JP7064885B2 - Board gripping mechanism, board transfer device and board processing system - Google Patents

Board gripping mechanism, board transfer device and board processing system Download PDF

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JP7064885B2
JP7064885B2 JP2018000861A JP2018000861A JP7064885B2 JP 7064885 B2 JP7064885 B2 JP 7064885B2 JP 2018000861 A JP2018000861 A JP 2018000861A JP 2018000861 A JP2018000861 A JP 2018000861A JP 7064885 B2 JP7064885 B2 JP 7064885B2
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sensor
substrate
gripping mechanism
wafer
state
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JP2019121697A (en
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公宏 堂込
圭祐 近藤
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0253—Gripping heads and other end effectors servo-actuated comprising parallel grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/905—Control arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Description

本発明は、基板を搬送するために該基板を把持する基板把持機構、基板搬送装置及び基板処理システムに関する。 The present invention relates to a substrate gripping mechanism, a substrate transfer device, and a substrate processing system that grips a substrate in order to convey the substrate.

半導体デバイスや液晶表示装置等のフラットパネルの製造工程においては、半導体ウェハ（以下、「ウェハ」という。）やガラス基板といった基板は、基板搬送容器に収納された上で基板処理システムの搬入ポートに搬入される。そして、上記基板は、基板処理システムの基板搬送装置により基板搬送容器から取り出され、該基板処理システムの処理装置に搬送され、所定の処理が行われる。 In the manufacturing process of flat panels such as semiconductor devices and liquid crystal displays, substrates such as semiconductor wafers (hereinafter referred to as "wafers") and glass substrates are stored in a substrate transfer container and then used as a carry-in port for a substrate processing system. It will be carried in. Then, the substrate is taken out from the substrate transfer container by the substrate transfer device of the substrate processing system, and is transferred to the processing device of the substrate processing system to perform a predetermined process.

上述の基板搬送装置として、基板の搬送の際に基板の縁部を保持する基板把持機構を有するものが知られている（特許文献１参照）。
特許文献１の基板把持機構は、基板の先端側の縁部と係合する固定クランプ部と、基板を間にして上記固定クランプ部と対向する位置に可動式で設けられた可動クランプ部とで基板を把持するものであり、上記可動クランプ部を往復運動させるクランプシリンダを有する。上記クランプシリンダには、クランプ原点確認オートスイッチと基板クランプ位置確認オートスイッチとが装着されている。特許文献１の基板把持機構では、上述のスイッチにより、可動クランプ部の位置として、移動前の位置である原点位置と、固定クランプ部との間で基板を把持する位置である把持位置と、を確認できるようになっている。また、特許文献１の基板把持機構では、可動クランプ部が上記把持位置を超えた所定の位置であるオーバーストローク位置も可動クランプ部の位置として確認している。 As the above-mentioned substrate transfer device, a device having a substrate gripping mechanism for holding an edge portion of the substrate when the substrate is transported is known (see Patent Document 1).
The substrate gripping mechanism of Patent Document 1 is composed of a fixed clamp portion that engages with an edge portion on the tip end side of the substrate and a movable clamp portion that is movably provided at a position facing the fixed clamp portion with the substrate in between. It grips the substrate and has a clamp cylinder that reciprocates the movable clamp portion. The clamp cylinder is equipped with a clamp origin confirmation auto switch and a board clamp position confirmation auto switch. In the substrate gripping mechanism of Patent Document 1, the position of the movable clamp portion is set to the origin position which is the position before movement and the gripping position which is the position where the substrate is gripped between the fixed clamp portions by the above-mentioned switch. You can check it. Further, in the substrate gripping mechanism of Patent Document 1, the overstroke position, which is a predetermined position where the movable clamp portion exceeds the gripping position, is also confirmed as the position of the movable clamp portion.

特開２００２－１３４５８６号公報Japanese Unexamined Patent Publication No. 2002-134586

ところで、基板搬送の際、基板把持機構の状態として、可動クランプ部が原点位置にある開状態、可動クランプ部が把持位置にあり基板を把持している把持状態、基板を把持できずに可動クランプ部が把持位置を通り越したオーバーストローク位置にある空振り状態の他に、可動クランプ部が原点位置と把持位置との間で移動している動作中状態についても正確に認識することができるとよい。なぜならば、基板把持機構が上記動作中状態であることを正確に認識することができれば、例えば、当該基板把持機構を有する基板搬送装置と他の装置との間での基板の受け渡し動作を、把持状態から開状態に移行してからではなく、動作中状態から開始することができるため、スループットを向上させることができるからである。 By the way, when transporting a substrate, the state of the substrate gripping mechanism is an open state in which the movable clamp portion is in the origin position, a gripping state in which the movable clamp portion is in the gripping position and grips the substrate, and a movable clamp in which the substrate cannot be gripped. In addition to the idle swing state in which the portion is in the overstroke position past the gripping position, it is preferable to be able to accurately recognize the operating state in which the movable clamp portion is moving between the origin position and the gripping position. This is because, if it is possible to accurately recognize that the board gripping mechanism is in the operating state, for example, the board transfer operation between the board transfer device having the board gripping mechanism and another device can be gripped. This is because the throughput can be improved because it is possible to start from the operating state instead of shifting from the state to the open state.

特許文献１の基板把持機構と同じ構造を採用することにより、上記動作中状態を推定することはできる。例えば、基板把持機構が把持状態であるときにおいて、開状態となるように可動クランプ部の動作を開始させる信号を送出してから所定時間経過すれば、動作中状態に移行していると推定することができる。しかし、この方法では、正確に動作中状態を認識することはできない。動作中状態を正確に認識できないと、例えば、基板の受け渡し動作を開始したときに、基板把持機構の状態が推定された状態と異なり動作中状態ではなく把持状態のままであった場合、基板が落下したり基板にキズがついたりする等の問題が生じる。 By adopting the same structure as the substrate gripping mechanism of Patent Document 1, the operating state can be estimated. For example, when the substrate gripping mechanism is in the gripping state, it is presumed that the operation shifts to the operating state if a predetermined time elapses after sending a signal for starting the operation of the movable clamp portion so as to be in the open state. be able to. However, with this method, it is not possible to accurately recognize the operating state. If the operating state cannot be accurately recognized, for example, when the transfer operation of the board is started, the board is not in the operating state but in the gripped state unlike the estimated state of the board gripping mechanism. Problems such as dropping or scratching the board occur.

また、より多くのセンサ、例えば４つのセンサを基板把持機構に設ければ、上述の開状態、把持状態、空振り状態、動作中状態の４つの状態を正確に認識することはできる。しかし、基板搬送装置内で基板搬送機構を実装可能な空間は限られており、多くのセンサを設けることはできない。 Further, if more sensors, for example, four sensors are provided in the substrate gripping mechanism, the above-mentioned four states of open state, gripping state, idle swinging state, and operating state can be accurately recognized. However, the space in which the board transfer mechanism can be mounted is limited in the board transfer device, and many sensors cannot be provided.

本発明は、上記事情に鑑みてなされたものであり、開状態、把持状態、空振り状態、動作中状態の４つの状態を少ない部品点数で正確に認識することが可能な基板把持機構、基板搬送装置及び基板処理システムを提供することを目的とする。 The present invention has been made in view of the above circumstances, and is a substrate gripping mechanism and a substrate transport capable of accurately recognizing four states of an open state, a gripping state, an idle swing state, and an operating state with a small number of parts. It is an object of the present invention to provide an apparatus and a substrate processing system.

