JP2011221537A - Exposure device, substrate processing device, and method of manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of efficiently manufacturing a device on a belt-like substrate.SOLUTION: The exposure device configured to rotate a mask having a pattern along a predetermined cylindrical surface in the circumferential direction of the cylindrical surface, and transfer the pattern on the substrate includes: a first projection optical system to project an image of a first partial pattern, positioned in a first area on the cylindrical surface, of the pattern to a first projection area; a second projection optical system to project an image of a second partial pattern, positioned in a second area away from the first area along the circumferential direction, of the pattern to a second projection area different from the first projection area; and a substrate carrying device to carry the substrate so that the substrate may pass through the first projection area and the second projection area in synchronism with the rotation of the mask in the circumferential direction. The substrate carrying device includes a path adjusting device to adjust the path length of the substrate carrying path between the first projection area and the second projection area.

Description

  The present invention relates to an exposure apparatus, a substrate processing apparatus, and a device manufacturing method.

  As display elements that constitute display devices such as display devices, for example, liquid crystal display elements and organic electroluminescence (organic EL) elements are known. Currently, in these display elements, active elements (active devices) that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.

  In recent years, a technique for forming a display element on a flexible substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1). In the roll method, the belt-shaped substrate wound around the substrate supply side supply roller is sent out, and the substrate is transported while being wound up by the substrate recovery side recovery roller.

International Publication No. 2008/1229819 Pamphlet

  By the way, the display device is expected to have a large display screen, and there is a demand for a technique that enables a large display element to be efficiently manufactured on a strip-shaped substrate even in the roll method described above.

  Accordingly, an aspect of the present invention is to provide an exposure apparatus, a substrate processing apparatus, and a device manufacturing method that can efficiently manufacture a device such as a display element on a belt-shaped substrate.

  According to a first aspect of the present invention, there is provided an exposure apparatus for transferring a pattern to a substrate while rotating a mask having a pattern along a predetermined cylindrical surface in the circumferential direction of the cylindrical surface, the cylindrical surface of the pattern A first projection optical system for projecting an image of the first partial pattern located in the first area of the first area onto the first projection area, and a second area of the pattern spaced from the first area along the circumferential direction. A second projection optical system that projects an image of the second partial pattern onto a second projection area different from the first projection area, and the first projection area and the second projection area in synchronization with the rotation of the mask in the circumferential direction An exposure apparatus including a path adjustment device that adjusts a path length of a transport path of the substrate between the first projection area and the second projection area. An apparatus is provided.

  According to a second aspect of the present invention, there is provided a substrate processing apparatus for processing a strip-shaped substrate, wherein the substrate transport unit transports the substrate in the longitudinal direction of the substrate, and the substrate transport path by the substrate transport unit. And a substrate processing unit that processes the substrate transported along the transport path, wherein the substrate processing unit transfers a pattern to the substrate according to the first aspect of the present invention. A substrate processing apparatus having the apparatus is provided.

  According to a third aspect of the present invention, there is provided a device manufacturing method for manufacturing a device by processing a substrate, wherein a pattern is transferred to the substrate using an exposure apparatus according to the second aspect of the present invention. And processing the substrate on which the pattern is transferred based on the pattern.

  According to the aspect of the present invention, a device such as a display element can be efficiently manufactured on a belt-like substrate.

Schematic which shows the structure of the substrate processing apparatus which concerns on 1st embodiment of this invention. 1 is a schematic diagram showing a configuration of an exposure apparatus according to the present embodiment. FIG. 3 is a perspective view showing the configuration of part of the exposure apparatus according to the present embodiment. FIG. 3 is a perspective view showing the configuration of part of the exposure apparatus according to the present embodiment. FIG. 3 is a perspective view showing the configuration of part of the exposure apparatus according to the present embodiment. FIG. 2 is a plan view showing a configuration of a part of the exposure apparatus according to the present embodiment. The figure which shows the mode of operation | movement of the exposure apparatus which concerns on this embodiment. The figure which shows the other structure of a mask. The flowchart which shows a part of manufacturing process at the time of manufacturing a semiconductor device. The flowchart which shows a part of manufacturing process at the time of manufacturing a liquid crystal display element.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to an embodiment of the present invention.
As shown in FIG. 1, the substrate processing apparatus FPA is a substrate supply unit SU that supplies a band-shaped substrate (for example, a band-shaped film member) FB, and a substrate process that performs processing on the surface (surface to be processed) of the substrate FB. The part PR, the substrate recovery part CL for recovering the substrate FB, and the control part CONT for controlling these parts are provided.

  In this embodiment, an XYZ coordinate system is set as shown in FIG. 1, and the following description will be given using this XYZ coordinate system as appropriate. In the XYZ coordinate system, for example, the X axis and the Y axis are set along the horizontal plane, and the Z axis is set upward along the vertical direction. The substrate processing apparatus FPA transports the substrate FB from the minus side (− side) to the plus side (+ side) along the X axis as a whole. At that time, the width direction (short direction) of the belt-like substrate FB is set to the Y-axis direction.

