JP2020201505A - Device manufacturing method - Google Patents

Abstract

To operate a processing unit for use in each of multiple processing steps efficiently, while improving productivity of the entire manufacturing line relevant to substrate processing.SOLUTION: A device manufacturing method includes a coating step of coating a sheet substrate with a photosensitive functional layer, while transporting at a first velocity in a first processing unit, a first recovery step of winding the sheet substrate, exported from the first processing unit, around a first recovery roller and cutting, a first patterning step of patterning the photosensitive functional layer while transporting the sheet substrate into a second processing unit where the sheet substrate is not processed, out of second processing units performing second processing while transporting the sheet substrate at a second velocity slower than the first velocity, a second recovery step of winding the sheet substrate around a second recovery roller and cutting, and a second patterning step of patterning the photosensitive functional layer while transporting the sheet substrate wound around the second recovery roller. The second patterning step is set to be started before the first patterning step is completed.SELECTED DRAWING: Figure 1

Description

The present invention relates to a device manufacturing method.
This application claims priority based on US provisional application 61 / 650,712 filed on May 23, 2012 and US provisional application 61 / 654,500 filed on June 1, 2012. Is used here.

In a large screen display element such as a liquid crystal display element, a transparent electrode such as ITO (Indium Tin Oxide) or a semiconductor substance such as Si is deposited on a flat glass substrate, and a metal material is vapor-deposited and a photoresist is applied. And transfer the circuit pattern. Then, after developing the photoresist, a circuit pattern or the like is formed by etching. However, as the screen size of the display element increases, the size of the glass substrate increases, which makes it difficult to transport the substrate. Therefore, a roll-to-roll method (hereinafter, simply "roll method") in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, metal foil, or an ultrathin glass sheet). A technique called (referred to as) has been proposed (see, for example, Patent Document 1).

Further, in Patent Document 2, a flexible long sheet (board) that can be wound around a feed roller and traveled is arranged close to the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuously arranged. A technique for exposing to a substrate has been proposed.

Further, in Patent Document 3, a mask in which a pattern forming region of a flexible long sheet (substrate) sent by a roll method is temporarily held on a flat stage and projected via a magnifying projection lens. A technique has been proposed in which a pattern image is scanned and exposed on the pattern forming region.

International Publication No. 2008/129819 Jitsukaisho 60-019037 Japanese Unexamined Patent Publication No. 2011-22584

However, the above-mentioned prior art has the following problems.
When a plurality of processes are sequentially applied to a long sheet-shaped substrate, the transfer speed of the substrate suitable for the process varies depending on the performance of each processing unit (for each processing content). For example, in the case of the exposure process as in Patent Document 2, the transport speed (tact) of the substrate is limited by the sensitivity of the photosensitive layer applied to the surface of the substrate, the brightness of the illumination light for exposure, and the like. Further, even in the wet treatment such as etching and plating and the drying / heating step after the wet treatment, the liquid tank and the drying / heating furnace can be miniaturized by slowly transporting the substrate.

In addition, there is an optimum substrate transfer speed in order to secure productivity while maintaining high precision (miniaturization) even in the process of depositing functional materials and the processes of printing and inkjet printing. However, these optimum substrate transfer speeds often vary depending on the processing unit.

When constructing a roll-type manufacturing line (processing system) in which a series of processing is continuously performed by sequentially passing a long sheet-like substrate by combining such a plurality of processing units, the transfer speed of the substrate (of the production line) is constructed. The speed) is adjusted to the processing unit having the lowest substrate transfer speed during processing.

Therefore, a processing unit having a high processing speed will transfer the substrate at a slow speed even though there is a margin in performance. Therefore, the efficiency of the processing unit may deteriorate and the productivity of the entire production line may not increase.

Further, in Patent Document 1, an electronic device is formed on a sheet substrate by mainly using a printing (injection) method while conveying a flexible sheet substrate by a roll method. However, in a general printing site, when the remaining amount of the sheet substrate wound on the supply roll becomes low, the printing apparatus is temporarily stopped, the sheet substrate is cut between the printing apparatus and the collection roll, and the collection roll is used. The printed sheet substrate wound as is sent to the next process. In that case, a sheet substrate in the middle of printing remains in the printing path from the inlet to the exit of the printing apparatus, and all of them are discarded as defective products. When printing with color ink on paper or film, the printing cost is extremely low. However, when forming an electronic device by the roll method, the manufacturing cost per unit length (m) of the sheet substrate is still high, and if the sheet substrate remaining in the apparatus is discarded as in a general printing site. , Waste increases and cost increases.

In particular, when a medium-sized or large-sized display panel made of organic EL is formed on a sheet substrate, the sheet substrate is formed by a series of a plurality of processing devices, such as a photosensitive layer printing device, an exposure device such as Patent Document 3, a wet processing device, and drying. After passing through the device etc. continuously, it is wound up on a collection roll. Therefore, it is assumed that the sheet substrate working on a plurality of processing devices (processing processes) from the supply roll to the recovery roll becomes extremely long, and once the transfer of the sheet substrate is stopped, the sheet substrate is spread over a considerably long distance. Will be wasted.

According to the first aspect of the present invention, after the first treatment of forming a photosensitive functional layer on a long flexible sheet substrate, a pattern for an electronic device is formed on the photosensitive functional layer. A device manufacturing method for performing a second treatment, wherein the sheet substrate wound on a supply roll is conveyed to the sheet substrate at a first speed while being conveyed into the first processing unit to be subjected to the first treatment, and the photosensitive of the sheet substrate is exhibited. The coating step of applying the functional layer, the first recovery step of winding the sheet substrate carried out from the first processing unit on a first recovery roll by a predetermined length and cutting the sheet substrate, and the sheet substrate. Among a plurality of second processing units that perform the second processing while being conveyed at a second speed slower than the first speed, the first recovery roll is contained in the second processing unit that has not processed the sheet substrate. After the first pattern forming step of forming the pattern on the photosensitive functional layer while conveying the sheet substrate wound around the sheet and the first recovery step, the first processing unit continues to perform the first. A second recovery step in which the sheet substrate carried out at a high speed is wound around a second recovery roll for a predetermined length and cut, and the sheet board is processed among the plurality of second processing units. The first processing unit includes a second pattern forming step of forming the pattern on the photosensitive functional layer while transporting the sheet substrate wound on the second recovery roll into the second processing unit. A device manufacturing method is provided in which the second pattern forming step is set to start before the completion of the pattern forming step.

In the aspect of the present invention, the processing units used in each of the plurality of processing steps can be efficiently operated, and the productivity of the entire production line related to the substrate processing can be improved.

Further, in another aspect of the present invention, the waste of the substrate can be significantly reduced, and the cost increase can be effectively suppressed.

It is a figure which showed typically the substrate processing system which concerns on 1st Embodiment. It is a schematic perspective view of the cutting mechanism which concerns on 1st Embodiment. It is a schematic external perspective view of the 1st splicer part which concerns on 1st Embodiment. It is a schematic external perspective view of the 2nd splicer part which concerns on 1st Embodiment. It is a control block diagram in the substrate processing system which concerns on 1st Embodiment. It is a figure which shows the structure of a part of the device manufacturing system which concerns on 1st Embodiment. It is a figure explaining the model arrangement example of the plurality of processing units constituting the production line which concerns on 1st Embodiment. It is a time chart explaining the tact improvement by the production line which concerns on 1st Embodiment. It is a figure which shows the structure of a part of the device manufacturing system as a substrate processing place which concerns on 2nd Embodiment. It is a figure which shows the schematic structure of the 1st splicer part and 1st buffer mechanism which concerns on 2nd Embodiment. It is a figure which shows the schematic structure of the 2nd splicer part and the 2nd buffer mechanism which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate of the substrate supply side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment. It is a figure which shows the joining / cutting operation of the substrate on the substrate recovery side which concerns on 2nd Embodiment.

First Embodiment Hereinafter, an embodiment of the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 6.
FIG. 1 is a diagram schematically showing a roll-type substrate processing system SYS in which a sheet-shaped substrate P is sequentially passed through three processing steps A, B, and C.

The substrate processing system has a processing unit UA (first processing unit) that performs processing A (first processing) as process A on the substrate P, and processing B (first processing, second processing) as process B. Processing unit UB (first processing unit, second processing unit) to be applied, processing unit UC (second processing unit) to apply processing C (second processing) as process C, cutting mechanism CU10, joining mechanism PU10, selective charging mechanism It is mainly composed of ST1, ST2, and a control unit CT (see FIG. 5).

The processing unit UA includes a roll mounting portion RSA on which the supply roll RRA is mounted, and sends the substrate P subjected to the processing A to the cutting mechanism CU10. The processing units UB are composed of processing units UB1 to UB3, each of which performs the same processing B. For example, the processing units UB are arranged vertically in three stages or horizontally in three rows on the downstream side of the processing unit UA in the substrate transport direction.

Each of the processing units UB1 to UB3 includes mounting portions RSB11 to RSB31 on which the roll of the substrate P subjected to the treatment A is mounted, and mounting portions RSB12 to RSB32 on which the roll of the substrate P subjected to the treatment B is mounted. The substrates P from the rolls RRB11 to RRB31 (hereinafter, appropriately referred to as child rolls RRB11 to RRB31) mounted on the mounting portions RSB11 to RSB31 are mounted on the mounting portions RSB12 to RSB32 after being subjected to the process B. The rolls RRB12 to RRB32 (hereinafter, appropriately referred to as child rolls RRB12 to RRB32) are wound up.

In FIG. 1, a roll RR1 for winding the substrate P subjected to the processing A is provided after the cutting mechanism CU10 in the subsequent stage of the processing unit UA. When a predetermined length of the substrate P is wound around the roll RR1, the substrate P is cut there, and the roll RR1 is placed on any of the mounting portions RSB11 to RSB31 of each processing unit UB1 to UB3, and any of the child rolls RRB11 to RRB31. It is installed as one.