上記課題を解決する本発明は、基板の縁部と係合する固定クランプ部と、進退駆動部により前記固定クランプ部に対して進退動する可動クランプ部との間で基板を把持する基板把持機構であって、前記可動クランプ部と連動して動く連動部材と、第１の検知領域を有すると共に、該第１の検知領域に前記連動部材が存在するか否かを検知する第１のセンサと、第２の検知領域を有すると共に、該第２の検知領域に前記連動部材が存在するか否かを検知する第２のセンサと、を備え、前記連動部材は、前記可動クランプ部の進退方向に連なる第１～第４の部分を有し、前記連動部材は、前記可動クランプ部の進退方向に沿って延在する中心領域を備え、前記中心領域を間に挟んで一方側に前記第１のセンサ及び前記第１の検知領域が位置し、他方側に前記第２のセンサ及び前記第２の検知領域が位置し、前記第１～第４の部分は、互いに異なる形状を有すると共に第１～第４の形状のいずれかを有し、前記第１の形状は、前記一方側にのみ延び出した形状、前記第２の形状は、前記他方側にのみ延び出した形状、前記第３の形状は、前記一方側及び前記他方側のいずれにも延び出さない形状、前記第４の形状は、前記一方側及び前記他方側の両方に延び出す形状を有する。 The present invention that solves the above problems has a substrate gripping mechanism that grips a substrate between a fixed clamp portion that engages with an edge portion of the substrate and a movable clamp portion that advances and retreats with respect to the fixed clamp portion by an advance / retreat drive portion. The interlocking member that moves in conjunction with the movable clamp portion, and the first sensor that has a first detection area and detects whether or not the interlocking member exists in the first detection area. , A second sensor that has a second detection area and detects whether or not the interlocking member is present in the second detection area, and the interlocking member advances and retreats the movable clamp portion. The interlocking member has first to fourth portions connected in a direction, and the interlocking member includes a central region extending along the advancing / retreating direction of the movable clamp portion, and the first portion is sandwiched between the central regions. The sensor 1 and the first detection region are located, the second sensor and the second detection region are located on the other side, and the first to fourth portions have different shapes and the first It has one of the first to fourth shapes, the first shape is a shape extending only to the one side, the second shape is a shape extending only to the other side, and the third shape. The shape of is a shape that does not extend to either the one side or the other side, and the fourth shape has a shape that extends to both the one side and the other side .

本発明によれば、可動クランプ部と連動する連動部材における可動クランプ部の進退方向に連なる第１～第４の部分それぞれが、第１のセンサ及び第２のセンサによる検知状態が互いに異なる形状を有するため、認識すべき基板把持機構の４つの状態それぞれと、当該状態のときに第１のセンサ及び第２のセンサの検知領域上に位置する連動部材の部分（上記第１～第４の部分のいずれか）とを対応づけておくことで、第１のセンサ及び第２のセンサでの検知結果に基づいて、基板把持機構の４つの状態を正確に認識することができる。また、上記４つの状態の認識に必要なセンサの数は２つと少ないため、本発明の基板把持機構は、部品を搭載可能な領域が小さい基板搬送装置にも搭載することができる。 According to the present invention, each of the first to fourth portions connected in the advancing / retreating direction of the movable clamp portion in the interlocking member interlocking with the movable clamp portion has a shape in which the detection states by the first sensor and the second sensor are different from each other. Therefore, each of the four states of the substrate gripping mechanism to be recognized and the part of the interlocking member located on the detection area of the first sensor and the second sensor in the state (the first to fourth parts described above). By associating with any of the above), the four states of the substrate gripping mechanism can be accurately recognized based on the detection results of the first sensor and the second sensor. Further, since the number of sensors required for recognizing the above four states is as small as two, the board gripping mechanism of the present invention can be mounted on a board transfer device having a small area on which components can be mounted.

前記第１のセンサ及び前記第２のセンサは、非接触型のセンサであってもよい。 The first sensor and the second sensor may be non-contact type sensors.

別の観点による本発明は、上記基板把持機構と、該基板把持機構を制御する制御部とを備え、該制御部は、前記第１のセンサ及び前記第２のセンサでの検知結果に基づいて、前記基板把持機構の状態を判定することを特徴としている。 The present invention from another viewpoint includes the substrate gripping mechanism and a control unit that controls the substrate gripping mechanism, and the control unit is based on the detection results of the first sensor and the second sensor. It is characterized in that the state of the substrate gripping mechanism is determined.

前記制御部は、前記基板把持機構の状態が、開状態、動作中状態、把持状態、及び空振り状態のいずれであるかを判定してもよい。 The control unit may determine whether the state of the substrate gripping mechanism is an open state, an operating state, a gripping state, or a swinging state.

さらに別の観点による本発明は、上記基板搬送装置と、該基板搬送装置により搬送された基板に所定の処理を行う処理装置とを備えた基板処理システムが提供される。 From yet another aspect, the present invention provides a substrate processing system including the substrate transfer device and a processing device that performs a predetermined process on the substrate conveyed by the substrate transfer device.

本発明によれば、基板把持機構の状態として、開状態、把持状態、空振り状態及び動作中状態の４つの状態を、少ない部品点数で正確に認識することができる。 According to the present invention, four states of the substrate gripping mechanism, an open state, a gripping state, a swinging state, and an operating state, can be accurately recognized with a small number of parts.

本発明の実施の形態にかかる基板処理システムの構成の概略を模式的に示す平面図である。It is a top view schematically showing the outline of the structure of the substrate processing system which concerns on embodiment of this invention. 図１のウェハ搬送装置の構成の概略を示す側面図である。It is a side view which shows the outline of the structure of the wafer transfer apparatus of FIG. 図２のウェハ把持機構の構成の概略を示す平面図である。It is a top view which shows the outline of the structure of the wafer gripping mechanism of FIG. 図３のフォークの固定クランプ部の部分拡大断面図である。It is a partially enlarged sectional view of the fixed clamp part of the fork of FIG. 図３のプッシャの可動クランプ部の部分拡大側面図である。It is a partially enlarged side view of the movable clamp part of the pusher of FIG. 図３の検出部の構成の概略を示す斜視図である。It is a perspective view which shows the outline of the structure of the detection part of FIG. 図３のキッカーの構成の概略を示す平面図である。It is a top view which shows the outline of the structure of the kicker of FIG. ウェハ把持機構の状態と、第１及び第２のセンサによる検知状態との関係を示す図である。It is a figure which shows the relationship between the state of the wafer gripping mechanism, and the detection state by the 1st and 2nd sensors. ウェハ把持機構の状態と、第１及び第２のセンサによる検知状態との関係を示す他の図である。It is another figure which shows the relationship between the state of the wafer gripping mechanism, and the detection state by the 1st and 2nd sensors. ウェハ把持機構の状態と、第１及び第２のセンサによる検知状態との関係を示す別の図である。It is another figure which shows the relationship between the state of the wafer gripping mechanism, and the detection state by the 1st and 2nd sensors. ウェハ把持機構の状態と、第１及び第２のセンサによる検知状態との関係を示すさらに別の図である。It is still another figure which shows the relationship between the state of the wafer gripping mechanism, and the detection state by the 1st and 2nd sensors.

以下、本発明の実施形態について、図面を参照しながら説明する。なお、本明細書および図面において、実質的に同一の機能構成を有する要素においては、同一の符号を付することにより重複説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification and the drawings, the elements having substantially the same functional configuration are designated by the same reference numerals, so that duplicate description will be omitted.

先ず、本実施形態にかかる基板処理システムの構成について説明する。図１は、基板処理システム１００の構成の概略を模式的に示す平面図である。 First, the configuration of the substrate processing system according to the present embodiment will be described. FIG. 1 is a plan view schematically showing an outline of the configuration of the substrate processing system 100.