  The substrate processing apparatus FPA is an apparatus that executes various processes on the surface of the substrate FB after the substrate FB is sent out from the substrate supply unit SU until the substrate FB is recovered by the substrate recovery unit CL. The substrate processing apparatus FPA can be used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate FB.

  As the substrate FB to be processed in the substrate processing apparatus FPA, for example, a foil (foil) such as a resin film or stainless steel can be used. For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.

  The substrate FB preferably has a smaller coefficient of thermal expansion so that, for example, the size does not change even when the substrate FB receives heat of about 200 ° C. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

  The dimension in the width direction (short direction) of the substrate FB is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the substrate FB may be 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the board | substrate FB may be 10 m or less.

  The substrate FB is formed to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even if a force of its own weight is applied to the substrate. In addition, flexibility includes a property of bending by a force of about its own weight. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate. As the substrate FB, a single strip-shaped substrate may be used, but a plurality of unit substrates may be connected to be formed in a strip shape.

  The substrate supply unit SU sends out and supplies the substrate FB wound in a roll shape to the substrate processing unit PR, for example. In this case, the substrate supply unit SU is provided with a shaft around which the substrate FB is wound, a rotation drive device that rotates the shaft, and the like. In addition, for example, a configuration in which a cover portion that covers the substrate FB wound in a roll shape or the like may be provided. Note that the substrate supply unit SU is not limited to a mechanism that sends out the substrate FB wound in a roll shape, and may be any device that includes a mechanism that sequentially sends the belt-like substrate FB in the length direction thereof.

  The substrate collection unit CL collects the substrate FB from the substrate processing unit PR in a roll shape, for example. Similar to the substrate supply unit SU, the substrate recovery unit CL is provided with a shaft for winding the substrate FB, a rotational drive source for rotating the shaft, a cover for covering the recovered substrate FB, and the like. When the substrate FB is cut into a panel shape in the substrate processing unit PR, the substrate FB is recovered in a state different from the state wound in a roll shape, for example, the substrate FB is recovered in an overlapped state. It does not matter.

  The substrate processing unit PR transports the substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and performs processing on the processing surface Fp of the substrate FB in the course of transport. The substrate processing unit PR includes, for example, a processing apparatus 10, a transfer apparatus 30, and an alignment apparatus 50.

  The processing apparatus 10 includes various apparatuses for forming, for example, organic EL elements on the processing surface Fp of the substrate FB. Examples of such an apparatus include a partition wall forming apparatus for forming a partition wall on the processing surface Fp, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer. More specifically, a droplet coating apparatus (for example, an ink jet type coating apparatus, a spin coating type coating apparatus), a film forming apparatus (for example, a vapor deposition apparatus, a sputtering apparatus), an exposure apparatus, a developing apparatus, a surface modification apparatus, a cleaning apparatus, etc. Is mentioned. Each of these apparatuses is appropriately provided along the transport path of the substrate FB. In the present embodiment, an exposure apparatus is provided as the processing apparatus 10.

  The transport device 30 includes a roller device R that transports the substrate FB to the substrate recovery unit CL in the substrate processing unit PR. A plurality of roller devices R are provided along the transport path of the substrate FB. A drive mechanism (not shown) is attached to at least some of the plurality of roller devices R. By rotating such a roller device R, the substrate FB is transported in the X-axis direction. A configuration may be adopted in which some of the plurality of roller devices R are movable in a direction intersecting the surface of the substrate FB.

  The alignment apparatus 50 performs an alignment operation on the substrate FB. The alignment apparatus 50 includes an alignment camera 51 that detects the position of the substrate FB, and an adjustment device 52 that adjusts at least one of the position and orientation of the substrate FB based on the detection result of the alignment camera 51.

  For example, the alignment camera 51 detects an alignment mark formed on the substrate FB, and transmits the detection result to the control unit CONT. The control unit CONT obtains the position information of the substrate FB based on the detection result, and controls the adjustment amount by the adjusting device 52 based on the position information.

  FIG. 2 is a view showing a configuration of an exposure apparatus EX used as the processing apparatus 10. The exposure apparatus EX is an apparatus that projects an image of the pattern Pm formed on the mask M onto the substrate FB. As shown in FIG. 2, the exposure apparatus EX projects an illumination apparatus IU that illuminates the mask M, a mask movement apparatus MST that can move and rotate while holding the mask M, and an image of the pattern Pm onto the substrate FB. And a substrate transport device FST that transports the substrate FB.

  The illumination device IU illuminates the exposure light ELI on the mask M. The illumination device IU has a plurality of illumination optical systems IL. The exposure light emitted from the illumination optical system IL is irradiated onto the mask M from a plurality of directions (for example, irradiated from the + X direction and the −X direction).