The processing unit UC can mount any one of the child rolls RRB12 to RRB32 subjected to the processing B by the processing units UB1 to UB3 as the roll RR2. The substrate P (intermediate product subjected to the treatments A and B) wound around the roll RR2 is carried into the processing unit UC via the joining mechanism PU10 and is subjected to the processing C. The substrate P that has received the treatment C is taken up by the recovery roll RRC mounted on the roll mounting portion RSC and recovered.

Processing speed VA of processing A in processing unit UA (conveying speed of substrate P) in the present embodiment, processing speed VB of processing B in processing units UB1 to UB3 (conveying speed of substrate P), processing of processing C in processing unit UC The relationship of speed VC (conveyance speed of substrate P) is as follows.
VA ≒ VC> VB
Since the transfer speed of the substrate P between the processing unit UA and any one of the processing units UB1 to UB3 is VA> VB, the processing unit UA is the first processing unit having a high transfer speed (V1). Corresponding to, any one of the processing units UB1 to UB3 corresponds to the second processing unit having a low transport speed (V2). On the other hand, between the processing units UB1 to UB3 and the processing unit UC, the transfer speed of the substrate P is VB <VC, so that any one of the processing units UB1 to UB3 has a transfer speed (V1). Corresponds to the first processing unit having a low processing speed, and the processing unit UC corresponds to the second processing unit having a high transport speed (V2).

In the present embodiment, the processing speeds VA and VC can be set to about 3 times the processing speed VB. When there is only one processing unit UB that executes the processing step B as in the conventional case, the substrate P connected to one from the supply roll RRA to the recovery roll RRC passes through the processing units UA, UB, and UC in order. The transport speed is adjusted to the slowest processing speed VB. That is, the tact (line speed, productivity) of the entire production line is regulated by the slowest processing unit.

In the present embodiment, by double-tracking the processing unit UB having a slow processing speed (here, three units are juxtaposed), a configuration that is not bound by the law is possible. In order to make this double track (or to provide a plurality of lines), when the substrate P is wound around the roll RR1 by a predetermined length, the substrate P is cut without temporarily stopping the processing step A and the processing step B. Mechanism CU10 is required.

The cutting mechanism CU10 mainly cuts the substrate P subjected to the process A to a predetermined length, and as shown in FIGS. 1 and 2, the first buffer mechanism (first buffer portion) BF1 and the first It is provided with one splicer portion CSa (cutting portion). Further, the cutting mechanism CU10 further includes an interlocking control unit that links the operation of the first splicer unit CSa (cutting unit) with the accumulated amount of the substrate P in the first buffer mechanism BF1 (buffer unit).

The first buffer mechanism BF1 is provided between the unit UA that executes the process A as the first process and the first splicer unit CSa, and is a dancer that folds the substrate P with a large number of rollers or the like to accumulate a predetermined length. It has a roller mechanism DR1 and carries in and out the substrate P while variably adjusting the accumulated length of the substrate P by moving the dancer roller up and down. The first buffer mechanism BF1 is provided adjacent to the downstream side of the substrate P of the processing unit UA in the transport direction, and is a nip drive that adjusts the transport amount (or transport speed) of the substrate P to be carried out to the first splicer unit CSa. It is equipped with a roller NR1 (see FIG. 5). The drive of the dancer roller mechanism DR1 and the drive of the nip drive roller NR1 are controlled by the control unit CT.

Here, the configuration will be described with reference to FIG. 3, which shows a schematic external perspective of the first splicer unit CSa.
The first splicer portion CSa has a suction pad 1 formed of, for example, a porous material on the upper surface thereof, and has a slider 2 that can move in the transport direction of the substrate P (hereinafter, simply referred to as a transport direction) and a slider 2. When the lift 3 with a guide rail that supports the lift 3 so as to be movable in the transport direction, the drive unit 4 that raises and lowers the lift 3, and the lift 3 are in the raised position, they move in the width direction of the substrate P. A cutter portion 5 capable of cutting the substrate P adsorbed on the suction pad 1 of the slider 2, a pasting portion 6 on which the adhesive tape TP can be attached to the substrate P, and an elevating table 3 are provided above the processing A. It is provided with a holding portion 8 (movable up and down) for holding the winding shaft 7 for the roll RR1 for winding the substrate P on both sides.

A resin film or material having high adhesive strength is attached to a part (or the entire peripheral surface) of the outer peripheral surface of the take-up shaft 7, and the tip of the substrate P is attached to the outer peripheral surface of the take-up shaft 7. The substrate P can be automatically wound by rotating the winding shaft 7 after the contact.

The slider 2, the elevating table 3, the drive unit 4, the cutter unit 5, the pasting unit 6, and the holding unit 8 are configured as an integrated station unit SN, and can be mounted on a caster table or the like for transportation. Moreover, it can be positioned at a predetermined position.
Each drive of the slider 2, the drive unit 4, the cutter unit 5, and the pasting unit 6 is controlled by the control unit CT (see FIG. 5).
Further, the station unit SN can move in the long direction while holding the substrate P, and is provided by a moving unit including a slider 2, an elevating table 3, a drive unit 4, etc. It is provided with a movement control unit that moves the moving unit to the joint region.

In addition, although the sticking part 6 in this embodiment is supposed to stick the substrate P by the adhesive tape TP, another sticking method (mechanism) may be used. For example, a method in which an adhesive is applied in a belt shape in a width direction orthogonal to the transport direction of the substrate P and pressure-bonded, and when the substrate P is a resin film or the like, the portion of the substrate P to be bonded is coated. A method of heating and crimping, or a method of ultrasonic bonding may be used.

Further, although the suction pad 1 provided on the upper surface of the slider 2 holds the substrate P by vacuum pressure, the substrate P is placed on the upper surface of the slider 1 by a mechanical clamping mechanism (clamp band or the like) other than the vacuum pressure. It may be a locking configuration.

By the way, the selective loading mechanism ST1 shown in FIG. 1 controls a roll RR1 (hereinafter, referred to as a child roll RR1) in which the substrate P subjected to the process A is wound around the take-up shaft 7 under the control of the control unit CT. The child rolls RRB11, RRB21, and RRB31 are selectively inserted into any of the mounting portions RSB11 to RSB31, and the child roll RR1 is carried out and spared in the holding portion 8 of the vacant first splicer portion CSa. The take-up shaft 7 is conveyed.

In the present embodiment, the processing speeds VA and VC are about three times the processing speed VC, and three processing units UB are also installed. Therefore, the child rolls RR1 (that is, the child rolls RRB11 to RRB31, RRB12 to RRB32, The length of the substrate P wound by the RR2) described later is set to about ⅔ of the length of the substrate P wound by the supply roll RRA which is the parent roll.
Therefore, the cutting mechanism CU10 cuts the substrate P at predetermined lengths so as to divide the total length of the substrate P wound around the supply roll RRA into substantially three equal parts.

Further, the selective input mechanism ST2 of FIG. 1 is any one of the child rolls RRB12 to RRB32 of the mounting portions RSB12 to RSB32, in which the substrate P subjected to the processing B by any of the processing units UB1 to UB3 is wound up by a predetermined length. Is selected under the control of the control unit CT and charged (roll-conveyed) to the joining mechanism PU10, and at the same time, any of the child rolls RRB12 to RRB32 is transported and is reserved for the vacant mounting units RSB12 to RSB32. A take-up shaft is attached.

The joining mechanism PU10 mainly uses any one of the child rolls RRB12 to RRB32 that has been subjected to the process B and is conveyed as the child roll RR2, and joins the child rolls RR2 near the end of the previously charged and cut substrate. As shown in FIG. 1, it includes a second splicer portion CSb (joining portion) and a second buffer mechanism (second buffer portion) BF2. Further, in the joining mechanism PU10, the accumulated amount of the substrate is variable according to the transfer amount of the second splicer portion CSb (joining portion) for joining the substrate to which the treatment B is applied and the substrate to which the treatment B is applied. It includes a second buffer mechanism (buffer portion) BF2 that adjusts the amount of substrate transported from the joint portion to the process B.

As shown in FIG. 4, the second splicer unit CSb is installed with the station unit SN installed in the first splicer unit CSa described above in a state in which the transport direction of the substrate P is reversed. That is, the second splicer unit CSb has a suction pad 1 on the upper surface, a slider 2 that can move in the transport direction, a lift 3 with a guide rail that supports the slider 2 so that it can move in the transport direction, and a lift. A cutter unit 5 capable of cutting the substrate P adsorbed on the suction pad 1 of the slider 2 by moving in the width direction of the substrate P when the drive unit 4 for raising and lowering 3 and the elevating table 3 are in the raised position. , And a take-up shaft 7 for the child roll RR2, which is provided above the elevating table 3 and has a sticking portion 6 on which the adhesive tape TP can be stuck to the board P, and which takes up the board P to which the process B has been applied. It is provided with a holding portion 8 for holding on both sides.

The second buffer mechanism BF2 is configured in the same manner as the first buffer mechanism BF1 and variably stores the substrate P carried into the processing unit UC within an adjustable length range, and is a substrate P of the processing unit UC. It is provided adjacent to the upstream side in the transport direction of.

The second buffer mechanism BF2 is derived from the dancer roller mechanism DR2, which can variably adjust the accumulated amount of the substrate P by moving a plurality of rollers adjacent to each other in the transport direction of the substrate P in opposite directions, and the second splicer unit CSb. It is provided with a nip drive roller NR2 (see FIG. 5) for adjusting the transport amount (transport speed) of the substrate P transported to the dancer roller mechanism DR2. The drive of the dancer roller mechanism DR2 and the drive of the nip drive roller NR2 are controlled by the control unit CT.

