CN104303110A - Cutting mechanism, joining mechanism, substrate processing system, substrate processing device, and substrate processing method - Google Patents

Cutting mechanism, joining mechanism, substrate processing system, substrate processing device, and substrate processing method Download PDF

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Publication number
CN104303110A
CN104303110A CN201380025725.XA CN201380025725A CN104303110A CN 104303110 A CN104303110 A CN 104303110A CN 201380025725 A CN201380025725 A CN 201380025725A CN 104303110 A CN104303110 A CN 104303110A
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CN
China
Prior art keywords
substrate
processing unit
processing
roller
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201380025725.XA
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Chinese (zh)
Other versions
CN104303110B (en
Inventor
鬼头义昭
铃木智也
堀正和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201380025725.XA priority Critical patent/CN104303110B/en
Priority to CN201510795430.1A priority patent/CN105467627A/en
Priority to CN201510795438.8A priority patent/CN105479737B/en
Publication of CN104303110A publication Critical patent/CN104303110A/en
Application granted granted Critical
Publication of CN104303110B publication Critical patent/CN104303110B/en
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/745—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool
    • B29C65/7451—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using a single unit having both a severing tool and a welding tool the severing tool and the welding tool being movable with respect to one-another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8221—Scissor or lever mechanisms, i.e. involving a pivot point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B29C66/83221—Joining or pressing tools reciprocating along one axis cooperating reciprocating tools, each tool reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8324—Joining or pressing tools pivoting around one axis
    • B29C66/83241—Joining or pressing tools pivoting around one axis cooperating pivoting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/853—Machines for changing web rolls or filaments, e.g. for joining a replacement web to an expiring web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1857—Support arrangement of web rolls
    • B65H19/1873—Support arrangement of web rolls with two stationary roll supports carrying alternately the replacement and the expiring roll
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/461—Processing webs in splicing process
    • B65H2301/4615—Processing webs in splicing process after splicing
    • B65H2301/4617—Processing webs in splicing process after splicing cutting webs in splicing process
    • B65H2301/46172—Processing webs in splicing process after splicing cutting webs in splicing process cutting expiring web only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
    • B65H2301/4631—Adhesive tape
    • B65H2301/46312—Adhesive tape double-sided
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2408/00—Specific machines
    • B65H2408/20—Specific machines for handling web(s)
    • B65H2408/21—Accumulators
    • B65H2408/217—Accumulators of rollers type, e.g. with at least one fixed and one movable roller
    • B65H2408/2171—Accumulators of rollers type, e.g. with at least one fixed and one movable roller the position of the movable roller(s), i.e. the web loop, being positively actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Replacement Of Web Rolls (AREA)
  • Advancing Webs (AREA)
  • Liquid Crystal (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

A substrate processing system is provided with a first processing unit that continuously carries out first processing on substrates transported at a velocity (V1) and a second processing unit that transports the substrates processed by the first processing unit at a velocity (V2) and continuously carries out second processing on the substrates. When the speed relationship can be set at V1 > V2 by the performance of the first processing unit and the performance of the second processing unit, a cutting mechanism and selection input mechanism are further provided in addition to a plurality of second processing units being provided. When the speed relationship can be set at V1 < V2 by the performance of the first processing unit and the performance of the second processing unit, a joining mechanism that sequentially joins a plurality of substrates that have been processed by the first processing by the plurality of first processing units and inputs to the second processing unit is further provided in addition to a plurality of first processing units being provided.

Description

Shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same
Technical field
Form of the present invention relates to shut-off mechanism, engaging mechanism, base plate processing system, substrate board treatment and substrate processing method using same.
The application is CLAIM OF PRIORITY based on the U.S. Provisional Application 61/654500 proposed in the U.S. Provisional Application 61/650712 proposed on May 23rd, 2012 and on June 1st, 2012, and its content is quoted so far.
Background technology
In the large picture display elements such as liquid crystal display cells, plane glass substrate deposits evaporation metal material after the semiconductor substances such as transparency electrode or Si such as ITO (Indium Tin Oxide), coating photoresistance transfer printing circuit pattern.Then, after photoresistance is developed, circuit pattern etc. is formed by etching.But along with the large screen of display element, glass substrate also maximizes, thus, substrate conveyance becomes difficulty.Therefore, propose a kind ofly there is flexible substrate (such as, film structural component or the very thin glass sheet etc. such as polyimide, PET, metal forming) upper technology (for example, referring to patent documentation 1) that form display element, that be called as volume to volume mode (being only called below " roll fashion ").
In addition, in patent documentation 2, propose a kind of technology, that is, with the peripheral part of the light shield of the cylindrical shape that can rotate closely configure volumes be around in conveying roller and the strip sheet (substrate) of the flexibility of movement, make mask pattern be exposed to substrate continuously.
In addition, a kind of technology is proposed in patent documentation 3, namely, the pattern forming region of the strip sheet (substrate) of the flexibility transported with roll fashion temporarily being remained on plane microscope carrier, making via amplifying projecting lens and the mask pattern that projects as scan exposure in this pattern forming region.
At first technical literature
Patent documentation 1: No. 2008/129819th, International Publication
Patent documentation 2: No. 60-019037, Japanese Unexamined Patent Publication
Patent documentation 3: No. 2011-22584, Japanese Unexamined Patent Publication
But there are the following problems in the above prior art.
When implementing multiple process successively to rectangular plate shape substrates, according to the performance of each processing unit, the conveyance speed being suitable for the substrate processed is different respectively in each unit (each contents processing).Such as, when the exposure-processed that patent documentation 2 is such, because of the coating sensitivity of photographic layer on the surface of the substrate and the brightness etc. of exposure illumination light, the conveyance speed (activity duration) of substrate is restricted.In addition, in the drying after the wet processed such as etching or plating or this wet processed, heating steps, by being transported lentamente by substrate, and the advantage that can make liquid bath or drying/heating furnace miniaturization etc. is obtained.
In addition, in the deposition processes of functional material or the step of printing or ink jet printing etc., in order to maintain high precision int (miniaturization) and guarantee throughput rate simultaneously, also there is best substrate conveyance speed.But the substrate conveyance speed of these the bests is mostly different because of processing unit.
Constructing the multiple processing unit of this combination, when rectangular plate shape substrates being passed through successively and continues roll fashion production line (disposal system) of carrying out a succession of process, the conveyance speed (speed of production line) of substrate has to coordinate the processing unit that the conveyance of the substrate in process speed is minimum.
Therefore, although the fast processing unit of processing speed does not play completely, also to carry out substrate conveyance at a slow speed in performance.Therefore, the deterioration of efficiency of processing unit, and the throughput rate that likely cannot promote production line entirety.
The object of form of the present invention is, provides a kind of shut-off mechanism, engaging mechanism, base plate processing system and the substrate processing method using same that can contribute to boosting productivity.
In addition, in patent documentation 1, the plate shape substrates flexible with roll fashion conveyance also mainly uses printing (ink-jet) mode to form electronic component on plate shape substrates.But, generally print scene, when the surplus being wound on the plate shape substrates in donor rollers tails off, then temporarily stop printing equipment, between printing equipment and recycling roll, plate shape substrates is cut off, the plate shape substrates completing printing reeled as recycling roll is delivered to next step.In this case, at the entrance from printing equipment in the printing path of outlet, printing can remain plate shape substrates in way, and these can all be discarded as defective products.Paper or film print with color inks, printing cost is extremely cheap.But, when forming electronic component with roll fashion, the manufacturing cost of the per unit length (m) of plate shape substrates is still expensive, if as printing is on-the-spot is discarded by the plate shape substrates remained in device like that, then too waste and cost increase.
Especially, when medium-sized, the larger display panels that form based on organic EL are formed on plate shape substrates, plate shape substrates is continually by a series of multiple treating apparatus, such as, after exposure device, wet type processing device, drying device etc. that photographic layer printing equipment, patent documentation 3 are such, be wound in recycling roll.Therefore, can infer can be extremely long by the plate shape substrates of multiple treating apparatus (treatment step) from donor rollers to recycling roll, once stop the conveyance of plate shape substrates, then can waste the plate shape substrates of quite long distance.
The object of other forms of the present invention is, provides a kind of cost that suppresses to increase and the substrate board treatment that boosts productivity and substrate processing method using same.
Summary of the invention
According to the 1st form of the present invention, a kind of base plate processing system is provided, has: the 1st processing unit, implement the 1st process to along long side direction continuously with the substrate that speed V1 transports; And the 2nd processing unit, with speed V2 conveyance by the substrate after the 1st processing unit processes, 2nd process is implemented continuously to substrate, it is characterized in that, according to the 1st, the 2nd processing unit performance separately, when the relation of speed can be set to V1 > V2, multiple 2nd processing unit is set, and after the 1st processing unit, also have: the shut-off mechanism that the substrate implementing the 1st process is cut off with the specified length of long side direction; With the selection injection mechanism of any one substrate after cut-out being fed into multiple 2nd processing unit, according to the 1st, the 2nd processing unit performance separately, when the relation of speed can be set to V1 < V2, multiple 1st processing unit is set, and before the 2nd processing unit, also there are the multiple substrates by being implemented the 1st process respectively by multiple 1st processing unit, engage successively along long side direction and be fed into the engaging mechanism of the 2nd processing unit.
According to the 2nd form of the present invention, a kind of substrate processing method using same is provided, has: by the 1st processing unit to the action implementing the 1st process along long side direction with the substrate that speed V1 transports continuously; Transport by the substrate after the 1st processing unit processes with speed V2, and by the 2nd processing unit, substrate is implemented continuously to the action of the 2nd process, it is characterized in that, according to the 1st, the 2nd processing unit performance separately, when the relation of speed can be set to V1 > V2, use multiple 2nd processing unit, and after the 1st processing unit, also have: the cut-out step that the substrate implementing the 1st process is cut off with the specified length of long side direction; Step is dropped into the selection of any one substrate after cut-out being fed into multiple 2nd processing unit, according to the 1st, the 2nd processing unit performance separately, when the relation of speed can be set to V1 < V2, use multiple 1st processing unit, and before the 2nd processing unit, also there are the multiple substrates by being implemented the 1st process respectively by multiple 1st processing unit, engage successively along long side direction and be fed into the engagement step of the 2nd processing unit.
According to the 3rd form of the present invention, a kind of shut-off mechanism is provided, has: cutting portion, its substrate cutting that will carry out predetermined processing; And buffer part, its enable the storage capacity of substrate according to implement predetermined processing substrate computed carrier amount and change, and adjustment is towards the computed carrier amount of substrate of cutting portion conveyance.
According to the 4th form of the present invention, provide a kind of engaging mechanism, have: junction surface, the substrate implementing predetermined processing engages by it; And buffer part, it enables the storage capacity of substrate change according to the computed carrier amount of the substrate of enforcement predetermined processing, and adjustment is fed into the computed carrier amount of the substrate of predetermined processing from junction surface.
According to the 5th form of the present invention, a kind of base plate processing system is provided, substrate along long side direction conveyance is passed through afterwards from the 1st processing unit, pass through from the 2nd processing unit, when the conveyance speed of the substrate in the 2nd processing unit being reduced in the conveyance speed relative to the substrate in the 1st processing unit, there is shut-off mechanism, this shut-off mechanism is between the 1st processing unit and the 2nd processing unit, substrate is cut off with the specified length of long side direction, when the conveyance speed of the substrate in the 2nd processing unit being increased in the conveyance speed relative to the substrate in the 1st processing unit, there is engaging mechanism, this engaging mechanism is between the 1st processing unit and the 2nd processing unit, substrate is engaged along long side direction.
According to the 6th form of the present invention, provide a kind of substrate board treatment, have: the 1st installation portion, it installs the 1st roller being wound with the 1st substrate of strip; 2nd installation portion, it installs the 2nd roller being wound with the 2nd substrate of strip; Processing mechanism, it is some as treatment substrate using the 1st substrate and the 2nd substrate, and predetermined processing is implemented in an edge long side direction conveying; Buffer gear, it is configured between processing mechanism and the 1st installation portion, after temporarily being stored by the 1st substrate from the 1st roller supply, sends to processing mechanism within the scope of the longest storage of regulation; Be connected with substrate and change mechanism, it cuts off the 1st substrate between buffer gear and the 1st installation portion, and the leading section of the 2nd substrate from the 2nd roller supply is bonded on the terminal part of the 1st substrate of cut-out, and sends to buffer gear.
According to the 7th form of the present invention, provide a kind of substrate board treatment, have: the 1st installation portion, it installs the 1st roller being wound with the 1st substrate of strip; 2nd installation portion, it installs the 2nd roller being wound with the 2nd substrate of strip; Processing mechanism, it is some as treatment substrate using the 1st substrate and the 2nd substrate, and predetermined processing is implemented in an edge long side direction conveying; Buffer gear, it is configured between processing mechanism and the 1st installation portion, after temporarily being stored within the scope of the longest storage of regulation by the 1st substrate from the 1st roller supply, sends to processing mechanism; Be connected with substrate and change mechanism, it cuts off the 1st substrate between buffer gear and the 1st installation portion, and is attached on the established part of the buffer gear side of the 1st substrate of cut-out the leading section of the 2nd substrate from the 2nd roller supply, and sends to buffer gear.
