CN104303110B - Shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same - Google Patents

Shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same Download PDF

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Publication number
CN104303110B
CN104303110B CN201380025725.XA CN201380025725A CN104303110B CN 104303110 B CN104303110 B CN 104303110B CN 201380025725 A CN201380025725 A CN 201380025725A CN 104303110 B CN104303110 B CN 104303110B
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China
Prior art keywords
substrate
processing unit
processing
speed
cut
Prior art date
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CN201380025725.XA
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Chinese (zh)
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CN104303110A (en
Inventor
鬼头义昭
铃木智也
堀正和
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Nikon Corp
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Nikon Corp
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Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201380025725.XA priority Critical patent/CN104303110B/en
Priority to CN201510795430.1A priority patent/CN105467627A/en
Priority to CN201510795438.8A priority patent/CN105479737B/en
Publication of CN104303110A publication Critical patent/CN104303110A/en
Application granted granted Critical
Publication of CN104303110B publication Critical patent/CN104303110B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/745—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool
    • B29C65/7451—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool the severing tool and the welding tool being movable with respect to one-another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8221—Scissor or lever mechanisms, i.e. involving a pivot point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B29C66/83221—Joining or pressing tools reciprocating along one axis cooperating reciprocating tools, each tool reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8324—Joining or pressing tools pivoting around one axis
    • B29C66/83241—Joining or pressing tools pivoting around one axis cooperating pivoting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/853—Machines for changing web rolls or filaments, e.g. for joining a replacement web to an expiring web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1857—Support arrangement of web rolls
    • B65H19/1873—Support arrangement of web rolls with two stationary roll supports carrying alternately the replacement and the expiring roll
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/461—Processing webs in splicing process
    • B65H2301/4615—Processing webs in splicing process after splicing
    • B65H2301/4617—Processing webs in splicing process after splicing cutting webs in splicing process
    • B65H2301/46172—Processing webs in splicing process after splicing cutting webs in splicing process cutting expiring web only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
    • B65H2301/4631—Adhesive tape
    • B65H2301/46312—Adhesive tape double-sided
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2408/00—Specific machines
    • B65H2408/20—Specific machines for handling web(s)
    • B65H2408/21—Accumulators
    • B65H2408/217—Accumulators of rollers type, e.g. with at least one fixed and one movable roller
    • B65H2408/2171—Accumulators of rollers type, e.g. with at least one fixed and one movable roller the position of the movable roller(s), i.e. the web loop, being positively actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Advancing Webs (AREA)
  • Replacement Of Web Rolls (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Liquid Crystal (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A kind of base plate processing system, has: the 1st processing unit, and the substrate transported with speed V1 is implemented the 1st process continuously；And the 2nd processing unit, transport by the substrate after the 1st processing unit processes with speed V2, substrate is implemented continuously the 2nd process, according to the 1st, the 2nd respective performance of processing unit, in the case of the relation of speed can being set to V1 ＞ V2, multiple 2nd processing unit is set, and also there is shut-off mechanism and select injection mechanism, according to the 1st, the 2nd respective performance of processing unit, in the case of the relation of speed can being set to V1 ＜ V2, multiple 1st processing unit is set, and also there are the multiple substrates by being implemented the 1st process by multiple 1st processing units, the engaging mechanism engaged successively and put into the 2nd processing unit.

Description

At shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate Reason method
Technical field
The form of the present invention relates to shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and processing substrate Method.
U.S. Provisional Application 61/650712 and on June 1st, 2012 that the application proposed based on May 23rd, 2012 propose U.S. Provisional Application 61/654500 and CLAIM OF PRIORITY, and its content is quoted so far.
Background technology
In the big picture display elements such as liquid crystal display cells, plane glass substrate deposits ITO (Indium Tin Oxide) etc. evaporation metal material after the semiconductor substance such as transparency electrode or Si, coating photoresistance also transfers circuit pattern.So After, after making photoresistance development, formed circuit pattern etc. by etching.But, along with the large screen of display element, glass substrate Also maximizing, thus, substrate conveyance becomes difficulty.It is therefore proposed that a kind of have flexibility substrate (such as, polyimides, The film structural component such as PET, metal forming or very thin sheet glass etc.) upper formed display element, (be the most only referred to as volume to volume mode Technology (for example, referring to patent documentation 1) referred to as " roll fashion ").
It addition, propose a kind of technology in patent documentation 2, i.e. with the peripheral part of the light shield of the cylindrical shape that can rotate Closely configuration is wound in the flexible strip sheet (substrate) of conveying roller and movement, makes mask pattern be exposed to substrate continuously.
It addition, propose a kind of technology in patent documentation 3, i.e. the flexible strip sheet that will come with roll fashion conveying The pattern of (substrate) forms region and is temporarily retained on plane microscope carrier, makes the projected light cover pattern image via amplification projecting lens Scan exposure forms region at this pattern.
Citation
Patent documentation 1: International Publication the 2008/129819th
Patent documentation 2: Japanese Unexamined Patent Publication 60-019037
Patent documentation 3: Japanese Unexamined Patent Publication 2011-22584
But, there are the following problems in the above prior art.
In the case of strip plate shape substrates is implemented multiple process successively, according to the performance of each processing unit, be suitable to place The conveyance speed of the substrate of reason is respectively different in each unit (respectively processing content).Such as, at exposure as patent documentation 2 In the case of reason, because of sensitivity and the brightness etc. of exposure illumination light of coating photosensitive layer on the surface of the substrate, make removing of substrate Speed (activity duration) is sent to be restricted.It addition, being dried after etching or the wet processed such as plating or this wet processed, add In hot step, by being transported lentamente by substrate, and obtain the advantage that can make liquid bath or dry/heating furnace miniaturization etc..
Additionally, in the deposition processes of functional material or the step etc. of printing or ink jet printing, in order to maintain high accuracy Change (miniaturization) and guarantee productivity ratio simultaneously, it may have optimal substrate conveyance speed.But, these optimal substrate conveyance speed Degree is mostly different because of processing unit.
Constructing the multiple processing unit of this combination, making strip plate shape substrates pass sequentially through and persistently carry out a succession of process Roll fashion production line (processing system) in the case of, the conveyance speed (speed of production line) of substrate have to cooperation process In the substrate conveyance minimum processing unit of speed.
Therefore, although the fast processing unit of processing speed plays, also to carry out at a slow speed substrate conveyance in performance the most completely. Therefore, the deterioration of efficiency of processing unit, and likely cannot promote the productivity ratio that production line is overall.
The purpose of the form of the present invention is, it is provided that one can aid in and carries large-duty shut-off mechanism, jointing machine Structure, base plate processing system and substrate processing method using same.
It addition, in patent documentation 1, the plate shape substrates flexible with roll fashion conveyance also mainly uses printing (ink-jet) side Formula forms electronic component on plate shape substrates.But, typically printing scene, when remaining of the plate shape substrates being wound in donor rollers Surplus tails off, then temporarily cease printing equipment, is cut off by plate shape substrates between printing equipment and recycling roll, will be as recycling roll And the plate shape substrates completing printing wound delivers to next step.In this case, from the entrance of printing equipment to outlet In printing path, printing can remain plate shape substrates in way, and these can all be discarded as defective products.With colour on paper or film In the case of ink, printing cost is the cheapest.But, in the case of forming electronic component with roll fashion, lamellar The manufacturing cost of the per unit length (m) of substrate is the most expensive, if printing scene will remain in device like that as Plate shape substrates is discarded, and the most excessively waste and cost increases.
Especially, in the case of medium-sized, the larger display panels that constitute based on organic EL are formed on plate shape substrates, sheet Shape substrate is continually by a series of multiple processing meanss, and such as photosensitive layer printing equipment, the such exposure of patent documentation 3 fills Put, after wet type processing device, drying device etc., be wound in recycling roll.Therefore, can speculate and pass through to recycling roll from donor rollers The plate shape substrates of multiple processing meanss (process step) can be the longest, once stops the conveyance of plate shape substrates, then can waste quite The plate shape substrates of distance.
The purpose of other forms of the present invention is, it is provided that a kind of suppression cost increases and puies forward large-duty processing substrate Device and substrate processing method using same.
Summary of the invention
The 1st form according to the present invention, it is provided that a kind of base plate processing system, has: the 1st processing unit, to along long limit side The 1st process is implemented continuously to the substrate transported with speed V1；And the 2nd processing unit, processed single by the 1st with the conveyance of speed V2 Unit process after substrate, substrate is implemented continuously the 2nd process, it is characterised in that according to the 1st, the 2nd processing unit respective Performance, it is possible in the case of the relation of speed is set to V1 ＞ V2, arranges multiple 2nd processing unit, and at the 1st processing unit Afterwards, also have: the shut-off mechanism that the substrate implementing the 1st process is cut off with the specific length of long side direction；Cut off with inciting somebody to action After substrate put into the selection injection mechanism of any one of multiple 2nd processing units, according to the 1st, the 2nd processing unit each Performance, it is possible in the case of the relation of speed is set to V1 ＜ V2, multiple 1st processing unit is set, and processes the 2nd single Before unit, also there are the multiple substrates by being implemented the 1st process respectively by multiple 1st processing units, engage successively along long side direction And the engaging mechanism put into the 2nd processing unit.
The 2nd form according to the present invention, it is provided that a kind of substrate processing method using same, has: by the 1st processing unit to along long limit The action of the 1st process is implemented continuously with the substrate that speed V1 transports in direction；Transport by the 1st processing unit processes with speed V2 After substrate, and by the 2nd processing unit, substrate is implemented continuously the action of the 2nd process, it is characterised in that according to the 1st, The 2nd respective performance of processing unit, it is possible in the case of the relation of speed is set to V1 ＞ V2, uses the multiple 2nd to process list Unit, and after the 1st processing unit, also have: the substrate implementing the 1st process is cut off with the specific length of long side direction Cut off step；The selection of any one put into multiple 2nd processing units with the substrate after cutting off puts into step, according to the 1, the 2nd respective performance of processing unit, it is possible in the case of the relation of speed is set to V1 ＜ V2, uses the multiple 1st to process Unit, and before the 2nd processing unit, also there are the multiple substrates by being implemented the 1st process respectively by multiple 1st processing units, The engagement step engaged successively along long side direction and put into the 2nd processing unit.
The 3rd form according to the present invention, it is provided that a kind of shut-off mechanism, has: cutting portion, and it will carry out predetermined processing Substrate cutting；And buffer part, it enables the storage capacity of substrate to change according to the computed carrier amount of substrate implementing predetermined processing, And adjust the computed carrier amount of the substrate transported towards cutting portion.
The 4th form according to the present invention, it is provided that a kind of engaging mechanism, has: junction surface, and it will implement the base of predetermined processing Plate engages；And buffer part, it enables the storage capacity of substrate to change according to the computed carrier amount of the substrate of enforcement predetermined processing, and adjusts The whole computed carrier amount putting into the substrate to predetermined processing from junction surface.
The 5th form according to the present invention, it is provided that a kind of base plate processing system, makes the substrate along long side direction conveyance from the 1st Processing unit, by afterwards, passes through from the 2nd processing unit, makes in the conveyance speed relative to the substrate in the 1st processing unit The conveyance speed of the substrate in the 2nd processing unit has shut-off mechanism when reducing, and this shut-off mechanism is at the 1st processing unit and the 2nd Between processing unit, substrate is cut off, in the conveyance relative to the substrate in the 1st processing unit with the specific length of long side direction Speed and make the conveyance speed of the substrate in the 2nd processing unit have engaging mechanism when increasing, this engaging mechanism processes single the 1st Between unit and the 2nd processing unit, substrate is engaged along long side direction.