  The mask moving device MST includes a holding unit 40 and a driving device ACM. The holding part 40 is formed in a cylindrical shape as a general shape, and is formed so as to hold the mask M along a cylindrical surface 40a corresponding to the outer peripheral surface thereof. The holding part 40 is provided to be rotatable along the circumferential direction of the cylindrical surface 40a (that is, around the axis C as the central axis of the cylindrical surface 40a). The driving device ACM can rotate the holding unit 40 along the cylindrical surface 40a and can move the holding unit 40 in the X, Y, and Z directions in the drawing.

The mask M is detachably held by the holding unit 40. FIG. 3 is a diagram showing the configuration of the mask M. As shown in FIG. As the mask M, a reflective mask formed in a sheet shape is used.
The pattern Pm formed on the mask M is formed in a state of being divided into four strip-shaped (long rectangular) patterns P1 to P4, for example. Each of the patterns P1 to P4 is formed in four different regions arranged in the left-right direction in FIG. 3 at an equal pitch. The mask M is held by the holding unit 40 so that the pattern Pm is arranged along the cylindrical surface 40a. In that case, the mask M is hold | maintained so that the longitudinal direction (long side direction) of each pattern P1-P4 may correspond with the circumferential direction of the cylindrical surface 40a. The dimension of the longitudinal direction of each pattern P1-P4 is formed so that it may become equal to the dimension of the semicircle of the cylindrical surface 40a, for example.

As shown in FIG. 2, the projection apparatus PU has a plurality of projection optical systems PL. A part of the plurality of projection optical systems PL is arranged on the upstream side (−X side) in the transport direction of the substrate FB with respect to the mask M, and an image of the pattern Pm positioned on the −X side of the holding unit 40 Projecting is performed on the substrate FB located on the −X side of the holding unit 40. Further, another part of the plurality of projection optical systems PL is arranged on the downstream side (+ X side) of the substrate FB with respect to the mask M, and an image of the pattern Pm positioned on the + X side of the holding unit 40 is Projection is performed on the substrate FB located on the + X side of the holding unit 40.
In this embodiment, as each projection optical system PL, for example, an enlargement optical system that enlarges and projects an image of the pattern Pm formed on the mask M (that is, an optical system having an enlargement magnification as the projection magnification) is used. ing. However, each projection optical system PL is not limited to the magnifying optical system, and may be an optical system having a projection magnification of equal or reduced magnification.

  Each projection optical system PL includes an adjustment mechanism that can adjust the projection position of the projection image (image of the pattern Pm) in the direction along the surface of the substrate FB (direction along the XY plane). As the adjustment mechanism, for example, as shown in FIG. 2, the exposure light ELI is transmitted and can be tilted with respect to the optical axis of the projection optical system PL (that is, rotatable about the axis HVa perpendicular to the optical axis). The obtained parallel flat glass HV can be used. Each projection optical system includes a parallel flat glass HV that is rotatable about an axis HVa along the width direction (Y direction) of the substrate FB, so that the projection position of the image of the pattern Pm is in the transport direction (X Direction).

  The substrate transport device FST transports the substrate FB so as to pass through each projection area PA onto which the image of the pattern Pm is projected by the projection device PU. The substrate transport device FST includes a first stage 81, a second stage 82, transport rollers 83 to 84, a path adjustment device ADJ, and a drive device ACF. The first stage 81 and the second stage 82 are positions corresponding to the projection area PA of the projection optical system PL arranged on the −X side of the holding unit 40 and the projection area PA of the projection optical system PL arranged on the + X side. Respectively. Flat surfaces parallel to the XY plane are formed on the + Z side surfaces of the first stage 81 and the second stage 82. The flat surfaces are substrate support surfaces 81a and 82a that support the substrate FB. The first stage 81 and the second stage 82 are each provided with an air bearing mechanism (not shown), and the air bearing mechanism can support the substrate FB on the substrate support surfaces 81a and 82a in a non-contact manner. The substrate support surfaces 81a and 82a are arranged at positions optically conjugate with the pattern Pm of the mask M held by the holding unit 40 (or the cylindrical surface 40a) by the projection optical system PL. The transport rollers 83 and 84 transport the substrate FB in the + X direction.

  The path adjustment device ADJ includes a moving unit 85 and a drive mechanism 86. The moving unit 85 is disposed on the −Z side of the substrate FB. The moving unit 85 is provided between the first stage 81 and the second stage 82 in the X direction (the conveyance direction of the substrate FB). The moving part 85 is formed, for example, in a cylindrical shape and is provided so as to be rotatable in the circumferential direction thereof, and is arranged so that the central axis of the rotation is parallel to the Y direction. Moreover, the moving part 85 is provided so that rotation around the center axis line is possible. The dimension of the moving part 85 in the central axis direction is formed larger than the dimension of the substrate FB in the Y direction (width direction).

  The moving unit 85 is provided so as to be movable in a direction intersecting the surface of the substrate FB (for example, the Z direction in the figure) by driving of the driving mechanism 86. As the moving unit 85 moves to the + Z side, a portion of the substrate FB between the transport roller 83 and the transport roller 84 is put on the moving unit 85. For this reason, the moving path of the substrate FB is changed to a path curved to the + Z side (a detour path) with respect to the linear path set in the X direction.