According to the 8th form of the present invention, provide a kind of substrate board treatment, have: the 1st installation portion, it installs the 1st roller of the 1st substrate being wound with strip removably; Maintaining part, it keeps the 2nd substrate with the 1st substrate equivalent specifications with specified length; Processing mechanism, it is some as treatment substrate using the 1st substrate and the 2nd substrate, and predetermined processing is implemented in an edge long side direction conveying; Buffer gear, it is configured between processing mechanism and the 1st installation portion, and after temporarily being stored within the scope of the longest storage of regulation by the 1st substrate from the 1st roller supply, sends to processing mechanism; Be connected with substrate and change mechanism, it cuts off the 1st substrate between buffer gear and the 1st installation portion, and is connected to the leading section of the 2nd substrate supplied from maintaining part on the established part of the buffer gear side of the 1st substrate of cut-out, and sends to buffer gear.
According to the 9th form of the present invention, a kind of substrate processing method using same is provided, using the substrate of input strip, as treatment substrate, one edge long side direction conveying, while implement predetermined processing by processing mechanism, comprises following action: the 1st roller of the 1st substrate being wound with strip is arranged on the action on the 1st roller installation portion; 2nd roller of the 2nd substrate being wound with strip is arranged on the action on the 2nd roller installation portion; By being configured in the buffer gear between processing mechanism and the 1st installation portion, the action sent to processing mechanism after the 1st substrate from the 1st roller supply is temporarily stored within the scope of the longest storage of regulation; With in the process that the temporarily store the 1st substrate is sent to processing mechanism, between buffer gear and the 1st installation portion, cut off the 1st substrate, and the leading section of the 2nd substrate from the 2nd roller supply is attached at the action on the established part of the buffer gear side of the 1st substrate of cut-out.
According to the 10th form of the present invention, provide a kind of substrate processing method using same, the substrate of input strip implemented predetermined processing as the conveying for the treatment of substrate one edge long side direction by processing mechanism, comprises following action:
1st roller of the 1st substrate being wound with strip is arranged on the action on the 1st roller installation portion; The 2nd substrate with the 1st substrate equivalent specifications is remained on the action in maintaining part with specified length; By being configured in the buffer gear between processing mechanism and the 1st installation portion, the action sent to processing mechanism after the 1st substrate from the 1st roller supply is temporarily stored within the scope of the longest storage of regulation; With in the process that the temporarily store the 1st substrate is sent to processing mechanism, between buffer gear and the 1st installation portion, cut off the 1st substrate, and the leading section of the 2nd substrate supplied from maintaining part is attached at the action on the established part of the buffer gear side of the 1st substrate of cut-out.
The effect of invention
In form of the present invention, can effectively be used in the processing unit used respectively in multiple treatment step, the throughput rate of the production line entirety of processing substrate is promoted.
In addition, in other forms of the present invention, significantly can reduce substrate waste, can effectively suppress cost to increase.
Accompanying drawing explanation
Fig. 1 is the figure that illustration represents the base plate processing system of the 1st embodiment.
Fig. 2 is the approximate three-dimensional map of the shut-off mechanism of the 1st embodiment.
Fig. 3 is the outline stereoscopic figure in the 1st splicer portion of the 1st embodiment.
Fig. 4 is the outline stereoscopic figure in the 2nd splicer portion of the 1st embodiment.
Fig. 5 is the control block diagram in the base plate processing system of the 1st embodiment.
Fig. 6 is the figure that a part for the device manufacturing system representing the 1st embodiment is formed.
Fig. 7 is the figure of the model configuration of multiple processing units of the production line that formation the 1st embodiment is described.
Fig. 8 is the sequential chart promoted the activity duration of the production line that the 1st embodiment is described.
Fig. 9 is the figure representing that a part for the device manufacturing system that the processing substrate as the 2nd embodiment is put is formed.
Figure 10 is the figure representing the 1st splicer portion of the 2nd embodiment and the schematic configuration of the 1st buffer gear.
Figure 11 is the figure representing the 2nd splicer portion of the 2nd embodiment and the schematic configuration of the 2nd buffer gear.
Figure 12 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 13 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 14 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 15 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 16 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 17 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 18 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 19 is the figure of the joint/cut-out action of the substrate of the substrate supply side representing the 2nd embodiment.
Figure 20 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Figure 21 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Figure 22 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Figure 23 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Figure 24 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Figure 25 represents that the substrate of the 2nd embodiment reclaims the figure of the joint/cut-out action of the substrate of side.
Embodiment
1st embodiment
Below, the embodiment of shut-off mechanism of the present invention, engaging mechanism, base plate processing system and substrate processing method using same is described referring to figs. 1 through Fig. 6.
Fig. 1 represents as an example to make plate shape substrates P successively by the figure of the base plate processing system SYS of the roll fashion of 3 treatment steps A, B, C in a schematic way.
The main body of base plate processing system is configured to the processing unit UA (the 1st processing unit) implementing to process A (the 1st process) to substrate P as steps A, treatments B (the 1st process is implemented as step B, 2nd process) processing unit UB (the 1st processing unit, 2nd processing unit), the processing unit UC (the 2nd processing unit) processing C (the 2nd process) is implemented as step C, shut-off mechanism CU10, engaging mechanism PU10, select injection mechanism ST1, ST2, control part CT (with reference to Fig. 5).
Processing unit UA has the roller installation portion RSA for installing donor rollers RRA, sends implementing the substrate P after processing A to shut-off mechanism CU10.Processing unit UB is made up of the processing unit UB1 ~ UB3 implementing identical treatments B respectively, such as, is configured to upper and lower 3 layers or level 3 arranges in the downstream of the substrate conveyance direction of processing unit UA.
Each processing unit UB1 ~ UB3 has the installation portion RSB11 ~ RSB31 installed for the roller implementing the substrate P processing A and the installation portion RSB12 ~ RSB32 installed for the roller of the substrate P implementing treatments B, (following from the roller RRB11 ~ RRB31 be arranged on installation portion RSB11 ~ RSB31, suitably be called sub-roller RRB11 ~ RRB31) substrate P enforcement treatments B after, be wound in and be arranged on roller RRB12 ~ RRB32 on installation portion RSB12 ~ RSB32 (following, to be suitably called sub-roller RRB12 ~ RRB32).
In addition, in FIG, after the shut-off mechanism CU10 of processing unit UA rear class, the roller RR1 for the substrate P winding implementing to process A is provided with.When the specified length amount of the substrate P that reels on this roller RR1, then cut off substrate P, roller RR1 is arranged in any one of installation portion RSB11 ~ RSB31 of each processing unit UB1 ~ UB3 as any one in sub-roller RRB11 ~ RRB31.
Any one being implemented the sub-roller RRB12 ~ RRB32 of treatments B by processing unit UB1 ~ UB3 can be installed as roller RR2 by processing unit UC.The substrate P (implementing the intermediate product of process A, B) be wound on this roller RR2 is moved into via engaging mechanism PU10 and is implemented to process C to processing unit UC.The substrate P accepted after process C is wound on the recycling roll RRC that is arranged on roller installation portion RSC and reclaims.
The pass of the processing speed VC (the conveyance speed of substrate P) of the process C in processing speed VB (the conveyance speed of substrate P), the processing unit UC of the treatments B in processing speed VA (the conveyance speed of substrate P), the processing unit UB1 ~ UB3 of the process A in the processing unit UA of present embodiment is as follows.
VA≈VC＞VB
In addition, processing unit UA and processing unit UB1 ~ UB3 any one between, the conveyance speed of substrate P becomes VA > VB, thus, the 1st processing unit that processing unit UA is high with conveyance speed (V1) is corresponding, and any one 2nd processing unit low with conveyance speed (V2) of processing unit UB1 ~ UB3 is corresponding.On the other hand, between any one and the processing unit UC of processing unit UB1 ~ UB3, the conveyance speed of substrate P becomes VB < VC, thus, any one 1st processing unit low with conveyance speed (V1) of processing unit UB1 ~ UB3 is corresponding, and the 2nd processing unit that processing unit UC is high with conveyance speed (V2) is corresponding.
In the present embodiment, processing speed VA, VC can be set as about 3 times of processing speed VB.As in the past, when the processing unit UB of enforcement treatment step B is 1, be linked to be the substrate P of 1 successively by processing unit UA, UB, UC from donor rollers RRA to recycling roll RRC, thus, its conveyance speed is consistent with the slowest processing speed VB.That is, the activity duration (line speed, throughput rate) of production line entirety limit by the slowest processing unit.
In the present embodiment, by the processing unit UB polytenization (being set up in parallel 3 at this) making processing speed slow, and can form without restriction.Need following shut-off mechanism CU10 to realize this polytenization (or arranging multiple), it is after substrate P is only wound on roller RR1 with specified length amount, does not temporarily stop treatment step A and treatment step B and cuts off substrate P.
Shut-off mechanism CU10 mainly cuts off the substrate P implementing process A with specified length, as shown in Figures 1 and 2, have the 1st buffer gear (the 1st buffer part) BF1 and the 1st splicer portion CSa (cutting portion).In addition, shut-off mechanism CU10 has the connecting move control portion of the storage capacity interlock of the substrate P in the action and the 1st buffer gear BF1 (buffer part) making the 1st splicer portion CSa (cutting portion) further.
1st buffer gear BF1 has tension reel mechanism DR1, to move up and down etc. and the storage variable-length of substrate P adjusted and simultaneously by substrate P move-in/move-out by tension reel, wherein, this tension reel mechanism DR1 is located at and implements, as between the unit UA of process A of the 1st process and the 1st splicer portion CSa, by multiple rollers etc., substrate P to be turned back and store specified length amount.1st buffer gear BF1 has clamping and drives reel NR1, it is disposed adjacent with the downstream of the conveyance direction of the substrate P of processing unit UA, and adjusts the computed carrier amount (or conveyance speed) (with reference to Fig. 5) of the substrate P taken out of to the 1st splicer portion CSa.The driving of tension reel mechanism DR1 and clamping drive the driving of reel NR1 to be controlled by control part CT.
At this, illustrate that it is formed by the Fig. 3 of the diagrammatic perspective outward appearance representing the 1st splicer portion CSa.
1st splicer portion CSa has: saddle 2, and it has the absorption layer 1 formed by such as Porous material at upper surface, and can be mobile freely along the conveyance direction of substrate P (hereinafter simply referred to as conveyance direction); Lifting table 3 with guide rail, saddle 2 movably supports along conveyance direction by it; Make the drive division 4 that lifting table 3 is elevated; Cutter part 5, it is when lifting table 3 is in lifting position, and the Width along substrate P moves and the substrate P be adsorbed on the absorption layer 1 of saddle 2 can be cut off; Paste section 6, it can paste adhesive band TP to substrate P; With maintaining part 8 (can move up and down), it is located at the top of lifting table 3, and is kept the wireline reel 7 of the roller RR1 of the substrate P winding by implementing to process A by both sides.
In addition, wireline reel 7 is pasted with the high resin molding of clinging power or material in a part (or whole side face) for its outer peripheral face, after the outer peripheral face making the leading section of substrate P with wireline reel 7 contacts, wireline reel 7 is rotated, the substrate P thereby, it is possible to automatically reel.
These saddles 2, lifting table 3, drive division 4, cutter part 5, paste section 6 and maintaining part 8 as integration workstation portion SN and form, can be placed in castor platform etc. transports, and can be positioned assigned position.
Each driving of these saddles 2, drive division 4, cutter part 5, paste section 6 is controlled (with reference to Fig. 5) by control part CT.
In addition, workstation portion SN has: moving part, and it can keep substrate P and move along long side direction, and comprises saddle 2, lifting table 3, drive division 4 etc.; And mobile control division, it makes moving part move to based on the cut-out region of shut-off mechanism CU10 or the engaging zones based on engaging mechanism PU10.
In addition, substrate P is fitted by adhesive band TP by the paste section 6 in present embodiment, but also can be other bonding method (mechanism).Also can be such as, bonding agent is applied and the mode of pressurizing attaching along the Width orthogonal with the conveyance direction of substrate P with band shape, when substrate P is resin molding etc., the mode of crimping by the heating of the part for laminating of substrate P, or the mode such as ultrasonic joint.
In addition, the absorption layer 1 being located at the upper surface of saddle 2 keeps substrate P by Vacuum Pressure, but also can be configured to, by the mechanical type clamping device (jig arm etc.) beyond Vacuum Pressure by locking for the upper surface of substrate P and saddle 1.