The 6th form according to the present invention, it is provided that a kind of substrate board treatment, has: the 1st installation portion, and its installation is wound with 1st roller of the 1st substrate of strip；2nd installation portion, it installs the 2nd roller of the 2nd substrate being wound with strip；Processing mechanism, Some of 1st substrate and the 2nd substrate is carried enforcement predetermined processing as process substrate, an edge long side direction by it； Buffer gear, it is arranged between processing mechanism and the 1st installation portion, by the 1st substrate from the 1st roller supply in the longest storage specified After temporarily storing in the range of depositing, send to processing mechanism；Connecting with substrate and change mechanism, it is at buffer gear and the 1st installation portion Between cut off the 1st substrate, and the leading section of the 2nd substrate from the 2nd roller supply is bonded on the terminal of the 1st substrate of cut-out Portion, and send to buffer gear.
The 7th form according to the present invention, it is provided that a kind of substrate board treatment, has: the 1st installation portion, and its installation is wound with 1st roller of the 1st substrate of strip；2nd installation portion, it installs the 2nd roller of the 2nd substrate being wound with strip；Processing mechanism, Its using some of the 1st substrate and the 2nd substrate as processing substrate, and at edge long side direction conveying enforcement regulation Reason；Buffer gear, it is arranged between processing mechanism and the 1st installation portion, at the 1st substrate that will supply from the 1st roller in regulation After temporarily storing in the range of the longest storage, send to processing mechanism；Connecting with substrate and change mechanism, it is at buffer gear and the 1st Cut-out the 1st substrate between installation portion, and the leading section of the 2nd substrate from the 2nd roller supply is attached at the 1st substrate of cut-out On the established part of buffer gear side, and send to buffer gear.
The 8th form according to the present invention, it is provided that a kind of substrate board treatment, has: the 1st installation portion, and it is pacified removably Dress is wound with the 1st roller of the 1st substrate of strip；Maintaining part, it keeps the 2nd with the 1st substrate equivalent specifications with specific length Substrate；Processing mechanism, some of the 1st substrate and the 2nd substrate is carried by it as process substrate, an edge long side direction Implement predetermined processing；Buffer gear, it is arranged between processing mechanism and the 1st installation portion, and the 1st base that will supply from the 1st roller After plate temporarily stores in the range of the longest storage of regulation, send to processing mechanism；Connecting with substrate and change mechanism, it is in buffering Cut off the 1st substrate between mechanism and the 1st installation portion, and be connected to the leading section of the 2nd substrate supplied from maintaining part cut off The 1st substrate buffer gear side established part on, and send to buffer gear.
The 9th form according to the present invention, it is provided that a kind of substrate processing method using same, using the substrate of input strip as place Reason substrate and an edge long side direction conveying are on one side by processing mechanism enforcement predetermined processing, including following action: will be wound with 1st roller of the 1st substrate of strip is arranged on the action on the 1st roller installation portion；The 2nd of the 2nd substrate of strip the will be wound with Roller is arranged on the action on the 2nd roller installation portion；By being arranged in the buffer gear between processing mechanism and the 1st installation portion, will be from The action that 1st substrate of the 1st roller supply is sent to processing mechanism after temporarily storing in the range of the longest storage of regulation；With will The 1st substrate temporarily stored, during processing mechanism is sent, cuts off the 1st substrate between buffer gear and the 1st installation portion, And on the established part of the buffer gear side that the leading section of the 2nd substrate from the 2nd roller supply is attached at the 1st substrate of cut-out Action.
The 10th form according to the present invention, it is provided that a kind of substrate processing method using same, using the substrate of input strip as Process the long side direction conveying of substrate one edge while implementing predetermined processing by processing mechanism, including following action:
The 1st roller being wound with the 1st substrate of strip is arranged on the action on the 1st roller installation portion；Will be same with the 1st substrate The action that 2nd substrate of equal-specification is maintained in maintaining part with specific length；By be arranged in processing mechanism and the 1st installation portion it Between buffer gear, to processing mechanism after the 1st substrate from the 1st roller supply is temporarily stored in the range of the longest storage of regulation The action sent；With at the 1st substrate that will temporarily store during processing mechanism is sent, buffer gear and the 1st install Between portion cut off the 1st substrate, and the leading section of the 2nd substrate supply from maintaining part is attached at cut-out the 1st substrate delay Action on the established part of punch mechanism side.
The effect of invention
In the form of the present invention, it is possible to be effectively used in multiple process step the processing unit used respectively, make The productivity ratio lifting that the production line of processing substrate is overall.
It addition, in other forms of the present invention, it is possible to substrate waste is greatly decreased, it is possible to suppression cost increases effectively Add.
Accompanying drawing explanation
Fig. 1 is the figure that illustration represents the base plate processing system of the 1st embodiment.
Fig. 2 is the approximate three-dimensional map of the shut-off mechanism of the 1st embodiment.
Fig. 3 is the outline stereoscopic figure in the 1st splicer portion of the 1st embodiment.
Fig. 4 is the outline stereoscopic figure in the 2nd splicer portion of the 1st embodiment.
Fig. 5 is the control block diagram in the base plate processing system of the 1st embodiment.
Fig. 6 is the figure of the part composition of the device manufacturing system representing the 1st embodiment.
Fig. 7 is the figure of the model configuration example illustrating to constitute multiple processing units of the production line of the 1st embodiment.
Fig. 8 is the sequential chart of the activity duration lifting of the production line that the 1st embodiment is described.
Fig. 9 is to be denoted as the figure that a part for the device manufacturing system that the processing substrate of the 2nd embodiment is put is constituted.
Figure 10 is the figure of the schematic configuration representing the 1st splicer portion of the 2nd embodiment and the 1st buffer gear.
Figure 11 is the figure of the schematic configuration representing the 2nd splicer portion of the 2nd embodiment and the 2nd buffer gear.
Figure 12 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 13 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 14 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 15 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 16 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 17 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 18 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 19 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 20 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Figure 21 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Figure 22 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Figure 23 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Figure 24 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Figure 25 is the figure of the joint/cut-out action of the substrate representing that the substrate of the 2nd embodiment reclaims side.
Detailed description of the invention
1st embodiment
Hereinafter, illustrate at the shut-off mechanism of the present invention, engaging mechanism, base plate processing system and substrate referring to figs. 1 through Fig. 6 The embodiment of reason method.
Fig. 1 is to represent that as an example making plate shape substrates P pass sequentially through 3 processes step A, the reel of B, C in a schematic way The figure of the base plate processing system SYS of mode.
The main body of base plate processing system is configured to implement to process as step A the process list of A (the 1st processes) to substrate P Unit UA (the 1st processing unit), implement as step B to process B (the 1st process, the 2nd process) processing unit UB (the 1st process single Unit, the 2nd processing unit), implement as step C to process the processing unit UC (the 2nd processing unit) of C (the 2nd process), cutting machine Structure CU10, engaging mechanism PU10, selection injection mechanism ST1, ST2, control portion CT (with reference to Fig. 5).
Processing unit UA has the roller installation portion RSA for installing donor rollers RRA, by have been carried out processing the substrate P after A to Shut-off mechanism CU10 sends.Processing unit UB is made up of processing unit UB1～UB3 implementing identical process B respectively, such as, It is configured to upper and lower 3 layers or level 3 arrange in the downstream of the substrate conveyance direction of processing unit UA.
Each processing unit UB1～UB3 have for have been carried out process A substrate P roller install installation portion RSB11～ RSB31 and confession have been carried out processing installation portion RSB12～RSB32 that the roller of the substrate P of B is installed, from being arranged on installation portion The substrate P of roller RRB11～RRB31 (following, the most sub-roller RRB11～RRB31) on RSB11～RSB31 is at enforcement After reason B, it is wound in roller RRB12～RRB32 (below, the most sub-roller being arranged on installation portion RSB12～RSB32 RRB12～RRB32) on.
Additionally, in FIG, after the shut-off mechanism CU10 of processing unit UA rear class, it is provided with the base for having been carried out processing A The roller RR1 of plate P winding.When winding the specific length amount of substrate P on this roller RR1, then cutting off substrate P, roller RR1 is as sub-roller In RRB11～RRB31 any one and be arranged on any one of installation portion RSB11～RSB31 of each processing unit UB1～UB3 On.
Processing unit UC can will be implemented the arbitrary of sub-roller RRB12～RRB32 of process B by processing unit UB1～UB3 Individual install as roller RR2.It is wound on the substrate P on this roller RR2 (implementing the intermediate products processing A, B) via engaging mechanism PU10 moves into processing unit UC and implements to process C.Substrate P after acceptance process C is wound in and is arranged on roller installation portion RSC Recycling roll RRC on and reclaim.
Processing speed VA (the conveyance speed of substrate P) of the process A in the processing unit UA of present embodiment, processing unit The processing speed of the process C in processing speed VB (the conveyance speed of substrate P) of the process B in UB1～UB3, processing unit UC The relation of VC (the conveyance speed of substrate P) is as follows.
VA ≈ VC ＞ VB
Additionally, between any one of processing unit UA and processing unit UB1～UB3, the conveyance speed of substrate P becomes VA ＞ VB, thus, the 1st high with conveyance speed (V1) for processing unit UA processing unit is corresponding, and processing unit UB1's～UB3 is arbitrary Individual 2nd processing unit low with conveyance speed (V2) is corresponding.On the other hand, processing unit UB1～UB3 any one with process Between unit UC, the conveyance speed of substrate P becomes VB ＜ VC, thus, any one of processing unit UB1～UB3 and conveyance speed (V1) the 1st low processing unit is corresponding, and the 2nd high with conveyance speed (V2) for processing unit UC processing unit is corresponding.
In the present embodiment, processing speed VA, VC can be set as about 3 times of processing speed VB.As in the past, In the case of the processing unit UB of enforcement process step B is 1, it is linked to be the substrate P of 1 from donor rollers RRA to recycling roll RRC Passing sequentially through processing unit UA, UB, UC, thus, its conveyance speed is consistent with the slowest processing speed VB.That is, production line is overall Activity duration (line speed, productivity ratio) limited by the slowest processing unit.
In the present embodiment, by making the slow processing unit UB polytenization (being set up in parallel 3 at this) of processing speed, and Can constitute without restriction.Following shut-off mechanism CU10 is needed in order to realize this polytenization (or arranging multiple), its After substrate P is only wound on roller RR1 with specific length amount, does not temporarily cease process step A and process step B and cut off base Plate P.
Shut-off mechanism CU10 mainly cuts off with specific length and implements the substrate P processing A, as shown in Figures 1 and 2, has 1st buffer gear (the 1st buffer part) BF1 and the 1st splicer portion CSa (cutting portion).It addition, shut-off mechanism CU10 has further The action in the 1st splicer portion CSa (cutting portion) and the storage capacity of the substrate P in the 1st buffer gear BF1 (buffer part) is made to interlock Connecting move control portion.
1st buffer gear BF1 has tension reel mechanism DR1, by up and down motion of tension reel etc. and by substrate P Storing variable-length ground to adjust and simultaneously by substrate P move-in/move-out, wherein, this tension reel mechanism DR1 is located at and implements as the Between the unit UA and the 1st splicer portion CSa of the 1 process A processed, making substrate P turn back by multiple rollers etc., to store regulation long Tolerance.1st buffer gear BF1 has clamping and drives reel NR1, the downstream of the conveyance direction of its substrate P with processing unit UA Side is disposed adjacent, and adjusts the computed carrier amount (or conveyance speed) (with reference to Fig. 5) of the substrate P taken out of to the 1st splicer portion CSa. The driving of tension reel mechanism DR1 and clamping drive the driving of reel NR1 to be controlled by controlling portion CT.
Here, Fig. 3 of the diagrammatic perspective outward appearance by representing the 1st splicer portion CSa illustrates that it is constituted.