  The driving device ACF adjusts the rotation speed of the transport rollers 83 and 84 based on the control signal from the control unit CONT, thereby adjusting the transport speed of the substrate FB. The controller CONT controls the driving of the driving device ACM and the driving of the driving device ACF so that the substrate FB is transported at a transport speed corresponding to the rotational speed of the mask M. Specifically, the control unit CONT compares the moving speed (peripheral speed) of the mask M along the cylindrical surface 40a with the transport speed in the length direction of the substrate FB (that is, the moving speed of the surface of the substrate FB). Controls the driving of the driving device ACM and the driving device ACF so as to be equal to the projection magnification (enlargement magnification) of the projection optical system PL.

  FIG. 4 is a diagram illustrating configurations of the mask moving device MST, the illumination device IU, and the projection device PU. As illustrated in FIG. 4, the illumination device IU includes four illumination optical systems IL (IL1 to IL4). The illumination optical systems IL1 to IL4 are provided one by one corresponding to each of the four patterns P1 to P4 of the mask M held by the holding unit 40. The illumination optical systems IL1 and IL3 illuminate the patterns P1 and P3 with the exposure light ELI from the −X side in the drawing, respectively. The illumination optical systems IL2 and IL4 illuminate the patterns P2 and P4 with the exposure light ELI from the + X side in the drawing, respectively.

  As described above, the illumination device IU includes the first illumination optical system (illumination optical systems IL1 and IL3) that illuminates a predetermined region (first region) on the −X side of the cylindrical surface 40a of the mask M with the exposure light ELI, The mask M includes a second illumination optical system (illumination optical systems IL2 and IL4) that illuminates a predetermined region (second region) on the + X side of the cylindrical surface 40a with the exposure light ELI.

FIG. 5 is a plan view showing the positional relationship between the projection apparatus PU, the projection area PA, and the substrate FB.
As shown in FIG. 5, the projection apparatus PU has four projection optical systems PL (PL1 to PL4).

  The exposure light ELI emitted from the illumination optical system IL1 and reflected by the pattern P1 is incident on the projection optical system PL1. Exposure light ELI emitted from illumination optical system IL2 and reflected by pattern P2 is incident on projection optical system PL2. The exposure light ELI emitted from the illumination optical system IL3 and reflected by the pattern P3 is incident on the projection optical system PL3. Exposure light ELI emitted from illumination optical system IL4 and reflected by pattern P4 is incident on projection optical system PL4. The projection optical systems PL1 to PL4 irradiate predetermined projection areas PA1 to PA4 on the substrate FB with the exposure light ELI reflected by the patterns P1 to P4, respectively, and enlarge and project the images of the patterns P1 to P4.

  Thus, the projection apparatus PU includes the first projection optical system (projection optical systems PL1 and PL3) that projects the images of the patterns P1 and P3 on the −X side projection areas PA1 and PA3 of the holding unit 40, and the holding unit 40, respectively. The second projection optical system (projection optical systems PL2 and PL4) that projects the images of the patterns P2 and P4 on the + X side projection areas PA2 and PA4, respectively. The first projection optical system includes a plurality of first unit optical systems (two projection optical systems PL1 and PL3 in the present embodiment). The second projection optical system has a plurality of second unit optical systems (in this embodiment, two projection optical systems PL2 and PL4).

  That is, in the present embodiment, the exposure light ELI irradiated from the first illumination optical system to the pattern P1 and the pattern P3 located in the first region of the cylindrical surface 40a is incident on the first projection optical system, and the first projection optical system. Images of the patterns P1 and P3 are respectively projected onto the first projection area by the system.

  Similarly, the exposure light ELI irradiated to the pattern P2 and the pattern P4 located in the second region of the cylindrical surface 40a from the second illumination optical system is incident on the second projection optical system, and the second projection optical system causes the second light to enter the second projection optical system. Images of the patterns P2 and P4 are respectively projected on the projection areas.

  Each of the projection areas PA1 to PA4 is formed in a parallelogram shape in which, for example, two sides are parallel along the Y direction. Each of the projection areas PA1 to PA4 is formed so that the width of the end in the Y direction (dimension in the X direction) gradually decreases. Hereinafter, the portion where the width is gradually reduced is referred to as a tapered portion. The shape of the projection areas PA1 to PA4 is not limited to the parallelogram shape, and may be a trapezoidal shape or a hexagonal shape having a tapered portion at an end portion in the Y direction, for example. The shapes of the projection areas PA1 to PA4 are set by blinds (not shown) provided in the projection optical systems PL1 to PL4, respectively.

  In the projection optical system PL1 and the projection optical system PL2, the position in the Y direction of the taper portion formed on the + Y side of the projection area PA1 and the position in the Y direction of the taper portion formed on the −Y side of the projection area PA2 overlap. Are arranged as follows. In addition, the projection optical system PL2 and the projection optical system PL3 include a position related to the Y direction of the tapered portion formed on the + Y side of the projection area PA2, and a position related to the Y direction of the tapered portion formed on the −Y side of the projection area PA3. Are arranged to overlap. Further, the projection optical system PL3 and the projection optical system PL4 have a position in the Y direction of the tapered portion formed on the + Y side of the projection area PA3 and a position in the Y direction of the taper portion formed on the −Y side of the projection area PA4. Are arranged to overlap.