In addition, selection injection mechanism ST1 shown in Fig. 1 is under the control of control part CT, by (following for the roller RR1 that the substrate P implementing to process A is wound in wireline reel 7, be called sub-roller RR1) as sub-roller RRB11, RRB21, RRB31 any one and be optionally fed into any one of installation portion RSB11 ~ RSB31, and the wireline reel 7 of preparation is transported the maintaining part 8 of the 1st splicer portion CSa be available by taking out of to sub-roller RR1.
In the present embodiment, processing speed VA, VC are about 3 times of processing speed VC, processing unit UB is also provided with 3 settings, therefore, sub-roller RR1 (namely, sub-roller RRB11 ~ RRB31, RRB12 ~ RRB32, RR2 described later) length of substrate P that reels, be set as being wound on about 1/3 of the length of the substrate P on the donor rollers RRA becoming female roller.
Therefore, shut-off mechanism CU10 by the specified length as by about for the total length of the substrate P be wound on donor rollers RRA 3 deciles to cut off substrate P.
In addition, the selection injection mechanism ST2 of Fig. 1 is under the control of control part CT, select any one of sub-roller RRB12 ~ RRB32 that the substrate P being implemented treatments B by any one of processing unit UB1 ~ UB3 only reeled with specified length amount, installation portion RSB12 ~ RSB32, and be fed into engaging mechanism PU10 (roller conveyance), and any one installation portion RSB12 ~ RSB32 be available by transporting of antithetical phrase roller RRB12 ~ RRB32 installs the wireline reel of preparation.
Engaging mechanism PU10 mainly will implement treatments B and any one of sub-roller RRB12 ~ RRB32 of conveyance as sub-roller RR2, and near the terminal dropping into cut-off substrate before being engaged in, as shown in Figure 1, there is the 2nd splicer portion CSb (junction surface) and the 2nd buffer gear (the 2nd buffer part) BF2.In addition, engaging mechanism PU10 comprises: the 2nd splicer portion CSb (junction surface) engaged by the substrate implementing treatments B; With the 2nd buffer gear (buffer part) BF2, its enable the storage capacity of substrate according to implement treatments B substrate computed carrier amount and change, and the computed carrier amount of the substrate from junction surface that the processed B of adjustment drops into.
As shown in Figure 4, the 2nd splicer portion CSb is, arranges under the state that the workstation portion SN be located in above-mentioned 1st splicer portion CSa makes the conveyance direction of substrate P become contrary.That is, the 2nd splicer portion CSb has: saddle 2, and it has absorption layer 1 at upper surface, and can move freely along conveyance direction; Lifting table 3 with guide rail, saddle 2 movably supports along conveyance direction by it; Make the drive division 4 that lifting table 3 is elevated; Cutter part 5, it is when lifting table 3 is in lifting position, and the Width along substrate P moves and the substrate P be adsorbed on the absorption layer 1 of saddle 2 can be cut off; Paste section 6, it can paste adhesive band TP to substrate P; With maintaining part 8, it is located at the top of lifting table 3, and is kept the wireline reel 7 of the roller RR2 of the substrate P winding by implementing treatments B by both sides.
2nd buffer gear BF2 is formed in the same manner as the 1st buffer gear BF1, the substrate P moved into processing unit UC is stored changeably in the length range that can adjust, is disposed adjacent with the upstream side of the conveyance direction of the substrate P of processing unit UC.
2nd buffer gear BF2 has: tension reel mechanism DR2, and it is elevated to direction opposite each other by making the multiple rollers along the conveyance direction of substrate P is adjacent, and the storage capacity of substrate P can be adjusted changeably; Drive reel NR2 with clamping, it adjusts the computed carrier amount (conveyance speed) (with reference to Fig. 5) of the substrate P transported from the 2nd splicer portion CSb to tension reel mechanism DR2.The driving of tension reel mechanism DR2 and clamping drive the driving of reel NR2 to be controlled by control part CT.
Fig. 5 is the control block diagram in the base plate processing system shown in Fig. 1 ~ Fig. 4.
As shown in Figure 5, the action of control part CT controlled processing unit UA, UB (UB1 ~ UB3), UC, and plan as a whole to control to be located at respectively saddle 2 on shut-off mechanism CU10 and engaging mechanism PU10, drive division 4, cutter part 5, paste section 6, select injection mechanism ST1, ST2, driving that tension reel mechanism DR1, DR2, clamping drive reel NR1, NR2 etc.In addition, control part CT counts and manages the conveyance length of the substrate P in donor rollers RRA, the rotary actuation of recycling roll RRC, each step (each processing unit), and management through figures becomes the substrate surplus of each roller of the supply side of substrate P and becomes the substrate winding amount of each roller of recovery side of substrate P, also carries out the management of the overall operation time till treatment step A ~ C, whether have the problem in process on each roller or the management etc. of the information such as the degree of unfavorable condition or position occurs.Control part CT comprises the connecting move control portion of the storage capacity interlock of the substrate P in the action and the 1st buffer part BF1 making shut-off mechanism CU10.Similarly, control part CT comprises the connecting move control portion of the storage capacity interlock of the substrate P in the action and the 2nd buffer part BF2 making engaging mechanism PU10.
Next, the action of the base plate processing system of above-mentioned formation is described.
At this, as shown in Figure 1, in processing unit UB1 treatments B complete tight after, sub-roller RRB12 is by selecting injection mechanism ST2 and the maintaining part 8 that transports to the 2nd splicer portion CSb.In addition, in processing unit UB2, treatments B is implemented to the substrate P of drawing from the sub-roller RRB21 be arranged on installation portion RSB21.In addition, in processing unit UB3, until the sub-roller RRB31 becoming next handling object to be arranged on installation portion RSB31 standby.
In addition, in the following description, because the action of each constitution equipment is controlled by control part CT, record so omit it.
First, after be wound with the substrate P implementing process A with specified length on the sub-roller RR1 of maintaining part 8 being held in the 1st splicer portion CSa, in the 1st buffer gear BF1, clamping drives reel NR1 to stop driving and stopping substrate P to the supply of the 1st splicer portion CSa.Now, process A in processing unit UA and continue to carry out, substrate P is sent to the 1st buffer gear BF1.Therefore, the tension reel mechanism DR1 in the 1st buffer gear BF1 drives to the direction making the storage capacity of substrate P increase.
Stop linkedly with the supply of the substrate P from the 1st buffer gear BF1, in the 1st splicer portion CSa, carry out the cut-out process of substrate P.
Particularly, first, after saddle 2 moves to the position relative with cutter part 5, lifting table 3 and saddle 2 is made together to increase by the action of drive division 4.By the rising of saddle 2, absorption layer 1 keeps substrate P from the back side (lower surface) absorption, is positioned to the off-position based on cutter part 5.Then, cutter part 5 moves along the Width of substrate P and cuts off substrate P.After substrate P is cut-off, injection mechanism ST1 is selected sub-roller RR1 to be fed into the installation portion RSB31 of processing unit UB3 as sub-roller RRB31.In addition, injection mechanism ST1 is selected to be discharged at sub-roller RR1 and the maintaining part 8 of the 1st splicer portion CSa that is available loads the wireline reel 7 of preparation.
In the 1st splicer portion CSa, when wireline reel 7 is arranged on after in maintaining part 8, the fore-end that saddle 2 moves to make absorption remain on the substrate P of the upper surface of saddle 2 is positioned at the below (clamping simultaneously drives reel NR1 also only synchronous rotary ormal weight) of wireline reel 7, the maintaining part 8 of supporting wireline reel 7 only declines the adhesive part close contact of certain distance, the fore-end of substrate P and the outer peripheral face of wireline reel 7.Like this, after the fore-end of the substrate P extended from the 1st buffer gear BF1 side is connected to new wireline reel 7, the absorption removed based on absorption layer 1 keeps, then, maintaining part 8 is back to height and position originally, is made lifting table 3 and saddle 2 together decline by the action of drive division 4.
Then, clamping drives the rotary actuation of reel NR1 and new wireline reel 7 again to start, and the supply from the substrate P of the 1st buffer gear BF1 starts again, and substrate P is wound in new wireline reel 7.After the supply of substrate P starts again, clamping drives reel NR1 to rotate with the speed that the transporting velocity (that is, substrate P carry to the 1st buffer gear BF1 speed) than the substrate P corresponding with the processing speed VA in processing unit UA is slightly fast.In tension reel mechanism DR1, drive the driving of reel NR1 accordingly with clamping, drive to the direction making the storage capacity of substrate P reduce.
The length being stored in the substrate P in the 1st buffer gear BF1 become roughly minimum after, drive to clamp with the speed identical with the transporting velocity of the substrate P in processing unit UA and drive reel NR1.
On the other hand, the sub-roller RRB31 from the installation portion RSB31 being arranged on processing unit UB3 draws substrate P, and carries with the speed corresponding with processing speed VB and implement treatments B, is wound to the sub-roller RRB32 be arranged on installation portion RSB32.
In processing unit UB3, implementing in the process of treatments B to the substrate P of drawing from sub-roller RRB31, in processing unit UB2, complete the treatments B that the substrate P of drawing from sub-roller RRB21 is implemented, the sub-roller RRB2 being wound with substrate P is standby at installation portion RSB22.
By selecting injection mechanism ST2, to from the substrate P being arranged on the sub-roller RRB12 on engaging mechanism PU10 before as sub-roller RR2, after completing the process C implemented based on processing unit UC, clamping in the 2nd buffer gear BF2 of engaging mechanism PU10 drives the driving of reel NR2 to stop, and stops substrate P to the supply of tension reel mechanism DR2.
Now, in processing unit UC, process C continues to carry out.Therefore, tension reel mechanism DR2 action, with the certain speed that the operational throughput (processing speed VC) with the substrate P in processing unit UC is corresponding, carries the substrate P be stored in the 2nd buffer gear BF2 to processing unit UC.
In the 2nd splicer portion CSb, in the same manner as the cut-out process in the 1st splicer portion CSa, after saddle 2 moves on the position relative with cutter part 5, lifting table 3 and saddle 2 is made together to increase by the action of drive division 4.By the rising of saddle 2, absorption layer 1 keeps the substrate P from sub-roller RRB12 from the back side (lower surface) absorption, is positioned to the off-position based on cutter part 5.Then, cutter part 5 moves along the Width of substrate P and cuts off substrate P.Cut off after substrate P, select injection mechanism ST2 to take out the wireline reel 7 being wound with sub-roller RR2 (RRB12) from maintaining part 8, the maintaining part 8 of sky is arranged on the standby sub-roller RRB22 of installation portion RSB22 and as sub-roller RR2.
Group roller RRB22 is arranged on after in the maintaining part 8 in the 2nd splicer portion CSb as sub-roller RR2, aim at from the fore-end of the substrate P of sub-roller RR2 extraction with the rearward end of the substrate P of the 2nd buffer gear BF2 side cut off before, 2 plate base P keep by absorption layer 1.In this condition, 2 plate base P are engaged by adhesive band TP.After substrate P engages, the absorption removed based on absorption layer 1 keeps, and then, is made lifting table 3 and saddle 2 together decline by the action of drive division 4.Then, by driving clamping to drive reel NR2, from the 2nd splicer portion CSb to the supply again of the substrate P of the 2nd buffer gear BF2.
After the supply of substrate P starts again, clamping drives reel NR2 to rotate with the speed that the transporting velocity than the substrate P corresponding with the processing speed VC in processing unit UC is slightly fast.In tension reel mechanism DR2, drive the driving of reel NR2 accordingly with clamping, drive to the direction making the storage capacity of substrate P increase.
When the length being stored to the substrate P in the 2nd buffer gear BF2 become roughly maximum after, drive to clamp with the speed identical with the transporting velocity of the substrate P in processing unit UC and drive reel NR2.Then, from the substrate P that the sub-roller RRB22 (sub-roller RR2) being delivered to processing unit UC via the 2nd buffer gear BF2 draws, process C is implemented with processing speed VC.
As mentioned above, after the sub-roller RR1 of length that the substrate P implementing process A by processing unit UA is wound as the number of units according to processing unit UB and splits, be fed into processing unit UB1 ~ UB3 successively and implement treatments B, then, processing unit UC is fed into successively to implement process C from processing unit UB1 ~ UB3 as sub-roller RR2.About the processing unit UB that processing speed VB is slower than processing speed VC, 3 are provided with according to the ratio of processing speed, thus, from surface, from 3 processing unit UB1 ~ UB3 with the cycle identical with the situation implementing treatments B by 3 times of processing speeds of processing speed VB, sub-roller RR2 is fed into processing unit VC.
As explained above ground, in the present embodiment, according to processing unit UA, UB performance separately, and when can be set as processing speed VA > processing speed VB, the relation of the number of units m of the number of units n of processing unit UA and processing unit UB is set to n < m, and sub-roller substrate P being cut to the length corresponding with number of units m is also optionally fed into any one of the processing unit UB1 ~ UBm of m platform.Thus, reduction process speed VB can not be limited to, if observe with production line entirety, then can with processing speed VA treatment substrate P.
