K, make the absorption layer 1D in cut-out engagement unit CU4 to atmosphere opening, then, such as Shown in Figure 22, cut-out is made to engage unit CU4 to the direction (+Z-direction) movement left from cut-out engagement unit CU3.Base as a result, In the state of being engaged with substrate P by double faced adhesive tape T, absorption is maintained at the suction of cut-out engagement unit CU3 for the front end of plate PK On attached pad 1C.
Then, in the state of paying tension to substrate P between cut-out engages unit CU3 and recycling roll RR3, pass through cut-out The cutter 2C in unit CU3 is engaged, opposite substrate P is cut off.After substrate P is cut off, make the suction in cut-out engagement unit CU3 Attached pad 1C is to atmosphere opening, then, as shown in figure 23, so that cut-out is engaged unit CU3 and engages the side that unit CU4 leaves to from cut-out It is mobile to (- Z-direction).The substrate P conveyed as a result, from the 2nd buffer gear BF2 in processing unit U1~Un (that is, carry out The substrate P of processing) recycle object be switched to recycling roll RR4.
During the joining process and cutoff process in carrying out the 2nd above-mentioned splicer portion CSb, also suitably carry out The rising of upper layer reel RJ2 in 2nd buffer gear BF2 and the decline of lower layer reel RK2, make to pass through from processing unit U5 on one side Storage length of the substrate P of clamping driving reel NR3 conveyings in the 2nd buffer gear BF2 is stored up on one side with a certain amount of increase It deposits.
Moreover, after the completion of to the switching of the recycle object of the substrate P of recycling roll RR4, clamping driving reel NR4 is with than clamping Drive the speed rotation that reel NR3 is slightly fast, in tension reel mechanism DR2, the driving with clamping driving reel NR4 accordingly, The rising of the decline and lower layer reel RK2 that make upper layer reel RJ2 suitably carries out, the joining process in the 2nd splicer portion CSb And during cutoff process, the length for the substrate P being stored in the 2nd buffer gear BF2 is made to reduce, and as in initial stage shape The substantially minimum storage length of state (with reference to Figure 24).When the length for the substrate P being stored in the 2nd buffer gear BF2 becomes substantially After minimum, clamping driving reel NR4 is made to be rotated with speed identical with clamping driving reel NR3.
On the other hand, in the 3rd mounting portion RS3 of the recycling for completing substrate P, recycling roll RR3 is removed, such as Figure 24 institutes Show that connection (connection or engagement) is had to the recycling roll RR6 peaces for the front end for introducing substrate P K2 (hereinafter simply referred to as substrate P K2) On motor drive shaft MT3, and so that the terminal part of substrate P K2 is adsorbed and be fixed on the cut-out engagement unit for turning to the position that is sticked On the absorption layer 1C of CU3, then, it is sticked double faced adhesive tape T on the face of absorption side opposite side.
When be sticked on substrate P K2 double faced adhesive tape T after, make cut-out engagement unit CU3 rotations and be moved to bonding station, and And by the rotation of motor drive shaft MT3 drives make recycling roll RR6 to the direction of recession of substrate P K2 (substrate P) (be suitable in fig. 25 Clockwise) rotation, it is standby until being based on winding sensor S4 as a result, as defined in being paid to substrate P K2 in the state of tension Recycling roll RR3 recycling terminate detection until.
As described above, in the present embodiment, substrate P is temporarily being stored from the 1st buffer gear BF1 and to place During managing device U1 conveyings, substrate P connection is changed to the substrate P 2 drawn from new supply roller RR2, and buffer to the 1st Mechanism BF1 is conveyed.Therefore, it is possible to not stop based on ground is managed everywhere in processing unit U1~Un, change becomes the roller of supply source.Cause This can be avoided the change moment in supply roller from putting into the substrate P of processing unit U1~Un and be wasted in the present embodiment And the case where causing cost to increase.
Moreover, in the present embodiment, the substrate P conveyed from processing unit Un is temporarily being stored up by the 2nd buffer gear BF2 During depositing, switch the recycle object of substrate.Therefore, it when changing the recycle object of substrate P, can also avoid in change The case where substrate P for carving input to processing unit U1~Un is wasted and cost is caused to increase.
In addition, in the present embodiment, in the 1st splicer portion CSa and the 2nd splicer portion CSb, new substrate is engaged After on used substrate before, substrate before is cut off.Therefore, not will produce formerly execute cut-out in the case of because The tension paid and the defect for causing substrate to detach and interfere engagement etc. in cut-out, can implement stable processing substrate.
More than, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned examples.Upper It is only an example to state each shape of each constituting portion material shown in example and combination etc., can be in the model not being detached from from the purport of the present invention It is made various changes based on design requirement etc. in enclosing.