基板処理システム１００は、図１に示すように、基板としてのウェハＷをカセット単位で搬入出するカセットステーション２００と、ウェハＷを枚葉式に処理する複数の処理装置を備えた処理ステーション３００を一体に接続した構成を有している。 As shown in FIG. 1, the substrate processing system 100 includes a cassette station 200 for loading and unloading a wafer W as a substrate in cassette units, and a processing station 300 including a plurality of processing devices for processing the wafer W in a single-wafer pattern. It has an integrally connected configuration.

カセットステーション２００は、カセット載置部２１０と、搬送室２１１と、を備えている。カセット載置部２１０には、複数のウェハＷを収容可能なカセットＣをＸ方向（図１中の左右方向）に複数、例えば３つ並べて載置できる。カセット載置部２１０のＹ方向正方向（図１中の上方）側には、搬送室２１１が隣接されている。搬送室２１１には、ウェハＷを搬送する基板搬送装置としてウェハ搬送装置１０が設けられている。搬送室２１１内のウェハ搬送装置１０は、旋回及び伸縮自在な多関節の搬送アーム１１を備えており、カセット載置部２１０のカセットＣと、後述する処理ステーション３００のロードロック室３１１、３１２に対してウェハＷを搬送できる。このウェハ搬送装置１０の動作は、後述する制御部４００によって制御される。 The cassette station 200 includes a cassette mounting portion 210 and a transport chamber 211. On the cassette mounting unit 210, a plurality of cassettes C capable of accommodating a plurality of wafers W can be mounted side by side in the X direction (left-right direction in FIG. 1), for example, three. A transport chamber 211 is adjacent to the cassette mounting portion 210 on the positive direction (upper side in FIG. 1) in the Y direction. The wafer transfer device 10 is provided in the transfer chamber 211 as a substrate transfer device for transporting the wafer W. The wafer transfer device 10 in the transfer chamber 211 is provided with an articulated transfer arm 11 that can be swiveled and expanded and contracted, and is provided in the cassette C of the cassette mounting portion 210 and the load lock chambers 311 and 312 of the processing station 300 described later. On the other hand, the wafer W can be conveyed. The operation of the wafer transfer device 10 is controlled by the control unit 400 described later.

処理ステーション３００の中央部には、内部を減圧可能な主搬送室３１０が設けられている。主搬送室３１０は、例えば平面から見て略６角形に形成され、その周囲にロードロック室３１１、３１２と、例えば４つの処理装置３１３、３１４、３１５、３１６が接続されている。 At the center of the processing station 300, a main transport chamber 310 capable of reducing the pressure inside is provided. The main transport chamber 310 is formed in a substantially hexagonal shape when viewed from a plane, for example, and a load lock chamber 311 and 312 and, for example, four processing devices 313, 314, 315, and 316 are connected around the main transport chamber 310.

ロードロック室３１１、３１２は、主搬送室３１０とカセットステーション２００の搬送室２１１の間に配置され、主搬送室３１０と搬送室２１１を接続している。ロードロック室３１１、３１２は、ウェハＷの載置部（図示せず）を有し、室内を減圧雰囲気に維持できる。 The load lock chambers 311 and 312 are arranged between the main transport chamber 310 and the transport chamber 211 of the cassette station 200, and connect the main transport chamber 310 and the transport chamber 211. The load lock chambers 311 and 312 have a wafer W mounting portion (not shown), and the chamber can be maintained in a reduced pressure atmosphere.

搬送室２１１とロードロック室３１１、３１２との間、主搬送室３１０と各ロードロック室３１１、３１２及び各処理装置３１３～３１６との間には、これらの間を気密にシールし、かつ開閉可能に構成されたゲートバルブ３１７がそれぞれ設けられている。 Between the transport chamber 211 and the load lock chambers 311 and 312, and between the main transport chamber 310 and each load lock chamber 311 and 312 and each processing device 313 to 316, the space between them is airtightly sealed and opened and closed. Each capable gate valve 317 is provided.

主搬送室３１０には、真空ウェハ搬送装置３１８が設けられている。真空ウェハ搬送装置３１８は、例えば二つの搬送アーム３１９を有している。各搬送アーム３１９は、旋回及び伸縮自在に構成されており、主搬送室３１０の周囲のロードロック室３１１、３１２、処理装置３１３～３１６に対してウェハＷを搬送することができる。この真空ウェハ搬送装置３１８によるウェハＷの搬送は、後述する制御部４００によって制御される。 The main transfer chamber 310 is provided with a vacuum wafer transfer device 318. The vacuum wafer transfer device 318 has, for example, two transfer arms 319. Each transfer arm 319 is configured to be swivelable and expandable, and can transfer the wafer W to the load lock chambers 311 and 312 around the main transfer chamber 310 and the processing devices 313 to 316. The transfer of the wafer W by the vacuum wafer transfer device 318 is controlled by the control unit 400 described later.

処理装置３１３～３１６は、所定の処理レシピに基づいて、所定の処理、例えばプラズマ処理を行うプラズマ処理装置である。処理装置３１３～３１６におけるウェハＷの処理は、後述する制御部４００によって制御される。 The processing devices 313 to 316 are plasma processing devices that perform predetermined processing, for example, plasma processing, based on a predetermined processing recipe. The processing of the wafer W in the processing devices 313 to 316 is controlled by the control unit 400 described later.

また、基板処理システム１００は、ウェハ搬送装置１０や真空ウェハ搬送装置３１８、処理装置３１３～３１６等を制御する制御部４００を備える。制御部４００は、例えばコンピュータであり、プログラム格納部（図示せず）を有している。プログラム格納部には、ウェハ搬送装置１０の動作等を制御するプログラムが格納されている。なお、上記プログラムは、例えばコンピュータ読み取り可能なハードディスク（ＨＤ）、フレキシブルディスク（ＦＤ）、コンパクトディスク（ＣＤ）、マグネットオプティカルデスク（ＭＯ）、メモリーカードなどのコンピュータに読み取り可能な記憶媒体に記録されていたものであって、その記憶媒体から制御部４００にインストールされたものであってもよい。 Further, the substrate processing system 100 includes a control unit 400 that controls a wafer transfer device 10, a vacuum wafer transfer device 318, processing devices 313 to 316, and the like. The control unit 400 is, for example, a computer and has a program storage unit (not shown). A program for controlling the operation of the wafer transfer device 10 and the like is stored in the program storage unit. The above program is recorded on a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical desk (MO), or memory card. It may be the one installed in the control unit 400 from the storage medium.

次に、上述したウェハ搬送装置１０の構成について説明する。図２は、ウェハ搬送装置１０の構成の概略を示す側面図である。
ウェハ搬送装置１０は、図２に示すように、基台１２と、搬送アーム１１とを有する。
基台１２は、不図示の駆動部により、水平方向に移動自在かつ昇降自在に構成されている。 Next, the configuration of the wafer transfer device 10 described above will be described. FIG. 2 is a side view showing an outline of the configuration of the wafer transfer device 10.
As shown in FIG. 2, the wafer transfer device 10 has a base 12 and a transfer arm 11.
The base 12 is configured to be movable in the horizontal direction and to be raised and lowered by a drive unit (not shown).

搬送アーム１１は、旋回及び伸縮自在に構成されており、第１のアーム１３と、第２のアーム１４とを有する。
第１のアーム１３は、その基端側が基台１２に鉛直軸周りに回転自在に接続されている。
第２のアーム１４は、第１のアーム１３の先端側に鉛直軸周りに回転自在に接続されると共に各種部品が搭載される搭載部１５を基端側に有し、さらに、ウェハＷの搬送中に当該ウェハＷを把持する基板把持機構としてのウェハ把持機構１とを有する。 The transport arm 11 is configured to be swivelable and telescopic, and has a first arm 13 and a second arm 14.
The base end side of the first arm 13 is rotatably connected to the base 12 around a vertical axis.
The second arm 14 has a mounting portion 15 rotatably connected to the tip end side of the first arm 13 around a vertical axis and on which various components are mounted, and further, the wafer W is conveyed. It has a wafer gripping mechanism 1 as a substrate gripping mechanism for gripping the wafer W.