In addition, according to processing unit UB, UC performance separately, when can be set as processing speed VB < processing speed VC, the substrate P processing unit UB1 ~ UBm by multiple stage (m) being implemented the sub-roller RR2 of treatments B engages successively and is fed into the processing unit UC of n platform (n < m).Therefore, it is possible to suppress in fact substrate P to move into the stand-by period to processing unit UC from processing unit UB.
Therefore, in this case, also reduction process speed VB can not be limited to, can with processing speed VC (≈ VA) treatment substrate P.
Therefore, in the present embodiment, implement the situation of the different multiple process A ~ C of processing speed successively, also can seek the lifting of throughput rate.In addition, in the present embodiment, the number of units of setting process unit UB is carried out according to the ratio of processing speed.Therefore, equipment is excessively set efficient processing substrate can not be realized.On this basis, in the present embodiment, by the processing unit UB1 ~ UB3 of polytenization along the vertical direction multilayer arrange situation, can implement efficient processing substrate while setting area (footprint) can not be increased.
In addition, in the present embodiment, make the engaging mechanism PU10 of the shut-off mechanism CU10 of band buffer gear and band buffer gear be can be used in cut off with the general formation of either party engaged, and be set to workstation portion SN.Therefore, do not need individually to arrange dissimilar device, the cost of production equipment can be reduced.
Namely, between processing unit adjacent in a succession of multiple processing unit, if the processing unit of the upstream side relative to the conveyance direction of substrate P, the processing speed of the processing unit in downstream is lower, and workstation portion SN is set betwixt as shut-off mechanism CU10, when the relation of processing speed is contrary, workstation portion SN is set between adjacent processing unit as engaging mechanism PU10.
Namely, the base plate processing system of present embodiment can be, between processing unit adjacent in a series of multiple processing unit, relative to the conveyance speed of the substrate P in the processing unit (the 1st processing unit) of the upstream side of the conveyance direction of substrate P, when the conveyance speed of the substrate P in the processing unit (the 2nd processing unit) in downstream is reduced, between the 1st processing unit and the 2nd processing unit, there is shut-off mechanism CU10 substrate P cut off with the specified length of long side direction, in the conveyance speed relative to the substrate P in the 1st processing unit, and when the conveyance speed of the substrate P in the 2nd processing unit is increased, there is engaging mechanism PU10 substrate P engaged along long side direction between the 1st processing unit with the 2nd processing unit.
(device manufacturing system)
Next, with reference to Fig. 6, the device manufacturing system being suitable for aforesaid substrate disposal system is described.
Fig. 6 is the figure representing that the part as the device manufacturing system (flexible display production line) of base plate processing system is formed.At this, represent from donor rollers RR1 draw flexibility substrate P (sheet, film etc.) successively through n platform treating apparatus U1, U2, U3, U4, U5 ... Un and the example be wound on recycling roll RR2.Host control device CONT (control part) plans as a whole each treating apparatus U1 ~ Un controlling to form production line.
In addition, the treating apparatus U1 ~ Un shown in Fig. 6 can be any one of the processing unit UA ~ UC shown in Fig. 1, also can be, to make in treating apparatus U1 ~ Un more than 2 continuous print treating apparatus come together any one of alignment processing unit UA ~ UC.
In figure 6, orthogonal coordinate system XYZ is set as that the surface (or back side) of substrate P is vertical with XZ face, and the Width orthogonal with the conveyance direction (long side direction) of substrate P is set as Y direction.In addition, this substrate P be by prespecified pre-treatment by its surfaction activate or the substrate of trickle next door structure (sag and swell) that forms precise pattern on surface.
The substrate P be wound on donor rollers RR1 is drawn by the driving reel DR10 of clamping and is transported to treating apparatus U1.The center of the Y direction (Width) of substrate P by marginal position controller EPC1, and converging on relative to target location ± scope of tens μm ~ about tens μm in mode servocontrol.
Treating apparatus U1 be with mode of printing in the conveyance direction (long side direction) of substrate P by photonasty functional liquid (photoresistance, photonasty silicon alkane coupling material, photonasty coupling material, the close and distant liquid modification agent of photonasty, photonasty plating reductive agent, UV cured resin liquid etc.) be coated in applying device on the surface of substrate P continuously or optionally.The drier Gp2 etc. of contained solvent or moisture in being provided with the laminate reel DR20, the applying mechanism Gp1 that are wound with substrate P and removing the photonasty functional liquid that is coated in substrate P rapidly in treating apparatus U1, wherein, applying mechanism Gp1 is included in the painting application reel that photonasty functional liquid is coated in by this laminate reel DR20 equably the surface of substrate P or using the relief printing plate of photonasty functional liquid as ink print or the version body reel etc. of intaglio plate.
Treating apparatus U2 is for the substrate P moved from treating apparatus U1 being heated to set point of temperature (such as, about tens ~ 120 DEG C) and making the photonasty functional layer being coated in surface stablize fixing heating arrangement.Be provided with in treating apparatus U2 substrate P is turned back and the multiple reel transported and air swingle, the heating chamber portion HA1 that the substrate P moved into is heated, make heating after the temperature of substrate P drop to the cooling chamber portion HA2 consistent with the environment temperature of subsequent step (treating apparatus U3) and clamped driving reel DR3 etc.
Treating apparatus U3 is the photonasty functional layer relative to the substrate P moved from treating apparatus U2, irradiates the exposure device of the ultraviolet patterning light corresponding with the circuit pattern of display or wiring pattern.Be provided with in treating apparatus U3 the center of the Y direction of substrate P (Width) controlled for marginal position controller EPC, the clamped driving reel DR4 on certain position, by substrate P with regulation tension force local volumes around and the rotating cylinder DR5 being uniform cylinder planar by the pattern exposure part supporting in substrate P and 2 groups of lax (space) DL of regulation are paid to substrate P drive reel DR6, DR7 etc.
And, be provided with in treating apparatus U3: infiltration type cylinder light shield DM; To be located in this cylinder light shield DM and will the lighting mechanism IU of the mask pattern photograph of the outer peripheral face of cylinder light shield DM to be formed in; With aligming microscope AM1, AM2 of detecting alignment mark etc., to be that the picture of a part for mask pattern in order to make cylinder light shield DM is relative with the part being supported the substrate P being cylinder planar by rotating cylinder DR5 with substrate P aim at (Alignment) and be previously formed in substrate P this alignment mark.
Treating apparatus U4 is the photonasty functional layer relative to the substrate P moved from treating apparatus U3, carries out the wet type processing device of at least one of the various wet processed as wet developing process, electroless plating process etc.Be provided with in treating apparatus U4 along 3 treatment trough BT1, BT2 of Z-direction form a social stratum, BT3, multiple reels, clamped driving reel DR8 etc. that substrate P warpage is transported.
Treating apparatus U5 is by the substrate P moved from treating apparatus U4 heating and the moisture amount becoming wet substrate P because of wet type flow process is adjusted to the heat drying apparatus of setting, but omission illustrates.Then, through several treating apparatus also by the substrate P of the last treating apparatus Un of a series of flow process, be wound on recycling roll RR2 by the driving reel DR10 of clamping.When this winding, can not the mode of deviation in the Y-axis direction with the edge of substrate at the center or Y direction that can not make the Y direction (Width) of substrate P, by marginal position controller EPC2, sequentially Correction and Control drives the relative position in the Y-axis direction of reel DR10 and recycling roll RR2.
In the device manufacturing system of above-mentioned Fig. 6, according to each treating apparatus U1, U2, U3, U4, U5 ... the processing speed of Un, the processing unit polytenization making processing speed slow and be set up in parallel multiple stage, and, shut-off mechanism CU10 was set before this treating apparatus, and the selection injection mechanism ST1 of any one being used for substrate being fed into multiple treating apparatus is set.
In addition, after the multiple stage treating apparatus that processing speed is slow, the engaging mechanism PU10 engaged successively by the multiple substrates taken out of from each treating apparatus is set, thus, even if when implementing the significantly different multiple process of processing speed successively, also can not be limited to the minimum treatment step of processing speed, the lifting of throughput rate can be sought.
When the production line shown in Fig. 6, the treating apparatus U2 carrying out heating does one's utmost the conveyance speed suppressing substrate P, thereby, it is possible to reduced by the volume of chamber portion HA1, HA2, accordingly, have to cut down and use electric power and the advantage of the setting area of device can be reduced.
On the other hand, treating apparatus U2 tight before treating apparatus U1 in, photonasty functional liquid patterning is also printed situation about being coated on the surface of substrate P to be configured to, use version body (intaglio plate or the relief printing plate) reel of pattern printing, this reel applies photonasty functional liquid as ink after, make substrate P be connected to an edition body reel and carry out pattern transferring.In this case, in order to make pattern transfer characteristics from from version body reel to substrate P good, and must with speed conveying substrate P faster to a certain degree.
Like this, in treating apparatus U1 and treating apparatus U2, substrate conveyance speed (processing speed) likely desired according to device performance is significantly different.Therefore, in this case, if treating apparatus U1 to be set to the processing unit UA in Fig. 1, make treating apparatus U2 as the processing unit UB1 ~ UB3 in Fig. 1 polytenization, then can construct efficient and that throughput rate is high production line.
At this, illustrate when disposal system (production line) of Fig. 1 before based on the model example shown in Fig. 7 with reference to the sequential chart of Fig. 8, with in the past based on single line process compared with, can expect that the activity duration of how many degree promotes.
Fig. 7 (a) represents makes to process 3 steps A respectively, processing unit UA, UB, UC of B, C are respectively 1 model example of carrying out the situation of single line process.At this, donor rollers RRA is wound with the substrate P that total length is 1200m.In addition, each processing unit UA ~ UC as device performance and suppose that there is following processing power.That is, processing unit UA has the ability of row relax of going forward side by side with maximum 15cm/s conveying substrate P, and processing unit UB has the ability of row relax of going forward side by side with maximum 5cm/s conveying substrate P, and processing unit UC has the ability of row relax of going forward side by side with maximum 15cm/s conveying substrate P.
When this single line, the conveyance speed of the substrate P of production line entirety is consistent with the speed 5cm/s of the slowest processing unit UB, thus, the production operation time (time to the process of substrate enforcement Overall Steps A, B, C of 1200m) is 400 minutes (6 hours 40 minutes).
In contrast, Fig. 7 (b) to represent as Fig. 1 before the model of production line of polytenization routine.Each performance of each processing unit UA, UB (UB1 ~ UB3), UC is identical with situation about illustrating in Fig. 7 (a).In the same manner as Fig. 1 before, make the processing unit UB polytenization carrying out treatment step B, 3 unit UB1 ~ UB3 are set, by the cut-out processing time in the shut-off mechanism CU10 after comprising processing unit UA, with based on selecting the setup time of the sub-roller replacing construction of injection mechanism ST1 etc. to be set to 3 minutes, by the joining process time in the engaging mechanism PU10 before comprising processing unit UC, and based on selecting the setup time of the sub-roller replacing construction of injection mechanism ST2 etc. to be set to 3 minutes.
In addition, as shown in Fig. 7 (b), the processing unit UB polytenization making processing speed slow, therefore, processing unit UA, UC are set as transporting substrate P with the maximal rate 15cm/s ensured by respective performance.
The sequential chart of Fig. 8 is the activity duration of the model example of drawing for estimate 7 (b), make production line S1, S2, S3 hypothetically with 3 processing unit UB1 ~ UB3 corresponding figure representing each processing time respectively.When the beginning processed, from the substrate P of donor rollers RRA by processing unit UA process, but substrate P is split by every 1/3 of total length 1200m in shut-off mechanism CU10.Thus, as shown in production line S1, the 1st the 400m amount being fed into the substrate of processing unit UA, after processing with about 44.4 minutes, in the setup time of shut-off mechanism CU10 through 3 minutes, and is delivered to processing unit UB1.
The activity duration of the substrate P that processing unit UB1 process 400m measures is 133.3 minutes.Then, as the setup time (installation etc. of sub-roller) specified after about 3 minutes, the substrate of the 1st 400m amount is fed into processing unit UC, to transport speed 15cm/s process.The activity duration of the substrate measured based on the 400m of processing unit UC is 44.4 minutes.
In the process, as shown in production line S2, processing unit UA continued the process of the substrate carrying out the 2nd 400m amount in about 44.4 minutes, then, as shown in production line S3, to transport the process that speed 15cm/s continues the substrate carrying out the 3rd 400m in about 44.4 minutes.The substrate of the 2nd 400m amount is delivered to processing unit UB2 after based on 3 minutes setup times of shut-off mechanism CU10, within about 133.3 minutes, processes in this consumption.