1st splicer portion CSa has: saddle 2, and it has by the absorption layer 1 that such as Porous material is formed at upper surface, and Can be mobile freely along the conveyance direction (hereinafter simply referred to as conveyance direction) of substrate P；Lifting platform 3 with guide rail, it is by saddle 2 Movably support along conveyance direction；Make the drive division 4 that lifting platform 3 lifts；Cutter part 5, it is in raise-position at lifting platform 3 When putting, the width along substrate P moves and can absorption substrate P on the absorption layer 1 of saddle 2 be cut off；Paste section 6, Substrate P can be pasted adhesive band TP by it；With maintaining part 8 (can move up and down), it is located at the top of lifting platform 3, and passes through Both sides keep the wireline reel 7 of the roller RR1 of the substrate P winding by having been carried out processing A.
Additionally, wireline reel 7 is pasted with, in a part (or whole side face) for its outer peripheral face, the resin molding that adhesion strength is high Or material, after the outer peripheral face of the leading section with wireline reel 7 that make substrate P contacts, make wireline reel 7 rotate, thereby, it is possible to automatically Ground winding substrate P.
These saddles 2, lifting platform 3, drive division 4, cutter part 5, paste section 6 and maintaining part 8 are as the work station of integration Portion SN and constitute, it is possible to being placed in castor platform etc. transports, and can be positioned assigned position.
These saddles 2, drive division 4, cutter part 5, each driving of paste section 6 are controlled (with reference to Fig. 5) by control portion CT.
It addition, work station portion SN has: moving part, it can keep substrate P to move along long side direction, and includes saddle 2, lifting platform 3, drive division 4 etc.；And mobile control division, it makes moving part move to cut-out region based on shut-off mechanism CU10, Or engaging zones of based on engaging mechanism PU10.
Additionally, the paste section 6 in present embodiment by adhesive band TP by substrate P fit but it also may for other Bonding method (mechanism).Can also be such as that bonding agent is coated with along the width orthogonal with the conveyance direction of substrate P with banding Apply and the mode of pressurizing attaching, in the case of substrate P is resin molding etc., the part to be fitted of substrate P is heated and crimps Mode, or the mode such as ultrasound joint.
It addition, the absorption layer 1 being located at the upper surface of saddle 2 keeps substrate P by Vacuum Pressure but it also may be configured to, By the mechanical type clamping device (jig arm etc.) beyond Vacuum Pressure, substrate P is locking with the upper surface of saddle 1.
Additionally, the selection injection mechanism ST1 shown in Fig. 1 is under the control of control portion CT, will have been carried out processing the substrate P of A Be wound in the roller RR1 (hereinafter referred to as sub-roller RR1) of wireline reel 7 as sub-roller RRB11, RRB21, RRB31 any one and select Property ground put into any one of installation portion RSB11～RSB31, and the wireline reel 7 of preparation is transported to sub-roller RR1 taken out of and The maintaining part 8 of the 1st splicer portion CSa being available.
In the present embodiment, processing speed VA, VC are about 3 times of processing speed VC, and processing unit UB also is provided with 3 and sets Put, therefore, the length of the substrate P that sub-roller RR1 (that is, sub-roller RRB11～RRB31, RRB12～RRB32, RR2 described later) is wound Degree, is set as being wound on about the 1/3 of the length of the substrate P in donor rollers RRA becoming female roller.
Therefore, shut-off mechanism CU10 is by the total length of the substrate P as being wound in donor rollers RRA about 3 decile Specific length cuts off substrate P.
It addition, the selection injection mechanism ST2 of Fig. 1 is under the control of control portion CT, selection will be by processing unit UB1～UB3 Any one implement process B substrate P only with specific length amount winding, the sub-roller RRB12 of installation portion RSB12～RSB32 ～any one of RRB32, and put into engaging mechanism PU10 (roller conveyance), and antithetical phrase roller RRB12's～RRB32 is arbitrary Individual installation portion RSB12～RSB32 transported and be available installs the wireline reel of preparation.
Enforcement is mainly processed any one of B sub-roller RRB12～RRB32 that transport as sub-roller by engaging mechanism PU10 RR2, and it is engaged near the terminal putting into cut-off substrate before, (engage as it is shown in figure 1, have the 2nd splicer portion CSb Portion) and the 2nd buffer gear (the 2nd buffer part) BF2.It addition, engaging mechanism PU10 includes: engage implementing the substrate processing B The 2nd splicer portion CSb (junction surface)；With the 2nd buffer gear (buffer part) BF2, it enables the storage capacity of substrate according to reality Execute the computed carrier amount of the substrate processing B and changed, and adjust the computed carrier amount of the substrate from junction surface that processed B puts into.
As shown in Figure 4, the 2nd splicer portion CSb is, the work station portion SN in being located at above-mentioned 1st splicer portion CSa makes base The conveyance direction of plate P becomes and arranges under contrary state.That is, the 2nd splicer portion CSb has: saddle 2, and it has at upper surface There is absorption layer 1, and can move freely along conveyance direction；Lifting platform 3 with guide rail, saddle 2 is moved certainly by it along conveyance direction As support；Make the drive division 4 that lifting platform 3 lifts；Cutter part 5, it is when lifting platform 3 is in lifting position, along the width of substrate P Degree direction is moved and can absorption substrate P on the absorption layer 1 of saddle 2 be cut off；Paste section 6, substrate P can be pasted by it Adhesive band TP；With maintaining part 8, it is located at the top of lifting platform 3, and keeps rolling up the substrate P having been carried out processing B by both sides Around the wireline reel 7 of roller RR2.
2nd buffer gear BF2 and the 1st buffer gear BF1 is similarly constituted, and the substrate P moved into processing unit UC is existed Store changeably in the length range that can adjust, be disposed adjacent with the upstream side of the conveyance direction of the substrate P of processing unit UC.
2nd buffer gear BF2 has: tension reel mechanism DR2, and it is by making the conveyance direction along substrate P adjacent many Individual roller rightabout to each other lifts, and can the storage capacity of substrate P be adjusted changeably；Driving reel NR2 with clamping, it is adjusted The computed carrier amount (conveyance speed) (with reference to Fig. 5) of the whole substrate P transported to tension reel mechanism DR2 from the 2nd splicer portion CSb.? The driving of power drum mechanism built DR2 and clamping drive the driving of reel NR2 to be controlled by controlling portion CT.
Fig. 5 is the control block diagram in the base plate processing system shown in Fig. 1～Fig. 4.
As it is shown in figure 5, control portion CT controls processing unit UA, UB (UB1～UB3), the action of UC, and plan as a whole to control to divide It is not located at the saddle 2 on shut-off mechanism CU10 and engaging mechanism PU10, drive division 4, cutter part 5, paste section 6, selects input machine Structure ST1, ST2, tension reel mechanism DR1, DR2, the driving of clamping driving reel NR1, NR2 etc..Additionally, control portion CT counts also The conveyance length of the substrate P in management donor rollers RRA, the rotation driving of recycling roll RRC, each step (each processing unit), and count The substrate surplus counting each roller managing the supply side becoming substrate P and the substrate winding of each roller reclaiming side becoming substrate P Amount, be also carried out the overall operation time till processing step A～C management, whether have on each roller the problem in process or The management etc. of the information such as the degree of generation unfavorable condition or position.Control portion CT includes the action and the 1st making shut-off mechanism CU10 The connecting move control portion that the storage capacity of the substrate P in buffer part BF1 interlocks.Similarly, control portion CT includes making engaging mechanism PU10 Action and the 2nd buffer part BF2 in the connecting move control portion that interlocks of the storage capacity of substrate P.
It follows that the action of the base plate processing system of above-mentioned composition is described.
Here, as it is shown in figure 1, in processing unit UB1 process B complete tight after, sub-roller RRB12 by select input machine Structure ST2 and the maintaining part 8 that transports to the 2nd splicer portion CSb.It addition, in processing unit UB2, to from being arranged on installation portion The substrate P enforcement that sub-roller RRB21 on RSB21 draws processes B.It addition, in processing unit UB3, until it becomes at Xia Yige The sub-roller RRB31 of reason object is standby till being arranged on installation portion RSB31.
It addition, in the following description, owing to the action of each constitution equipment is controlled by controlling portion CT, so omitting its note Carry.
First, when being wound with enforcement with specific length on the sub-roller RR1 of maintaining part 8 being held in the 1st splicer portion CSa After processing the substrate P of A, in the 1st buffer gear BF1, clamping drives reel NR1 to stop driving and stopping substrate P and connect to the 1st Supply with device portion CSa.Now, processing A and persistently carry out in processing unit UA, substrate P is sent to the 1st buffer gear BF1.Cause This, the tension reel mechanism DR1 in the 1st buffer gear BF1 drives to the direction making the storage capacity of substrate P increase.
Supply with the substrate P from the 1st buffer gear BF1 stops linkedly, carries out base in the 1st splicer portion CSa The cut-out of plate P processes.
Specifically, first, saddle 2 moves after the position relative with cutter part 5, is made by the action of drive division 4 Lifting platform 3 together rises with saddle 2.By the rising of saddle 2, absorption layer 1 keeps substrate P from the back side (lower surface) absorption, fixed Position is to off-position based on cutter part 5.Then, cutter part 5 moves along the width of substrate P and cuts off substrate P.Work as substrate After P is cut-off, select the installation portion that sub-roller RR1 is put into processing unit UB3 by injection mechanism ST1 as sub-roller RRB31 RSB31.It addition, the maintaining part 8 of the 1st splicer portion CSa selecting injection mechanism ST1 to be discharged at sub-roller RR1 and being available fills Fill out the wireline reel 7 of preparation.
In the 1st splicer portion CSa, after wireline reel 7 is arranged in maintaining part 8, saddle 2 moves so that adsorbing and being maintained at The fore-end of the substrate P of the upper surface of saddle 2 is positioned at the lower section of wireline reel 7 and (clamps simultaneously and drive reel NR1 the most only to synchronize rotation Turn ormal weight), the maintaining part 8 of supporting wireline reel 7 only declines certain distance, the fore-end of substrate P and the outer peripheral face of wireline reel 7 Adhesive part be in close contact.So, it is connected to new winding when the fore-end of the substrate P extended from the 1st buffer gear BF1 side After axle 7, releasing absorption based on absorption layer 1 and keep, then, maintaining part 8 is back to height and position originally, by drive division 4 Action and make lifting platform 3 together decline with saddle 2.
Then, clamping drives reel NR1 to start again at, from the 1st buffer gear with the rotation driving of new wireline reel 7 The supply of the substrate P of BF1 starts again at, and substrate P is wound in new wireline reel 7.After the supply of substrate P starts again at, clamping is driven (that is, substrate P is to the 1st with the transporting velocity than the substrate P corresponding with processing speed VA in processing unit UA for movable reel NR1 The speed of buffer gear BF1 conveying) the fastest speed rotates.In tension reel mechanism DR1, drive reel NR1's with clamping Drive accordingly, drive to the direction making the storage capacity of substrate P reduce.
The length of the substrate P in being stored in the 1st buffer gear BF1 becomes substantially after minimum, with processing unit UA In the identical speed of the transporting velocity of substrate P drive clamping to drive reel NR1.
On the other hand, the sub-roller RRB31 extraction substrate P from the installation portion RSB31 being arranged on processing unit UB3, and with The speed corresponding with processing speed VB carries and implements to process B, is wound to the sub-roller RRB32 being arranged on installation portion RSB32.
In processing unit UB3, during the substrate P enforcement drawn from sub-roller RRB31 is processed B, single processing In unit UB2, the process B being implemented the substrate P drawn from sub-roller RRB21 completes, and the sub-roller RRB2 being wound with substrate P is installing Portion RSB22 is standby.
By selecting injection mechanism ST2, to from the sub-roller being arranged on engaging mechanism PU10 as sub-roller RR2 before The substrate P of RRB12, after completing process C based on processing unit UC enforcement, in the 2nd buffer gear BF2 of engaging mechanism PU10 Clamping drive reel NR2 driving stop, stop the substrate P supply to tension reel mechanism DR2.