FIG. 5 is a control block diagram in the substrate processing system shown in FIGS. 1 to 4.
As shown in FIG. 5, the control unit CT controls the operations of the processing units UA, UB (UB1 to UB3), and UC, and the sliders 2 and the drive unit 4 provided on each of the cutting mechanism CU10 and the joining mechanism PU10. It comprehensively controls the drive of the cutter unit 5, the pasting unit 6, the selective input mechanisms ST1 and ST2, the dancer roller mechanisms DR1 and DR2, the nip drive rollers NR1 and NR2, and the like. In addition, the control unit CT counts and manages the supply roll RRA, the rotation drive of the recovery roll RRC, the transport length of the substrate P in each process (each processing unit), and the substrate of each roll that is the supply side of the substrate P. The remaining amount and the amount of winding of the substrate of each roll on the collection side of the substrate P are counted and managed, the overall tact management from the processing steps A to C is managed, and the processing problem occurs for each roll. It also manages information such as the degree and location of the presence or absence and the occurrence of defects. The control unit CT includes an interlocking control unit that links the operation of the cutting mechanism CU10 with the accumulated amount of the substrate P in the first buffer unit BF1. Similarly, the control unit CT includes an interlocking control unit that links the operation of the joining mechanism PU10 with the accumulated amount of the substrate P in the second buffer unit BF2.

Next, the operation of the substrate processing system having the above configuration will be described.
Here, as shown in FIG. 1, the child roll RRB 12 is conveyed to the holding unit 8 of the second splicer unit CSb by the selective charging mechanism ST2 immediately after the processing B is completed in the processing unit UB1. Further, in the processing unit UB2, the processing B is applied to the substrate P drawn out from the child roll RRB21 mounted on the mounting portion RSB21. Further, it is assumed that the processing unit UB3 waits until the child roll RRB31 to be processed next is mounted on the mounting portion RSB31.

Further, in the following description, since the operation of each component device is controlled by the control unit CT, the description indicating that is omitted.

First, when the substrate P subjected to the process A is wound with a predetermined length around the child roll RR1 held by the holding portion 8 of the first splicer portion CSa, the nip drive roller NR1 is driven by the first buffer mechanism BF1. Is stopped to stop the supply of the substrate P to the first splicer unit CSa. At this time, the processing A is continuously performed in the processing unit UA, and the substrate P is sent to the first buffer mechanism BF1. Therefore, the dancer roller mechanism DR1 in the first buffer mechanism BF1 is driven in a direction of increasing the accumulated amount of the substrate P.

In conjunction with the suspension of the supply of the substrate P from the first buffer mechanism BF1, the first splicer unit CSa performs the cutting process of the substrate P.
Specifically, first, after the slider 2 moves to a position facing the cutter portion 5, the lift 3 rises together with the slider 2 by the operation of the drive portion 4. As the slider 2 rises, the suction pad 1 sucks and holds the substrate P from the back surface (lower surface) and positions the substrate P at the cutting position by the cutter portion 5. After that, the cutter portion 5 moves in the width direction of the substrate P to cut the substrate P. When the substrate P is cut, the selective charging mechanism ST1 inputs the child roll RR1 to the mounting portion RSB31 of the processing unit UB3 as the child roll RRB31. Further, the selective charging mechanism ST1 loads a spare take-up shaft 7 into the holding portion 8 of the first splicer portion CSa that has become empty due to the discharge of the child roll RR1.

In the first splicer portion CSa, when the take-up shaft 7 is attached to the holding portion 8, the slider so that the tip portion of the substrate P attracted and held on the upper surface of the slider 2 is located below the take-up shaft 7. 2 moves (at the same time, the nip drive roller NR1 also rotates synchronously by a predetermined amount), the holding portion 8 supporting the take-up shaft 7 is lowered by a certain distance, and the tip portion of the substrate P is the outer circumference of the take-up shaft 7. Adheres to the adhesive part of the surface. In this way, when the tip end portion of the substrate P extending from the first buffer mechanism BF1 side is connected to the new take-up shaft 7, the holding portion 8 is in the original height position after the suction holding by the suction pad 1 is released. The lift 3 is lowered together with the slider 2 by the operation of the drive unit 4.

After that, the rotational drive of the nip drive roller NR1 and the new take-up shaft 7 is restarted, the supply of the substrate P from the first buffer mechanism BF1 is restarted, and the substrate P is taken up by the new take-up shaft 7. After resuming the supply of the substrate P, the nip drive roller NR1 has a speed slightly faster than the feed speed of the substrate P (that is, the speed at which the substrate P is fed to the first buffer mechanism BF1) according to the processing speed VA in the processing unit UA. It is rotated by. In the dancer roller mechanism DR1, the nip drive roller NR1 is driven in a direction of reducing the accumulated amount of the substrate P.

After the length of the substrate P stored in the first buffer mechanism BF1 is almost minimized, the nip drive roller NR1 is driven at the same speed as the feed speed of the substrate P in the processing unit UA.

On the other hand, the substrate P is pulled out from the child roll RRB31 mounted on the mounting portion RSB31 of the processing unit UB3, sent at a speed corresponding to the processing speed VB to perform the processing B, and the child mounted on the mounting portion RSB32. It is wound on the roll RRB32.

While the processing unit UB3 is performing the processing B on the substrate P drawn out from the child roll RRB 31, the processing unit UB2 completes the processing B on the substrate P drawn out from the child roll RRB 21 and the substrate P is completed. The child roll RRB2 that has wound up is waiting at the mounting portion RSB22.

When the processing C by the processing unit UC is completed for the substrate P from the child roll RRB12 previously mounted on the joining mechanism PU10 as the child roll RR2 by the selective input mechanism ST2, the second buffer mechanism BF2 of the joining mechanism PU10 The drive of the nip drive roller NR2 is stopped, and the supply of the substrate P to the dancer roller mechanism DR2 is stopped.

At this time, the processing C is continuously performed in the processing unit UC. Therefore, the dancer roller mechanism DR2 is operated, and the substrate P stored in the second buffer mechanism BF2 is sent out to the processing unit UC at a constant speed corresponding to the feed amount (processing speed VC) of the substrate P in the processing unit UC. ..

In the second splicer unit CSb, as in the cutting process in the first splicer unit CSa, after the slider 2 moves to a position facing the cutter unit 5, the lift 3 is raised together with the slider 2 by the operation of the drive unit 4. As the slider 2 rises, the suction pad 1 sucks and holds the substrate P from the child roll RRB 12 from the back surface (lower surface), and positions the substrate P at the cutting position by the cutter portion 5. After that, the cutter portion 5 moves in the width direction of the substrate P to cut the substrate P. When the substrate P is cut, the selective loading mechanism ST2 takes out the take-up shaft 7 on which the child roll RR2 (RRB12) is wound from the holding portion 8, and waits in the vacant holding portion 8 at the mounting portion RSB22. The child roll RRB22 is mounted as the child roll RR2.

When the child roll RRB22 is mounted on the holding portion 8 of the second splicer portion CSb as the child roll RR2, the tip portion of the substrate P pulled out from the child roll RR2 is cut earlier than the substrate P on the second buffer mechanism BF2 side. Aligned with the rear end portion, the two substrates P are both held by the suction pad 1. In that state, the two substrates P are joined by the adhesive tape TP. When the substrates P are joined, the lifting platform 3 is lowered together with the slider 2 by the operation of the drive unit 4 after the suction holding by the suction pad 1 is released. After that, the nip drive roller NR2 is driven to restart the supply of the substrate P from the second splicer unit CSb to the second buffer mechanism BF2.

After resuming the supply of the substrate P, the nip drive roller NR2 is rotated at a speed slightly faster than the feed speed of the substrate P according to the processing speed VC in the processing unit UC. In the dancer roller mechanism DR2, the nip drive roller NR2 is driven in a direction of increasing the accumulated amount of the substrate P in response to the drive.

After the length of the substrate P stored in the second buffer mechanism BF2 is almost maximized, the nip drive roller NR2 is driven at the same speed as the feed speed of the substrate P in the processing unit UC. Then, the substrate P drawn out from the child roll RRB22 (child roll RR2) sent to the processing unit UC via the second buffer mechanism BF2 is subjected to the processing C at the processing speed VC.

In this way, the substrate P subjected to the processing A by the processing unit UA is wound as a child roll RR1 having a length divided according to the number of the processing units UB, and then sequentially put into the processing units UB1 to UB3. After the processing B is applied, the processing units UB1 to UB3 are sequentially charged into the processing unit UC as child rolls RR2 to perform the processing C. Since three processing units UB having a processing speed VB slower than the processing speed VC are provided according to the ratio of the processing speeds, the three processing units UB1 to UB3 apparently triple the processing speed VB. The child roll RR2 is charged into the processing unit VC at the same cycle as when the processing B is performed at the processing speed of.

As described above, in the present embodiment, when the processing speed VA> the processing speed VB can be set according to the performance of each of the processing units UA and UB, the number n of the processing units UA and the number m of the processing units UB m. The relationship with the above is n <m, and the substrate P is cut into child rolls having a length corresponding to the number of units m and selectively charged into any of m processing units UB1 to UBm. Therefore, it is possible to process the substrate P at the processing speed VA in the entire production line without being regulated by the low processing speed VB.

Further, if the processing speed VB <processing speed VC can be set according to the performance of each of the processing units UB and UC, the substrate of the child roll RR2 subjected to the processing B by the processing units UB1 to UBm of a plurality of units (m). Ps are sequentially joined and put into n processing units (n <m) of processing units UC. Therefore, the waiting time until the substrate P is carried from the processing unit UB to the processing unit UC can be substantially suppressed.
Therefore, also in this case, the substrate P can be processed at the processing speed VC (≈VA) without being regulated by the low processing speed VB.

Therefore, in the present embodiment, it is possible to improve the productivity even when a plurality of processes A to C having different processing speeds are sequentially applied. Further, in the present embodiment, the number of processing units UB is set according to the ratio of processing speeds. Therefore, efficient substrate processing can be realized without excessively installing equipment. In addition, in the present embodiment, when the double-tracking processing units UB1 to UB3 are installed in multiple stages in the vertical direction, efficient substrate processing can be performed without increasing the installation area (footprint).