In processing unit UC, after the process of the substrate of the 1st 400m amount completes and is from the beginning of time 228.1 minutes.But, before this, the process of the substrate of the 2nd 400m amount is completed by processing unit UB2, and the substrate of the 2nd 400m amount is via engaging mechanism PU10, selection injection mechanism ST2C, after the setup time of about 3 minutes, engage with the terminal part of the 1st substrate that 400m measures.
Then, processing unit UC processes to transport speed 15cm/s the 2nd substrate that 400m measures engaged with the substrate of the 1st 400m constantly.
Similarly, as shown in production line S3, after the substrate measured completes the process in processing unit UA, be fed into processing unit UB3, be wound on after 133.3 minutes on sub-roller RRB32 by the 3rd (finally) 400m after shut-off mechanism CU10 cuts off.The substrate of the 3rd 400m amount, also in processing unit UC, before the process of the substrate of the 2nd 400m amount completes, completes the process in processing unit UB32.
In the process of the substrate measured by processing unit UC process the 2nd 400m, the substrate of the 3rd 400m amount via engaging mechanism PU10, select injection mechanism ST2C and after the setup time of about 3 minutes, engage with the terminal part of the 2nd substrate that 400m measures.Then, processing unit UC processes to transport speed 15cm/s the 3rd substrate that 400m measures engaged with the substrate of the 2nd 400m constantly.
As mentioned above, by making the unit polytenization for the treatment of step B, and the process of the substrate P that 1200m is measured terminates with 317 minutes (5 hours 17 minutes).Compared with the model example of the single line process shown in this situation with Fig. 7 (a), improve the activity duration (shortening of production time) of about 20%.
In the model example shown in Fig. 7 (b), although the total length be wound on as the substrate P on the donor rollers RRA of female roller is set to 1200m, but, even if be the length on this, as long as carry out the segmentation of the substrate in shut-off mechanism CU10 with every 400m, the substrate being fed into production line can be made to continue to be delivered to last treatment step C continuously till.
In addition, in the model example shown in Fig. 7 (b), all to operate 3 processing unit UB1 ~ UB3 with identical processing speed (5cm/s), but, also can, in the scope that can adjust, make the conveyance speed of the substrate in each unit UB1 ~ UB3 only different with small quantity.
Above, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned example.Each shape of each constituting portion material shown in above-mentioned example and combination etc. are examples, in the scope do not departed from from purport of the present invention, can carry out various change based on designing requirement etc.
Such as, in the above-described embodiment, be configured to be provided with 3 processing unit UB1 ~ UB3, but, also can be configured to, according to the ratio setting 2 of processing speed or arrange more than 4.
In addition, in the above-described embodiment, make by the step polytenization of the part in the production line that single line is formed.But, even if when production line originally (producing like products, same to category) is from initial step to last step polytenization, also above-mentioned embodiment can be applied.
Such as, when the production line of the such single line process of script Fig. 7 (a) is set side by side with 2, also can be, shut-off mechanism CU10 (CU101, CU102) is set respectively after 2 processing unit UA (UA1, UA2), using the processing unit the UB low activity duration of 2 afterwards add 3 as 5 unit UB1 ~ UB5 polytenization, then, 2 engaging mechanism PU10 (PU101, PU102) are then set, then, 2 processing unit UC (UC1, UC2) are set.
In this formation, to make the substrate of the unit length (such as 400m) after by any one cut-out of shut-off mechanism CU101, CU102, the mode being delivered to any one unit be available in 5 processing unit UB1 ~ UB5 is formed selects injection mechanism ST2, and the mode accepting the substrate of the unit length (such as 400m) after by any one process of 5 processing unit UB1 ~ UB5 with engaging mechanism PU101, PU102 is respectively formed selection injection mechanism ST2.
In addition, in the process of initial processing unit UA1, UA2, be preferably, only process from after the substrate of donor rollers RRA with unit length (such as 400m) to make processing unit UA1, processing unit UA2 starts the process of the substrate from donor rollers RRA, and pays the mistiming wittingly.
So, can avoid 2 processing units UA1, UA2 each in female roller (RRA) is installed simultaneously roller change operation (brief interruption of production development), and each processing unit is effectively operated.
2nd embodiment
Below, the embodiment of substrate board treatment of the present invention and substrate processing method using same is described with reference to Fig. 9 to Figure 25.In the present embodiment, for the inscape same with above-mentioned embodiment, mark identical Reference numeral and simplification be described or omit.
Fig. 9 is the figure that the part of device manufacturing system (flexible display production line) SYS put as processing substrate representing present embodiment is formed.At this, illustrate following example, namely, device manufacturing system SYS has the 1st installation portion RS1 of installation donor rollers (the 1st roller) RR1, the 2nd installation portion RS2 (maintaining part) of donor rollers (the 2nd roller) RR2 is installed, the 3rd installation portion RS3 of recycling roll (the 3rd roller) RR3 is installed, with the 4th installation portion RS4 installing recycling roll (the 4th roller) RR4, from donor rollers RR1, substrate P (the sheet of the flexibility of some extractions of RR2, film etc.) successively through the 1st splicer portion (substrate connects replacing mechanism) CSa, 1st buffer gear BF1, the treating apparatus U1 of n platform, U2, U3, U4, U5, Un, 2nd buffer gear BF2, 2nd splicer portion (the 2nd substrate connect change mechanism) CSb and be wound to recycling roll RR3, RR4 some on.
In addition, in the present embodiment, for being fed into the 1st, the 2nd buffer gear BF1, BF2, treating apparatus U1 as treatment substrate ... substrate in Un, is suitably called substrate P to illustrate.For before input from donor rollers RR1, RR2 draw substrate, be suitably called substrate P 1, P2 to illustrate.For based on treating apparatus U1 ... the substrate reclaimed by recycling roll RR3, RR4 after the process of Un, is suitably called substrate P 3, P4 to illustrate.
Host control device CONT (control part, the 2nd control part) plan as a whole to control to form each treating apparatus U1 ~ Un and the 1st of production line, the 2nd splicer portion CSa, CSb, the 1st, the 2nd buffer gear BF1, BF2.In addition, host control device CONT controls in the 1st installation portion RS1, be arranged on the rotary actuation of the motor drive shaft MT1 on donor rollers RR1 and in the 2nd installation portion RS2, be arranged on the rotary actuation of the motor drive shaft MT2 on donor rollers RR2.In addition, host control device CONT comprises the connecting move control portion of the storage capacity interlock of the substrate P 1 in the cut-out action and the 1st buffer gear BF1 (buffer gear) making substrate P 1 (the 1st substrate).In addition, host control device CONT comprises the connecting move control portion of the storage capacity interlock of the substrate P in the cut-out action and the 2nd buffer gear BF2 making substrate P (treatment substrate).
In addition, as shown in Figure 10, near the 1st installation portion RS1, be provided with the supply sensor S1 of the state of supply of the substrate P 1 detected in donor rollers RR1.Supply sensor S1 at the end of supply substrate P 1 being detected, to host control device CONT end of output signal.Similarly, near the 2nd installation portion RS2, be provided with the supply sensor S2 of the state of supply of the substrate P 2 detected in donor rollers RR2.At the end of supply sensor S2 works as supply substrate P 2 being detected, to host control device CONT end of output signal.
In fig .9, orthogonal coordinate system XYZ is set as that the surface (or back side) of substrate P is vertical with XZ face, and the Width orthogonal with the conveyance direction (long side direction) of substrate P is set as Y direction.In addition, this substrate P be by prespecified pre-treatment by its surfaction activate or the substrate of trickle next door structure (sag and swell) that forms precise pattern on surface.
Figure 10 is the figure of the schematic configuration representing the 1st splicer portion CSa and the 1st buffer gear BF1.
1st splicer portion CSa will connect to the substrate that the 1st buffer gear BF1 carries another substrate of drawing be replaced by from donor rollers RR1, RR2 from some extractions of donor rollers RR1, RR2, and has a clamping and drive reel NR1, cut off joint unit CU1, CU2.In addition, 1st splicer portion CSa (substrate connects replacing mechanism) has control part, this control part controls to cut off action and joint action, after making when the position of the terminal part leading section of the substrate P supplied from donor rollers RR2 (the 2nd roller) 2 (the 2nd substrate) being engaged to the substrate P 1 (the 1st substrate) becoming cut off, cut off substrate P 1 (the 1st substrate).
Clamping drives reel NR1 under the control of host control device CONT, keep substrate P 1 or substrate P 2 and carry to the 1st buffer gear BF1, or stop the conveying of substrate P, and be configured in the roughly centre position of the 1st installation portion RS1 and the 2nd installation portion RS2 in the Z-axis direction.
Cut off joint unit CU1, CU2 by with the parallel plane virtual composition surface VF1 of the XY passed through from the position clamping the Z-direction driving reel NR1 centered by, configure symmetrically along Z-direction.Cut off joint unit CU1 with the position faced by virtual composition surface VF1 on there is absorption layer 1A, cutter 2A and tension reel 3A.In addition, cut off joint unit CU1 by not shown rotating mechanism, in such as Figure 10 by cut off the joint unit CU2 bonding station relative with absorption layer 1A shown in solid line and as Figure 10 in by the 1A of absorption layer shown in double dot dash line be sticked position between in rotary moving (swing) relative with the 1st installation portion RS1.And, cut off joint unit CU1 at bonding station, by not shown travel mechanism along leaving relative to virtual composition surface VF1 (namely cutting off joint unit CU2)/close direction is moved.Absorption layer 1A, when cutting off joint unit CU1 and being in bonding station, is configured in the downstream (+X-axis side) of the throughput direction of substrate P (substrate P 1) compared with cutter 2A.
Similarly, cut off joint unit CU2 with the position faced by virtual composition surface VF1 on there is absorption layer 1B, cutter 2B and tension reel 3B.In addition, cut off joint unit CU2 by not shown rotating mechanism, in such as Figure 10 by cut off the joint unit CU1 bonding station relative with absorption layer 1B shown in solid line and as Figure 10 in by the 1B of absorption layer shown in double dot dash line be sticked position between in rotary moving (swing) relative with the 1st installation portion RS2.And, cut off joint unit CU2 at bonding station, by not shown travel mechanism along leaving relative to virtual composition surface VF1 (namely cutting off joint unit CU1)/close direction is moved.Absorption layer 1B, when cutting off joint unit CU2 and being in bonding station, is configured in the downstream (+X-axis side) of the throughput direction of substrate P (substrate P 2) compared with cutter 2B.
These movements cutting off joint unit CU1, CU2 are controlled by host control device CONT.
1st buffer gear BF1 is configured between treating apparatus (processing mechanism) U1 and the 1st splicer portion CSa, and sending to treating apparatus U1 after the substrate P of carrying from the 1st splicer portion CSa temporarily being stored within the scope of the longest storage specified, and there is tension reel mechanism DR1 and clamping driving reel NR2.
The substrate P that clamping drives reel NR2 to keep being stored by the 1st buffer gear BF1 is also carried to treating apparatus U1, is configured in and clamps the Z axis position driving reel NR1 roughly the same compared with tension reel mechanism DR1 by the conveyance direction downstream side of substrate P.
Tension reel mechanism DR1 is located opposite from along the X-direction range that is alternately arranged the lower floor reel RK1 that multiple upper strata reel RJ1 of top and range are located opposite from below, and each reel RJ1, RK1 can separately move along Z-direction.The position of top is set as compared with the upper dead center position JU2 of the upper dead center position JU1 of upper strata reel RJ1 and lower dead point position JD1 and lower floor reel RK1 and lower dead point position JD2.The action of these tension reel mechanisms DR1 is controlled by host control device CONT.
Figure 11 is the figure of the schematic configuration representing the 2nd splicer portion CSb and the 2nd buffer gear BF2.
2nd buffer gear BF2 is configured between treating apparatus (processing mechanism) Un and the 2nd splicer portion CSb, send to the 2nd splicer portion CSb after the substrate P of carrying from treating apparatus Un is temporarily stored within the scope of the longest storage of regulation, and there is clamping driving reel NR3 and tension reel mechanism DR2.
Tension reel mechanism DR2 is located opposite from along the X-direction range that is alternately arranged the lower floor reel RK2 that multiple upper strata reel RJ2 of top and range are located opposite from below, and each reel RJ2, RK2 can separately move along Z-direction.The position of top is set as compared with the upper dead center position JU4 of the upper dead center position JU3 of upper strata reel RJ2 and lower dead point position JD3 and lower floor reel RK2 and lower dead point position JD4.The action of these tension reel mechanisms DR2 is controlled by host control device CONT.
2nd splicer portion CSb will carry from the 2nd buffer gear BF2 and by the substrate P of some recovery of recycling roll RR3, RRR4 connect be replaced by be recycled to recycling roll RR3, RRR4 another, and there is clamping drive reel NR4, cut off joint unit CU3, CU4.