Now, in processing unit UC, process C and persistently carry out.Therefore, the DR2 action of tension reel mechanism, with single with process The certain speed of conveying capacity (processing speed VC) correspondence of the substrate P in unit UC, will be stored in the base in the 2nd buffer gear BF2 Plate P carries to processing unit UC.
In the 2nd splicer portion CSb, with in the 1st splicer portion CSa cut-out process in the same manner as, when saddle 2 move to After on the position that cutter part 5 is relative, lifting platform 3 is made together to increase with saddle 2 by the action of drive division 4.By saddle 2 Rising, absorption layer 1 keeps from the substrate P of sub-roller RRB12 from the back side (lower surface) absorption, and location is to based on cutter part 5 Off-position.Then, cutter part 5 moves along the width of substrate P and cuts off substrate P.After cutting off substrate P, select input machine Structure ST2 takes out the wireline reel 7 being wound with sub-roller RR2 (RRB12) from maintaining part 8, is arranged on installation portion in empty maintaining part 8 Sub-roller RRB22 that RSB22 is standby and as sub-roller RR2.
After group roller RRB22 is arranged in the maintaining part 8 in the 2nd splicer portion CSb as sub-roller RR2, from sub-roller RR2 The fore-end of substrate P drawn is directed at the rearward end of the substrate P of the 2nd buffer gear BF2 side cut off before, 2 plate base P Kept by absorption layer 1.In this condition, 2 plate base P are engaged by adhesive band TP.After substrate P engages, release based on absorption layer 1 Absorption keep, then, make lifting platform 3 together decline with saddle 2 by the action of drive division 4.Then, clamped by driving Drive reel NR2, start again to the supply of the substrate P of the 2nd buffer gear BF2 from the 2nd splicer portion CSb.
After the supply of substrate P starts again at, clamping drive reel NR2 with than with processing speed VC in processing unit UC The speed that the transporting velocity of corresponding substrate P is the fastest rotates.In tension reel mechanism DR2, drive driving of reel NR2 with clamping Move accordingly, drive to the direction making the storage capacity of substrate P increase.
Become substantially after maximum when storing to the length of the substrate P in the 2nd buffer gear BF2, with processing unit UC In the identical speed of the transporting velocity of substrate P drive clamping to drive reel NR2.Then, from defeated via the 2nd buffer gear BF2 Deliver to the substrate P that the sub-roller RRB22 (sub-roller RR2) of processing unit UC draws, be carried out process C with processing speed VC.
Process the substrate P of A and be wound as the number of units according to processing unit UB as it has been described above, implemented by processing unit UA and divide After the sub-roller RR1 of the length cut, put into successively to processing unit UB1～UB3 and implement to process B, then, from processing unit UB1 ～UB3 puts into successively as sub-roller RR2 and implements to process C to processing unit UC.About processing speed VB than processing speed VC Slow processing unit UB, is provided with 3 according to the ratio of processing speed, thus, from surface, from 3 processing unit UB1 ～UB3 is with the cycle identical with the situation processing B with the 3 of processing speed VB times of processing speed enforcements, is put into extremely by sub-roller RR2 Processing unit VC.
As explained above ground, in the present embodiment, according to the respective performance of processing unit UA, UB, and can In the case of being set as processing speed VA ＞ processing speed VB, by number of units m of number of units n of processing unit UA and processing unit UB Relation is set to n ＜ m, substrate P is cut to the sub-roller of the length corresponding with number of units m and optionally puts into the process list to m platform Any one of unit UB1～UBm.Thus, being not limited by reduction process speed VB, if observing with production line entirety, then can Substrate P is processed with processing speed VA.
It addition, according to the respective performance of processing unit UB, UC, it is possible to it is set as processing speed VB ＜ processing speed VC In the case of, processing unit UB1～UBm of multiple stage (m) substrate P implementing the sub-roller RR2 processing B is engaged successively and puts into Processing unit UC to n platform (n ＜ m).Therefore, it is possible to substantially suppression substrate P is moved into processing unit UC from processing unit UB Till waiting time.
Therefore, in this case, reduction process speed VB also it is not limited by, it is possible to process base with processing speed VC (≈ VA) Plate P.
Therefore, in the present embodiment, the situation of different multiple process A～C of processing speed is implemented successively, it is also possible to scheme Seek survival the lifting of productivity.It addition, in the present embodiment, the number of units of processing unit UB is set according to the ratio of processing speed. Therefore, efficient processing substrate will not be realized while equipment is excessively set.On this basis, in the present embodiment, by polytenization Processing unit UB1～UB3 multilamellar along the vertical direction arrange situation, setting area (footprint) will not be increased can Implement efficient processing substrate.
It addition, in the present embodiment, shut-off mechanism CU10 and the engaging mechanism of band buffer gear of band buffer gear is made PU10 is to be used in the cut-out general composition with either one engaged, and is set to work station portion SN.Therefore, it is not required to Different types of device is individually set, it is possible to reduce the cost of production equipment.
That is, between adjacent in a succession of multiple processing units processing unit, if relative to the conveyance direction of substrate P The processing unit of upstream side, the processing speed of the processing unit in downstream is relatively low, and arranges work station portion SN betwixt as cutting Breaking mechanism CU10, in the case of the relation of processing speed is contrary, arranges work station portion SN between adjacent processing unit and makees For engaging mechanism PU10.
That is, the base plate processing system of present embodiment can be, process adjacent in a series of multiple processing units Between unit, relative to substrate P conveyance direction upstream side processing unit (the 1st processing unit) in the conveyance of substrate P Speed, when making the conveyance speed of substrate P in the processing unit (the 2nd processing unit) in downstream reduce, the 1st processing unit with Between 2nd processing unit, there is shut-off mechanism CU10 substrate P cut off with the specific length of long side direction, relative to the 1st The conveyance speed of the substrate P in processing unit, and when making the conveyance speed of the substrate P in the 2nd processing unit increase, at the 1st Between reason unit and the 2nd processing unit, there is engaging mechanism PU10 substrate P engaged along long side direction.
(device manufacturing system)
It follows that illustrate to be suitable for the device manufacturing system of aforesaid substrate processing system with reference to Fig. 6.
Fig. 6 is the part composition of the device manufacturing system (flexible display production line) being denoted as base plate processing system Figure.Here, represent the flexible substrate P (sheet, film etc.) drawn from donor rollers RR1 sequentially pass through n platform processing means U1, U2, U3, U4, U5 ... Un and the example that is wound in recycling roll RR2.Host control device CONT (control portion) plans as a whole to control to constitute to produce Each processing means U1 of line～Un.
Additionally, processing means U1 shown in Fig. 6～Un can be for any one of processing unit UA～UC shown in Fig. 1, also Can be to make more than 2 continuous print processing meanss in processing means U1～Un come together the arbitrary of alignment processing unit UA～UC Individual.
In figure 6, orthogonal coordinate system XYZ is set as that the surface (or back side) of substrate P is vertical with XZ face, with substrate P The orthogonal width of conveyance direction (long side direction) is set as Y direction.Additionally, this substrate P is by before prespecified Process and by its surfaction activation or trickle next door structure (the concavo-convex structure that forms precise pattern on surface Make) substrate.
The substrate P being wound in donor rollers RR1 is drawn by the driving reel DR10 of clamping and is transported to processing means U1.The Y direction (width) of substrate P centrally through marginal position controller EPC1, and with relative to target location receive Hold back the mode SERVO CONTROL in the range of in about ± tens μm～tens μm.
Processing means U1 be with mode of printing in the conveyance direction (long side direction) of substrate P by photonasty functional liquid (light Resistance, photonasty silicon alkane coupling material, photonasty coupling material, photonasty close and distant liquid modification agent, photonasty plating reducing agent, UV solidifies tree Fat liquid etc.) continuously or the applying device that is optionally applied on the surface of substrate P.Winding it is provided with in processing means U1 There is laminate reel DR20, the applying mechanism Gp1 of substrate P and remove institute in the photonasty functional liquid being coated in substrate P rapidly The solvent contained or the drier Gp2 etc. of moisture, wherein, applying mechanism Gp1 is included in photonasty on this laminate reel DR20 Functional liquid is evenly coated at the painting application reel on the surface of substrate P or using photonasty functional liquid as ink print Relief printing plate or the version body reel etc. of intaglio plate.
Processing means U2 be for the substrate P moved from processing means U1 is heated to set point of temperature (such as, tens～ About 120 DEG C) and the heater that makes the photonasty functional layer being coated in surface stably fix.It is provided with in processing means U2 and makes Substrate P is turned back and multiple reels of transporting and air swingle, the heating chamber portion HA1 that the substrate P moved into is heated, make heating after Substrate P at a temperature of reduce to the cooling chamber portion HA2 consistent with the ambient temperature of subsequent step (processing means U3) and clamped Driving reel DR3 etc..
Processing means U3 is the photonasty functional layer relative to the substrate P moved from processing means U2, irradiates and display The exposure device of the patterning light of the circuit pattern of device or ultraviolet corresponding to wiring pattern.Be provided with in processing means U3 by The center of the Y direction (width) of substrate P controls as the marginal position controller EPC on certain position, clamped driving Movable reel DR4, by substrate P with regulation tension force local winding and by substrate P pattern exposure part support for uniform cylinder The rotating cylinder DR5 of planar and substrate P is paid 2 groups of drivings reel DR6, DR7 etc. of lax (space) DL of regulation.
And, it is provided with in processing means U3: infiltration type cylinder light shield DM；It is located in this cylinder light shield DM and will be formed in The lighting mechanism IU of the mask pattern photograph of the outer peripheral face of cylinder light shield DM；With the aligming microscope AM1 of detection alignment mark etc., AM2, this alignment mark is the picture of a part for the mask pattern in order to make cylinder light shield DM and substrate P is propped up with by rotating cylinder DR5 The part holding the substrate P for cylinder planar is relatively directed at (Alignment) and is previously formed in substrate P.
Processing means U4 is the photonasty functional layer relative to the substrate P moved from processing means U3, carries out such as wet type The wet type processing device of at least one of such various wet processed such as development treatment, electroless plating process.Processing dress 3 treatment trough BT1 along Z-direction form a social stratum, BT2, BT3, the multiple reels transported by substrate P warpage, institute it is provided with in putting U4 The driving reel DR8 etc. of clamping.
Processing means U5 is the substrate substrate P moved from processing means U4 being heated and getting wet because of wet type flow process The moisture amount of P is adjusted to the heat drying apparatus of setting, but omits and illustrate.Then, through several processing meanss And by the substrate P of last processing means Un of a series of flow process, it is wound on recovery by the driving reel DR10 of clamping On roller RR2.When this winding, so that center or the edge of substrate of Y direction of the Y direction (width) of substrate P will not be made Will not the mode of deviation in the Y-axis direction, by marginal position controller EPC2, sequentially Correction and Control drives reel DR10 and returns Receive the relative position in the Y-axis direction of roller RR2.
In the device manufacturing system of above-mentioned Fig. 6, according to each processing means U1, U2, U3, U4, the process speed of U5 ... Un Degree, makes the slow processing unit polytenization of processing speed and is set up in parallel multiple stage, and, in this place before reason device, cutting machine is set Structure CU10, and be provided for substrate is put into the selection injection mechanism ST1 of any one to multiple processing meanss.
It addition, after the multiple stage processing means that processing speed is slow, arrange the multiple substrates that will take out of from each processing means The engaging mechanism PU10 engaged successively, thus, even if in the case of implementing multiple process that processing speed is the most different successively, Also the process step that processing speed is minimum it is not limited by, it is possible to seek the lifting of productivity ratio.