Further, in the present embodiment, the cutting mechanism CU10 with a buffer mechanism and the joining mechanism PU10 with a buffer mechanism have a common configuration that can be used for both cutting and joining, and are installed as a station unit SN. There is. Therefore, it is not necessary to install different types of devices individually, and it is possible to reduce the cost related to the production equipment.

That is, if the processing speed of the processing unit on the downstream side is lower than that of the processing unit on the upstream side in the transport direction of the substrate P among the adjacent processing units in the series of a plurality of processing units, the station unit SN is in between. Is installed as the cutting mechanism CU10, and when the relationship between the processing speeds is opposite, the station unit SN may be installed as the joining mechanism PU10 between the adjacent processing units.

That is, in the substrate processing system of the present embodiment, among a series of a plurality of processing units, the transfer speed of the substrate P in the processing unit (first processing unit) on the upstream side in the transfer direction of the substrate P between adjacent processing units. On the other hand, when reducing the transport speed of the substrate P in the downstream processing unit (second processing unit), the substrate P has a predetermined length in the long direction between the first processing unit and the second processing unit. When the transfer speed of the substrate P in the second processing unit is increased with respect to the transfer speed of the substrate P in the first processing unit, the first processing unit and the second processing unit are provided with a cutting mechanism CU10 for cutting with. A joining mechanism PU10 for joining the substrate P in the long direction can be provided between them.

(Device manufacturing system)
Next, a device manufacturing system to which the substrate processing system is applied will be described with reference to FIG.

FIG. 6 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) as a substrate processing system. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll RR1 sequentially passes through n processing devices U1, U2, U3, U4, U5, ... Un to the recovery roll RR2. An example of how to wind up is shown. The upper control device CONT (control unit) collectively controls each of the processing devices U1 to Un constituting the production line.

The processing devices U1 to Un shown in FIG. 6 may be any of the processing units UA to UC shown in FIG. 1, and two or more continuous processing devices may be used in the processing devices U1 to Un. Collectively, it may correspond to any one of the processing units UA to UC.

In FIG. 6, the Cartesian coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ surface, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. It shall be set. The substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or one in which a fine partition wall structure (concavo-convex structure) for precision patterning is formed on the surface.

The substrate P wound around the supply roll RR1 is pulled out by the nipped drive roller DR10 and conveyed to the processing apparatus U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of ± tens of μm to several tens of μm with respect to the target position.

The processing device U1 prints on the surface of the substrate P with a photosensitive functional liquid (photoresist, photosensitive silane coupling material, photosensitive coupling material, photosensitive repellent liquid modifier, photosensitive plating reducing agent, UV. This is a coating device that continuously or selectively applies a cured resin solution or the like) in the transport direction (long direction) of the substrate P. In the processing apparatus U1, an impression roller DR20 around which the substrate P is wound, a coating roller for uniformly applying the photosensitive functional liquid on the surface of the substrate P, or a photosensitive functional liquid on the impression roller DR20. A coating mechanism Gp1 including a letterpress or intaglio plate body roller for printing a pattern as ink, and a drying mechanism Gp2 for rapidly removing solvent or moisture contained in the photosensitive functional liquid applied to the substrate P are provided. ..

The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) to stably fix the photosensitive functional layer coated on the surface. It is a device. In the processing device U2, a plurality of rollers and an air turn bar that fold back and convey the substrate P, a heating chamber portion HA1 that heats the carried-in substrate P, and the temperature of the heated substrate P are subjected to a post-process (processing). A cooling chamber portion HA2 that lowers the temperature so as to be uniform with the ambient temperature of the apparatus U3), a nipped drive roller DR3, and the like are provided.

The processing device U3 is an exposure device that irradiates the photosensitive functional layer of the substrate P conveyed from the processing device U2 with ultraviolet patterning light corresponding to a circuit pattern for display and a wiring pattern. The edge position controller EPC that controls the center of the substrate P in the Y-axis direction (width direction) at a fixed position, the nipped drive roller DR4, and the substrate P are partially wound in the processing device U3 with a predetermined tension. A rotating drum DR5 that supports the portion exposed to the pattern on the substrate P in a uniform cylindrical surface, and two sets of drive rollers DR6, DR7, etc. that give a predetermined slack (play) DL to the substrate P are provided. There is.

Further, in the processing device U3, a transmissive cylindrical mask DM, a lighting mechanism IU provided in the cylindrical mask DM to illuminate the mask pattern formed on the outer peripheral surface of the cylindrical mask DM, and a rotating drum DR5 make a cylinder. In order to relatively align the image of a part of the mask pattern of the cylindrical mask DM with the substrate P on a part of the substrate P supported in a plane shape, an alignment mark or the like formed in advance on the substrate P is formed. Alignment microscopes AM1 and AM2 for detection are provided.

The processing device U4 is a wet processing device that performs at least one of various wet treatments such as wet development treatment, electroless plating treatment, and the like on the photosensitive functional layer of the substrate P conveyed from the treatment device U3. Is. In the processing device U4, three processing tanks BT1, BT2, and BT3 layered in the Z-axis direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like are provided. ..

The processing device U5 is a heating / drying device that warms the substrate P conveyed from the processing device U4 and adjusts the water content of the substrate P moistened by the wet process to a predetermined value, but the details will be omitted. After that, the substrate P that has passed through the final processing apparatus Un of the series of processes through several processing apparatus is wound up on the recovery roll RR2 via the nipped drive roller DR10. Even during the winding, the drive roller DR10 and the recovery roll are used by the edge position controller EPC2 so that the center of the substrate P in the Y-axis direction (width direction) or the edge of the substrate in the Y-axis direction does not vary in the Y-axis direction. The relative position of the RR2 in the Y-axis direction is sequentially corrected and controlled.

In the device manufacturing system of FIG. 6 above, according to the processing speed of each processing device U1, U2, U3, U4, U5, ... Un, the processing units having a slow processing speed are double-tracked and a plurality of units are juxtaposed. A cutting mechanism CU10 is provided in front of the processing device, and a selective charging mechanism ST1 for charging the substrate into any of a plurality of processing devices is provided.

Further, by providing a joining mechanism PU10 for sequentially joining a plurality of substrates carried out from each processing device after a plurality of processing devices having a slow processing speed, even when a plurality of processes having significantly different processing speeds are sequentially performed. It is possible to improve productivity without being regulated by the processing process having the lowest processing speed.

In the case of the production line shown in FIG. 6, the processing device U2 that performs the heat treatment can reduce the volumes of the chamber portions HA1 and HA2 by suppressing the transport speed of the substrate P as low as possible, and the power consumption can be reduced accordingly. There is an advantage that the footprint of the equipment can be reduced.

On the other hand, in the processing device U1 immediately before the processing device U2, when the photosensitive functional liquid is patterned and printed on the surface of the substrate P, a plate cylinder (intaglio or letterpress) roller for pattern printing is used, and this roller After the photosensitive functional liquid is applied as ink to the plate, the substrate P is pressed against the plate cylinder roller to transfer the pattern. In this case, in order to improve the pattern transfer characteristics from the plate cylinder roller to the substrate P, it is necessary to feed the substrate P at a somewhat high speed.

As described above, the desired substrate carrying speed (processing speed) may be significantly different between the processing apparatus U1 and the processing apparatus U2 depending on the apparatus performance. Therefore, in such a case, if the processing device U1 is the processing unit UA in FIG. 1 and the processing device U2 is double-tracked as in the processing units UB1 to UB3 in FIG. 1, efficient and highly productive manufacturing is performed. You can build a line.

Here, in the case of the processing system (manufacturing line) shown in FIG. 1 above, how much tact improvement can be expected as compared with the conventional single-track processing is shown in FIG. 8 based on the model example shown in FIG. This will be explained with reference to the time chart of.

FIG. 7A shows an example of a model in which the processing units UA, UB, and UC responsible for each of the three steps A, B, and C are used as one unit for single-track processing. Here, it is assumed that a substrate P having a total length of 1200 m is wound around the supply roll RRA. Further, it is assumed that each processing unit UA to UC has the following processing capacity as the performance of the apparatus. That is, the processing unit UA has the ability to send the substrate P at a maximum of 15 cm / s for processing, the processing unit UB has the ability to send the substrate P at a maximum of 5 cm / s for processing, and the processing unit UC , The substrate P shall have the ability to feed and process at a maximum of 15 cm / s.

In the case of such a single wire, the transport speed of the substrate P in the entire line is adjusted to the speed of 5 cm / s of the slowest processing unit UB, so that the production tact time (all of the process processes A, B, and C on the substrate of 1200 m). The time to apply) is 400 minutes (6 hours and 40 minutes).

On the other hand, a model example of the double-tracked production line as shown in FIG. 1 is shown in FIG. 7 (b). The performance of each processing unit UA, UB (UB1 to UB3), and UC is the same as that described in FIG. 7A. Similar to FIG. 1 above, the processing unit UB responsible for the processing process B is double-tracked to provide three units UB1 to UB3, and the cutting processing time in the cutting mechanism CU10 after the processing unit UA and the selective input mechanism ST1 are used. The setup time including the child roll exchange time and the like is set to 3 minutes, and the setup time including the joining processing time in the joining mechanism PU10 before the processing unit UC and the child roll exchange time by the selective input mechanism ST2 is set to 3 minutes.

Further, as shown in FIG. 7B, since the processing unit UB having a slow processing speed is double-tracked, the processing units UA and UC use the substrate P at a maximum speed of 15 cm / s guaranteed by their respective performances. Set to carry.

The time chart of FIG. 8 estimates the tact according to the model example of FIG. 7 (b), and the lines S1, S2, and S3 virtually correspond to each of the three processing units UB1 to UB3. It represents the processing time. At the start of processing, the substrate P from the supply roll RRA is processed by the processing unit UA, and the substrate P is divided into 1/3 of the total length of 1200 m by the cutting mechanism CU10. Therefore, as shown in line S1, the first 400 m of the substrate to be charged into the processing unit UA is processed in about 44.4 minutes, and then the cutting mechanism CU10 passes a setup time of 3 minutes. It is sent to the processing unit UB1.