図３は、ウェハ把持機構１の構成の概略を示す平面図である。
ウェハ把持機構１は、図３に示すように、フォーク２０と、プッシャ２１と、アクチュエータ２２と、キッカー２３と、検出部２４とを有する。これらのうち、アクチュエータ２２、キッカー２３及び検出部２４は前述の搭載部１５上に搭載される。なお、搭載部１５の部品搭載空間は不図示の筐体で覆われている。これにより、搭載部１５に搭載された部品からパーティクルが生じたとしても、該パーティクルがウェハＷに影響を及ぼすのを防ぐことができる。 FIG. 3 is a plan view showing an outline of the configuration of the wafer gripping mechanism 1.
As shown in FIG. 3, the wafer gripping mechanism 1 includes a fork 20, a pusher 21, an actuator 22, a kicker 23, and a detection unit 24. Of these, the actuator 22, the kicker 23, and the detection unit 24 are mounted on the above-mentioned mounting unit 15. The component mounting space of the mounting portion 15 is covered with a housing (not shown). As a result, even if particles are generated from the parts mounted on the mounting portion 15, it is possible to prevent the particles from affecting the wafer W.

フォーク２０は、搭載部１５から延伸し先端が二股に分かれたＹ字状に形成されたフォーク本体２０ａを有し、フォーク本体２０ａの二股に分かれた先端にはそれぞれ固定クランプ部２０ｂが形成されている。 The fork 20 has a fork body 20a extending from the mounting portion 15 and having a bifurcated tip formed in a Y shape, and a fixed clamp portion 20b is formed at each bifurcated tip of the fork body 20a. There is.

図４は、フォーク２０の固定クランプ部２０ｂの部分拡大断面図である。
固定クランプ部２０ｂは、鉛直方向に延びる垂壁２０ｃと、フォーク２０の基端側に向けて下がり上記垂壁２０ｃと連続する傾斜壁２０ｄとを有する。ウェハ把持機構１でウェハＷを把持する際には、まず、ウェハＷの縁部下端と傾斜壁２０ｄが当接するように、ウェハＷが傾斜壁２０ｄ上に乗せられる。その後、プッシャ２１の後述する可動クランプ部２１ｂが固定クランプ部２０ｂに向けて移動することにより、ウェハＷが傾斜壁２０ｄ上を滑らかに上げられていく。そして、垂壁２０ｃとウェハＷの縁部が当接するところで当該ウェハＷは把持される。 FIG. 4 is a partially enlarged cross-sectional view of the fixed clamp portion 20b of the fork 20.
The fixed clamp portion 20b has a hanging wall 20c extending in the vertical direction and an inclined wall 20d that descends toward the base end side of the fork 20 and is continuous with the hanging wall 20c. When gripping the wafer W with the wafer gripping mechanism 1, first, the wafer W is placed on the inclined wall 20d so that the lower end of the edge portion of the wafer W and the inclined wall 20d come into contact with each other. After that, the movable clamp portion 21b described later of the pusher 21 moves toward the fixed clamp portion 20b, so that the wafer W is smoothly raised on the inclined wall 20d. Then, the wafer W is gripped at the point where the hanging wall 20c and the edge portion of the wafer W come into contact with each other.

図３の説明に戻る。
プッシャ２１は、先端側が二股に分かれた形状に形成されたプッシャ本体２１ａを有する。プッシャ本体２１ａの二股に分かれた先端にはそれぞれ可動クランプ部２１ｂが設けられており、また、プッシャ本体２１ａの基端側はアクチュエータ２２に接続されている。 Returning to the description of FIG.
The pusher 21 has a pusher body 21a formed in a shape in which the tip side is bifurcated. A movable clamp portion 21b is provided at each of the bifurcated tips of the pusher body 21a, and the base end side of the pusher body 21a is connected to the actuator 22.

アクチュエータ２２は、プッシャ本体２１ａすなわち可動クランプ部２１ｂを固定クランプ部２０ｂに対して進退動させる進退駆動部であり、例えば、エアシリンダにより構成される。なお、アクチュエータ２２は、リニアモーターやリニアソレノイドで構成してもよい。 The actuator 22 is an advancing / retreating driving unit that advances / retracts the pusher main body 21a, that is, the movable clamp portion 21b with respect to the fixed clamp portion 20b, and is composed of, for example, an air cylinder. The actuator 22 may be composed of a linear motor or a linear solenoid.

ウェハ把持機構１では、固定クランプ部２０ｂと、アクチュエータ２２により該固定クランプ部２０ｂに対して進退動する可動クランプ部２１ｂとの間で、ウェハＷを把持することができる。 In the wafer gripping mechanism 1, the wafer W can be gripped between the fixed clamp portion 20b and the movable clamp portion 21b that moves forward and backward with respect to the fixed clamp portion 20b by the actuator 22.

図５は、プッシャ２１の可動クランプ部２１ｂの部分拡大側面図である。
可動クランプ部２１ｂは、図５に示すように、鉛直方向中央に円柱状に形成された円柱部２１ｃを有する。また、可動クランプ部２１ｂは、円柱部２１ｃの上方に、上方が大径の円錐台状に形成された上円錐台部２１ｄを有し、円柱部２１ｃの下方に、下方が大径の円錐台状に形成された下円錐台部２１ｅを有する。ウェハ把持機構１でウェハＷを把持する際には、可動クランプ部２１ｂが前進していくことで、すなわち、固定クランプ部２０ｂに向けて移動してゆくことで、ウェハＷの縁部下端と下円錐台部２１ｅが当接した形態で、当該ウェハＷが下円錐台部２１ｅ上に乗せられる。その後、さらに可動クランプ部２１ｂが前進していくことで、さらにウェハＷが下円錐台部２１ｅの傾斜面上を滑らかに上げられていき、円柱部２１ｃとウェハＷの縁部が当接するところで当該ウェハＷは把持される。 FIG. 5 is a partially enlarged side view of the movable clamp portion 21b of the pusher 21.
As shown in FIG. 5, the movable clamp portion 21b has a columnar portion 21c formed in a columnar shape in the center in the vertical direction. Further, the movable clamp portion 21b has an upper truncated cone portion 21d formed in the shape of a truncated cone having a large diameter above the columnar portion 21c, and a truncated cone having a large diameter below the columnar portion 21c. It has a lower truncated cone portion 21e formed in a shape. When the wafer W is gripped by the wafer gripping mechanism 1, the movable clamp portion 21b moves forward, that is, moves toward the fixed clamp portion 20b, so that the lower end and the lower end of the edge portion of the wafer W are held. The wafer W is placed on the lower truncated cone portion 21e in a form in which the truncated cone portion 21e is in contact with the lower cone base portion 21e. After that, as the movable clamp portion 21b further advances, the wafer W is further smoothly raised on the inclined surface of the lower truncated cone portion 21e, and the cylindrical portion 21c and the edge portion of the wafer W come into contact with each other. The wafer W is gripped.

再度図３の説明に戻る。
キッカー２３は、プッシャ２１すなわち可動クランプ部２１ｂと連動して動く連動部材である。本例のキッカー２３は、プッシャ２１とは別体で形成され、該プッシャ２１に取り付けられることにより、プッシャ２１と連動して動くことができるようになっている。 Returning to the explanation of FIG. 3 again.
The kicker 23 is an interlocking member that moves in conjunction with the pusher 21, that is, the movable clamp portion 21b. The kicker 23 of this example is formed separately from the pusher 21, and by being attached to the pusher 21, it can move in conjunction with the pusher 21.