  Projection areas PA1 and PA3 of projection optical systems PL1 and PL3 are arranged at equal positions in the X direction. Similarly, the projection areas PA2 and PA4 of the projection optical systems PL2 and PL4 are arranged at equal positions in the X direction. Further, the interval from the first region to the second region along the circumferential direction of the cylindrical surface 40a with respect to the rotation traveling direction of the mask M (that is, from the field region of the first projection optical system to the field region of the second projection optical system). In the present embodiment, the distance Dm is equal to half of the circumferential dimension of the cylindrical surface 40a (πR), where R is the radius of the cylindrical surface 40a (substantially the radius of the holding portion 40). In the present embodiment, the first projection optical system and the second projection optical system are arranged in the X direction between the first projection area (projection areas PA1 and PA3) and the second projection area (projection areas PA2 and PA4). The linear interval DL, the projection magnification β of the first projection optical system and the second projection optical system, and the interval Dm are arranged so as to satisfy DL ≦ β × Dm. Furthermore, as will be described later, the moving unit 85 of the path adjusting device ADJ causes the path length Dp (see FIG. 7) of the substrate FB from the first projection area to the second projection area to satisfy Dp = β × Dm. Placed in.

  Next, a process of manufacturing a display element (electronic device) such as an organic EL element or a liquid crystal display element using the substrate processing apparatus FPA configured as described above will be described. The substrate processing apparatus FPA manufactures the display element according to the control of the control unit CONT.

  First, a belt-like substrate FB wound around a roller (not shown) is attached to the substrate supply unit SU. The controller CONT rotates a roller (not shown) so that the substrate FB is sent out from the substrate supply unit SU from this state. And the said board | substrate FB which passed the board | substrate process part PR is wound up with the roller not shown provided in the board | substrate collection | recovery part CL. By controlling the substrate supply unit SU and the substrate recovery unit CL, the processing surface Fp of the substrate FB can be continuously transferred to the substrate processing unit PR.

  The control unit CONT appropriately transfers the substrate FB within the substrate processing unit PR by the transfer device 30 of the substrate processing unit PR after the substrate FB is sent out from the substrate supply unit SU until it is wound up by the substrate recovery unit CL. While being conveyed, the processing device 10 sequentially forms the constituent elements of the display element on the substrate FB. In this process, when processing is performed by the exposure apparatus EX, first, the mask M is attached to the holding unit 40.

  Next, the control unit CONT irradiates the exposure light ELI to the pattern Pm of the mask M from the illumination device IU. The projection optical system PL projects the image of the pattern Pm onto the projection areas PA1 to PA4.

  As shown in FIG. 6, the projection areas PA1 to PA4 are formed in portions of the substrate FB that are disposed on the substrate support surfaces 81a and 82a of the first stage 81 and the second stage 82. The portion of the substrate FB is flattened along the substrate support surfaces 81a and 82a. The projection areas PA1 to PA4 are formed on the flattened substrate FB.

  First, the control unit CONT performs an exposure process on the upstream side (−X side) of the holding unit 40. The controller CONT irradiates the patterns P1 and P3 with the exposure light ELI from the illumination optical systems IL1 and IL3, respectively. At this time, as shown in FIG. 7, the pattern P1 and the pattern P3 are arranged in the first area MA1 (that is, the field area of the projection optical systems PL1 and PL3) located on the −X side of the cylindrical surface 40a. Exposure light ELI is irradiated.

  The exposure light ELI irradiated to the patterns P1 and P3 is reflected by the patterns P1 and P3, respectively, and enters the projection optical systems PL1 and PL3. Exposure light ELI through projection optical systems PL1 and PL3 is irradiated to projection areas PA1 and PA3, respectively. By this operation, enlarged images of the patterns P1 and P3 are projected onto the projection areas PA1 and PA3, respectively.

  In this state, the control unit CONT transports the substrate FB in the + X direction while rotating the holding unit 40 by the driving device ACM. The substrate FB is transported in the + X direction. By this operation, two regions of the substrate FB separated in the Y direction are sequentially exposed from the + X side to the −X side by the images of the patterns P1 and P2 projected onto the projection regions PA1 and PA2, and the substrate FB is exposed to X. Band-shaped exposure regions PB1 and PB3 along the axial direction are formed. At this time, the control unit CONT determines that the ratio of the moving speed in the length direction of the substrate FB to the moving speed (circumferential speed) of the mask M along the cylindrical surface 40a is the projection magnification (enlargement magnification) of the first projection optical system. The driving device ACM and the driving device ACF are caused to perform the operation while adjusting the rotation speed of the holding unit 40 and the moving speed of the substrate FB so as to be equal to each other.