The takt time for the processing unit UB1 to process the substrate P for 400 m is 133.3 minutes. Then, after about 3 minutes have passed as a predetermined setup time (mounting of the child roll, etc.), the first 400 m portion of the substrate is put into the processing unit UC and processed at a transport speed of 15 cm / s. The tact time of the substrate for 400 m by the processing unit UC is 44.4 minutes.

During this time, as shown in line S2, the processing unit UA continued processing of the second 400 m substrate for about 44.4 minutes, and subsequently, as shown in line S3, of the third 400 m substrate. The process is continued for about 44.4 minutes at a transport speed of 15 cm / s. The second 400 m substrate is sent to the processing unit UB2 after a setup time of 3 minutes by the cutting mechanism CU10, where it is processed over about 133.3 minutes.

The processing of the first 400 m of the substrate is completed in the processing unit UC after 228.1 minutes from the start time. However, before that, the processing of the second 400 m substrate is completed by the processing unit UB2, and the second 400 m substrate is set up for about 3 minutes via the bonding mechanism PU10 and the selective loading mechanism ST2C. After some time, it is joined to the end of the first 400 m of substrate.
After that, the processing unit UC continuously processes the second 400 m substrate bonded to the first 400 m substrate at a transport speed of 15 cm / s.

Similarly, as shown in line S3, the third (last) 400 m substrate cut by the cutting mechanism CU10 is charged into the processing unit UB3 when the processing by the processing unit UA is completed, and 133.3. After a minute, it is wound on the child roll RRB32. The processing of the third 400 m substrate is also completed in the processing unit UC before the processing of the second 400 m substrate is completed in the processing unit UB32.

While the processing unit UC is processing the second 400 m of substrate, the third 400 m of substrate is passed through the bonding mechanism PU10 and the selective loading mechanism ST2C, and after a setup time of about 3 minutes, the second substrate is used. It is joined to the terminal portion of the substrate for 400 m. After that, the processing unit UC continuously processes the third 400 m substrate bonded to the second 400 m substrate at a transport speed of 15 cm / s.

As described above, by double-tracking the unit of the processing step B, the processing of the substrate P for 1200 m is completed in 317 minutes (5 hours and 17 minutes). This is an improvement in tact (shortening of production time) of about 20% as compared with the model example of the single wire processing shown in FIG. 7A.

In the model example shown in FIG. 7B, the total length of the substrate P wound around the supply roll RRA as the parent roll is 1200 m, but even if the length is longer than that, the substrate by the cutting mechanism CU10 is used. If the division is performed every 400 m, the substrate to be put into the production line can be continuously flowed until the final processing step C.

In the model example shown in FIG. 7B, it is assumed that all three processing units UB1 to UB3 are operated at the same processing speed (5 cm / s), but each unit UB1 to UB1 within an adjustable range. The transfer speed of the substrate in UB3 may be slightly different.

Although preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to such examples. The various shapes and combinations of the constituent members shown in the above-mentioned examples are examples, and can be variously changed based on design requirements and the like without departing from the gist of the present invention.

For example, in the above embodiment, three processing units UB1 to UB3 are provided, but if the setting is made according to the processing speed ratio, two or four or more processing units may be provided.

Further, in the above embodiment, a part of the processes in the production line composed of a single wire is double-tracked. However, even when the original production line (producing the same product and variety) is double-tracked from the first process to the last process, the configuration to which the above embodiment is applied is possible.

For example, when two production lines for single-track processing as shown in FIG. 7A are originally arranged side by side, the cutting mechanism CU10 (CU101, CU101,) is placed after each of the two processing units UA (UA1, UA2). CU102) is provided, and the subsequent two low-tact processing units UB are double-tracked as five units UB1 to UB5 by adding three units, and then two joining mechanisms PU10 (PU101, PU102) are provided. After that, two processing units UC (UC1, UC2) may be provided.

In such a configuration, a substrate having a unit length (for example, 400 m) cut by either the cutting mechanism CU101 or CU102 is sent to any of the five processing units UB1 to UB5 that are free. The selective loading mechanism ST2 is configured, and each of the bonding mechanisms PU101 and PU102 is selectively loaded so that a substrate having a unit length (for example, 400 m) processed by any of the five processing units UB1 to UB5 can be received. The mechanism ST2 is configured.

Further, in the processing of the first processing units UA1 and UA2, when the processing unit UA1 processes the substrate from the supply roll RRA by the unit length (for example, 400 m), the processing unit UA2 starts processing the substrate from the supply roll RRA. In order to do so, it is better to give a deliberate time difference.

In this way, the roll exchange work (temporary interruption of production) in which the parent roll (RRA) is simultaneously attached to each of the two processing units UA1 and UA2 can be avoided, and each processing unit can be made efficient. Can be operated as a target.

Second Embodiment Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to FIGS. 9 to 25. In the present embodiment, the same components as those in the above embodiment are designated by the same reference numerals to simplify or omit the description thereof.

FIG. 9 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS as a substrate processing device of the present embodiment. Here, the device manufacturing system SYS has a first mounting portion RS1 for mounting the supply roll (first roll) RR1, a second mounting portion RS2 (holding portion) for mounting the supply roll (second roll) RR2, and a recovery roll ( A flexible third mounting portion RS3 for mounting the third roll) RR3 and a fourth mounting portion RS4 for mounting the recovery roll (fourth roll) RR4, which are drawn from either one of the supply rolls RR1 and RR2. Substrate P (sheet, film, etc.) sequentially has a first splicer unit (board reconnection mechanism) CSa, a first buffer mechanism BF1, and n processing devices U1, U2, U3, U4, U5, ... Un, second. An example is shown in which the buffer mechanism BF2, the second splicer unit (second substrate reconnection mechanism) CSb, and the recovery rolls RR3 and RR4 are wound up.

In the present embodiment, the substrates put into the first and second buffer mechanisms BF1, BF2, the processing devices U1 ... Un as the processing substrate will be referred to as the substrate P as appropriate. The substrates drawn out from the supply rolls RR1 and RR2 before loading will be referred to as substrates P1 and P2 as appropriate. The substrates recovered by the recovery rolls RR3 and RR4 after the treatment by the processing devices U1 ... Un will be appropriately referred to as substrates P3 and P4.

The upper control device CONT (control unit, second control unit) includes the processing devices U1 to Un, the first and second splicer units CSa and CSb, and the first and second buffer mechanisms BF1 and BF2 that constitute the production line. Combined control. Further, the host control device CONT controls the rotational drive of the motor shaft MT1 mounted on the supply roll RR1 in the first mounting portion RS1 and the rotational drive of the motor shaft MT2 mounted on the supply roll RR2 in the second mounting portion RS2. To do. Further, the host control device CONT includes an interlocking control unit that links the cutting operation of the substrate P1 (first substrate) with the accumulated amount of the substrate P1 in the first buffer mechanism BF1 (buffer mechanism). Further, the host control device CONT includes an interlocking control unit that links the cutting operation of the substrate P (processing substrate) with the accumulated amount of the substrate P in the second buffer mechanism BF2.

Further, as shown in FIG. 10, a supply sensor S1 for detecting the supply status of the substrate P1 on the supply roll RR1 is provided in the vicinity of the first mounting portion RS1. When the end of supply of the substrate P1 is detected, the supply sensor S1 outputs an end signal to the host control device CONT. Similarly, a supply sensor S2 for detecting the supply status of the substrate P2 on the supply roll RR2 is provided in the vicinity of the second mounting portion RS2. When the end of supply of the substrate P2 is detected, the supply sensor S2 outputs an end signal to the host control device CONT.

In FIG. 9, the Cartesian coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ surface, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. It shall be set. The substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or one in which a fine partition structure (concavo-convex structure) of precision patterning is formed on the surface.

FIG. 10 is a diagram showing a schematic configuration of a first splicer unit CSa and a first buffer mechanism BF1.

The first splicer unit CSa connects the substrate drawn from either one of the supply rolls RR1 and RR2 and sent out to the first buffer mechanism BF1 to the substrate drawn out from any one of the supply rolls RR1 and RR2. The nip drive roller NR1 and the cutting and joining units CU1 and CU2 are provided. Further, the first splicer portion CSa (board reconnecting mechanism) is a substrate P2 (second substrate) supplied from the supply roll RR2 (second roll) at a position serving as a terminal portion of the substrate P1 (first substrate) to be cut. ) Is joined, and then a control unit for controlling the cutting operation and the joining operation is provided so as to cut the substrate P1 (first substrate).

The nip drive roller NR1 holds the substrate P1 or the substrate P2 and feeds the substrate P1 or the substrate P2 to the first buffer mechanism BF1 or stops the feed of the substrate P under the control of the upper control device CONT, and is the first in the Z-axis direction. It is arranged at a substantially intermediate position between the 1 mounting portion RS1 and the 2nd mounting portion RS2.

The cutting and joining units CU1 and CU2 are arranged symmetrically in the Z-axis direction about the virtual joining surface VF1 parallel to the XY plane passing through the position of the nip drive roller NR1 in the Z-axis direction. The cutting joint unit CU1 includes a suction pad 1A, a cutter 2A, and a tension roller 3A at a position facing the virtual joint surface VF1. Further, the cutting and joining unit CU1 is provided by a rotation mechanism (not shown) so that the cutting and joining unit CU2 and the suction pad 1A face each other at the joining position as shown by the solid line in FIG. 10 and the two-dot chain line in FIG. , The suction pad 1A rotates (swings) between the first mounting portion RS1 and the attachment position facing the first mounting portion RS1. Further, the cutting and joining unit CU1 moves in a direction of separating and approaching the virtual joining surface VF1 (that is, the cutting and joining unit CU2) by a moving mechanism (not shown) at the joining position. The suction pad 1A is arranged on the downstream side (+ X-axis side) of the substrate P (substrate P1) in the feed direction with respect to the cutter 2A when the cutting and bonding unit CU1 is in the bonding position.