Clamping drives reel NR4 under the control of host control device CONT, by the substrate P of carrying from the 2nd buffer gear BF2 towards cutting off joint unit CU3, CU4 conveying or stopping the conveying of substrate P, the position of Z-direction be configured in the 3rd installation portion RS3 and the 4th installation portion RS4 roughly centre position and with the position of the parallel plane virtual composition surface VF2 of XY.
Cut off joint unit CU3, CU4 to configure symmetrically along Z-direction centered by virtual composition surface VF2.Cut off joint unit CU3 with the position faced by virtual composition surface VF2 on there is absorption layer 1C, cutter 2C and tension reel 3C.In addition, cut off joint unit CU3 by not shown rotating mechanism, in such as Figure 11 by cut off the joint unit CU4 bonding station relative with absorption layer 1C shown in solid line and as Figure 11 in by the 1C of absorption layer shown in double dot dash line be sticked position between in rotary moving (swing) relative with the 3rd installation portion RS3.And, cut off joint unit CU3 at bonding station, by not shown travel mechanism along leaving relative to virtual composition surface VF2 (namely cutting off joint unit CU4)/close direction is moved.
Absorption layer 1C, when cutting off joint unit CU3 and being positioned at bonding station, is configured in the upstream side (-X-axis side) of the throughput direction of substrate P compared with cutter 2C.
Similarly, cut off joint unit CU4 with the position faced by virtual composition surface VF2 on there is absorption layer 1D, cutter 2D and tension reel 3D.In addition, cut off joint unit CU4 by not shown rotating mechanism, in such as Figure 11 by cut off the joint unit CU3 bonding station relative with absorption layer 1D shown in solid line and as Figure 11 in by the 1D of absorption layer shown in double dot dash line be sticked position between in rotary moving (swing) relative with the 4th installation portion RS4.And, cut off joint unit CU4 at bonding station, by not shown travel mechanism along leaving relative to virtual composition surface VF2 (namely cutting off joint unit CU3)/close direction is moved.Absorption layer 1D, when cutting off joint unit CU4 and being in bonding station, is configured in the upstream side (-X-axis side) of the throughput direction of substrate P compared with cutter 2D.
These movements cutting off joint unit CU3, CU4 are controlled by host control device CONT.
As shown in figure 11, in the 3rd installation portion RS3, reclaim reel RR3 and be arranged on motor drive shaft MT3.In the 4th installation portion RS4, reclaim reel RR4 and be arranged on motor drive shaft MT4.The rotary actuation of motor drive shaft MT3 and the rotary actuation of motor drive shaft MT4 are controlled by host control device CONT.
In addition, as shown in figure 11, near the 3rd installation portion RS3, the winding sensor S3 of the winding situation detecting the substrate P 3 reclaimed in reel RR3 is provided with.Winding sensor S3 at the end of winding substrate P 3 being detected, to host control device CONT end of output signal.Similarly, near the 4th installation portion RS4, be provided with the winding sensor S4 of the winding situation detecting the substrate P 4 reclaimed in reel RR4.At the end of winding sensor S4 works as winding substrate P 4 being detected, to host control device CONT end of output signal.
Recovery reel RR3, RR4 have leading section and are connected with roller core and introducing substrate (the 3rd substrate) PK (in fig. 11, only illustrating the substrate P K reclaiming reel RR4) being bonded to the introducing of substrate P 3 or substrate 4 at terminal part.As substrate P K, can for and carry out based on the identical material of the substrate P of the process for the treatment of apparatus U1 ~ Un, also can be the thickness roughly the same from substrate P and material is different.
The treating apparatus U5 of present embodiment is the substrate P heating will moved from treating apparatus U4, and the moisture amount becoming the substrate P wet because of wet type flow process is adjusted to setting, or implement the crystallization of semiconductor material or comprise the heat drying apparatus of thermal annealing (less than 200 °) of removal of solvents etc. of ink of metal nanoparticle, but omission illustrates.Then, temporarily stored by the 2nd buffer gear BF2 by the substrate P of the last treating apparatus Un of a succession of flow process through several treating apparatus, and suitably carry out connection by the 2nd splicer portion CSb and change, and be wound to recycling roll RR3 or recycling roll RR4.
Next, illustrate in the process of the substrate P in the device manufacturing system SYS of above-mentioned formation with reference to Figure 12 to Figure 19, the action of the 1st splicer portion CSa and the 1st buffer gear BF1.In addition, the action of the various treating apparatus, constitution equipment etc. of composed component manufacturing system SYS is controlled by host control device CONT, but in the following description, omits and carries out about host control device CONT the record that controls.
Figure 12 is that the substrate P 1 of drawing from donor rollers RR1 drives reel NR1 via the reel 3A and clamping cutting off joint unit CU1 and carries and the figure temporarily stored among the 1st buffer gear BF1 to the 1st buffer gear BF1 as the 1st substrate.As shown in figure 12, in the 1st buffer gear BF1, upper strata reel RJ1 is positioned at upper dead center position JU1, and lower floor reel RK1 is positioned at lower dead point position JD2, and thus, substrate P stores close to the longest length in the 1st buffer gear BF1.
In the 2nd installation portion RS2, after being wound with the donor rollers RR2 that will carry out connecting the substrate P 2 changed when the substrate P 1 of donor rollers RR1 is used up and being arranged on motor drive shaft MT2, rotate and cut off joint unit CU2 and make absorption layer 1B move to the position that is sticked.Make the leading section of substrate P 2 adsorb (link or connect) and be fixed on the absorption layer 1B being positioned at the position that is sticked, then, with the face of absorption side opposite side on to be sticked double sticky tape T.
Above-mentioned substrate P 2 to be undertaken by operator to being sticked of the absorption of absorption layer 1B and double sticky tape T or using mechanical arm etc. to carry out.
After the substrate P 2 of double sticky tape T of being sticked fixedly completes to the absorption of absorption layer 1B, as shown in figure 13, rotate and cut off joint unit CU2 and make substrate P 2 move to bonding station, and made by the rotary actuation of motor drive shaft MT2 donor rollers RR2 to the supplying party with substrate P 2 in the opposite direction (in fig. 13 for being rotated counterclockwise direction) rotate, thus, substrate P 2 is paid to the tension force of regulation.
On the other hand, after the supply sensor S1 supply detected from the substrate P 1 of donor rollers RR1 terminates, clamping is stopped to drive the driving of reel NR1, and make motor drive shaft MT1 to the direction rotary actuation contrary with the throughput direction of substrate P 1, thus, the substrate P 1 between reel NR1 and donor rollers RR1 is driven to pay weak tension force to clamping.
After clamping drives the driving of reel NR1 to stop, clamping drives reel NR2 also to continue to drive.Therefore, tension reel mechanism DR1 action, drives the driving of reel NR2 accordingly with clamping, the rising of the decline of upper strata reel RJ1 and lower floor reel RK1 is suitably carried out.Thus, the substrate P be stored in the 1st buffer gear BF1 drives reel NR2 to continue conveying to treating apparatus U1 with certain speed by clamping.
Next, as shown in figure 14, cut-out joint unit CU1, CU2 are moved to approximating direction, under the state accompanying double sticky tape T, substrate P 1, P2 is crimped between absorption layer 1A, 1B with certain hour.Thus, substrate P 2 is becoming on the position of the terminal part of substrate P 1 by being cut off at subsequent step, fits and engage via double sticky tape T with substrate P 1.
In addition, carry out substrate P 1, P2 joining process process in, clamping drives reel NR2 and tension reel mechanism DR1 also to continue to drive, and the substrate P be stored in the 1st buffer gear BF1 drives reel NR2 to continue conveying to treating apparatus U1 with certain speed by clamping.
After substrate P 1 engages with substrate P 2, making absorption layer 1B in cut-out joint unit CU2 to atmosphere opening, then, as shown in figure 15, making cut-out joint unit CU2 to mobile from cutting off the direction (+Z-direction) that joint unit CU1 leaves.Thus, from the leading section of substrate P 2 that donor rollers RR2 draws under the state being engaged (link or be connected) by double sticky tape T with substrate P 1, adsorb remain on cut-out joint unit CU1 absorption layer 1A on.
Then, cutting off under the state of paying tension force to substrate P 1 between joint unit CU1 and donor rollers RR1, by cutting off the cutter 2A in joint unit CU1, relative substrate P 1 is cut off.As cutter 2A, the formation such as by making point of a knife substrate P 1 be cut off along Width (Y direction) slip of substrate P 1 can be adopted.
In the process of cut-out process of carrying out substrate P 1, clamping drives reel NR2 and tension reel mechanism DR1 also to continue to drive, and the substrate P be stored in the 1st buffer gear BF1 drives reel NR2 to continue conveying to treating apparatus U1 with certain speed by clamping.
After substrate P 1 is cut off, make absorption layer 1A in cut-out joint unit CU1 to atmosphere opening, then, as shown in figure 16, make cut-out joint unit CU1 mobile to the direction (-Z-direction) left from cut-out joint unit CU2 (virtual composition surface VF1).Thus, the substrate P 1 of drawing from donor rollers RR1 is being that rightabout rotation is wound on this donor rollers RR1 with the throughput direction of donor rollers RR1.
In addition, about donor rollers RR2, by being rightabout torque with the throughput direction of donor rollers RR2, substrate P 2 drives between reel NR1 (and reel 3B) at rotating roller RR2 and clamping and is paid tension force.Thus, the substrate be connected with the substrate P be stored in the 1st buffer gear BF1 switches to the substrate P 2 as the 2nd substrate of drawing from donor rollers RR2.Substrate P 2 as the 2nd substrate also can have the specification equal with substrate P 1 (the 1st substrate).
Then, clamping drives reel NR1 to rotate to drive the speed that reel NR2 is slightly fast than clamping, in tension reel mechanism DR1, as shown in figure 17, drive the driving of reel NR1 accordingly with clamping, the decline of the rising of upper strata reel RJ1 and lower floor reel RK1 is suitably carried out.In addition, by making motor drive shaft MT2 to throughput direction rotary actuation, and the substrate P 2 of drawing from donor rollers RR2 is admitted to, the storage length of the substrate P in the 1st buffer gear BF1 is increased.
And, when the storage length of the substrate P in the 1st buffer gear BF1 become roughly maximum after, clamping drives reel NR1 to drive the speed that reel NR2 is identical to rotate with clamping, thus, the storage length equilibrium of the substrate P in the 1st buffer gear BF1.In addition, the donor rollers RR1 that roughly uses up of substrate P 1 removes (can dismounting) from the 1st installation portion RS1, as shown in figure 18, installs other the donor rollers RR5 being wound with substrate P 5.
When after installation donor rollers RR5, based on the testing result of supply sensor S2, before the substrate P 2 in donor rollers RR2 is used up, as shown in figure 18, rotate and cut off joint unit CU1 and make absorption layer 1A move to the position that is sticked.The leading section of substrate P 5 is adsorbed and fixes (link or connect) on the absorption layer 1A being positioned at the position that is sticked, then, with the face of absorption side opposite side on to be sticked double sticky tape T.
Then, made by the rotary actuation of motor drive shaft MT1 donor rollers RR5 to the supplying party with substrate P 5 in the opposite direction (in figure 18 for being rotated counterclockwise direction) rotate, thus, substrate P 5 is paid to the tension force of regulation, make cut-out joint unit CU1 rotate simultaneously, as shown in figure 19, bonding station is moved to.
And, after the supply of the substrate P 2 in supply sensor S2 detection donor rollers RR2 terminates, clamping is stopped to drive the driving of reel NR1, and in the same manner as above-mentioned steps, cut-out joint unit CU1, CU2 are moved to approximating direction, under the state accompanying double sticky tape T, make substrate P 2, P5 certain hour is crimped between absorption layer 1A, 1B, then, cut off substrate P 2 by the cutter 2B cut off in joint unit CU2.Thus, the substrate be connected with the substrate P be stored in the 1st buffer gear BF1 switches to the substrate P 5 of drawing from donor rollers RR5.
So, the substrate P switched successively is after the wet processed implemented in the heating in the coating process of the photonasty functional liquid in treating apparatus U1, treating apparatus U2, the pattern exposure process in treating apparatus U3, treating apparatus U4 and the heat drying process in treating apparatus U5, be delivered to the 2nd buffer gear BF2, the 2nd splicer portion CSb successively, and be recycled to recycling roll RR3 or recycling roll RR4.
Next, illustrate in the process of the substrate P in the device manufacturing system SYS of above-mentioned formation with reference to Figure 20 to Figure 25, the 2nd splicer portion CSb of recycling roll side and the action of the 2nd buffer gear BF2.
Figure 20 is that treatment substrate and substrate P drive reel NR3 be delivered to the 2nd buffer gear BF2 and store via clamping, drives the substrate P of reel NR4 conveying (discharge) to be recycled to figure the recycling roll RR3 being arranged on the 3rd installation portion RS3 via the reel 3C cutting off joint unit CU3 from the 2nd buffer gear BF2 via clamping.In addition, as shown in figure 20, in the 2nd buffer gear BF2, upper strata reel RJ2 is positioned at lower dead point position JD3, and lower floor reel RK2 is positioned at upper dead center position JU4, and thus, substrate P is to be stored in the 2nd buffer gear BF2 close to the shortest length.