  Subsequently, when the + X side end portions of the exposure areas PB1 and PB3 reach the X direction position equal to the projection areas PA2 and PA4 as the substrate FB moves, the control unit CONT next moves to the downstream side (+ X side) of the holding unit 40. ) To perform an exposure process. The controller CONT irradiates the patterns P2 and P4 with the exposure light ELI from the illumination optical systems IL2 and IL4, respectively. Exposure light ELI through patterns P2 and P4 is incident on projection optical systems PL2 and PL4. At this time, as shown in FIG. 7, the pattern P2 and the pattern P4 are exposed in a state where they are arranged in the second area MA2 located on the + X side of the cylindrical surface 40a (that is, the visual field area of the projection optical systems PL2 and PL4). Light ELI is irradiated.

  The exposure light ELI that has passed through the projection optical systems PL2 and PL4 is applied to the projection areas PA2 and PA4. Enlarged images of the patterns P2 and P4 are projected on the projection areas PA2 and PA4, respectively. As a result, two regions of the substrate FB separated in the Y direction are exposed sequentially from the + X side to the −X side by the image of the pattern P2 and the image of P4, respectively, and a strip-shaped exposure region PB2 along the X-axis direction. , PB4 are formed on the substrate FB. At this time, the −Y side end and the + Y side end of the exposure area PB2 are exposed in a state where they overlap the + Y side end of the exposure area PB1 and the −Y side end of the exposure area PB3, respectively. The exposure area PB4 is exposed in the state where the end on the −Y side overlaps the end on the + Y side of the exposure area PB3.

  In the present embodiment, on the substrate FB, a portion exposed by only a single image projected onto the projection areas PA1 to PA4, a part of the image projected onto the projection area PA1, and a projection area PA2 are projected. A portion exposed by a portion of the image, a portion exposed by a portion of the image projected on the projection region PA2 and a portion of the image projected on the projection region PA3, and a portion projected by the projection region PA3 A part to be exposed is formed by a part of the image and a part of the image projected onto the projection area PA4. By performing the exposure operation in this way, an exposure pattern Pf corresponding to an enlarged image of the pattern in which the patterns P1 to P4 are interconnected in the short direction is formed on the substrate FB.

  When the exposure operation is performed, the control unit CONT adjusts the rotation speed of the holding unit 40 and the conveyance speed of the substrate FB, and, as shown in FIG. 7, the projection areas PA1 and P3 to the projection areas PA2 and P4. The path adjusting device ADJ adjusts the path length Dp of the transport path of the substrate FB up to this point. The path length Dp does not necessarily coincide with the distance DL along the X direction from the projection areas PA1 and P3 to the projection areas PA2 and P4. When the transport path of the substrate FB is bent by the moving unit 85 of the path adjusting device ADJ, the path length Dp becomes larger than the interval DL.

  The control unit CONT has a distance Dm between the first region MA1 when the exposure light ELI is irradiated on the patterns P1 and P3 and the second region MA2 when the exposure light ELI is irradiated on the patterns P2 and P4, and projection optics. The path length Dp of the substrate FB is adjusted based on the projection magnification β of the systems PL1 to PL4.

Specifically, the control unit CONT adjusts the path length Dp so that the interval Dm, the projection magnification β, and the path length Dp satisfy the relationship Dp = Dm × β. Here, the distance Dm refers to the rotation direction of the mask M from the center in the circumferential direction of the cylindrical surface 40a in the first region MA1 to the center in the circumferential direction of the cylindrical surface 40a in the second region MA2. The distance along the circumferential direction.
Therefore, in this embodiment, when the radius of the circumference of the cylindrical surface 40a is R, Dm = πR. Therefore, the control unit CONT adjusts the path length Dp so as to satisfy Dp = πR × β.
In addition, it is not limited to the case where Dm = πR is satisfied, and in general, the interval Dm is Dm = φ × R using the central angle φ (radian) of the circular arc of the cylindrical surface 40a corresponding to the interval Dm. In this case, the control unit CONT adjusts the path length Dp so as to satisfy Dp = φ × R × β.

  When the substrate FB is transported linearly along the X direction between the transport roller 83 and the transport roller 84, the path length Dp is equal to the distance DL between the projection areas PA1 and PA3 and the projection areas PA2 and PA4 ( Dp = DL). On the other hand, when the distances DL and Dm and the projection magnification β satisfy DL = β × Dm, the control unit CONT retracts the moving unit 85 from the substrate FB by the drive mechanism 86, and the transport roller 83 to the transport roller 84. Until the substrate FB is conveyed in a straight line. On the other hand, when the distances DL and Dm and the projection magnification β satisfy DL <β × Dm, the control unit CONT moves the moving unit 85 to the + Z side by the driving mechanism 86 and moves from the transport roller 83 to the transport roller 84. The path length Dp is increased by detouring the transfer path of the substrate FB during the period, and Dp = β × Dm is satisfied. The relationship between the moving distance of the moving unit 85 and the amount of change in the path length Dp is determined in advance as a design value, or is obtained by experiments or simulations. Based on the relationship, the control unit CONT moves the moving unit 85 so that the optimum path length Dp is obtained. Further, the control unit CONT can move the moving unit 85 so that Dp = β × Dm is satisfied based on the measurement result of a measurement device (not shown) that measures the path length Dp.