Similarly, the cutting and joining unit CU2 includes a suction pad 1B, a cutter 2B, and a tension roller 3B at a position facing the virtual joining surface VF1. Further, the cutting and joining unit CU2 has a rotation mechanism (not shown) so that the cutting and joining unit CU1 and the suction pad 1B face each other at the joining position as shown by the solid line in FIG. 10 and the two-dot chain line in FIG. , The suction pad 1B rotates (swings) between the first mounting portion RS2 and the attachment position facing the first mounting portion RS2. Further, the cutting and joining unit CU2 moves in a direction of separating and approaching the virtual joining surface VF1 (that is, the cutting and joining unit CU1) by a moving mechanism (not shown) at the joining position. The suction pad 1B is arranged on the downstream side (+ X-axis side) of the substrate P (substrate P2) in the feed direction with respect to the cutter 2B when the cutting and bonding unit CU2 is in the bonding position.

The movement of these cutting and joining units CU1 and CU2 is controlled by the host control device CONT.

The first buffer mechanism BF1 is arranged between the processing device (processing mechanism) U1 and the first splicer unit CSa, and temporarily stores the substrate P sent from the first splicer unit CSa within a predetermined longest storage range. Then, it is sent to the processing device U1 and includes a dancer roller mechanism DR1 and a nip drive roller NR2.

The nip drive roller NR2 holds the substrate P accumulated by the first buffer mechanism BF1 and sends it to the processing device U1, and the nip drive roller NR1 and the nip drive roller NR1 are located downstream of the dancer roller mechanism DR1 in the feed direction of the substrate P. They are arranged at substantially the same Z-axis position.

In the dancer roller mechanism DR1, a plurality of upper roller RJ1s whose elevating range is relatively upward and lower roller RK1 whose elevating range is relatively downward are arranged alternately in the X direction, and each roller RJ1 , RK1 can move independently in the Z-axis direction. The top dead center position JU1 and the bottom dead center position JD1 of the upper roller RJ1 are set to positions above the top dead center position JU2 and the bottom dead center position JD2 of the lower roller RK1. The operation of these dancer roller mechanism DR1 is also controlled by the host control device CONT.

FIG. 11 is a diagram showing a schematic configuration of a second splicer unit CSb and a second buffer mechanism BF2.
The second buffer mechanism BF2 is arranged between the processing device (processing mechanism) Un and the second splicer unit CSb, and after temporarily accumulating the substrate P sent from the processing device Un within a predetermined longest storage range. It is to be sent to the second splicer unit CSb, and includes a nip drive roller NR3 and a dancer roller mechanism DR2.

In the dancer roller mechanism DR2, a plurality of upper rollers RJ2 whose elevating range is relatively upward and lower rollers RK2 whose elevating range is relatively downward are alternately arranged in the X-axis direction, and each roller. RJ2 and RK2 can move independently in the Z-axis direction. The upper dead center position JU3 and the lower dead center position JD3 of the upper roller RJ2 are set to positions higher than the upper dead center position JU4 and the lower dead center position JD4 of the lower roller RK2. The operation of these dancer roller mechanism DR2 is also controlled by the host control device CONT.

The second splicer unit CSb reconnects the substrate P, which is sent from the second buffer mechanism BF2 and is recovered by either one of the recovery rolls RR3 and RRR4, so as to be recovered by either one of the recovery rolls RR3 and RRR4. It is provided with a nip drive roller NR4, a cutting and joining unit CU3, and a CU4.

The nip drive roller NR4 sends the substrate P sent from the second buffer mechanism BF2 toward the cutting and joining units CU3 and CU4, or stops the feeding of the substrate P under the control of the upper control device CONT. The position in the Z-axis direction is a substantially intermediate position between the third mounting portion RS3 and the fourth mounting portion RS4, and is arranged at the position of the virtual joint surface VF2 parallel to the XY plane.

The cutting and joining units CU3 and CU4 are arranged symmetrically in the Z-axis direction with the virtual joining surface VF2 as the center. The cutting joint unit CU3 includes a suction pad 1C, a cutter 2C, and a tension roller 3C at a position facing the virtual joint surface VF2. Further, the cutting and joining unit CU3 uses a rotation mechanism (not shown) so that the cutting and joining unit CU4 and the suction pad 1C face each other at the joining position as shown by the solid line in FIG. 11 and the two-dot chain line in FIG. The suction pad 1C rotates (swings) between the third mounting portion RS3 and the attachment position facing the third mounting portion RS3. Further, the cutting and joining unit CU3 moves in a direction of separating and approaching the virtual joining surface VF2 (that is, the cutting and joining unit CU4) by a moving mechanism (not shown) at the joining position.

The suction pad 1C is arranged on the upstream side (−X axis side) of the substrate P in the feed direction with respect to the cutter 2C when the cutting and joining unit CU3 is in the joining position.

Similarly, the cutting and joining unit CU4 includes a suction pad 1D, a cutter 2D, and a tension roller 3D at a position facing the virtual joining surface VF2. Further, the cutting and joining unit CU4 has a rotation mechanism (not shown) so that the cutting and joining unit CU3 and the suction pad 1D face each other at the joining position as shown by the solid line in FIG. 11 and the two-dot chain line in FIG. The suction pad 1D rotates (swings) between the fourth mounting portion RS4 and the attachment position facing the fourth mounting portion RS4. Further, the cutting and joining unit CU4 moves in a direction of separating and approaching the virtual joining surface VF2 (that is, the cutting and joining unit CU3) by a moving mechanism (not shown) at the joining position. The suction pad 1D is arranged on the upstream side (−X axis side) of the substrate P in the feed direction with respect to the cutter 2D when the cutting and joining unit CU4 is in the joining position.
The movement of these cutting and joining units CU3 and CU4 is controlled by the host control device CONT.

As shown in FIG. 11, in the third mounting portion RS3, the recovery roller RR3 is mounted on the motor shaft MT3. In the fourth mounting portion RS4, the recovery roller RR4 is mounted on the motor shaft MT4. The rotary drive of the motor shaft MT3 and the rotary drive of the motor shaft MT4 are controlled by the host control device CONT.

Further, as shown in FIG. 11, a winding sensor S3 for detecting the winding state of the substrate P3 on the recovery roller RR3 is provided in the vicinity of the third mounting portion RS3. When the winding end of the substrate P3 is detected, the winding sensor S3 outputs an end signal to the host control device CONT. Similarly, a winding sensor S4 for detecting the winding status of the substrate P4 on the recovery roller RR4 is provided in the vicinity of the fourth mounting portion RS4. When the winding end of the substrate P4 is detected, the winding sensor S4 outputs an end signal to the host control device CONT.

The recovery rollers RR3 and RR4 have a lead-in substrate (third substrate) PK in which the tip end portion is connected to the roll core and the substrate P3 or the substrate 4 is joined to the end portion (in FIG. 11, the substrate PK of the recovery roller RR4). Only shown). The substrate PK may be the same material as the substrate P to be processed by the processing devices U1 to Un, or may be made of substantially the same thickness as the substrate P but different in material.

The processing apparatus U5 of the present embodiment warms the substrate P conveyed from the processing apparatus U4, adjusts the water content of the substrate P moistened by the wet process to a predetermined value, crystallizes the semiconductor material, and metal nanoparticles. It is a heat-drying device that performs thermal annealization (200 ° or less) for removing the solvent of ink containing particles, but the details will be omitted. After that, the substrate P that has passed through several processing devices and the final processing device Un of the series of processes is temporarily accumulated by the second buffer mechanism BF2, and is appropriately reconnected by the second splicer unit CSb. , It is wound up on the recovery roll RR3 or the recovery roll RR4.

Next, among the processes of the substrate P in the device manufacturing system SYS having the above configuration, the operations of the first splicer unit CSa and the first buffer mechanism BF1 will be described with reference to FIGS. 12 to 19. The operations of various processing devices, constituent devices, and the like that make up the device manufacturing system SYS are controlled by the host control device CONT, but in the following description, the description of control by the host controller CONT will be omitted.

In FIG. 12, the substrate P1 drawn out from the supply roll RR1 is sent to the first buffer mechanism BF1 as the first substrate via the roller 3A of the cutting and joining unit CU1 and the nip drive roller NR1, and in the first buffer mechanism BF1. It is a figure that is temporarily accumulated. As shown in FIG. 12, in the first buffer mechanism BF1, the upper roller RJ1 is located at the top dead center position JU1 and the lower roller RK1 is located at the bottom dead center position JD2, so that the substrate P is the first buffer. The length close to the longest is accumulated in the mechanism BF1.

When the supply roll RR2 wound with the substrate P2 to be reconnected when the substrate P1 of the supply roll RR1 is exhausted in the second mounting portion RS2 is mounted on the motor shaft MT2, the cutting and joining unit CU2 is rotated and sucked. Move the pad 1B to the attachment position. The tip of the substrate P2 is sucked (connected or connected) to the suction pad 1B at the sticking position to fix it, and then the double-sided tape T is stuck on the surface opposite to the suction side.
The suction of the substrate P2 to the suction pad 1B and the sticking of the double-sided tape T are performed by an operator or by using a robot or the like.

When the suction and fixing of the substrate P2 to which the double-sided tape T is attached to the suction pad 1B is completed, as shown in FIG. 13, the cutting and joining unit CU2 is rotated to move the board P2 to the joining position and the motor shaft. A predetermined tension is applied to the substrate P2 by rotating the supply roll RR2 in the direction opposite to the supply direction of the substrate P2 (counterclockwise direction in FIG. 13) by rotationally driving the MT2.

On the other hand, when the supply sensor S1 detects the end of supply of the substrate P1 from the supply roll RR1, the drive of the nip drive roller NR1 is stopped and the motor shaft MT1 is rotationally driven in the direction opposite to the feed direction of the substrate P1. , A weak tension is applied to the substrate P1 between the nip drive roller NR1 and the supply roll RR1.