In the 4th installation portion RS4, after the winding of recycling roll RR3 has reclaimed, the recycling roll RR4 that substrate P reclaims is arranged on motor drive shaft MT4, then, has rotated and cut off joint unit CU4 and make absorption layer 1D move to the position that is sticked.The introducing substrate P K that leading section is connected with recycling roll RR4 is (following, be only called substrate P K) terminal part adsorb and fix (link or connect) on the absorption layer 1D being positioned at the position that is sticked, then, with the face of absorption side opposite side on to be sticked double sticky tape T.When after the double sticky tape T that is sticked on substrate P K, cut-out joint unit CU4 is made to rotate and move to bonding station, and made recycling roll RR4 rotate to the direction of recession (being clockwise direction in fig. 20) of substrate P K (substrate P) by the rotary actuation of motor drive shaft MT4, thus, substrate P K is paid to the tension force of regulation.
And, after winding sensor S3 detects and terminates based on the recovery of the substrate P of recycling roll RR3, stop clamping driving the driving of reel NR4, and make tension reel mechanism DR2 action, the decline of the rising of upper strata reel RJ2 and lower floor reel RK2 is suitably carried out.Thus, make to drive the storage length of the substrate P of reel NR3 conveying among the 2nd buffer gear BF2 to increase with a certain amount of (operational throughput corresponding with the conveyance speed of the substrate P in production line) from treating apparatus U5 by clamping to store.
On the other hand, after the recovery of the substrate P based on recycling roll RR3 terminates, as shown in figure 21, cut-out joint unit CU3, CU4 are moved to approximating direction, under the state accompanying double sticky tape T, makes substrate P, PK certain hour is crimped between absorption layer 1C, 1D.Thus, the terminal part of substrate P K becomes on the position of leading section when in subsequent step, substrate P is cut off, and to fit and engage (link or be connected) via double sticky tape T with substrate P.
After substrate P engages with substrate P K, making absorption layer 1D in cut-out joint unit CU4 to atmosphere opening, then, as shown in figure 22, making cut-out joint unit CU4 to mobile from cutting off the direction (+Z-direction) that joint unit CU3 leaves.Thus, the leading section of substrate P K is under the state engaged with substrate P by double sticky tape T, and absorption remains on the absorption layer 1C of cut-out joint unit CU3.
Then, cutting off under the state of paying tension force to substrate P between joint unit CU3 and recycling roll RR3, by cutting off the cutter 2C in joint unit CU3, relative substrate P is cut off.After substrate P is cut off, making absorption layer 1C in cut-out joint unit CU3 to atmosphere opening, then, as shown in figure 23, making cut-out joint unit CU3 to mobile from cutting off the direction (-Z-direction) that joint unit CU4 leaves.Thus, recycling roll RR4 is switched to from the recycle object of the substrate P (that is, the substrate P processed in treating apparatus U1 ~ Un) of the 2nd buffer gear BF2 conveying.
In the process that the joining process of carrying out in the 2nd above-mentioned splicer portion CSb and cut-out process, also suitably carry out the rising of the upper strata reel RJ2 in the 2nd buffer gear BF2 and the decline of lower floor reel RK2, make to drive the storage length of substrate P among the 2nd buffer gear BF2 of reel NR3 conveying to store with a certain amount of increase from treating apparatus U5 by clamping.
And, after the recycle object of the substrate P to recycling roll RR4 has switched, clamping drives reel NR4 to rotate to drive the speed that reel NR3 is slightly fast than clamping, in tension reel mechanism DR2, the driving of reel NR4 is driven accordingly with clamping, the rising of the decline of upper strata reel RJ2 and lower floor reel RK2 is suitably carried out, in the process of the joining process in the 2nd splicer portion CSb and cut-out process, the length of the substrate P be stored in the 2nd buffer gear BF2 is reduced, and becomes the roughly minimum storage length (with reference to Figure 24) being in A-stage.When the length being stored in the substrate P in the 2nd buffer gear BF2 become roughly minimum after, make clamping drive reel NR4 to drive the speed that reel NR3 is identical to rotate with clamping.
On the other hand, in the 3rd installation portion RS3 of recovery completing substrate P, recycling roll RR3 is removed, as shown in figure 24, to connect (link or joint) has introducing substrate P K2 (following, be only called substrate P K2) the recycling roll RR6 of leading section be arranged on motor drive shaft MT3, and the terminal part of substrate P K2 is adsorbed and is fixed on the absorption layer 1C of the cut-out joint unit CU3 turning to the position that is sticked, then, with the face of absorption side opposite side on to be sticked double sticky tape T.
When after the double sticky tape T that is sticked on substrate P K2, cut-out joint unit CU3 is made to rotate and move to bonding station, and made recycling roll RR6 rotate to the direction of recession (being clockwise direction in fig. 25) of substrate P K2 (substrate P) by the rotary actuation of motor drive shaft MT3, thus, under the state of tension force of substrate P K2 being paid to regulation, standby until the recovery detection of end of recycling roll RR3 based on winding sensor S4.
As described above, in the present embodiment, by the 1st buffer gear BF1 substrate P temporarily stored and in the process of carrying to treating apparatus U1, substrate P connected the substrate P 2 being replaced by and drawing from new donor rollers RR2, and carry to the 1st buffer gear BF1.Therefore, it is possible to do not stop each process ground based on treating apparatus U1 ~ Un, change the roller becoming supply source.Therefore, in the present embodiment, the substrate P being fed into treating apparatus U1 ~ Un in the change moment of donor rollers can be avoided to be wasted and the situation causing cost to increase.
And, in the present embodiment, in the process substrate P of carrying from treating apparatus Un temporarily stored by the 2nd buffer gear BF2, switch the recycle object of substrate.Therefore, when changing the recycle object of substrate P, also can avoid being wasted in the substrate P changing the moment and be fed into treating apparatus U1 ~ Un and the situation that causes cost to increase.
In addition, in the present embodiment, in the 1st splicer portion CSa and the 2nd splicer portion CSb, after on the substrate used before new substrate is engaged in, by substrate cutting before.Therefore, can not produce when formerly performing cut-out and cause when cutting off because of paid tension force substrate be separated and hinder the defect of joint etc., stable processing substrate can be implemented.
Above, with reference to the accompanying drawings of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned example.Each shape of each constituting portion material shown in above-mentioned example and combination etc. are only examples, can carry out various change in the scope do not departed from from purport of the present invention based on designing requirement etc.
Such as, in the above-described embodiment, the formation that processing mechanism has multiple treating apparatus U1 ~ Un is listed.But, be not limited thereto, also can be configured to, in a treating apparatus, be provided with above-mentioned substrate connect replacing mechanism.
In addition, be configured in the above-described embodiment, there is recycling roll in addition that be connected with and introduce substrate P K.But, such as, also can be configured to, use and used and the cut-off donor rollers of the substrate of leading section.
In addition, in the above-described embodiment, be configured to, at supply side and recovery side, there are 2 roller installation portions respectively.But, also can have the roller installation portion of more than 3 respectively.
In the above-described embodiment, before becoming roller terminal from the substrate of side's supply of 2 donor rollers, the substrate from other rollers is automatically connected, thereby, it is possible to do not continue to process with not stopping production line.If but in the somewhere of production line, produce defect being produced in the pattern on substrate, or produce the unfavorable condition of manufacturing installation, then worry can make a large amount of defective productss.
Therefore, also can be that following production line (factory) is formed, namely, in production line before final products complete, the multiple steps performing flow process with the state of strip substrate are divided into several block, in each block, carry out based on roll-to-roll continuous process, in next step block, transport to be wound with the roller unit forming half-finished substrate, be arranged on the installation portion (RS1 or RS2) of regulation.In this case, substrate conveyance can be carried out continuously with step block unit, even if when there occurs problem (pattern defect or device defect etc.) in certain step block, only make this step block temporarily stop, a large amount of generations of defective products can be reduced.
In addition, in the above-described embodiment, be arranged on the donor rollers RR1 on 2 installation portions RS1, RS2, RR2 respectively, the plate shape substrates of product manufacturing is wound with equal length amount, before the substrate from a donor rollers RR1 supplies end (roller terminal) tightly, connect and be replaced by the substrate of another donor rollers RR2, and continue process until the using up of substrate of donor rollers RR2.But can be also following using method, that is, another donor rollers becoming roller terminal be only replaced by the process of new roller by the donor rollers be arranged on of installation portion RS1, RS2, to treating apparatus U1 ~ Un sustainable supply substrate.
In this case, such as, be set to and will become the donor rollers of roller terminal as RR2, this roller RR2 is removed from installation portion RS2, new donor rollers is mounted to installation portion RS2, until the setup time that the joint on the 1st splicer portion CSa is ready to complete state (state of Figure 13) is set to 180 seconds, then in this process, when the transporting velocity of substrate in processing is set to 50mm/ second, the length of the substrate (P1) be fed into treating apparatus U1 (production line) from another donor rollers RR1 is 9m.
Therefore, also can be, after the substrate (P1) measured as this 9m supplies from another donor rollers RR1, immediately by the 1st splicer portion CSa, by the front end of the substrate (P2) from the new donor rollers RR2 be arranged on installation portion RS2, engage (link or connect) in the position of substrate (P1) of only dropping into roughly 9m from donor rollers RR1 to treating apparatus U1, and this substrate (P1) is cut off, connect the substrate (P2) be replaced by from donor rollers RR2.
In addition, as mentioned above, by the substrate (P1) from the donor rollers RR1 be seated on installation portion RS1, when being utilized as temporary connection substrate (such as about 9m measures), about the process carried out this substrate (P1), can be set to the conditional decision of each treating apparatus U1 ~ Un or guide's process of maintenance management, the element formed at this does not use as final products.
And, also can be, when being utilized as temporary connection substrate (such as about 9m measures), this substrate (P1) is not needed to be wound to donor rollers RR1, take care of in chest etc. after folding for piece leaf formula substrate being such as cut to 10m length, take out substrate (10m) from this chest 1 blade and be supplied to the 1st splicer portion CSa.
In addition, technical scope of the present invention is not limited to above-mentioned each embodiment.Such as, more than 1 of the key element illustrated by the respective embodiments described above has abridged situation.In addition, the key element illustrated by the respective embodiments described above can be appropriately combined.
Description of reference numerals
BF1 ... 1st buffer gear (the 1st buffer part, buffer gear), BF2 ... 2nd buffer gear (the 2nd buffer part), CSa ... 1st splicer portion (substrate connects replacing mechanism), CSb ... 2nd splicer portion (the 2nd substrate connects replacing mechanism), CU ... shut-off mechanism, FS ... substrate, P ... substrate, PK, PK2 ... introduce substrate (the 3rd substrate), PU10 ... engaging mechanism, RR1 ... donor rollers (the 1st roller), RR2 ... donor rollers (the 2nd roller), RR3 ... recycling roll (the 3rd roller), RR4 ... recycling roll (the 4th roller), RS1 ... 1st installation portion, RS2 ... 2nd installation portion, RS3 ... 3rd installation portion, RS4 ... 4th installation portion, ST ... select injection mechanism, SYS ... device manufacturing system (substrate board treatment), UA, UB, UB1 ~ UB3, UC ... processing unit, U1 ~ Un ... treating apparatus (processing mechanism).

Claims (31)

1. a base plate processing system, has:
1st processing unit, implements the 1st process to along long side direction continuously with the substrate that speed V1 transports; And
2nd processing unit, with speed V2 conveyance by the described substrate after described 1st processing unit processes, implements the 2nd process continuously to described substrate, it is characterized in that,
According to described 1st processing unit, the 2nd processing unit performance separately, when the relation of described speed can be set to V1 > V2, multiple described 2nd processing unit is set, and after described 1st processing unit, also have: the shut-off mechanism that the described substrate implementing described 1st process is cut off with the specified length of described long side direction; With the selection injection mechanism of any one substrate of described cut-out being fed into multiple described 2nd processing unit,
According to described 1st processing unit, the 2nd processing unit performance separately, when the relation of described speed can be set to V1 < V2, multiple described 1st processing unit is set, and before described 2nd processing unit, also there are the multiple substrates by being implemented described 1st process respectively by multiple described 1st processing unit, engage successively along described long side direction and be fed into the engaging mechanism of described 2nd processing unit.
2. base plate processing system according to claim 1, it is characterized in that, when the relation of described speed being set as V1 > V2, also there is the 1st buffer part, 1st buffer part enables the storage capacity of described substrate change according to the computed carrier amount implementing the described substrate that the described 1st processes, and adjusts the computed carrier amount of the described substrate transported towards described shut-off mechanism.