In the case of the production line shown in Fig. 6, processing means U2 carrying out heat treated does one's utmost to suppress the conveyance of substrate P Speed, thereby, it is possible to reduced by the volume of chamber portion HA1, HA2, accordingly, has and can cut down use electric power and can reduce The advantage of the setting area of device.
On the other hand, processing means U2 tight before processing means U1 in, photonasty functional liquid is patterned and prints Situation about being coated on the surface of substrate P is configured to, and uses version body (intaglio plate or the relief printing plate) reel of pattern printing, rolls up at this After coating photonasty functional liquid is as ink on cylinder, substrate P is made to be connected to edition body reel to transfer pattern.In this case, Good to the pattern transfer characteristics of substrate P in order to make from version body reel, and must be with speed conveying substrate the most faster P。
So, in processing means U1 and processing means U2, the substrate conveyance likely desired according to device performance Speed (processing speed) is significantly different.Therefore, in this case, if the processing unit UA that processing means U1 is set in Fig. 1, Make processing means U2 polytenization as processing unit UB1～UB3 in Fig. 1, then can construct efficiently and productivity ratio is high Production line.
Here, the sequential chart based on the model example shown in Fig. 7 and with reference to Fig. 8 illustrates that the processing system at Fig. 1 before is (raw Produce line) in the case of, compared with process based on single line in the past, it is possible to expect that the activity duration of how many degree promotes.
Fig. 7 (a) represents makes to process 3 steps A respectively, processing unit UA, UB, UC of B, C are respectively 1 and carry out single line The model example of situation about processing.Here, be wound with the substrate P that total length is 1200m in donor rollers RRA.It addition, each processing unit UA～UC assumes have following disposal ability as the performance of device.That is, processing unit UA has with maximum 15cm/s defeated Sending substrate P and carry out the ability processed, processing unit UB has with maximum 5cm/s conveying substrate P and carries out the ability processed, place Reason unit UC has with maximum 15cm/s conveying substrate P and carries out the ability processed.
In the case of this single line, the conveyance speed of the substrate P that production line is overall is with the slowest processing unit UB's Speed 5cm/s is consistent, and thus, the production operation time (substrate of 1200m is implemented Overall Steps and processes the time of A, B, C) is 400 minutes (6 hours 40 minutes).
In contrast, Fig. 7 (b) represents the model example of the production line of polytenization as Fig. 1 before.Each processing unit UA, UB (UB1～UB3), each performance of UC are identical with the situation of explanation in Fig. 7 (a).In the same manner as Fig. 1 before, make Carry out processing the processing unit UB polytenization of step B, 3 unit UB1～UB3 are set, the cut-out after processing unit UA will be included Cut-out in mechanism CU10 processes time and sub-roller replacing construction based on selection injection mechanism ST1 etc. in interior time It is set to 3 minutes, the joining process time in the engaging mechanism PU10 before processing unit UC will be included and based on selection injection mechanism The sub-roller replacing construction etc. of ST2 is set to 3 minutes in interior time.
It addition, as shown in Fig. 7 (b), make the processing unit UB polytenization that processing speed is slow, therefore, processing unit UA, UC set It is set to and transports substrate P with maximal rate 15cm/s ensured by respective performance.
The sequential chart of Fig. 8 is the activity duration of the model example estimating Fig. 7 (b), makes production line S1, S2, S3 hypothetically with 3 Individual processing unit UB1～the UB3 corresponding figure representing each process time respectively.When the beginning processed, from donor rollers RRA Substrate P by processing unit UA process, but, substrate P is split by every the 1/3 of total length 1200m in shut-off mechanism CU10.By This, as shown in production line S1, the 1st 400m putting into the substrate to processing unit UA measures after processing with about 44.4 minutes, Shut-off mechanism CU10 was through the time of 3 minutes, and was delivered to processing unit UB1.
The activity duration of the substrate P that processing unit UB1 processes 400m amount is 133.3 minutes.Then, as the preparation of regulation Time (installation etc. of sub-roller) and after about 3 minutes, the substrate of the 1st 400m amount puts into processing unit UC, with conveyance The process of speed 15cm/s.The activity duration of the substrate of 400m based on processing unit UC amount is 44.4 minutes.
In the process, as shown in production line S2, processing unit UA persistently carried out the 2nd 400m amount in about 44.4 minutes The process of substrate, then, as shown in production line S3, in about 44.4 minutes, persistently carry out the 3rd with conveyance speed 15cm/s The process of the substrate of 400m.The substrate of the 2nd 400m amount is delivered to place after 3 minutes times based on shut-off mechanism CU10 Reason unit UB2, consumes at this and processes for about 133.3 minutes.
In processing unit UC, the process of the substrate of the 1st 400m amount complete be from the beginning of time 228.1 minutes it After.But, before this, the place reason processing unit UB2 of the substrate of the 2nd 400m amount completes, the substrate warp of the 2nd 400m amount By engaging mechanism PU10, select injection mechanism ST2C, after the time of about 3 minutes, with the substrate of the 1st 400m amount Terminal part engages.
Then, processing unit UC process that the substrate with the 1st 400m engages constantly with conveyance speed 15cm/s the 2nd The substrate of 400m amount.
Similarly, as shown in production line S3, shut-off mechanism CU10 the substrate of the 3rd (finally) 400m amount after cutting off is complete After having become the process in processing unit UA, put into processing unit UB3, be wound on after 133.3 minutes on sub-roller RRB32. The substrate of the 3rd 400m amount, also in processing unit UC, before the process of the substrate of the 2nd 400m amount completes, completes Process in processing unit UB32.
During the substrate being processed the 2nd 400m amount by processing unit UC, the substrate of the 3rd 400m amount is via joint Mechanism PU10, select injection mechanism ST2C after the time of about 3 minutes, with the terminal of the substrate of the 2nd 400m amount Part engages.Then, processing unit UC process that the substrate with the 2nd 400m engages constantly with conveyance speed 15cm/s the 3rd The substrate of individual 400m amount.
As it has been described above, by the unit polytenization making process step B, and make the process of the substrate P that 1200m measures with 317 points Clock (5 hours 17 minutes) terminates.This situation, compared with the model example that the single line shown in Fig. 7 (a) processes, improves about 20% Activity duration (shortening of production time).
In the model example shown in Fig. 7 (b), although the total length as the substrate P in donor rollers RRA of female roller will be wound on It is set to 1200m, but, even if being the length on this, as long as carrying out substrate in shut-off mechanism CU10 with every 400m Segmentation, can making input to the substrate of production line the most persistently be delivered to last process step C.
Additionally, in the model example shown in Fig. 7 (b), all operate 3 processing units with identical processing speed (5cm/s) UB1～UB3, but it is also possible in the range of can adjusting, make the conveyance speed of substrate in each unit UB1～UB3 only with Small quantity is different.
Above, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned example.Upper Each shape and the combination etc. of stating each constituting portion material shown in example are examples, it is possible in the scope not departed from from the purport of the present invention In, carry out various change based on design requirement etc..
Such as, in the above-described embodiment, it is configured to be provided with 3 processing unit UB1～UB3, but it is also possible to constitute For, according to the ratio setting 2 of processing speed or arrange more than 4.
It addition, in the above-described embodiment, make the step polytenization of a part in the production line being made up of single line.But It is, even if at production line originally (producing like products, same to category) from initial step to last step polytenization In the case of, it is also possible to apply above-mentioned embodiment.
Such as, in the case of the production line processed at single line as script Fig. 7 (a) is set side by side with 2, it is also possible to For, after 2 processing unit UA (UA1, UA2), it is respectively provided with shut-off mechanism CU10 (CU101, CU102), by 2 works afterwards Industry time low processing unit UB add 3 as 5 unit UB1～UB5 polytenization, then, then 2 jointing machines are set Structure PU10 (PU101, PU102), then, arranges 2 processing unit UC (UC1, UC2).
In this composition, so that by the unit length after any one cut-out of shut-off mechanism CU101, CU102 (such as Substrate 400m), the mode of any one unit being delivered in 5 processing unit UB1～UB5 be available constitutes selection input machine Structure ST2, and with engaging mechanism PU101, PU102 accept respectively by 5 processing unit UB1～UB5 any one process after list The mode of the substrate of bit length (such as 400m) constitutes selection injection mechanism ST2.
It addition, in the process of initial processing unit UA1, UA2, be preferably, in order to make processing unit UA1 only with unit Length (such as 400m) processes after the substrate of donor rollers RRA, and processing unit UA2 starts the substrate from donor rollers RRA Process, and pay time difference wittingly.
The roller that so, it is possible to avoid simultaneously installing female roller (RRA) in each of 2 processing units UA1, UA2 changes work Industry (the temporary transient interruption of production development), and make each processing unit effectively operate.
2nd embodiment
Hereinafter, substrate board treatment and the embodiment of substrate processing method using same of the present invention are described with reference to Fig. 9 to Figure 25. In the present embodiment, for the element as above-mentioned embodiment, mark identical reference and said Bright simplification or omission.
Fig. 9 is the device manufacturing system (flexible display production line) put as processing substrate representing present embodiment The figure that a part of SYS is constituted.Here, illustrate following example, i.e. device manufacturing system SYS has installation donor rollers the (the 1st Roller) RR1 the 1st installation portion RS1, the 2nd installation portion RS2 (maintaining part) of donor rollers (the 2nd roller) RR2 is installed, recycling roll (the is installed 3 rollers) the 3rd installation portion RS3 of RR3 and install the 4th installation portion RS4 of recycling roll (the 4th roller) RR4, from donor rollers RR1, RR2 Some flexible substrate P (sheet, film etc.) drawn sequentially pass through the 1st splicer portion (substrate connect change mechanism) CSa, the 1st Processing means U1 of buffer gear BF1, n platform, U2, U3, U4, U5 ... Un, the 2nd buffer gear BF2, the 2nd splicer portion (the 2nd base Plate connect change mechanism) CSb and be wound to recycling roll RR3, RR4 some on.
Additionally, in the present embodiment, for putting into as processing substrate to the 1st, the 2nd buffer gear BF1, BF2, place Reason device U1 ... the substrate in Un, is properly termed as substrate P and illustrates.For drawing from donor rollers RR1, RR2 before input Substrate, properly termed as substrate P 1, P2 illustrate.For based on processing means U1 ... by recycling roll RR3, RR4 after the process of Un The substrate reclaimed, is properly termed as substrate P 3, P4 illustrates.
Host control device CONT (control portion, the 2nd control portion) plan as a whole control constitute production line each processing means U1～ Un and the 1st, the 2nd splicer portion CSa, CSb, the 1st, the 2nd buffer gear BF1, BF2.It addition, host control device CONT controls The rotation of the motor drive shaft MT1 being arranged in donor rollers RR1 in the 1st installation portion RS1 drives and installs in the 2nd installation portion RS2 The rotation of the motor drive shaft MT2 in donor rollers RR2 drives.It addition, host control device CONT includes making substrate P 1 (the 1st substrate) Cut-out action and the 1st buffer gear BF1 (buffer gear) in the connecting move control portion that interlocks of the storage capacity of substrate P 1.It addition, Host control device CONT includes the storage of the cut-out action making substrate P (process substrate) and the substrate P in the 2nd buffer gear BF2 The connecting move control portion that storage interlocks.
It addition, as shown in Figure 10, the supply of the substrate P 1 being provided with near the 1st installation portion RS1 in detection donor rollers RR1 The supply sensor S1 of situation.Sensor S1 is at the end of the supply of substrate P 1 being detected, to host control device CONT in supply End of output signal.Similarly, the state of supply of the substrate P 2 being provided with near the 2nd installation portion RS2 in detection donor rollers RR2 Supply sensor S2.Supply sensor S2, at the end of the supply of substrate P 2 being detected, exports to host control device CONT End signal.