Even after the drive of the nip drive roller NR1 is stopped, the nip drive roller NR2 continues to be driven. Therefore, the dancer roller mechanism DR1 operates, and the upper roller RJ1 is lowered and the lower roller RK1 is raised as appropriate according to the drive of the nip drive roller NR2. As a result, the substrate P accumulated in the first buffer mechanism BF1 is continuously sent to the processing device U1 by the nip drive roller NR2 at a constant speed.

Next, as shown in FIG. 14, the cutting and joining units CU1 and CU2 are moved in a direction approaching each other, and the substrates P1 and P2 are crimped between the suction pads 1A and 1B for a certain period of time with the double-sided tape T interposed therebetween. .. As a result, the substrate P2 is bonded and joined to the substrate P1 via the double-sided tape T at a position that becomes the terminal portion of the substrate P1 by being cut in a later process.

While the substrates P1 and P2 are being joined, the nip drive roller NR2 and the dancer roller mechanism DR1 are continuously driven, and the substrate P accumulated in the first buffer mechanism BF1 is replaced by the nip drive roller. It is continuously sent to the processing device U1 by the NR2 at a constant speed.

When the substrate P1 and the substrate P2 are joined, the suction pad 1B in the cutting joining unit CU2 is opened to the atmosphere, and then the cutting joining unit CU2 is separated from the cutting joining unit CU1 (+ Z-axis direction) as shown in FIG. ). As a result, the tip of the substrate P2 drawn out from the supply roll RR2 is adsorbed and held by the suction pad 1A of the cutting and joining unit CU1 in a state of being bonded (connected or connected) to the substrate P1 by the double-sided tape T.

After that, with the substrate P1 being tensioned between the cutting and joining unit CU1 and the supply roll RR1, the opposing substrate P1 is cut by the cutter 2A in the cutting and joining unit CU1. As the cutter 2A, for example, the substrate P1 can be cut by sliding the cutting edge in the width direction (Y-axis direction) of the substrate P1.

While the substrate P1 is being cut, the nip drive roller NR2 and the dancer roller mechanism DR1 are continuously driven, and the substrate P accumulated in the first buffer mechanism BF1 is processed by the nip drive roller NR2. It continues to be sent to U1 at a constant speed.

When the substrate P1 is cut, after the suction pad 1A in the cutting / joining unit CU1 is opened to the atmosphere, the cutting / joining unit CU1 is separated from the cutting / joining unit CU2 (virtual joining surface VF1) (-) as shown in FIG. Move in the Z-axis direction). As a result, the substrate P1 drawn out from the supply roll RR1 is wound around the supply roll RR1 by rotating in the direction opposite to the feed direction of the supply roll RR1.

Further, with respect to the supply roll RR2, tension is applied to the substrate P2 between the rotary roll RR2 and the nip drive roller NR1 (and the roller 3B) by the rotational torque in the direction opposite to the feed direction of the supply roll RR2. As a result, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P2 as the second substrate pulled out from the supply roll RR2. The substrate P2 as the second substrate may have the same standard as the substrate P1 (first unit).

After that, the nip drive roller NR1 rotates at a slightly faster speed than the nip drive roller NR2, and in the dancer roller mechanism DR1, as shown in FIG. 17, the upper roller RJ1 is driven by the nip drive roller NR1. The lower roller RK1 is raised and lowered as appropriate. Further, by rotationally driving the motor shaft MT2 in the feed direction, the substrate P2 drawn from the supply roll RR2 is fed, and the accumulated length of the substrate P in the first buffer mechanism BF1 increases.

Then, when the accumulated length of the substrate P in the first buffer mechanism BF1 becomes almost the maximum, the nip drive roller NR1 rotates at the same speed as the nip drive roller NR2, so that the accumulated length of the substrate P in the first buffer mechanism BF1 is increased. Is balanced. Further, the supply roll RR1 whose substrate P1 is almost exhausted is removed from the first mounting portion RS1 (detachable), and as shown in FIG. 18, another supply roll RR5 around which the substrate P5 is wound is mounted.

When the supply roll RR5 is attached, based on the detection result of the supply sensor S2, before the substrate P2 on the supply roll RR2 is exhausted, the cutting and joining unit CU1 is rotated to attach the suction pad 1A as shown in FIG. Move to the installation position. The tip of the substrate P5 is sucked and fixed (connected or connected) to the suction pad 1A at the sticking position, and then the double-sided tape T is stuck on the surface opposite to the suction side.

After that, the supply roll RR5 is rotated in the direction opposite to the supply direction of the substrate P5 (counterclockwise in FIG. 18) by rotationally driving the motor shaft MT1, so that the substrate P5 is cut while applying a predetermined tension. The joining unit CU1 is rotated to move it to the joining position as shown in FIG.

Then, when the supply sensor S2 detects the end of supply of the substrate P2 on the supply roll RR2, the drive of the nip drive roller NR1 is stopped, and the cutting and joining units CU1 and CU2 are brought closer to each other in the same manner as in the above procedure. The substrates P2 and P5 are crimped between the suction pads 1A and 1B for a certain period of time with the double-sided tape T interposed therebetween, and the substrate P2 is further cut by the cutter 2B in the cutting and joining unit CU2. As a result, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P5 pulled out from the supply roll RR5.

In this way, the sequentially switched substrates P are used in the coating process of the photosensitive functional liquid in the processing device U1, the heat treatment in the processing device U2, the pattern exposure processing in the processing device U3, the wet processing in the processing device U4, and the processing device U5. After being heat-dried, it is sequentially sent to the second buffer mechanism BF2 and the second splicer unit CSb, and is collected by the recovery roll RR3 or the recovery roll RR4.

Next, among the processes of the substrate P in the device manufacturing system SYS having the above configuration, the operations of the second splicer unit CSb and the second buffer mechanism BF2 on the recovery roll side will be described with reference to FIGS. 20 to 25.

In FIG. 20, the substrate P, which is a processing substrate, is sent to and accumulated in the second buffer mechanism BF2 via the nip drive roller NR3, and is sent (discharged) from the second buffer mechanism BF2 via the nip drive roller NR4. The substrate P is recovered by the recovery roll RR3 mounted on the third mounting portion RS3 via the roller 3C of the cutting and joining unit CU3. Further, as shown in FIG. 20, in the second buffer mechanism BF2, the upper roller RJ2 is located at the bottom dead center position JD3, and the lower roller RK2 is located at the top dead center position JU4. The length close to the shortest is accumulated by the 2-buffer mechanism BF2.

When the recovery roll RR4 for collecting the substrate P is mounted on the motor shaft MT4 after the winding recovery of the recovery roll RR3 is completed in the fourth mounting portion RS4, the cutting joint unit CU4 is rotated to attach the suction pad 1D. Move to the installation position. With respect to the suction pad 1D at the sticking position, the end portion of the lead-in substrate PK (hereinafter, simply referred to as the substrate PK) whose tip is connected to the recovery roll RR4 is attracted and fixed (connected or connected). After that, the double-sided tape T is attached to the surface opposite to the suction side. After the double-sided tape T is attached to the substrate PK, the cutting and joining unit CU4 is rotated to move it to the joining position, and the recovery roll RR4 is driven by the rotation of the motor shaft MT4 in the recovery direction of the substrate PK (board P) (FIG. In 20, a predetermined tension is applied to the substrate PK by rotating it in the clockwise direction).

Then, when the winding sensor S3 detects the completion of collection of the substrate P by the collection roll RR3, the drive of the nip drive roller NR4 is stopped and the dancer roller mechanism DR2 is operated to raise the upper roller RJ2 and the lower roller RK2. To make the descent of. As a result, the substrate P fed from the processing device U5 by the nip drive roller NR3 increases the accumulation length in the second buffer mechanism BF2 by a constant amount (a feed amount corresponding to the transport speed of the substrate P on the production line). Accumulate.

On the other hand, when the recovery of the substrate P by the recovery roll RR3 is completed, as shown in FIG. 21, the cutting and joining units CU3 and CU4 are moved in directions close to each other, and the suction pads 1C and 1D are interposed with the double-sided tape T interposed therebetween. The substrates P and PK are crimped between them for a certain period of time. As a result, the end portion of the substrate PK is bonded (connected or connected) to the substrate P via the double-sided tape T at a position that becomes the tip portion when the substrate P is cut in the subsequent process.

When the substrate P and the substrate PK are joined, the suction pad 1D in the cutting joining unit CU4 is opened to the atmosphere, and then the cutting joining unit CU4 is separated from the cutting joining unit CU3 (+ Z-axis direction) as shown in FIG. ). As a result, the tip of the substrate PK is adsorbed and held by the suction pad 1C of the cutting and joining unit CU3 in a state of being bonded to the substrate P by the double-sided tape T.

After that, the opposing substrates P are cut by the cutter 2C in the cutting and joining unit CU3 in a state where the substrate P is tensioned between the cutting and joining unit CU3 and the recovery roll RR3. When the substrate P is cut, the suction pad 1C in the cutting / joining unit CU3 is opened to the atmosphere, and then the cutting / joining unit CU3 is moved in the direction away from the cutting / joining unit CU4 (-Z axis direction) as shown in FIG. Let me. As a result, the collection destination of the substrate P sent from the second buffer mechanism BF2 (that is, the substrate P processed by the processing devices U1 to Un) is switched to the collection roll RR4.

While the joining process and the cutting process in the second splicer unit CSb are being performed, the upper roller RJ2 in the second buffer mechanism BF2 and the lower roller RK2 are appropriately lowered from the processing device U5. The substrate P sent by the nip drive roller NR3 is accumulated while increasing the accumulation length in the second buffer mechanism BF2 by a constant amount.