3. base plate processing system according to claim 2, is characterized in that, also has the connecting move control portion of the storage capacity interlock of the described substrate made in the action of described shut-off mechanism and described 1st buffer part.
4. base plate processing system according to any one of claim 1 to 3, it is characterized in that, when the relation of described speed being set as V1 < V2, also there is the 2nd buffer part, 2nd buffer part enables the storage capacity of described substrate change according to the computed carrier amount will implementing the described substrate that the described 2nd processes, and adjustment is fed into the computed carrier amount of the described substrate of described 2nd processing unit from described engaging mechanism.
5. base plate processing system according to claim 4, is characterized in that, also has the 2nd connecting move control portion of the storage capacity interlock of the described substrate made in the action of described engaging mechanism and described 2nd buffer part.
6. base plate processing system according to any one of claim 1 to 5, it is characterized in that, have workstation portion, it is adjacent to arrange with described 1st processing unit and described 2nd processing unit respectively, and has described shut-off mechanism and described engaging mechanism integratedly.
7. base plate processing system according to claim 6, is characterized in that, described workstation portion has:
Moving part, it can keep described substrate and move along described long side direction; With
Mobile control division, it makes described moving part move to based on the cut-out region of described shut-off mechanism or the engaging zones based on described engaging mechanism.
8. a substrate processing method using same, has:
By the 1st processing unit to the action implementing the 1st process along long side direction with the substrate that speed V1 transports continuously; With
With speed V2 conveyance by the described substrate after described 1st processing unit processes, and by the 2nd processing unit, described substrate is implemented continuously to the action of the 2nd process, it is characterized in that,
According to described 1st processing unit, the 2nd processing unit performance separately, when the relation of described speed can be set to V1 > V2, use multiple described 2nd processing unit, and after described 1st processing unit, also have: the cut-out step that the described substrate implementing described 1st process is cut off with the specified length of described long side direction; Step is dropped into the selection of any one substrate of described cut-out being fed into multiple described 2nd processing unit,
According to described 1st processing unit, the 2nd processing unit performance separately, when the relation of described speed can be set to V1 < V2, use multiple described 1st processing unit, and before described 2nd processing unit, also there are the multiple substrates by being implemented described 1st process respectively by multiple described 1st processing unit, engage successively along described long side direction and be fed into the engagement step of described 2nd processing unit.
9. substrate processing method using same according to claim 8, it is characterized in that, when the relation of described speed being set as V1 > V2, adjust the storage capacity of described substrate according to the computed carrier amount of the described substrate implementing described 1st process, and adjust towards the computed carrier amount of the described substrate of the region conveyance carrying out described cut-out.
10. substrate processing method using same according to claim 9, is characterized in that, makes the adjustment interlock of the cut-out action of described substrate and the storage capacity of described substrate.
11. substrate processing method using sames according to claim 8, it is characterized in that, when the relation of described speed being set as V1 < V2, adjust the storage capacity of described substrate according to the computed carrier amount of the described substrate will implementing described 2nd process, and adjustment is from the computed carrier amount of the regional inputs to the described substrate of described 2nd processing unit that carry out described joint.
12. substrate processing method using sames according to claim 11, is characterized in that, make the adjustment interlock of the storage capacity of the joint action of described substrate and described substrate.
13. 1 kinds of shut-off mechanisms, is characterized in that having:
Cutting portion, its substrate cutting that will carry out predetermined processing; With
Buffer part, its enable the storage capacity of described substrate according to implement described predetermined processing described substrate computed carrier amount and change, and the computed carrier amount of described substrate that adjustment transports towards described cutting portion.
14. shut-off mechanisms according to claim 13, is characterized in that, also have the connecting move control portion of the storage capacity interlock of the substrate made in the action of described cutting portion and described buffer part.
15. 1 kinds of engaging mechanisms, is characterized in that having:
Junction surface, its substrate will implementing predetermined processing engages; With
Buffer part, its enable the storage capacity of described substrate according to implement described predetermined processing described substrate computed carrier amount and change, and adjustment to be fed into the computed carrier amount of the described substrate of described predetermined processing from described junction surface.
16. 1 kinds of base plate processing systems, make the 1st processing unit processed along the substrate of long side direction conveyance from enforcement the 1st by afterwards, the 2nd processing unit processed from enforcement the 2nd passes through, and it is characterized in that,
When the conveyance speed of the described substrate in described 2nd processing unit being reduced in the conveyance speed relative to the described substrate in described 1st processing unit, there is shut-off mechanism, this shut-off mechanism is between described 1st processing unit and described 2nd processing unit, described substrate is cut off with the specified length of described long side direction
When the conveyance speed of the described substrate in described 2nd processing unit being increased in the conveyance speed relative to the described substrate in described 1st processing unit, there is engaging mechanism, described substrate, between described 1st processing unit and described 2nd processing unit, engages along described long side direction by this engaging mechanism.
17. base plate processing systems according to claim 16, it is characterized in that, when the setting of numbers of described 1st processing unit is set to n (n >=1) platform, and when the setting of numbers of described 2nd processing unit is set to m (m >=1) platform, being set as n < m when arranging described shut-off mechanism, being set as n > m when arranging described engaging mechanism.
18. 1 kinds of substrate board treatments, is characterized in that having:
1st installation portion, it installs the 1st roller being wound with the 1st substrate of strip;
2nd installation portion, it installs the 2nd roller being wound with the 2nd substrate of strip;
Processing mechanism, it is some as treatment substrate using described 1st substrate and described 2nd substrate, and predetermined processing is implemented in long side direction conveying described in an edge;
Buffer gear, it is configured between described processing mechanism and described 1st installation portion, after temporarily being stored by described 1st substrate from described 1st roller supply, sends to described processing mechanism within the scope of the longest storage of regulation; With
Substrate connects changes mechanism, it cuts off described 1st substrate between described buffer gear and described 1st installation portion, and the leading section of described 2nd substrate from described 2nd roller supply is bonded on the terminal part of described 1st substrate of described cut-out, and sends to described buffer gear.
19. substrate board treatments according to claim 18, it is characterized in that, described substrate connects replacing mechanism and has control part, this control part controls described cut-out action and described joint action, after making on the position leading section of described 2nd substrate from described 2nd roller supply being bonded on the terminal part of described 1st substrate becoming described cut-out, cut off described 1st substrate.
20. substrate board treatments according to claim 18 or 19, is characterized in that also having the connecting move control portion of the storage capacity interlock of the described substrate in the cut-out action and described buffer gear making described 1st substrate.
21., according to claim 18 to the substrate board treatment according to any one of 20, is characterized in that, have:
3rd installation portion, it installs the 3rd roller reclaimed by the described treatment substrate winding of discharging from described processing mechanism;
4th installation portion, it installs the 4th roller reclaimed by the described treatment substrate winding of discharging from described processing mechanism;
2nd buffer gear, it is configured between described processing mechanism and described 3rd installation portion, and after the described treatment substrate will supplied from described processing mechanism temporarily stores within the scope of the longest storage of regulation, sends to described 3rd roller; With
2nd substrate connects changes mechanism, it cuts off the described treatment substrate be wound on described 3rd roller between described 2nd buffer gear and described 3rd installation portion, and the leading section of the described treatment substrate of described cut-out is bonded on the terminal part of the 3rd substrate be connected with described 4th roller, and sends to described 4th roller.
22. substrate board treatments according to claim 21, it is characterized in that, described 2nd substrate connects replacing mechanism and has the 2nd control part, 2nd control part controls described cut-out action and described joint action, after making on the position terminal part of described 3rd substrate being bonded on the leading section of the described treatment substrate becoming described cut-out, cut off described treatment substrate.
23. substrate board treatments according to claim 21 or 22, is characterized in that also having the 2nd connecting move control portion of the storage capacity interlock of the described treatment substrate made in the cut-out action of described treatment substrate and described 2nd buffer gear.
24. 1 kinds of substrate board treatments, is characterized in that having:
1st installation portion, it installs the 1st roller being wound with the 1st substrate of strip;
2nd installation portion, it installs the 2nd roller being wound with the 2nd substrate of strip;
Processing mechanism, it is some as treatment substrate using described 1st substrate and described 2nd substrate, and described in an edge, predetermined processing is implemented in long side direction conveying;
Buffer gear, it is configured between described processing mechanism and described 1st installation portion, after temporarily being stored within the scope of the longest storage of regulation by described 1st substrate from described 1st roller supply, sends to described processing mechanism; With
Substrate connects changes mechanism, it cuts off described 1st substrate between described buffer gear and described 1st installation portion, and the leading section of described 2nd substrate from described 2nd roller supply is attached on the established part of the described buffer gear side of described 1st substrate of described cut-out, and sends to described buffer gear.
25. 1 kinds of substrate board treatments, is characterized in that having:
1st installation portion, it installs the 1st roller of the 1st substrate being wound with strip removably;
Maintaining part, it keeps the 2nd substrate with described 1st substrate equivalent specifications with specified length;
Processing mechanism, it is some as treatment substrate using described 1st substrate and described 2nd substrate, and predetermined processing is implemented in long side direction conveying described in an edge;
Buffer gear, it is configured between described processing mechanism and described 1st installation portion, and after temporarily being stored within the scope of the longest storage of regulation by described 1st substrate from described 1st roller supply, sends to described processing mechanism; With
Substrate connects changes mechanism, it cuts off described 1st substrate between described buffer gear and described 1st installation portion, and the leading section of described 2nd substrate supplied from described maintaining part is connected on the established part of the described buffer gear side of described 1st substrate of described cut-out, and sends to described buffer gear.
26. 1 kinds of substrate processing method using sames, using the substrate of input strip as treatment substrate described in one edge long side direction conveying implement predetermined processing by processing mechanism, it is characterized in that, comprise following action:
1st roller of the 1st substrate being wound with strip is arranged on the action on the 1st roller installation portion;
2nd roller of the 2nd substrate being wound with strip is arranged on the action on the 2nd roller installation portion;
By being configured in the buffer gear between described processing mechanism and described 1st installation portion, the action sent to described processing mechanism after described 1st substrate from described 1st roller supply is temporarily stored within the scope of the longest storage of regulation; With
In the process that the 1st substrate of described temporary transient storage is sent to described processing mechanism, between described buffer gear and described 1st installation portion, cut off described 1st substrate, and the leading section of described 2nd substrate from described 2nd roller supply is attached at the action on the established part of the described buffer gear side of described 1st substrate of described cut-out.
27. substrate processing method using sames according to claim 26, is characterized in that, after on the position leading section of described 2nd substrate from described 2nd roller supply being attached at the terminal part of the 1st substrate becoming described cut-out, cut off described 1st substrate.
28. substrate processing method using sames according to claim 26 or 27, is characterized in that, comprise following action:
3rd roller of the described treatment substrate of winding recovery being discharged from described processing mechanism is arranged on the action the 3rd roller installation portion;
4th roller of the described treatment substrate of winding recovery being discharged from described processing mechanism is arranged on the action the 4th roller installation portion;
By being configured in the 2nd buffer gear between described processing mechanism and described 3rd installation portion, the action sent to described 3rd roller after the described treatment substrate supplied from described processing mechanism is temporarily stored within the scope of the longest storage of regulation; With
In the process described treatment substrate supplied from described processing mechanism temporarily stored by the 2nd buffer gear, cut off the described treatment substrate that is wound on described 3rd roller, and on the terminal part leading section of the described treatment substrate of described cut-out being bonded on the 3rd substrate be connected with described 4th roller and the action sent to described 4th roller.
29. substrate processing method using sames according to claim 28, is characterized in that, after on the position terminal part of described 3rd substrate being bonded on the terminal part of the treatment substrate becoming described cut-out, cut off described treatment substrate.
30. substrate processing method using sames according to claim 28 or 29, it is characterized in that, described 3rd substrate is the substrate formed by the material different from described treatment substrate.
31. 1 kinds of substrate processing method using sames, the substrate of input strip is implemented predetermined processing as long side direction conveying described in treatment substrate one edge by processing mechanism, it is characterized in that, comprise following action:
1st roller of the 1st substrate being wound with strip is arranged on the action on the 1st roller installation portion;
The 2nd substrate with described 1st substrate equivalent specifications is remained on the action in maintaining part with specified length;
By being configured in the buffer gear between described processing mechanism and described 1st installation portion, the action sent to described processing mechanism after described 1st substrate from described 1st roller supply is temporarily stored within the scope of the longest storage of regulation; With
In the process that the 1st substrate of described temporary transient storage is sent to described processing mechanism, between described buffer gear and described 1st installation portion, cut off described 1st substrate, and the leading section of described 2nd substrate supplied from described maintaining part is attached at the action on the established part of the described buffer gear side of described 1st substrate of described cut-out.
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PCT/JP2013/060705 WO2013175882A1 (en) 2012-05-23 2013-04-09 Cutting mechanism, joining mechanism, substrate processing system, substrate processing device, and substrate processing method
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