For example, in the above-described embodiment, listing processing mechanism has the composition of multiple processing unit U1~Un.But It is that it's not limited to that, can also be configured to, above-mentioned substrate connection is equipped in a processing unit and replaces mechanism.
In addition, being configured in the above-described embodiment, in addition there is the recycling roll for being connected with and introducing substrate P K.But example Such as, it can also be configured to, use the supply roller having been used by and the substrate of front end is cut-off.
In addition, in the above-described embodiment, being configured to, 2 roller mounting portions are respectively provided in supply side and recycling side.But It is the roller mounting portion that can also be respectively provided with 3 or more.
In the above-described embodiment, it before the substrate supplied from a side of 2 supply rollers becomes roller terminal, automatically connects Substrate from other rollers, thereby, it is possible to persistently be handled with not stopping production line.If but in the somewhere of production line, making Make to generate defect in the pattern on substrate, or generate the unfavorable condition of manufacturing device, then worries that a large amount of defective products can be made.
Accordingly it is also possible to be constituted for following production line (factory), that is, will in the production line before final products completion Multiple steps that flow is executed with the state of strip substrate are divided into several blocks, in each block, carry out based on roll-to-roll Continuous processing, in next step block, the roller unit to be wound with the substrate to form semi-finished product is transported, and is mounted on rule On fixed mounting portion (RS1 or RS2).In this case, substrate conveyance can continuously be carried out with step block unit, even if In the case of problem (pattern defect or device defect etc.) has occurred in some step block, the step block is only made temporarily to stop Only, a large amount of generations of defective products can be reduced.
In addition, in the above-described embodiment, supply roller RR1, RR2 being separately mounted on 2 mounting portions RS1, RS2, It is wound with the plate shape substrates of product manufacturing with equal length amount, terminates (roller end in the substrate supply from a supply roller RR1 End) it is tight before, connection is changed to the substrate of another supply roller RR2, and persistently handles until the substrate of supply roller RR2 is used up. However, it is possible to for following application method, that is, the supply roller on one of mounting portion RS1, RS2 will only become During another supply roller of roller terminal is changed to new roller, to processing unit U1~Un sustainable supply substrates.
In this case, for example, being set as supply roller will roller terminal become as RR2, by roller RR2 from mounting portion RS2 It removes, new supply roller is installed to mounting portion RS2, until the engagement on the 1st splicer portion CSa is ready to complete state (Figure 13 State) until time be set as 180 seconds, then in this process, when the conveying speed of the substrate in processing is set as 50mm/ When the second, the length put into from another supply roller RR1 to the substrate (P1) in processing unit U1 (production line) is 9m.
Accordingly it is also possible to be after the substrate (P1) of the 9m amounts is supplied from another supply roller RR1, to be connect immediately by the 1st Band device portion CSa, future new supply roller RR2 of the self installation on mounting portion RS2 substrate (P2) front end, engagement (connection or Person connects) it is cut in the position for only putting into the substantially substrate of 9m (P1) from supply roller RR1 to processing unit U1, and by the substrate (P1) Disconnected, connection is changed to the substrate (P2) from supply roller RR2.
In addition, as described above, will be utilized as temporarily from the substrate (P1) for the supply roller RR1 being seated on mounting portion RS1 In the case of when property connecting substrate (for example, about 9m amounts), about the processing carried out to the substrate (P1), each processing dress can be set as It sets the conditional decision of U1~Un or guide's processing of maintenance management, the element formed herein is used not as final products.
Furthermore, it is also possible to be, it, need not be by the base in the case where being utilized as temporary connecting substrate (for example, about 9m amounts) Plate (P1) is wound to supply roller RR1, such as is taken care of in chest etc., from this after piece leaf formula substrate for being cut to 10m length is folded It takes out to 1 piece of chest substrate (10m) and supplies to the 1st splicer portion CSa.
In addition, the technical scope of the present invention is not limited to above-mentioned each embodiment.For example, the respective embodiments described above institute 1 or more of the element of explanation has the case where omission.In addition, the element illustrated by the respective embodiments described above can be appropriately combined.
Reference sign
The 1st buffer gears of BF1 ... (the 1st buffer part, buffer gear), the 2nd buffer gears of BF2 ... (the 2nd buffer part), The 1st splicer portions CSa ... (substrate connection replacement mechanism), the 2nd splicer portions CSb ... (the 2nd substrate connection replaces mechanism), CU ... Cutting mechanism, FS ... substrates, P ... substrates, PK, PK2 ... introduce substrate (the 3rd substrate), PU10 ... engaging mechanisms, RR1 ... supplies Roller (the 1st roller), RR2 ... supply rollers (the 2nd roller), RR3 ... recycling rolls (the 3rd roller), RR4 ... recycling rolls (the 4th roller), RS1 ... the 1st pacify Dress portion, the 2nd mounting portions of RS2 ..., the 3rd mounting portions of RS3 ..., the 4th mounting portions of RS4 ..., ST ... select injection mechanism, SYS ... elements Manufacture system (substrate board treatment), UA, UB, UB1~UB3, UC ... processing unit, U1~Un ... processing unit (processors Structure).