In fig .9, orthogonal coordinate system XYZ is set as that the surface (or back side) of substrate P is vertical with XZ face, with substrate P The orthogonal width of conveyance direction (long side direction) is set as Y direction.Additionally, this substrate P is by before prespecified Process and by its surfaction activation or trickle next door structure (the concavo-convex structure that forms precise pattern on surface Make) substrate.
Figure 10 is the figure of the schematic configuration representing the 1st splicer portion CSa and the 1st buffer gear BF1.
1st splicer portion CSa is by from donor rollers RR1, some base drawn and carry to the 1st buffer gear BF1 of RR2 Plate connection is replaced by from donor rollers RR1, another substrate drawn of RR2, and has clamping driving reel NR1, cuts off joint Unit CU1, CU2.It addition, the 1st splicer portion CSa (substrate connects replacing mechanism) has control portion, this control portion controls to cut off Action and joint action, so that when the leading section of the substrate P 2 (the 2nd substrate) supplied from donor rollers RR2 (the 2nd roller) is bonded to After on the position of the terminal part becoming cut off substrate P 1 (the 1st substrate), cut off substrate P 1 (the 1st substrate).
Clamping drives reel NR1 under the control of host control device CONT, keeps substrate P 1 or substrate P 2 and to the 1st Buffer gear BF1 carries, or stops the conveying of substrate P, and is arranged in the 1st installation portion RS1 and the 2nd installation portion in the Z-axis direction The approximately mid way between of RS2.
Cut off joint unit CU1, CU2 to put down with the X/Y plane passed through from the position clamping the Z-direction driving reel NR1 Centered by the virtual composition surface VF1 of row, configure symmetrically along Z-direction.Cut off joint unit CU1 with virtual composition surface VF1 Faced by position on there is absorption layer 1A, cutter 2A and tension reel 3A.It addition, cut off joint unit CU1 by not shown Rotating mechanism, is cut off bonding station relative with absorption layer 1A for joint unit CU2 and such as figure by shown in solid in such as Figure 10 By be sticked (swing) in rotary moving between position that absorption layer 1A shown in double dot dash line and the 1st installation portion RS1 are relative in 10.And And, joint unit CU1 is at bonding station in cut-out, by not shown travel mechanism along (i.e. cutting relative to virtual composition surface VF1 Disconnected joint unit CU2) leave/close direction moves.Absorption layer 1A cut off joint unit CU1 be in bonding station time, with Cutter 2A compares the downstream (+X-axis side) of the conveying direction being arranged in substrate P (substrate P 1).
Similarly, cut off joint unit CU2, on the position faced by virtual composition surface VF1, there is absorption layer 1B, cutter 2B and tension reel 3B.It addition, cut off joint unit CU2 to pass through not shown rotating mechanism, by shown in solid in such as Figure 10 Ground cut off the joint unit CU1 bonding station relative with absorption layer 1B and as in Figure 10 by absorption layer 1B shown in double dot dash line Be sticked position between in rotary moving (swing) relative with the 1st installation portion RS2.And, cut off joint unit CU2 and engage position Put, by not shown travel mechanism along leaving relative to virtual composition surface VF1 (i.e. cut off joint unit CU1)/close Direction is moved.Absorption layer 1B, when cutting off joint unit CU2 and being in bonding station, is arranged in substrate P (substrate compared with cutter 2B The downstream (+X-axis side) of conveying direction P2).
These movements cutting off joint unit CU1, CU2 are controlled by host control device CONT.
1st buffer gear BF1 is arranged between processing means (processing mechanism) U1 and the 1st splicer portion CSa, and will be from The substrate P of the 1st splicer portion CSa conveying is sent to processing means U1 after temporarily storing in the range of the longest storage of regulation, and There is tension reel mechanism DR1 and clamping drives reel NR2.
Clamping drive reel NR2 keep by the 1st buffer gear BF1 store substrate P and to processing means U1 carry, with Power drum mechanism built DR1 is compared the conveyance direction downstream side by substrate P and is arranged in and clamps the Z axis driving reel NR1 roughly the same Position.
Tension reel mechanism DR1 is along the X-direction alternately arranged multiple upper stratas having range to be located opposite from top volume Cylinder RJ1 and range are located opposite from the lower floor reel RK1 of lower section, and each reel RJ1, RK1 can be separately along Z Direction of principal axis moves.The upper dead center position JU1 and lower dead point position JD1 of upper strata reel RJ1 and the upper dead center position of lower floor reel RK1 JU2 and lower dead point position JD2 compares the position being set as top.These tension reel mechanisms are controlled by host control device CONT The action of DR1.
Figure 11 is the figure of the schematic configuration representing the 2nd splicer portion CSb and the 2nd buffer gear BF2.
2nd buffer gear BF2 is arranged between processing means (processing mechanism) Un and the 2nd splicer portion CSb, will be from process The substrate P of device Un conveying is sent to the 2nd splicer portion CSb after temporarily storing in the range of the longest storage of regulation, and has Clamping drives reel NR3 and tension reel mechanism DR2.
Tension reel mechanism DR2 is along the X-direction alternately arranged multiple upper stratas having range to be located opposite from top volume Cylinder RJ2 and range are located opposite from the lower floor reel RK2 of lower section, and each reel RJ2, RK2 can be separately along Z Direction of principal axis moves.The upper dead center position JU3 and lower dead point position JD3 of upper strata reel RJ2 and the upper dead center position of lower floor reel RK2 JU4 and lower dead point position JD4 compares the position being set as top.These tension reel machines are controlled by host control device CONT The action of structure DR2.
2nd splicer portion CSb by from the 2nd buffer gear BF2 conveying and by recycling roll RR3, RRR4 some reclaim Substrate P connect be replaced by be recycled to recycling roll RR3, RRR4 another, and have clamping drive reel NR4, cut off engage single Unit CU3, CU4.
Clamping driving reel NR4, will be from the base of the 2nd buffer gear BF2 conveying under the control of host control device CONT Plate P is towards cutting off joint unit CU3, CU4 conveying or stopping the conveying of substrate P, and the position of Z-direction is arranged in the 3rd installation Portion RS3 and the approximately mid way between of the 4th installation portion RS4 and the position of the virtual composition surface VF2 parallel with X/Y plane.
Cut off joint unit CU3, CU4 to configure symmetrically along Z-direction centered by virtual composition surface VF2.Cut-out connects Close unit CU3, on the position faced by virtual composition surface VF2, there is absorption layer 1C, cutter 2C and tension reel 3C.It addition, Cut off joint unit CU3 by not shown rotating mechanism, in such as Figure 11, cut off joint unit CU4 and suction by shown in solid Attached bonding station relative for pad 1C with as in Figure 11 by absorption layer 1C shown in double dot dash line and the 3rd patch relative for installation portion RS3 (swing) if in rotary moving between position.And, joint unit CU3 is at bonding station, by not shown travel mechanism in cut-out And along leaving relative to virtual composition surface VF2 (i.e. cut off joint unit CU4)/close direction moves.
Absorption layer 1C, when cutting off joint unit CU3 and being positioned at bonding station, is arranged in the conveying of substrate P compared with cutter 2C The upstream side (-X-axis side) in direction.
Similarly, cut off joint unit CU4, on the position faced by virtual composition surface VF2, there is absorption layer 1D, cutter 2D and tension reel 3D.It addition, cut off joint unit CU4 to pass through not shown rotating mechanism, by shown in solid in such as Figure 11 Ground cut off the joint unit CU3 bonding station relative with absorption layer 1D and as in Figure 11 by absorption layer 1D shown in double dot dash line Be sticked position between in rotary moving (swing) relative with the 4th installation portion RS4.And, cut off joint unit CU4 and engage position Put, by not shown travel mechanism along leaving relative to virtual composition surface VF2 (i.e. cut off joint unit CU3)/close Direction is moved.Absorption layer 1D, when cutting off joint unit CU4 and being in bonding station, is arranged in the defeated of substrate P compared with cutter 2D Send the upstream side (-X-axis side) in direction.
These movements cutting off joint unit CU3, CU4 are controlled by host control device CONT.
As shown in figure 11, in the 3rd installation portion RS3, reclaim reel RR3 and be arranged on motor drive shaft MT3.At the 4th installation portion In RS4, reclaim reel RR4 and be arranged on motor drive shaft MT4.Rotating of motor drive shaft MT3 drives and the rotation driving of motor drive shaft MT4 Controlled by host control device CONT.
It addition, as shown in figure 11, near the 3rd installation portion RS3, the substrate P 3 being provided with in detection recovery reel RR3 The winding sensor S3 of winding situation.Winding sensor S3 is at the end of the winding of substrate P 3 being detected, to host control device CONT end of output signal.Similarly, near the 4th installation portion RS4, it is provided with detection and reclaims the volume of the substrate P 4 in reel RR4 Winding sensor S4 around situation.Winding sensor S4 is at the end of the winding of substrate P 4 being detected, to host control device CONT end of output signal.
Reclaim reel RR3, RR4 there is leading section to be connected with roller core and be bonded to substrate P 3 or substrate 4 at terminal part Introducing substrate (the 3rd substrate) PK (in fig. 11, only diagram reclaims substrate P K of reel RR4) introduced.As substrate P K, can Think the material identical with carrying out substrate P based on processing means U1～the process of Un, it is also possible to for roughly the same with substrate P Thickness and material are different.
Processing means U5 of present embodiment is the substrate P heating that will move from processing means U4, and will be because of wet type stream The moisture amount of the substrate P that journey gets wet is adjusted to setting, or implements the crystallization of semi-conducting material or comprise metal nano The heat drying apparatus of the thermal annealing (less than 200 °) of the solvent removal etc. of the ink of particle, but omit and illustrate.Then, Temporarily store up by the 2nd buffer gear BF2 through several processing meanss and by the substrate P of last processing means Un of a succession of flow process Deposit, and be suitably attached by the 2nd splicer portion CSb changing, and be wound to recycling roll RR3 or recycling roll RR4.
It follows that the process of the substrate P illustrated with reference to Figure 12 to Figure 19 in the device manufacturing system SYS of above-mentioned composition In, the 1st splicer portion CSa and the action of the 1st buffer gear BF1.Additionally, composed component manufactures the various process dresses of system SYS Put, the action of constitution equipment etc. is controlled by host control device CONT, but in the following description, omits and fill about upper control Put the record that CONT is controlled.
Figure 12 is that the substrate P 1 drawn from donor rollers RR1 drives volume via the reel 3A and clamping cutting off joint unit CU1 Cylinder NR1 and as the 1st substrate to the 1st buffer gear BF1 conveying the figure that temporarily stores in the 1st buffer gear BF1.Such as Figure 12 Shown in, in the 1st buffer gear BF1, upper strata reel RJ1 is positioned at upper dead center position JU1, lower floor reel RK1 and is positioned at bottom dead centre position Putting JD2, thus, substrate P stores close to the longest length in the 1st buffer gear BF1.
In the 2nd installation portion RS2, it is wound with in the case of the substrate P 1 in donor rollers RR1 is used up and to be attached more After donor rollers RR2 of the substrate P 2 changed is arranged on motor drive shaft MT2, rotates and cut off joint unit CU2 and make absorption layer 1B move Move to the position that is sticked.(link or connect) the absorption layer of the position that is held within being sticked are adsorbed in the leading section making substrate P 2 1B, then, is being sticked two-sided tape T on the face of absorption side opposite side.
Above-mentioned substrate P 2 is carried out by operator or use machine to absorption and being sticked of two-sided tape T of absorption layer 1B Tool hands etc. is carried out.
The substrate P 2 of two-sided tape T of being sticked is after the absorption of absorption layer 1B has been fixed, and as shown in figure 13, rotates and cuts off Joint unit CU2 and make substrate P 2 move to bonding station, and driven by the rotation of motor drive shaft MT2 and make donor rollers RR2 Rotate, thus, to substrate P 2 pairs to the supplying party of substrate P 2 (being direction of rotation counterclockwise in fig. 13) in the opposite direction Tension force with regulation.