Then, when the switching of the recovery destination of the substrate P to the recovery roll RR4 is completed, the nip drive roller NR4 rotates at a speed slightly faster than the nip drive roller NR3, and in the dancer roller mechanism DR2, the nip drive roller NR4 is driven. Correspondingly, the upper roller RJ2 is lowered and the lower roller RK2 is raised as appropriate, and the length of the substrate P accumulated in the second buffer mechanism BF2 is reduced during the joining process and the cutting process in the second splicer portion CSb. The accumulation length is set to almost the minimum, which is the initial state (see FIG. 24). After the length of the substrate P stored in the second buffer mechanism BF2 is almost minimized, the nip drive roller NR4 is rotated at the same speed as the nip drive roller NR3.

On the other hand, in the third mounting portion RS3 in which the recovery of the substrate P is completed, the recovery roll RR3 is removed, and as shown in FIG. 24, the tip end portion of the lead-in substrate PK2 (hereinafter, simply referred to as the substrate PK2) is connected (connected). The recovered roll RR6 (or joined) is attached to the motor shaft MT3, and is fixed by sucking the end portion of the substrate PK2 to the suction pad 1C of the cutting and joining unit CU3 that has been rotated to the sticking position, and then opposite to the suction side. A double-sided tape T is attached to the side surface.

After the double-sided tape T is attached to the substrate PK2, the cutting and joining unit CU3 is rotated to move it to the joining position, and the recovery roll RR6 is driven by the rotation of the motor shaft MT3 in the recovery direction of the substrate PK2 (board P) (FIG. In 25, the substrate PK2 is rotated in the clockwise direction) to wait until the recovery end detection of the recovery roll RR3 by the winding sensor S4 is performed in a state where a predetermined tension is applied.

As described above, in the present embodiment, while the substrate P is temporarily stored by the first buffer mechanism BF1 and sent to the processing device U1, the substrate P is connected to the substrate P2 drawn from the new supply roll RR2. Instead, it is sent to the first buffer mechanism BF1. Therefore, it is possible to change the roll as the supply source without stopping each process by the processing devices U1 to Un. Therefore, in the present embodiment, it is possible to avoid a situation in which the substrates P that have been put into the processing devices U1 to Un at the time of changing the supply roll are wasted and cause an increase in cost.

Further, in the present embodiment, the collection destination of the substrate is switched while the substrate P sent from the processing device Un is temporarily stored by the second buffer mechanism BF2. Therefore, even when the collection destination of the substrate P is changed, it is possible to avoid a situation in which the substrate P charged in the processing devices U1 to Un at the time of the change is wasted and the cost is increased.

Further, in the present embodiment, in the first splicer section CSa and the second splicer section CSb, the conventional substrate is cut after joining a new substrate to the previously used substrate. Therefore, when cutting is executed first, stable substrate processing can be executed without causing problems such as the substrate being separated at the time of cutting due to the applied tension and hindering joining. ..

Although preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to such examples. The various shapes and combinations of the constituent members shown in the above-mentioned examples are examples, and can be variously changed based on design requirements and the like without departing from the gist of the present invention.

For example, in the above embodiment, the configuration in which the processing mechanism includes a plurality of processing devices U1 to Un is illustrated. However, the present invention is not limited to this, and one processing apparatus may be provided with the above-described substrate reconnecting mechanism.

Further, in the above embodiment, a recovery roll to which the lead-in substrate PK is connected is separately provided. However, for example, a supply roll that has been used and the substrate at the tip portion has been cut may be used.

Further, in the above embodiment, the supply side and the collection side are each provided with two roll mounting portions. However, each may include three or more roll mounting portions.

In the above embodiment, before the substrate supplied from one of the two supply rolls reaches the roll end, the substrate from the other roll is automatically added to continue the processing without stopping the production line. I tried to do it. If a defect occurs in the pattern formed on the substrate or a defect occurs in the manufacturing equipment somewhere on the manufacturing line, a large number of defective products may be produced.

Therefore, in the manufacturing line until the final product is made, many processes that carry out the process with a long substrate are divided into several blocks, and in each block, continuous processing by roll-to-roll is performed, and the next Even in a production line (factory) configuration in which a substrate on which a semi-finished product is formed is conveyed to a process block in roll units and set in a predetermined mounting portion (RS1 or RS2). good. In that case, the substrate can be continuously transported in units of process blocks, and even if a problem (pattern defect, equipment failure, etc.) occurs in a certain process block, only that process block is temporarily stopped. It is possible to reduce the large number of defective products.

Further, in the above embodiment, the supply rolls RR1 and RR2 mounted on each of the two mounting portions RS1 and RS2 are assumed to be a sheet-shaped substrate for manufacturing a product wound by the same length. Immediately before the substrate supply from the supply roll RR1 is completed (roll end), the substrate is connected to the substrate of the other supply roll RR2, and the processing is continued until the end of the substrate of the supply roll RR2. However, the supply roll mounted on one of the mounting portions RS1 and RS2 is used so as to continue supplying the substrate to the processing devices U1 to Un only while the other supply roll, which is the roll end, is replaced with a new roll. You may.

In that case, for example, the supply roll to be the roll end is set to RR2, the roll RR2 is removed from the mounting portion RS2, a new supply roll is mounted on the mounting portion RS2, and the preparation for joining in the first splicer portion CSa is completed ( Assuming that the setup time to the state of FIG. 13) is 180 seconds, the length of the substrate (P1) charged from the other supply roll RR1 to the processing apparatus U1 (manufacturing line) during this period is the feed rate of the substrate being processed. When is 50 mm / sec, it becomes 9 m.

Therefore, as soon as the 9 m portion of the substrate (P1) is supplied from the other supply roll RR1, the tip of the substrate (P2) from the new supply roll RR2 mounted on the mounting portion RS2 is immediately pressed by the first splicer unit CSa. , After joining (connecting or connecting) to the position of the substrate (P1) that was put into the processing device U1 from the supply roll RR1 by about 9 m, the substrate (P1) was cut, and the substrate (P2) from the supply roll RR2. You may change the connection to.

Further, when the substrate (P1) from the supply roll RR1 loaded in the mounting portion RS1 is used as a temporary connecting substrate (for example, about 9 m), the substrate (P1) is used. The processing to be performed may be a pilot processing for setting conditions and maintenance management of each processing apparatus U1 to Un, and the device formed therein may not be used as a final product.

Further, when it is used as a temporary connecting substrate (for example, about 9 m), it is not necessary to wind the substrate (P1) around the supply roll RR1, and for example, a single-wafer substrate cut to a length of 10 m. May be folded and stored in a case or the like, and the substrates (10 m) may be taken out one by one from the case and supplied to the first splicer unit CSa.

The technical scope of the present invention is not limited to each of the above-described embodiments. For example, one or more of the elements described in each of the above embodiments may be omitted. In addition, the elements described in each of the above embodiments can be combined as appropriate.

BF1 ... 1st buffer mechanism (1st buffer part, buffer mechanism), BF2 ... 2nd buffer mechanism (2nd buffer part), CSa ... 1st splicer part (board reconnection mechanism), CSb ... 2nd splicer part (1st) 2 board reconnection mechanism), CU ... cutting mechanism, FS ... board, P ... board, PK, PK2 ... lead-in board (third board), PU10 ... joining mechanism, RR1 ... supply roll (first roll), RR2 ... supply Roll (2nd roll), RR3 ... Recovery roll (3rd roll), RR4 ... Recovery roll (4th roll), RS1 ... 1st mounting part, RS2 ... 2nd mounting part, RS3 ... 3rd mounting part, RS4 ... 4th mounting unit, ST ... selective input mechanism, SYS ... device manufacturing system (board processing device), UA, UB, UB1 to UB3, UC ... processing unit, U1 to Un ... processing device (processing mechanism)

Claims (5)

A device manufacturing method in which a first treatment for forming a photosensitive functional layer on a long flexible sheet substrate is followed by a second treatment for forming a pattern for an electronic device on the photosensitive functional layer. ,
A coating step of applying the photosensitive functional layer to the sheet substrate while transporting the sheet substrate wound on the supply roll into the first processing unit to be subjected to the first treatment at a first speed.
A first recovery step in which the sheet substrate carried out from the first processing unit is wound around a first recovery roll by a predetermined length and cut.
Among a plurality of second processing units that perform the second processing while transporting the sheet substrate at a second speed slower than the first speed, the sheet substrate is contained in the second processing unit that has not been processed. A first pattern forming step of forming the pattern on the photosensitive functional layer while conveying the sheet substrate wound on the first recovery roll.
After the first recovery step, a second recovery in which the sheet substrate carried out from the first processing unit at the first speed is wound up on a second recovery roll by a predetermined length and cut. Process and
Among the plurality of second processing units, the pattern is transferred to the photosensitive functional layer while transporting the sheet substrate wound on the second recovery roll into the second processing unit in which the sheet substrate is not processed. Including a second pattern forming step of forming
A device manufacturing method set to start the second pattern forming step before the completion of the first pattern forming step. The device manufacturing method according to claim 1.
A device manufacturing method in which, when the first speed is VA and the second speed is VB, the number of the second processing units is provided according to the speed ratio VA / VB. The device manufacturing method according to claim 2.
The first processing unit includes a coating device for applying the photosensitive functional layer to the surface of the sheet substrate, and a drying device for drying the sheet substrate after coating.
The second processing unit includes an exposure apparatus that irradiates the photosensitive functional layer of the sheet substrate with patterning light corresponding to the pattern.
Device manufacturing method. The device manufacturing method according to claim 3.
The coating device is used to form the photosensitive functional layer.
Any one of a photoresist, a photosensitive silane coupling material, a photosensitive repellent liquid modifier, a photosensitive plating reducing agent, and a UV curable resin solution may be used as a whole or selectively in the elongated direction of the sheet substrate. Apply,
Device manufacturing method. The device manufacturing method according to any one of claims 1 to 4.
The sheet substrate processed by each of the plurality of second processing units is subjected to the third processing while being conveyed in the longitudinal direction at a third speed faster than the second speed in the order in which the second processing is completed earlier. Sent to the third processing unit to apply,
Device manufacturing method.

Images