  The control unit CONT includes at least a parallel flat glass HV included in the first projection optical system (projection optical systems PL1 and PL3) and a parallel flat glass HV included in the second projection optical system (projection optical systems PL2 and PL4). One is rotated about a corresponding axis HVa by a driving device (not shown), so that the projection position of the image of the pattern Pm by the first projection optical system (that is, the first projection area) and the pattern by the second projection optical system The path length Dp can be changed by moving at least one of the projection positions (that is, the second projection area) of the Pm image in the X direction. For this reason, the control part CONT can adjust the path length Dp so that Dp = β × Dm is satisfied using the parallel flat glass HV as the path adjusting device.

  Further, the control unit CONT can adjust the path length Dp by using the path adjusting device ADJ and the parallel flat glass HV together. In this case, for example, the control unit CONT can perform rough adjustment of the path length Dp by the path adjustment device ADJ and fine adjustment of the path length Dp by the parallel flat glass HV.

The relationship between the amount of rotation of the parallel flat glass HV and the amount of change in the path length Dp is determined in advance as a design value, or is obtained by experiments or simulations.
Based on the relationship, the control unit CONT can rotate the parallel flat glass HV so as to have a desired path length Dp. Moreover, the control part CONT can rotate the parallel flat glass HV based on the measurement result of the measurement apparatus not shown which measures the path length Dp.

  As described above, in the exposure apparatus EX of the present embodiment, the substrate transport apparatus FST has the substrate FB between the first projection area (projection areas PA1 and PA3) and the second projection area (projection areas PA2 and PA4). Since the path adjustment device ADJ for adjusting the path length Dp of the transport path is included, the patterns P1 and P3 (and thus the exposure areas PB1 and PB3) transferred to the substrate FB in the first projection area, and the second projection area The patterns P2 and P4 (and thus the exposure areas PB2 and PB4) transferred to the substrate FB can be simply and accurately aligned. Thereby, the exposure apparatus EX can efficiently manufacture devices such as display elements on the strip-shaped substrate FB.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above-described embodiment, the example in which the magnifying optical system (β> 0) is used as the projection optical system PL (PL1 to PL4) has been described. ), An equal-magnification optical system (β = 1) can be used. In this case, the pattern Pm formed on the mask M is formed in a state where the patterns P1 to P4 are connected together as shown in FIG.

  In the above-described embodiment, the configuration using the reflective mask M that reflects the exposure light ELI from the illumination device IU as an example has been described as the mask M. However, the present invention is not limited to this. A transmissive mask that transmits light ELI may be used. In the above-described embodiment, the configuration in which the flexible sheet-like mask M is held in the cylindrical holding portion 40 so as to be attachable is described as an example. However, the present invention is not limited to this. A mask having a configuration in which a pattern is directly formed on the cylindrical outer peripheral surface of the mask M may be used.

  As a light source of the exposure apparatus EX of the above embodiment, for example, g-line (436 nm), h-line (405 nm), i-line (365 nm), third harmonic of YAG laser (wavelength 355 nm), KrF excimer laser (248 nm), ArF excimer laser (193 nm), F2 laser (157 nm), or the like can be used.

  In the above-described embodiment, the case where an organic EL display element is manufactured has been described as an example. Of course, not only an exposure apparatus used for manufacturing an organic EL display element but also a liquid crystal display element is manufactured, for example. The present invention can also be applied to an exposure apparatus used for the above. As long as the exposure apparatus is used for manufacturing a device such as a display element on a belt-like substrate, the present invention can be used for manufacturing various devices.

  Next, an embodiment of a manufacturing method of a micro device using an exposure apparatus according to an embodiment of the present invention in a lithography process will be described. FIG. 9 is a flowchart showing a part of a manufacturing process when manufacturing a semiconductor device as a micro device. First, in step S10 of FIG. 9, a metal film is deposited on a belt-like substrate. In the next step S12, a photoresist is applied on the metal film of the substrate. Thereafter, in step S14, the image of the pattern on the mask M is sequentially exposed and transferred to each shot area of the substrate via the projection unit PU (projection optical systems PL1 to PL4) using the exposure apparatus EX (transfer). Process).

  Thereafter, in step S16, the photoresist on the substrate is developed (development process), and then in step S18, the substrate is etched through the resist pattern, whereby a circuit pattern corresponding to the pattern on the mask is obtained. Are formed in each shot region of the substrate. Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, a semiconductor device having an extremely fine circuit pattern can be efficiently manufactured with high throughput.

  In the exposure apparatus EX, a liquid crystal display element as a micro device can also be manufactured by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a belt-like substrate. Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. FIG. 10 is a flowchart showing a part of a manufacturing process when manufacturing a liquid crystal display element as a micro device.