また、検出部２４は、可動クランプ部２１ｂの進退方向に係るキッカー２３の位置を検出するためのものであり、第１のセンサ２４ａ及び第２のセンサ２４ｂを有する。 Further, the detection unit 24 is for detecting the position of the kicker 23 in the advancing / retreating direction of the movable clamp unit 21b, and has a first sensor 24a and a second sensor 24b.

図６は、検出部２４の構成の概略を示す斜視図である。
検出部２４の第１のセンサ２４ａ及び第２のセンサ２４ｂはそれぞれ、図６に示すように、互いに異なる検知領域Ａ１、Ａ２を有し、該検知領域Ａ１、Ａ２にキッカー２３が存在するか否かを検知する。第１のセンサ２４ａは、キッカー２３が存在し得る領域に検知領域Ａ１が位置するように設けられる。第２のセンサ２４ｂも同様である。
また、第１のセンサ２４ａ及び第２のセンサ２４ｂは、例えばフォトインタラプタであり、キッカー２３が存在し得る領域を間に挟んで対向する発光部２４ｃと受光部２４ｄを有する。 FIG. 6 is a perspective view showing an outline of the configuration of the detection unit 24.
As shown in FIG. 6, the first sensor 24a and the second sensor 24b of the detection unit 24 have different detection areas A1 and A2, respectively, and whether or not the kicker 23 exists in the detection areas A1 and A2. Is detected. The first sensor 24a is provided so that the detection region A1 is located in the region where the kicker 23 can exist. The same applies to the second sensor 24b.
Further, the first sensor 24a and the second sensor 24b are, for example, photo interrupters, and have a light emitting unit 24c and a light receiving unit 24d facing each other with a region in which the kicker 23 can exist.

図７は、キッカー２３の構成の概略を示す平面図である。
キッカー２３は、可動クランプ部２１ｂ（図２参照）の進退方向（図の上下方向）に連なる第１～第４の部分２３ａ～２３ｄを有する。第１～第４の部分２３ａ～２３ｄはそれぞれ、当該部分が検出部２４内に位置するときに第１のセンサ２４ａ及び第２のセンサ２４ｂによる検知結果が互いに異なる形状を有する。 FIG. 7 is a plan view showing an outline of the configuration of the kicker 23.
The kicker 23 has first to fourth portions 23a to 23d that are continuous with each other in the advancing / retreating direction (vertical direction in the figure) of the movable clamp portion 21b (see FIG. 2). The first to fourth portions 23a to 23d each have a shape in which the detection results by the first sensor 24a and the second sensor 24b are different from each other when the portion is located in the detection unit 24.

第１～第４の部分２３ａ～２３ｄのうち最も先端側の第１の部分２３ａは、上記進退方向に沿って延在する中心領域Ｂから第１のセンサ２４ａの検知領域Ａ１側（図の右側）にのみ延び出した形状であって、当該部分２３ａが検出部２４内に位置するときに第１のセンサ２４ａにのみ検知される形状を有する。 Of the first to fourth portions 23a to 23d, the first portion 23a on the most advanced side is from the central region B extending along the advancing / retreating direction to the detection region A1 side of the first sensor 24a (right side of the figure). ), And has a shape that is detected only by the first sensor 24a when the portion 23a is located in the detection unit 24.

また、第２の部分２３ｂは、上記中心領域Ｂから第２のセンサ２４ｂの検知領域Ａ２側（図の左側）にのみ延び出した形状であって、当該部分２３ｂが検出部２４内に位置するときに第２のセンサ２４ｂにのみ検知される形状を有する。 Further, the second portion 23b has a shape extending only from the central region B to the detection region A2 side (left side in the figure) of the second sensor 24b, and the portion 23b is located in the detection portion 24. It has a shape that is sometimes detected only by the second sensor 24b.

第３の部分２３ｃは、上記中心領域Ｂから上記検知領域Ａ１側及び上記検知領域Ａ２側（図の左側及び右側）のいずれにも延び出さない形状であって、当該部分２３ｃが検出部２４内に位置するときに第１のセンサ２４ａ及び第２のセンサ２４ｂのいずれにも検知されない形状を有する。 The third portion 23c has a shape that does not extend from the central region B to either the detection region A1 side or the detection region A2 side (left side and right side in the figure), and the portion 23c is inside the detection unit 24. It has a shape that is not detected by either the first sensor 24a or the second sensor 24b when it is located at.

第４の部分２３ｄは、上記中心領域Ｂから上記検知領域Ａ１側及び上記検知領域Ａ２側（図の左側及び右側）の両方に延び出す形状であって、当該部分２３ｄが検出部２４内に位置するときに第１のセンサ２４ａ及び第２のセンサ２４ｂの両方に検知される形状を有する。 The fourth portion 23d has a shape extending from the central region B to both the detection region A1 side and the detection region A2 side (left side and right side in the figure), and the portion 23d is located in the detection unit 24. It has a shape that is detected by both the first sensor 24a and the second sensor 24b.

続いて、上述の各構成部材を有するウェハ把持機構１の状態と、第１のセンサ２４ａ及び第２のセンサ２４ｂの検知状態との関係を、図８～図１１を用いて説明する。 Subsequently, the relationship between the state of the wafer gripping mechanism 1 having each of the above-mentioned constituent members and the detection state of the first sensor 24a and the second sensor 24b will be described with reference to FIGS. 8 to 11.

（開状態）
図８（Ａ）に示すように、ウェハ把持機構１の状態が、開状態の場合、すなわち、可動クランプ部２１ｂが原点位置Ｐ１にある場合、可動クランプ部２１ｂと連動するキッカー２３は、図８（Ｂ）に示すように、検出部２４内に第１の部分２３ａが位置する。したがって、ウェハ把持機構１の状態が上記開状態の場合、第１のセンサ２４ａでのみキッカー２３の存在が検知される。 (Open state)
As shown in FIG. 8A, when the wafer gripping mechanism 1 is in the open state, that is, when the movable clamp portion 21b is at the origin position P1, the kicker 23 interlocking with the movable clamp portion 21b is shown in FIG. As shown in (B), the first portion 23a is located in the detection unit 24. Therefore, when the wafer gripping mechanism 1 is in the open state, the presence of the kicker 23 is detected only by the first sensor 24a.

（把持状態）
一方、図９（Ａ）に示すように、ウェハ把持機構１の状態が、把持状態の場合、すなわち、可動クランプ部２１ｂが把持位置Ｐ２にあり該可動クランプ部２１ｂの円柱部２１ｃ及び固定クランプ部２０ｂの垂壁２０ｃがウェハＷの側端に当接し可動クランプ部２１ｂと固定クランプ部２０ｂとによりウェハＷが把持されている場合、可動クランプ部２１ｂと連動するキッカー２３は、図９（Ｂ）に示すように、検出部２４内に第３の部分２３ｃが位置する。したがって、ウェハ把持機構１の状態が上記保持状態の場合第１のセンサ２４ａ及び第２のセンサ２４ｂのいずれにもキッカー２３の存在が検知されない。 (Gripping state)
On the other hand, as shown in FIG. 9A, when the wafer gripping mechanism 1 is in the gripping state, that is, the movable clamp portion 21b is in the gripping position P2, and the cylindrical portion 21c and the fixed clamp portion of the movable clamp portion 21b are located. When the hanging wall 20c of 20b abuts on the side end of the wafer W and the wafer W is gripped by the movable clamp portion 21b and the fixed clamp portion 20b, the kicker 23 interlocking with the movable clamp portion 21b is shown in FIG. 9B. As shown in the above, the third portion 23c is located in the detection unit 24. Therefore, when the wafer gripping mechanism 1 is in the holding state, the presence of the kicker 23 is not detected in either the first sensor 24a or the second sensor 24b.