On the other hand, after supply sensor S1 detection terminates from the supply of the substrate P 1 of donor rollers RR1, clamping is stopped Drive the driving of reel NR1, and make motor drive shaft MT1 rotate driving to the direction contrary with the conveying direction of substrate P 1, thus, The substrate P 1 between reel NR1 and donor rollers RR1 is driven to pay weak tension force clamping.
After clamping drives the driving of reel NR1 to stop, clamping drives reel NR2 the most persistently to drive.Therefore, tension reel Mechanism's DR1 action, drives the driving of reel NR2 accordingly with clamping, makes the decline of upper strata reel RJ1 and lower floor reel RK1 Rise and suitably carry out.Thus, the substrate P being stored in the 1st buffer gear BF1 drives reel NR2 to processing dress by clamping Put U1 persistently to carry with certain speed.
It follows that as shown in figure 14, the direction making cut-out joint unit CU1, CU2 the most close is moved, double accompanying Under the state of face adhesive tape T, substrate P 1, P2 were crimped between absorption layer 1A, 1B with certain time.Thus, substrate P 2 is will be rear Continuous step is cut-off and becomes on the position of the terminal part of substrate P 1, fits with substrate P 1 via two-sided tape T and engages.
Additionally, during the joining process carrying out substrate P 1, P2, clamping drives reel NR2 and tension reel mechanism DR1 the most persistently drives, the substrate P being stored in the 1st buffer gear BF1 by clamping drive reel NR2 to processing means U1 with Certain speed persistently carries.
After substrate P 1 engages with substrate P 2, make the absorption layer 1B in cut-out joint unit CU2 to atmosphere opening, then, As shown in figure 15, make cut-out joint unit CU2 mobile to the direction (+Z-direction) left from cut-out joint unit CU1.Thus, From the leading section of the substrate P 2 of donor rollers RR2 extraction at the shape being engaged (link or be connected) by two-sided tape T with substrate P 1 Under state, absorption is maintained on the absorption layer 1A cutting off joint unit CU1.
Then, when substrate P 1 being paid tension force between cut-out joint unit CU1 and donor rollers RR1, by cutting Cutter 2A in disconnected joint unit CU1, cuts off relative substrate P 1.As cutter 2A, it is possible to use such as by making point of a knife The composition that width (Y direction) along substrate P 1 slides and substrate P 1 cut off.
During the cut-out carrying out substrate P 1 processes, clamping drives reel NR2 and tension reel mechanism DR1 also to continue Driving, the substrate P being stored in the 1st buffer gear BF1 drives reel NR2 to hold with certain speed to processing means U1 by clamping Continuous conveying.
When substrate P 1 cut off after, make the absorption layer 1A in cut-out joint unit CU1 to atmosphere opening, then, such as Figure 16 institute Show, make cut-out joint unit CU1 to from cutting off the direction (-Z-direction) shifting that joint unit CU2 (virtual composition surface VF1) leaves Dynamic.Thus, the substrate P 1 drawn from donor rollers RR1 is being that rightabout rotation is wound on the conveying direction of donor rollers RR1 In this donor rollers RR1.
It addition, about donor rollers RR2, by being rightabout torque with the conveying direction of donor rollers RR2, substrate P 2 exists Rotating roller RR2 and clamping drive and are paid tension force between reel NR1 (and reel 3B).Thus, be stored in the 1st buffer gear The substrate that substrate P in BF1 connects switches to the substrate P 2 as the 2nd substrate drawn from donor rollers RR2.As the 2nd substrate Substrate P 2 can also have the specification equal with substrate P 1 (the 1st substrate).
Then, clamping drives reel NR1 to rotate, in tension reel mechanism with the speed faster than clamping driving reel NR2 In DR1, as shown in figure 17, drive the driving of reel NR1 accordingly with clamping, make rising and lower floor's reel of upper strata reel RJ1 The decline of RK1 is suitably carried out.It addition, drive by making motor drive shaft MT2 rotate to conveying direction, and make to draw from donor rollers RR2 The substrate P 2 gone out is admitted to, and makes the storage length of the substrate P in the 1st buffer gear BF1 increase.
And, when the storage length of the substrate P in the 1st buffer gear BF1 becomes substantially after maximum, and clamping drives reel NR1 is to drive speed identical for reel NR2 to rotate with clamping, and thus, the storage length of the substrate P in the 1st buffer gear BF1 is equal Weighing apparatus.It addition, donor rollers RR1 that substrate P 1 is substantially used up is removed (can dismount) from the 1st installation portion RS1, as shown in figure 18, install It is wound with other donor rollers RR5 of substrate P 5.
After installing donor rollers RR5, testing result based on supply sensor S2, the substrate P 2 in donor rollers RR2 is used Before Jin, as shown in figure 18, rotate cut-out joint unit CU1 and make absorption layer 1A move to the position that is sticked.Before making substrate P 5 End adsorb and fix (link or connect) on the absorption layer 1A being positioned at the position that is sticked, then, with absorption side contrary Be sticked on the face of side two-sided tape T.
Then, make donor rollers RR5 to the side contrary with the direction of the supply of substrate P 5 by the rotating driving of motor drive shaft MT1 Rotate to (being direction of rotation counterclockwise in figure 18), thus, substrate P 5 is paid the tension force of regulation, make cut-out engage single simultaneously Unit CU1 rotates, as shown in figure 19, mobile to bonding station.
And, after the supply of the substrate P 2 in supply sensor S2 detection donor rollers RR2 terminates, stop clamping and drive volume The driving of cylinder NR1, and in the same manner as above-mentioned steps, the direction making cut-out joint unit CU1, CU2 the most close is moved, Make substrate P 2, P5 certain time be crimped between absorption layer 1A, 1B under the state accompanying two-sided tape T, then, connect by cut-out Close the cutter 2B in unit CU2 and cut off substrate P 2.Thus, the substrate being connected with the substrate P being stored in the 1st buffer gear BF1 Switch to the substrate P 5 drawn from donor rollers RR5.
So, the coating of the substrate P switched successively photonasty functional liquid in implementing processing means U1 processes, processes Wet processed in the process of heat treated in device U2, the pattern exposure in processing means U3, processing means U4 and process dress After putting the heat drying process in U5, it is delivered to the 2nd buffer gear BF2, the 2nd splicer portion CSb successively, and is recycled to reclaim Roller RR3 or recycling roll RR4.
It follows that the process of the substrate P illustrated with reference to Figure 20 to Figure 25 in the device manufacturing system SYS of above-mentioned composition In, the 2nd splicer portion CSb of recycling roll side and the action of the 2nd buffer gear BF2.
Figure 20 is to process substrate i.e. substrate P to drive reel NR3 be delivered to the 2nd buffer gear BF2 and store via clamping, from 2nd buffer gear BF2 drives the substrate P of reel NR4 conveying (discharge) via the reel cutting off joint unit CU3 via clamping 3C is recycled to the figure being arranged in recycling roll RR3 of the 3rd installation portion RS3.It addition, as shown in figure 20, at the 2nd buffer gear BF2 In, upper strata reel RJ2 is positioned at lower dead point position JD3, lower floor reel RK2 and is positioned at upper dead center position JU4, and thus, substrate P is with close In the shortest length is stored in the 2nd buffer gear BF2.
In the 4th installation portion RS4, after the winding of recycling roll RR3 has reclaimed, the recycling roll RR4 peace that substrate P is reclaimed It is contained on motor drive shaft MT4, then, rotates and cut off joint unit CU4 and make absorption layer 1D move to the position that is sticked.Make leading section with The terminal part of introducing substrate P K (hereinafter simply referred to as substrate P K) that recycling roll RR4 connects adsorbs and fixes (link or connect) On the absorption layer 1D being positioned at the position that is sticked, then, it is being sticked two-sided tape T on the face of absorption side opposite side.When at base It is sticked on plate PK after two-sided tape T, makes cut-out joint unit CU4 rotate and move to bonding station, and by motor drive shaft MT4 Rotation drive and make recycling roll RR4 rotate to the direction of recession (in fig. 20 for clockwise) of substrate P K (substrate P), by This, pay the tension force of regulation to substrate P K.
And, after the recovery of winding sensor S3 detection substrate P based on recycling roll RR3 terminates, stop clamping and drive The driving of reel NR4, and make the DR2 action of tension reel mechanism, make under rising and the lower floor reel RK2 of upper strata reel RJ2 Fall is suitably carried out.Thus, make to drive the substrate P of reel NR3 conveying at the 2nd buffer from processing means U5 by clamping Storage length in structure BF2 increases on one side with a certain amount of (conveying capacity corresponding with the conveyance speed of the substrate P in production line) Store.
On the other hand, after the recovery of substrate P based on recycling roll RR3 terminates, as shown in figure 21, cut-out joint unit is made CU3, CU4 move at the most close direction, make substrate P, PK certain time be crimped on suction when accompanying two-sided tape T Attached pad is between 1C, 1D.Thus, the terminal part of substrate P K substrate P in subsequent step becomes on the position of leading section when being cut off, Fit with substrate P via two-sided tape T and engage (link or be connected).
After substrate P engages with substrate P K, make the absorption layer 1D in cut-out joint unit CU4 to atmosphere opening, then, as Shown in Figure 22, make cut-out joint unit CU4 mobile to the direction (+Z-direction) left from cut-out joint unit CU3.Thus, base The leading section of plate PK is when engaging with substrate P by two-sided tape T, and absorption is maintained at the suction cutting off joint unit CU3 On attached pad 1C.
Then, when substrate P being paid tension force between cut-out joint unit CU3 and recycling roll RR3, by cutting off Cutter 2C in joint unit CU3, cuts off relative substrate P.After substrate P is cut off, make the suction in cut-out joint unit CU3 Attached pad 1C is to atmosphere opening, then, as shown in figure 23, makes cut-out joint unit CU3 to from cutting off the side that joint unit CU4 leaves Mobile to (-Z-direction).Thus, the substrate P from the 2nd buffer gear BF2 conveying (that is, is carried out in processing means U1～Un The substrate P processed) recycle object switch to recycling roll RR4.
During joining process in carrying out the 2nd above-mentioned splicer portion CSb and cut-out process, the most suitably carry out The rising of the upper strata reel RJ2 in the 2nd buffer gear BF2 and the decline of lower floor reel RK2, make to pass through from processing means U5 Clamping drives the substrate P of reel NR3 conveying storage length in the 2nd buffer gear BF2 to increase while storing up with a certain amount of Deposit.
And, after the recycle object of the substrate P to recycling roll RR4 has switched, clamping drives reel NR4 with than clamping Drive speed the fastest for reel NR3 to rotate, in tension reel mechanism DR2, drive the driving of reel NR4 accordingly with clamping, The decline of upper strata reel RJ2 and the rising of lower floor reel RK2 is made suitably to carry out, the joining process in the 2nd splicer portion CSb And during cut-out processes, make the length being stored in the substrate P in the 2nd buffer gear BF2 reduce, and become and be in initial stage shape The substantially minimum of state stores length (with reference to Figure 24).When the length of the substrate P being stored in the 2nd buffer gear BF2 becomes substantially After minimum, clamping is made to drive reel NR4 to drive speed identical for reel NR3 to rotate with clamping.
On the other hand, in completing the 3rd installation portion RS3 of recovery of substrate P, recycling roll RR3 is removed, such as Figure 24 institute Show have recycling roll RR6 of the leading section introducing substrate P K2 (hereinafter simply referred to as substrate P K2) to pacify connection (link or engage) It is contained on motor drive shaft MT3, and makes the terminal part of substrate P K2 adsorb and be fixed on the cut-out joint unit of the position that turns to be sticked On the absorption layer 1C of CU3, then, it is being sticked two-sided tape T on the face of absorption side opposite side.