Claims (5)

1. a kind of cutting mechanism, which is characterized in that
In order to which the substrate for utilizing the 1st processing unit to implement treated strip is delivered to and the 1st processing unit successively Multiple 2nd processing units slower compared to processing speed each and implement to post-process, the cutting mechanism has：
Cutting portion, only to be implemented described in processing cut-out later to specific length by the 1st processing unit in the substrate The mode of substrate is arranged after the 1st processing unit；With
Buffer part is arranged between the 1st processing unit and the cutting portion, enable the storage capacity of the substrate according to Implemented the computed carrier amount on the long side direction of the substrate of processing by the 1st processing unit and change, and adjusts described in The computed carrier amount of the substrate of cutting portion conveyance.
2. cutting mechanism according to claim 1, which is characterized in that also have the action for making the cutting portion to delay with described Rush the connecting move control portion that the storage capacity of the substrate in portion interlocks.
3. a kind of engaging mechanism, which is characterized in that
In order to will utilize each substrate for implementing treated strip of multiple 1st processing units be delivered to successively with it is described 1st processing unit is compared to faster 2nd processing unit of processing speed and implements to post-process, and the engaging mechanism has：Joint portion, It by either one or two of multiple described 1st processing units will be implemented front end and the quilt of the substrate of treated specific length The mode that 2nd processing unit implements the terminal part engagement of the substrate of processing is arranged before the 2nd processing unit；With
Buffer part is arranged between the 2nd processing unit and the joint portion, makes the storage on the long side direction of the substrate Storage can change according to the computed carrier amount for the substrate for being implemented processing by the 2nd processing unit, and adjustment connects from described Conjunction portion puts into the computed carrier amount of the substrate to the 2nd processing unit.
4. a kind of cut-out engagement device is configured at side and the plate shape substrates of strip is downstream handled list from upstream side processing unit Member is cut off the plate shape substrates, or will be other along the production line that predetermined processing is implemented in long side direction conveyance side to it Plate shape substrates are engaged with the plate shape substrates, and the cut-out engagement device is characterized in that having：
Buffer gear configures between the upstream side processing unit and the downstream side processing unit, what storage was transported The plate shape substrates simultaneously can be such that the length on its long side direction changes in defined longest storage range；Cut off jointing machine Structure is equipped with the cut-out that the plate shape substrates are cut off on the long side direction along the conveyance direction of the plate shape substrates side by side Portion and the joint portion for engaging other plate shape substrates with the end on the long side direction of the plate shape substrates, the cut-out Combining mechanism can be set to the sheet for moving in side and the buffer gear of the plate shape substrates of the buffer gear The one party for moving out side of substrate；With
Control unit, in the processing speed of the downstream side processing unit compared with the processing speed of the upstream side processing unit In the case of slower, the side of moving in of the buffer gear is set in the downstream side of the upstream side processing unit, and described The cut-out engaging mechanism is arranged in the side that moves out of buffer gear, and the control unit is controlled in such a way：At described After shape substrate only implements processing by the upstream side processing unit to specific length, described is cut off using the cutting portion Shape substrate,
In the faster feelings of processing speed of the downstream side processing unit compared with the processing speed of the upstream side processing unit Under condition, the side that moves out of the buffer gear is set in the upstream side of the downstream side processing unit, and in the buffer gear Side of moving in the cut-out engaging mechanism is set, the control unit is controlled in such a way：It will using the joint portion Implemented by the upstream side processing unit front ends of the plate shape substrates of treated specific length with by the downstream side Processing unit implements the terminal part engagement of the plate shape substrates of processing.
5. cut-out engagement device according to claim 4, which is characterized in that
The conveyance of the plate shape substrates when control unit makes the cutoff action in the cutting portion stops or the joint portion In joint action when the conveyances of the plate shape substrates stop, storage with the plate shape substrates in the buffer gear is dynamic It interlocks.
CN201510795438.8A 2012-05-23 2013-04-09 Cutting mechanism, engaging mechanism and cut-out engagement device Active CN105479737B (en)

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US201261650712P 2012-05-23 2012-05-23
US61/650,712 2012-05-23
US201261654500P 2012-06-01 2012-06-01
US61/654,500 2012-06-01
CN201380025725.XA CN104303110B (en) 2012-05-23 2013-04-09 Shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same

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