（空振り状態）
また、図１０（Ａ）に示すように、ウェハ把持機構１の状態が、空振り状態の場合、すなわち、ウェハＷを把持できずに可動クランプ部２１ｂが把持位置Ｐ２を通り越したオーバーストローク位置Ｐ３にある場合、可動クランプ部２１ｂと連動するキッカー２３は、図１０（Ｂ）に示すように、検出部２４内に第４の部分２３ｄが位置する。したがって、ウェハ把持機構１の状態が上記空振り状態の場合、第１のセンサ２４ａ及び第２のセンサ２４ｂの両方にキッカー２３の存在が検知される。 (Swinging state)
Further, as shown in FIG. 10A, when the wafer gripping mechanism 1 is in the idle swing state, that is, at the overstroke position P3 where the movable clamp portion 21b cannot grip the wafer W and passes through the gripping position P2. In some cases, in the kicker 23 interlocking with the movable clamp portion 21b, as shown in FIG. 10B, the fourth portion 23d is located in the detection portion 24. Therefore, when the state of the wafer gripping mechanism 1 is the above-mentioned idle swing state, the presence of the kicker 23 is detected in both the first sensor 24a and the second sensor 24b.

（動作中状態）
さらに、図１１（Ａ）に示すように、ウェハ把持機構１の状態が、動作中状態の場合、すなわち、可動クランプ部２１ｂが上記原点位置Ｐ１と上記把持位置Ｐ２との間にある場合、より具体的には、上記原点位置Ｐ１より所定距離先端側の位置と上記把持位置Ｐ２より所定距離基端側の位置との間に可動クランプ部２１ｂが位置する場合、キッカー２３は、図１１（Ｂ）に示すように、検出部２４内に第２の部分２３ｂが位置する。したがって、ウェハ把持機構１の状態が上記動作中状態の場合、第２のセンサ２４ｂでのみキッカー２３が検知される。 (Operating state)
Further, as shown in FIG. 11A, when the state of the wafer gripping mechanism 1 is in the operating state, that is, when the movable clamp portion 21b is between the origin position P1 and the gripping position P2. Specifically, when the movable clamp portion 21b is located between the position on the tip side of the origin position P1 at a predetermined distance and the position on the base end side at a predetermined distance from the gripping position P2, the kicker 23 is shown in FIG. 11 (B). ), The second portion 23b is located in the detection unit 24. Therefore, when the wafer gripping mechanism 1 is in the operating state, the kicker 23 is detected only by the second sensor 24b.

このように上述のウェハ把持機構１によれば、当該ウェハ把持機構１の状態が、開状態、把持状態、空振り状態、動作中状態のいずれであるかに応じて、第１のセンサ２４ａ及び第２のセンサ２４ｂの検知結果が異なる。
したがって、ウェハ把持機構１を有するウェハ搬送装置１０では、制御部４００が、第１のセンサ２４ａ及び第２のセンサ２４ｂの検知結果に基づいて、ウェハ把持機構１の状態を判定することができる。 As described above, according to the wafer gripping mechanism 1 described above, the first sensor 24a and the first sensor 24a and the first sensor 24a depend on whether the state of the wafer gripping mechanism 1 is an open state, a gripping state, a swinging state, or an operating state. The detection results of the sensors 24b of 2 are different.
Therefore, in the wafer transfer device 10 having the wafer gripping mechanism 1, the control unit 400 can determine the state of the wafer gripping mechanism 1 based on the detection results of the first sensor 24a and the second sensor 24b.

次に、基板処理システム１００におけるウェハ搬送装置１０によるウェハＷの搬送処理の一例について説明する。 Next, an example of wafer W transfer processing by the wafer transfer device 10 in the substrate processing system 100 will be described.

まず、フォーク２０が、カセット載置部２１０上のカセット内に挿入され、ウェハＷの下側に位置するように移動される。なお、この段階では、ウェハ把持機構１の状態は開状態である。 First, the fork 20 is inserted into the cassette on the cassette mounting portion 210 and moved so as to be located below the wafer W. At this stage, the wafer gripping mechanism 1 is in an open state.

そして、フォーク２０が上昇され、これによりウェハＷの縁部に固定クランプ部２０ｂ及び可動クランプ部２１ｂを接近させる。 Then, the fork 20 is raised, whereby the fixed clamp portion 20b and the movable clamp portion 21b are brought close to the edge portion of the wafer W.

次いで、制御部４００が、先端方向移動開始信号をアクチュエータ２２に出力し、フォーク２０の先端方向へのプッシャ２１すなわち可動クランプ部２１ｂの移動を開始させる。これにより、ウェハＷの縁部を固定クランプ部２０ｂの傾斜壁２０ｄ及び可動クランプ部２１ｂの下円錐台部２１ｅに当接させる。その後、可動クランプ部２１ｂの移動を継続させることで、ウェハＷの先端側を固定クランプ部２０ｂの傾斜壁２０ｄに沿って上昇させると共にウェハＷの基端側を可動クランプ部２１ｂの下円錐台部２１ｅの傾斜面に沿って上昇させる。ウェハＷの先端側は該先端側の縁部が固定クランプ部２０ｂの垂壁２０ｃに当接するまで上昇され、ウェハＷの基端側は該基端側の縁部が可動クランプ部２１ｂの円柱部２１ｃに当接するまで上昇される。 Next, the control unit 400 outputs a tip direction movement start signal to the actuator 22 to start the movement of the pusher 21, that is, the movable clamp portion 21b toward the tip end of the fork 20. As a result, the edge portion of the wafer W is brought into contact with the inclined wall 20d of the fixed clamp portion 20b and the lower truncated cone portion 21e of the movable clamp portion 21b. After that, by continuing the movement of the movable clamp portion 21b, the tip end side of the wafer W is raised along the inclined wall 20d of the fixed clamp portion 20b, and the base end side of the wafer W is raised to the lower truncated cone portion of the movable clamp portion 21b. It is raised along the inclined surface of 21e. The tip end side of the wafer W is raised until the edge portion on the tip end side abuts on the hanging wall 20c of the fixed clamp portion 20b, and the edge portion on the proximal end side of the wafer W is a cylindrical portion of the movable clamp portion 21b. It is raised until it comes into contact with 21c.

その後、前述の先端方向移動開始信号を出力してから所定時間が経過したときに、制御部４００は、第１のセンサ２４ａ及び第２のセンサ２４ｂでの検知結果に基づいて、ウェハ把持機構１の状態を判定する。 After that, when a predetermined time has elapsed after outputting the above-mentioned tip direction movement start signal, the control unit 400 receives the wafer gripping mechanism 1 based on the detection results of the first sensor 24a and the second sensor 24b. Judge the state of.

判定の結果、第１のセンサ２４ａ及び第２のセンサ２４ｂの両方でキッカー２３が検知され、ウェハ把持機構１の状態が空振り状態と判定された場合、制御部４００は、空振り状態となったことを示す情報を基板処理システム１００のオペレータに報知する。例えば、制御部４００は、不図示の表示部にエラーメッセージを表示させる。 As a result of the determination, when the kicker 23 is detected by both the first sensor 24a and the second sensor 24b and the state of the wafer gripping mechanism 1 is determined to be the missed swing state, the control unit 400 is in the missed swing state. The information indicating the above is notified to the operator of the substrate processing system 100. For example, the control unit 400 causes an error message to be displayed on a display unit (not shown).