In the pattern forming step S20 in FIG. 10, the pattern of the mask M is transferred and exposed to a photosensitive substrate (for example, a glass or plastic substrate coated with a resist) using the exposure apparatus EX of the present embodiment. An optical lithography process is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate.
Thereafter, the exposed substrate undergoes steps such as a development step, an etching step, and a reticle peeling step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S22.

  Next, in the color filter forming step S22, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. And cell assembly process S24 is performed after color filter formation process S22. In the cell assembly step S24, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S20 and the color filter obtained in the color filter formation step S22.

  In the cell assembling step S24, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S20 and the color filter obtained in the color filter forming step S22. ). Thereafter, in a module assembly step S26, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete the liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine circuit pattern can be efficiently manufactured with high throughput.

DESCRIPTION OF SYMBOLS FPA ... Substrate processing apparatus FB ... Substrate CONT ... Control part EX ... Exposure apparatus M ... Mask MST ... Mask moving apparatus PU ... Projection apparatus PL (PL1-PL4) ... Projection optical system FST ... Substrate conveyance apparatus ELI ... Exposure light Pm (P1) ... P4) Pattern PA (PA1 to PA4) Projection area ADJ Path adjustment device DL Space Dp Path length Dm Space β Projection magnification LS Lens LH Lens holder 10 Processing device 81 First stage 82 ... second stage 85 ... moving part 86 ... drive mechanism 180 ... stage mechanism

Claims (12)

An exposure apparatus for transferring the pattern to a substrate while rotating a mask having a pattern along a predetermined cylindrical surface in a circumferential direction of the cylindrical surface,
A first projection optical system that projects an image of a first partial pattern located in the first region of the cylindrical surface of the pattern onto the first projection region;
A second projection of an image of a second partial pattern located in a second area spaced from the first area along the circumferential direction in the pattern onto a second projection area different from the first projection area. A projection optical system;
A substrate transport device that transports the substrate through the first projection region and the second projection region in synchronization with the rotation of the mask in the circumferential direction;
The transport apparatus includes a path adjustment device that adjusts a path length of a transport path of the substrate between the first projection area and the second projection area. The path adjusting device is based on an interval between the first region and the second region along a circumferential direction of the cylindrical surface, and projection magnifications of the first projection optical system and the second projection optical system. The exposure apparatus according to claim 1, wherein the path length is adjusted. The path adjusting device includes a distance Dm between the first region and the second region along a circumferential direction of the cylindrical surface, a projection magnification β of the first projection optical system and the second projection optical system, The exposure apparatus according to claim 2, wherein the path length is adjusted so that the path length Dp between the first projection area and the second projection area satisfies a relationship of Dp = Dm × β. The exposure apparatus according to claim 2, wherein the path adjustment apparatus adjusts the path length based on an interval between the first projection area and the second projection area. 5. The exposure apparatus according to claim 1, wherein the path adjustment device includes a moving unit that supports the substrate and is movable in a direction intersecting the surface of the substrate. The exposure apparatus according to claim 5, wherein the moving unit is formed in a cylindrical shape, is provided so as to be rotatable in a circumferential direction, and is arranged so as to rotate in a conveyance direction of the substrate. The first projection optical system includes a plurality of first unit optical systems,
The first projection region includes a plurality of first unit regions by the plurality of first unit optical systems,
7. The plurality of first unit optical systems are arranged such that the plurality of first unit regions are arranged in a direction intersecting a transport direction of the substrate. Exposure equipment. The second projection optical system includes a plurality of second unit optical systems,
The second projection region includes a plurality of second unit regions by the plurality of second unit optical systems,
8. The plurality of second unit optical systems are arranged so that the plurality of second unit regions are arranged in a direction intersecting the transport direction of the substrate. 9. Exposure equipment. The first projection optical system includes a plurality of first unit optical systems,
The first projection region includes a plurality of first unit regions by the plurality of first unit optical systems,
The second projection optical system includes a plurality of second unit optical systems,
The second projection region includes a plurality of second unit regions by the plurality of second unit optical systems,
The plurality of first unit optical systems and the plurality of second unit optical systems are arranged so that the first unit regions and the second unit regions are alternately arranged in a direction intersecting the transport direction of the substrate. The exposure apparatus according to any one of claims 1 to 8. The plurality of first unit optical systems and the plurality of second unit optical systems are arranged so that the positions of the first unit region and the second unit region partially overlap in a direction intersecting the transport direction of the substrate. The exposure apparatus according to claim 9. A substrate processing apparatus for processing a band-shaped substrate,
A substrate transfer section for transferring the substrate in the longitudinal direction of the substrate;
A substrate processing section that is provided along a transport path of the substrate by the substrate transport section and that processes the substrate transported along the transport path;
The substrate processing apparatus having the exposure apparatus according to any one of claims 1 to 10, wherein the substrate processing unit transfers a pattern to the substrate. A device manufacturing method for manufacturing a device by processing a substrate,
Using the exposure apparatus according to claim 1 to transfer a pattern to the substrate;
Processing the substrate to which the pattern is transferred based on the pattern;
A device manufacturing method including:

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