When, after the two-sided tape T that is sticked in substrate P K2, making cut-out joint unit CU3 rotate and move to bonding station, and And driven by the rotation of motor drive shaft MT3 and make recycling roll RR6 to the direction of recession of substrate P K2 (substrate P) (in fig. 25 for suitable Clockwise) rotate, thus, when substrate P K2 being paid the tension force of regulation, standby until based on winding sensor S4 Recycling roll RR3 recovery detection of end till.
As described above, in the present embodiment, by the 1st buffer gear BF1 substrate P temporarily stored and to During reason device U1 conveying, substrate P is connected and is replaced by the substrate P 2 drawn from new donor rollers RR2, and to the 1st buffering Mechanism BF1 carries.Therefore, it is possible to do not stop based on processing means U1～Un respectively processing ground, change becomes the roller of supply source.Cause This, in the present embodiment, it is possible to avoid putting into the substrate P of processing means U1～Un in the change moment of donor rollers being wasted And cause the situation that cost increases.
And, in the present embodiment, the substrate P carried from processing means Un is temporarily being stored up by the 2nd buffer gear BF2 During depositing, the recycle object of switching substrate.Therefore, when changing the recycle object of substrate P, it is also possible to avoid when change Carve and put into situation about being wasted to the substrate P of processing means U1～Un and cause cost to increase.
It addition, in the present embodiment, in the 1st splicer portion CSa and the 2nd splicer portion CSb, new substrate is engaged After on the substrate the most used, by substrate cutting before.Therefore, will not produce in the case of first carrying out cut-out because of The tension force paid and cause substrate to separate and hinder the defect of joint etc. when cutting off, it is possible to implement stable processing substrate.
Above, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned example.Upper Each shape and the combination etc. of stating each constituting portion material shown in example are only examples, it is possible at the model not departed from from the purport of the present invention Require to wait based on design in enclosing and carry out various change.
Such as, in the above-described embodiment, list processing mechanism and there is the composition of multiple processing means U1～Un.But It is to be not limited to this, it is also possible to be configured to, a processing means is provided with above-mentioned substrate and connects replacing mechanism.
It addition, be configured in the above-described embodiment, additionally having to connect has the recycling roll introducing substrate P K.But, example As, it is also possible to it is configured to, uses and have been used by and donor rollers that the substrate of leading section is cut-off.
It addition, in the above-described embodiment, it is configured to, is respectively provided with 2 roller installation portions at supply side and recovery side.But It is, it is also possible to be respectively provided with the roller installation portion of more than 3.
In the above-described embodiment, before the substrate of side's supply of 2 donor rollers becomes roller terminal, automatically connect From the substrate of other rollers, persistently process thereby, it is possible to do not stop production line ground.If but in the somewhere of production line, in system Make to produce in the pattern on substrate defect, or produce the unfavorable condition manufacturing device, then worry can make substantial amounts of defective products.
Accordingly it is also possible to be that line produced by below (factory) is constituted, i.e. in the production line before final products complete, will The multiple steps performing flow process with the state of strip substrate are divided into several block, in each block, carry out based on roll-to-roll Continuous processing, in next step block, transports being wound with the roller unit of substrate forming semi-finished product, is arranged on rule On fixed installation portion (RS1 or RS2).In this case, substrate conveyance can be carried out continuously with step block unit, even if In the case of there occurs problem (pattern defect or device defect etc.) in certain step block, this step block is only made temporarily to stop Only, it is possible to reduce a large amount of generations of defective products.
It addition, in the above-described embodiment, it is separately mounted to donor rollers RR1 on 2 installation portions RS1, RS2, RR2, It is wound with the plate shape substrates of product manufacturing with equal length amount, terminates that (roller is eventually supplying from the substrate of donor rollers RR1 End) tight before, connect the substrate being replaced by another donor rollers RR2, and persistently process until the using up of substrate of donor rollers RR2. However, it is possible to think following using method, i.e. being arranged on the donor rollers on of installation portion RS1, RS2 only will become During another donor rollers of roller terminal is replaced by new roller, to processing means U1～Un sustainable supply substrate.
In this case, such as, be set to using become roller terminal donor rollers as RR2, by this roller RR2 from installation portion RS2 Remove, new donor rollers is installed to installation portion RS2, until the joint on the 1st splicer portion CSa is ready to complete state (Figure 13 State) till time be set to 180 seconds, the most in this process, the transporting velocity of the substrate in processing is set to 50mm/ During the second, from a length of 9m of the substrate (P1) that another donor rollers RR1 puts into processing means U1 (production line).
Accordingly it is also possible to be, the substrate (P1) measured as this 9m, after another donor rollers RR1 supplies, connects by the 1st immediately Band device portion CSa, the in the future front end of the substrate (P2) of the self installation new donor rollers RR2 on installation portion RS2, engage (link or Person connects) in the position of the substrate (P1) only putting into substantially 9m from donor rollers RR1 to processing means U1, and this substrate (P1) is cut Disconnected, connect and be replaced by the substrate (P2) from donor rollers RR2.
It addition, as it has been described above, by the substrate (P1) from donor rollers RR1 being seated on installation portion RS1, be utilized as temporarily In the case of time property connects substrate (e.g., from about 9m amount), about the process that this substrate (P1) is carried out, each process can be set to and fill The guide of the conditional decision or maintenance management of putting U1～Un processes, and the element formed at this uses not as final products.
Furthermore, it is also possible to be, in the case of being utilized as temporary connection substrate (e.g., from about 9m amount), it is not necessary to by this base Plate (P1) is wound to donor rollers RR1, such as after being folded by piece leaf formula substrate being cut to 10m length, keeping is in chest etc., from this Chest 1 blade ground takes out substrate (10m) and supplies to the 1st splicer portion CSa.
Additionally, the technical scope of the present invention is not limited to above-mentioned each embodiment.Such as, the respective embodiments described above institute More than 1 situation having omission of the key element illustrated.It addition, the key element illustrated by the respective embodiments described above can be appropriately combined.
Description of reference numerals
BF1 ... the 1st buffer gear (the 1st buffer part, buffer gear), BF2 ... the 2nd buffer gear (the 2nd buffer part), CSa ... the 1st splicer portion (substrate connects replacing mechanism), CSb ... the 2nd splicer portion (the 2nd substrate connects replacing mechanism), CU ... Shut-off mechanism, FS ... substrate, P ... substrate, PK, PK2 ... introduce substrate (the 3rd substrate), PU10 ... engaging mechanism, RR1 ... supply Roller (the 1st roller), RR2 ... donor rollers (the 2nd roller), RR3 ... recycling roll (the 3rd roller), RR4 ... recycling roll (the 4th roller), RS1 ... the 1st peace Dress portion, RS2 ... the 2nd installation portion, RS3 ... the 3rd installation portion, RS4 ... the 4th installation portion, ST ... select injection mechanism, SYS ... element Manufacture system (substrate board treatment), UA, UB, UB1～UB3, UC ... processing unit, U1～Un ... processing means (datatron Structure).

Claims (12)

1. a base plate processing system, has:
1st processing unit, implements the 1st process to along long side direction continuously with the substrate that speed V1 transports；And
2nd processing unit, transports by the described substrate after described 1st processing unit processes with speed V2, continuous to described substrate The 2nd process is implemented on ground, it is characterised in that
According to described 1st processing unit, the 2nd respective performance of processing unit, it is possible to the relation of described speed is set to V1 In the case of ＞ V2, multiple described 2nd processing unit is set, and after described 1st processing unit, also has: will implement The shut-off mechanism that the described 1st described substrate processed cuts off with the specific length of described long side direction；With the base by described cut-out Plate puts into the selection injection mechanism of any one to multiple described 2nd processing units,
According to described 1st processing unit, the 2nd respective performance of processing unit, it is possible to the relation of described speed is set to V1 In the case of ＜ V2, multiple described 1st processing unit is set, and before described 2nd processing unit, also has by multiple institutes State the 1st processing unit and implement the described 1st multiple substrates processed respectively, engage successively along described long side direction and put into described The engaging mechanism of the 2nd processing unit.
Base plate processing system the most according to claim 1, it is characterised in that the relation of described speed can be set as In the case of V1 ＞ V2, also having the 1st buffer part, the 1st buffer part enables the storage capacity of described substrate according to implementing State the computed carrier amount of the described substrate of the 1st process and change, and adjust the conveyance of the described substrate transported towards described shut-off mechanism Amount.
Base plate processing system the most according to claim 2, it is characterised in that also have make the action of described shut-off mechanism with The connecting move control portion that the storage capacity of the described substrate in described 1st buffer part interlocks.
Base plate processing system the most according to any one of claim 1 to 3, it is characterised in that can be by described speed Relation be set as V1 ＜ V2 in the case of, also there is the 2nd buffer part, the 2nd buffer part enables the storage capacity of described substrate Change according to the computed carrier amount implementing the described 2nd described substrate processed, and adjust from described engaging mechanism input to described The computed carrier amount of the described substrate of the 2nd processing unit.
Base plate processing system the most according to claim 4, it is characterised in that also have make the action of described engaging mechanism with The 2nd connecting move control portion that the storage capacity of the described substrate in described 2nd buffer part interlocks.
Base plate processing system the most according to any one of claim 1 to 3, it is characterised in that have work station portion, it sets Between described 1st processing unit and described 2nd processing unit, and have and can be used in described shut-off mechanism and described joint The universal architecture of either one of mechanism.
Base plate processing system the most according to claim 6, it is characterised in that described work station portion has:
Moving part, it can keep described substrate and move along described long side direction；With
Mobile control division, it makes described moving part move to cut-out region based on described shut-off mechanism or based on described joint The engaging zones of mechanism.
8. a substrate processing method using same, has:
By the action to implementing the 1st process continuously with the substrate that speed V1 transports along long side direction of the 1st processing unit；With
Transport by the described substrate after described 1st processing unit processes with speed V2, and by the 2nd processing unit to described substrate Implement the action of the 2nd process continuously, it is characterised in that
According to described 1st processing unit, the 2nd respective performance of processing unit, it is possible to the relation of described speed is set to V1 In the case of ＞ V2, use multiple described 2nd processing unit, and after described 1st processing unit, also have: will implement The cut-out step that the described 1st described substrate processed cuts off with the specific length of described long side direction；With the base by described cut-out Plate puts into the selection of any one the input step to multiple described 2nd processing units,
According to described 1st processing unit, the 2nd respective performance of processing unit, it is possible to the relation of described speed is set to V1 In the case of ＜ V2, use multiple described 1st processing unit, and before described 2nd processing unit, also have by multiple institutes State the 1st processing unit and implement the described 1st multiple substrates processed respectively, engage successively along described long side direction and put into described The engagement step of the 2nd processing unit.
Substrate processing method using same the most according to claim 8, it is characterised in that the relation of described speed can be set as In the case of V1 ＞ V2, adjust the storage capacity of described substrate according to the computed carrier amount implementing the described 1st described substrate processed, And adjust the computed carrier amount of the described substrate transported towards the region carrying out described cut-out.
Substrate processing method using same the most according to claim 9, it is characterised in that make the cut-out action of described substrate with described The adjustment of the storage capacity of substrate interlocks.
11. substrate processing method using sames according to claim 8, it is characterised in that the relation of described speed can set In the case of V1 ＜ V2, adjust the storage of described substrate according to the computed carrier amount implementing the described 2nd described substrate processed Amount, and adjust the computed carrier amount from the regional inputs to the described substrate of described 2nd processing unit carrying out described joint.
12. substrate processing method using sames according to claim 11, it is characterised in that make the joint action of described substrate with described The adjustment of the storage capacity of substrate interlocks.
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