また、上記判定の結果、第１のセンサ２４ａ及び第２のセンサ２４ｂのいずれにもキッカー２３が検知されず、ウェハ把持機構１の状態が把持状態と判定された場合、フォーク２０がカセットＣから脱抜される。
次いで、フォーク２０は、ロードロック室３１１内に挿入され、ウェハＷの載置部（図示せず）の上方の位置に移動される。 Further, as a result of the above determination, when the kicker 23 is not detected in any of the first sensor 24a and the second sensor 24b and the state of the wafer gripping mechanism 1 is determined to be the gripping state, the fork 20 is removed from the cassette C. Be pulled out.
The fork 20 is then inserted into the load lock chamber 311 and moved to a position above the wafer W mounting portion (not shown).

そして、制御部４００が、基端方向移動開始信号をアクチュエータ２２に出力し、フォーク２０の基端方向へのプッシャ２１すなわち可動クランプ部２１ｂの移動を開始させる。
その後、制御部４００が、所定間隔毎に、第１のセンサ２４ａ及び第２のセンサ２４ｂでの検知結果に基づいて、ウェハ把持機構１の状態を判定する。そして、判定の結果、第２のセンサ２４ｂでのみキッカー２３が検知されウェハ把持機構１の状態が動作中状態と判定されたときに、フォーク２０からロードロック室３１１内の載置部へのウェハＷの受け渡しを開始させ、具体的には、フォーク２０の下降動作を開始させる。 Then, the control unit 400 outputs a base end direction movement start signal to the actuator 22 to start the movement of the pusher 21, that is, the movable clamp portion 21b in the base end direction of the fork 20.
After that, the control unit 400 determines the state of the wafer gripping mechanism 1 based on the detection results of the first sensor 24a and the second sensor 24b at predetermined intervals. Then, as a result of the determination, when the kicker 23 is detected only by the second sensor 24b and the state of the wafer gripping mechanism 1 is determined to be the operating state, the wafer from the fork 20 to the mounting portion in the load lock chamber 311. The delivery of W is started, and specifically, the lowering operation of the fork 20 is started.

下降動作が完了すると、フォーク２０はロードロック室３１１から脱抜される。該脱抜は、ウェハ把持機構１の状態が開状態となってから行っても良いし、開状態となる前に行っても良い。 When the lowering operation is completed, the fork 20 is pulled out from the load lock chamber 311. The removal may be performed after the wafer gripping mechanism 1 is in the open state, or may be performed before the wafer gripping mechanism 1 is in the open state.

本実施形態によれば、ウェハ把持機構１の状態として、開状態、把持状態、空振り状態、動作中状態の４つの状態を正確に認識することができる。したがって、ウェハＷが把持されていない状態でウェハＷが搬送されるのを確実に防ぐことができ、また、ウェハ搬送装置１０と他の装置との間での基板の受け渡し動作を、把持状態から開状態に移行してからではなく、動作中状態から開始することができるため、スループットを向上させることができる。さらに、本実施形態によれば、動作中状態であるか否かを推定によらず判定できるため、言い換えると、ウェハ把持機構１による把持が解除されているか否かをより確実に認識することができるため、ウェハ把持機構１による把持が解除されていない状態を認識できない場合の問題、例えば、上記把持が解除されていない状態で上記受け渡し動作が行われること等を防ぐことができる。すなわち、把持状態のときに行われる動作に続いて行われる動作の確実性が向上する。 According to this embodiment, it is possible to accurately recognize four states of the wafer gripping mechanism 1: an open state, a gripping state, a swinging state, and an operating state. Therefore, it is possible to reliably prevent the wafer W from being transferred in a state where the wafer W is not gripped, and the operation of transferring the substrate between the wafer transfer device 10 and another device can be performed from the gripped state. Since it is possible to start from the operating state instead of shifting to the open state, the throughput can be improved. Further, according to the present embodiment, it is possible to determine whether or not the wafer is in the operating state without estimation. In other words, it is possible to more reliably recognize whether or not the wafer gripping mechanism 1 is released from gripping. Therefore, it is possible to prevent a problem when the wafer gripping mechanism 1 cannot recognize the state in which the grip is not released, for example, the delivery operation is performed in the state where the grip is not released. That is, the certainty of the operation performed following the operation performed in the gripped state is improved.

また、本実施形態によれば、上記４つの状態を認識するために必要なセンサの数は２つである。つまり、本実施形態によれば、少ない部品点数で上記４つの状態を正確に認識することができる。したがって、部品を搭載可能な領域すなわち搭載部１５が小さい基板搬送装置にも本実施形態のウェハ把持機構１を搭載することができる。 Further, according to the present embodiment, the number of sensors required to recognize the above four states is two. That is, according to the present embodiment, the above four states can be accurately recognized with a small number of parts. Therefore, the wafer gripping mechanism 1 of the present embodiment can be mounted on the substrate transfer device in which the component can be mounted, that is, the mounting portion 15 is small.

なお、上記４つの状態を認識する方法として、プッシャ２１の進退方向にかかる位置を正確に検出するリニアエンコーダを設け、検出された位置に基づいて、上記４つの状態を認識する方法が考えられる。しかし、リニアエンコーダは、高価である。その点、第１のセンサ２４ａ、第２のセンサ２４ｂは、その検知領域Ａ１、Ａ２内にキッカー２３が存在するか否か検知できればよく、安価なセンサを採用することができる。
また、ウェハ搬送装置１０のアーム（第２のアーム１４）に搭載される部品は軽量であることが求められるが、リニアエンコーダは重量が大きい。それに対し、第１のセンサ２４ａ、第２のセンサ２４ｂは、フォトインタラプタ等を採用することにより軽量化を図ることができる。さらに、市販のリニアエンコーダの分解能は最も大きくても０．５ｍｍ等であるが、上記４つの状態を認識するためには、ここまでの分解能は不要である。 As a method of recognizing the above four states, a method of providing a linear encoder that accurately detects the position of the pusher 21 in the advancing / retreating direction and recognizing the above four states based on the detected position can be considered. However, linear encoders are expensive. In that respect, the first sensor 24a and the second sensor 24b need only be able to detect whether or not the kicker 23 exists in the detection areas A1 and A2, and an inexpensive sensor can be adopted.
Further, the parts mounted on the arm (second arm 14) of the wafer transfer device 10 are required to be lightweight, but the linear encoder is heavy. On the other hand, the weight of the first sensor 24a and the second sensor 24b can be reduced by adopting a photo interrupter or the like. Further, although the resolution of a commercially available linear encoder is 0.5 mm or the like at the maximum, the resolution up to this point is not necessary for recognizing the above four states.

なお、以上の説明では、第１のセンサ２４ａ及び第２のセンサ２４ｂは、フォトインタラプタであるとしたが、この例に限られず、非接触型のセンサであればよい。接触型のセンサを採用した場合、当該センサが発塵源となり、ウェハ処理に影響が及ぶ事態が発生するおそれがあるが、非接触型のセンサとすることにより、上述のような事態を防ぐことができる。 In the above description, the first sensor 24a and the second sensor 24b are photo interrupters, but the present invention is not limited to this example, and any non-contact type sensor may be used. If a contact-type sensor is used, the sensor may become a dust source and affect the wafer processing. However, by using a non-contact type sensor, the above-mentioned situation can be prevented. Can be done.

また、以上の説明では、第１のセンサ２４ａ及び第２のセンサ２４ｂの両方に検知される形状を第１の形状、第１のセンサ２４ａのみに検知される形状を第２の形状、第２のセンサ２４ｂのみに検知される形状を第３の形状、第１のセンサ２４ａ及び第２のセンサ２４ｂのいずれにも検知されない形状を第４の形状としたときに、キッカー２３の第１の部分２３ａは第２の形状であり、第２の部分２３ｂは第３の形状であり、第３の部分２３ｃは第４の形状であり、第４の部分２３ｄは第１の形状であった。しかし、各部分２３ａ～２３ｄの形状はこれに限られない。キッカー２３の第１の部分２３ａ～第４の部分２３ｄは、互いに異なる形状を有すると共に、上記第１～第４の形状のいずれかを有すればよい。 Further, in the above description, the shape detected by both the first sensor 24a and the second sensor 24b is the first shape, the shape detected only by the first sensor 24a is the second shape, and the second shape. When the shape detected only by the sensor 24b of the above is defined as the third shape, and the shape detected only by the first sensor 24a and the second sensor 24b is defined as the fourth shape, the first portion of the kicker 23 is used. 23a was the second shape, the second portion 23b was the third shape, the third portion 23c was the fourth shape, and the fourth portion 23d was the first shape. However, the shape of each portion 23a to 23d is not limited to this. The first portion 23a to the fourth portion 23d of the kicker 23 may have different shapes from each other and may have any of the first to fourth shapes.

以上の説明では、プッシャ本体２１ａとキッカー２３は別体としており、言い換えると、プッシャ本体２１ａと本発明にかかる連動部材とを別体としていた。しかし、プッシャ本体２１ａ自体を本発明にかかる連動部材とし、プッシャ本体２１ａが可動クランプ部２１ｂの進退方向に沿って連なる第１～第４の部分を有し、該第１～第４の部分が互いに異なる形状を有すると共に前述の第１～第４の形状のいずれかを有するようにしてもよい。 In the above description, the pusher main body 21a and the kicker 23 are separate bodies, in other words, the pusher main body 21a and the interlocking member according to the present invention are separate bodies. However, the pusher main body 21a itself is used as an interlocking member according to the present invention, and the pusher main body 21a has first to fourth portions connected along the advancing / retreating direction of the movable clamp portion 21b, and the first to fourth portions are connected. It may have different shapes from each other and may have any of the above-mentioned first to fourth shapes.

以上、本発明の実施形態について説明したが、本発明はかかる例に限定されない。当業者であれば、特許請求の範囲に記載された技術的思想の範疇内において、各種の変更例または修正例に想到しうることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。 Although the embodiments of the present invention have been described above, the present invention is not limited to such examples. It is clear that a person skilled in the art can come up with various modifications or amendments within the scope of the technical idea described in the claims, and of course, the technical scope of the present invention also includes them. It is understood that it belongs to.

本発明は基板を搬送する技術に有用である。 The present invention is useful in techniques for transporting substrates.

１ ウェハ把持機構
１０ ウェハ搬送装置
１１ 搬送アーム
１２ 基台
１３ 第１のアーム
１４ 第２のアーム
１５ 搭載部
２０ フォーク
２０ａ フォーク本体
２０ｂ 固定クランプ部
２０ｃ 垂壁
２０ｄ 傾斜壁
２１ プッシャ
２１ａ プッシャ本体
２１ｂ 可動クランプ部
２１ｃ 円柱部
２１ｄ 上円錐台部
２１ｅ 下円錐台部
２２ アクチュエータ
２３ キッカー
２３ａ 第１の部分
２３ｂ 第２の部分
２３ｃ 第３の部分
２３ｄ 第４の部分
２４ 検出部
２４ａ 第１のセンサ
２４ｂ 第２のセンサ
１００ 基板処理システム
３１３～３１６ 処理装置
４００ 制御部
Ａ１、Ａ２ 検知領域
Ｗ ウェハ
1 Wafer gripping mechanism 10 Wafer transfer device 11 Transfer arm 12 Base 13 First arm 14 Second arm 15 Mounting part 20 Fork 20a Fork body 20b Fixed clamp part 20c Hanging wall 20d Inclined wall 21 Pusher 21a Pusher body 21b Movable clamp Part 21c Cylindrical part 21d Upper truncated cone part 21e Lower truncated cone part 22 Actuator 23 Kicker 23a First part 23b Second part 23c Third part 23d Fourth part 24 Detection part 24a First sensor 24b Second Sensor 100 Substrate processing system 313 to 316 Processing device 400 Control unit A1, A2 Detection area W Wafer

Claims (5)

基板の縁部と係合する固定クランプ部と、進退駆動部により前記固定クランプ部に対して進退動する可動クランプ部との間で基板を把持する基板把持機構であって、
前記可動クランプ部と連動して動く連動部材と、
第１の検知領域を有すると共に、該第１の検知領域に前記連動部材が存在するか否かを検知する第１のセンサと、
第２の検知領域を有すると共に、該第２の検知領域に前記連動部材が存在するか否かを検知する第２のセンサと、を備え、
前記連動部材は、前記可動クランプ部の進退方向に連なる第１～第４の部分を有し、
前記連動部材は、前記可動クランプ部の進退方向に沿って延在する中心領域を備え、
前記中心領域を間に挟んで一方側に前記第１のセンサ及び前記第１の検知領域が位置し、他方側に前記第２のセンサ及び前記第２の検知領域が位置し、
前記第１～第４の部分は、互いに異なる形状を有すると共に第１～第４の形状のいずれかを有し、
前記第１の形状は、前記一方側にのみ延び出した形状、前記第２の形状は、前記他方側にのみ延び出した形状、前記第３の形状は、前記一方側及び前記他方側のいずれにも延び出さない形状、前記第４の形状は、前記一方側及び前記他方側の両方に延び出す形状を有することを特徴とする基板把持機構。 A substrate gripping mechanism that grips a substrate between a fixed clamp portion that engages with an edge portion of a substrate and a movable clamp portion that advances and retreats with respect to the fixed clamp portion by an advance / retreat drive portion.
An interlocking member that moves in conjunction with the movable clamp portion,
A first sensor having a first detection area and detecting whether or not the interlocking member is present in the first detection area, and a first sensor.
It has a second detection area and includes a second sensor that detects whether or not the interlocking member is present in the second detection area.
The interlocking member has first to fourth portions connected in the advancing / retreating direction of the movable clamp portion.
The interlocking member includes a central region extending along the advancing / retreating direction of the movable clamp portion.
The first sensor and the first detection region are located on one side of the central region, and the second sensor and the second detection region are located on the other side.
The first to fourth portions have different shapes from each other and have any of the first to fourth shapes.
The first shape is a shape extending only to the one side, the second shape is a shape extending only to the other side, and the third shape is either the one side or the other side. The substrate gripping mechanism is characterized in that the fourth shape has a shape extending to both the one side and the other side . 前記第１のセンサ及び前記第２のセンサは、非接触型のセンサであることを特徴とする請求項１に記載の基板把持機構。 The substrate gripping mechanism according to claim 1 , wherein the first sensor and the second sensor are non-contact type sensors. 請求項１または２に記載の基板把持機構と、該基板把持機構を制御する制御部とを備え、
該制御部は、前記第１のセンサ及び前記第２のセンサでの検知結果に基づいて、前記基板把持機構の状態を判定することを特徴とする基板搬送装置。 The board gripping mechanism according to claim 1 or 2 and a control unit for controlling the board gripping mechanism are provided.
The control unit is a substrate transfer device, characterized in that the state of the substrate gripping mechanism is determined based on the detection results of the first sensor and the second sensor. 前記制御部は、前記基板把持機構の状態が、開状態、動作中状態、把持状態、及び空振り状態のいずれであるかを判定することを特徴とする請求項３に記載の基板搬送装置。 The substrate transfer device according to claim 3 , wherein the control unit determines whether the state of the substrate gripping mechanism is an open state, an operating state, a gripping state, or a swinging state. 請求項３または４に記載の基板搬送装置と、該基板搬送装置により搬送された基板に所定の処理を行う処理装置とを備えることを特徴とする基板処理システム。 A substrate processing system comprising the substrate transfer device according to claim 3 or 4 , and a processing device that performs predetermined processing on the substrate conveyed by the substrate transfer device.
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