CN111660309A - Robot arm for transferring wafers - Google Patents
Robot arm for transferring wafers Download PDFInfo
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- CN111660309A CN111660309A CN202010507041.5A CN202010507041A CN111660309A CN 111660309 A CN111660309 A CN 111660309A CN 202010507041 A CN202010507041 A CN 202010507041A CN 111660309 A CN111660309 A CN 111660309A
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- Prior art keywords
- blade
- wafer
- robot arm
- transferring wafers
- linear moving
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a robot arm for transferring wafers, which comprises: a blade; a rail fixed to a front end of the blade; the blade fixing strip is fixed at the rear end of the blade and is positioned on a middle line where the front end of the blade and the rear end of the blade are positioned; the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip; the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide. The invention realizes the safe transfer of the wafer through the robot arm, and avoids the damage caused by the wafer deflection, thereby improving the technical effect of the yield of the manufacturing process.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a robot arm for transferring wafers.
Background
The reaction of the wafer in the manufacturing process is performed in the reaction chamber, the wafer is usually stored in a wafer storage box, and during production, the wafer storage box is placed on the equipment machine, the wafer storage box is opened by the equipment machine, the wafer is supported by the robot arm and transferred into the reaction chamber, so that the wafer is reacted.
In a robot arm in the prior art, a slope-shaped passive inclined structure (pasivetype) is arranged at the rear end of a blade, and a wafer slides down from the passive inclined structure under the action of gravity to complete self-alignment placement. However, as the service time is prolonged, the Passive Type surface becomes rough, so that the wafer is difficult to slide in self-alignment and cannot be stably placed, and the wafer is prone to be distorted and damaged during the wafer transferring process.
Disclosure of Invention
The embodiment of the application provides a robot arm for transferring wafers, and the technical problem that wafers are prone to being skewed and damaged when the wafers are transferred through the robot arm in the prior art is solved, so that the wafers are safely transferred through the robot arm, the wafers are prevented from being skewed and damaged, and the technical effect of improving the yield of a manufacturing process is improved.
Therefore, the wafer is safely transferred, and the technical effect of avoiding the damage of the wafer is achieved.
On one hand, the present application provides the following technical solutions through an embodiment of the present application:
a robot arm for transferring wafers, comprising:
a blade;
a rail fixed to a front end of the blade;
the blade fixing strip is fixed at the rear end of the blade and is positioned on a middle line where the front end of the blade and the rear end of the blade are positioned;
the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip;
the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide.
Preferably, the robot arm for transferring a wafer further includes:
the blade moving strip is positioned at the guide front end of the linear moving bearing and is connected with the linear moving bearing in a guide mode, the blade moving strip is perpendicular to the blade fixing strip, and the two supporting handles are fixed at the two ends of the blade moving strip respectively.
Preferably, the support handle is made of a flexible material.
Preferably, the flexible material is in particular polytetrafluoroethylene.
Preferably, the blade is made of metal or composite material.
Preferably, the two support handles are splayed and have larger openings in the direction from the rear section of the blade to the front end of the blade.
Preferably, the two support handles push the contact surface of the wafer and the included angle between the upper surfaces of the blades to be obtuse angles.
Based on the same inventive concept, on the other hand, the application provides the following technical scheme through an embodiment of the application:
a semiconductor processing apparatus, comprising:
a process cabin;
and the transfer cabin is provided with the robot arm for transferring the wafer.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in an embodiment of the present application, a robot arm for transferring a wafer is disclosed, comprising: a blade; a rail fixed to a front end of the blade; the blade fixing strip is fixed in the middle of the rear end of the blade and is positioned at the front end of the blade and the rear end of the blade; the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip; the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide. Therefore, the wafer can smoothly reach the safe position and is stably attached to the blade, and the wafer cannot be inclined in the process of transferring the wafer. Therefore, the technical problem that when the wafer is transferred through the mechanical arm in the prior art, the wafer is prone to being skewed, and the wafer is damaged is solved, the wafer is safely transferred through the mechanical arm, the wafer is prevented from being skewed and damaged, and therefore the technical effect of improving the yield of the manufacturing process is achieved. In addition, since the wafer 201 can be effectively prevented from sliding or tilting, it is also beneficial to protect an ESC (Electro-Static Chuck) for holding a wafer, and prevent damage to the ESC.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a top view of a robot for transferring wafers in an embodiment of the present application;
fig. 2 is a side view of a robot arm for transferring wafers in an embodiment of the present application.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The embodiment of the application provides a robot arm for transferring wafers, and the technical problem that wafers are prone to being skewed and damaged when the wafers are transferred through the robot arm in the prior art is solved, so that the wafers are safely transferred through the robot arm, the wafers are prevented from being skewed and damaged, and the technical effect of improving the yield of a manufacturing process is improved.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
a robot arm for transferring wafers, comprising: a blade; a rail fixed to a front end of the blade; the blade fixing strip is fixed in the middle of the rear end of the blade and is positioned on a middle line where the front end of the blade and the rear end of the blade are positioned; the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip; the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide. Therefore, the wafer can smoothly reach the safe position and is stably attached to the blade, and the wafer cannot be inclined in the process of transferring the wafer. Therefore, the technical problem that when the wafer is transferred through the mechanical arm in the prior art, the wafer is prone to being skewed, and the wafer is damaged is solved, the wafer is safely transferred through the mechanical arm, the wafer is prevented from being skewed and damaged, and therefore the technical effect of improving the yield of the manufacturing process is achieved. In addition, since the wafer 201 can be effectively prevented from sliding or tilting, it is also beneficial to protect an ESC (Electro-Static Chuck) for holding a wafer, and prevent damage to the ESC.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
First, it is stated that the term "and/or" appearing herein is merely one type of associative relationship that describes an associated object, meaning that three types of relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Example one
As shown in fig. 1 to 2, the present embodiment provides a robot arm (hereinafter, may be simply referred to as "robot arm") for transferring a wafer, including:
the blades 106;
a rail 105 fixed to the front end of the blade 106;
the blade fixing strip 102 is fixed at the rear end of the blade 106 and is positioned on a middle line where the front end of the blade 106 and the rear end of the blade 106 are positioned;
a linear movement bearing guide 101 located at the rear end of the blade 106 and disposed on the blade fixing bar 102, the linear movement bearing guide 101 being movable back and forth along the blade fixing bar 102;
two support handles 103 respectively located at two ends of the linear motion bearing guide 101, the two support handles 103 can push the wafer 201 to the enclosure 105 under the driving of the linear motion bearing guide 101.
In the implementation, the linear motion bearing guide 101 is located at the rear end of the blade 106, and the rail 105 is located at the front end of the blade 106. The rail 105 and the blade 106 may be integrally formed.
In the implementation process, as shown in fig. 1, a center line may be made to divide the robot arm into two parts along the rear end of the blade 106 to the front end of the blade 106, and the robot arm is axisymmetric (with the center line as a symmetry axis). The blade fixing strip 102 is on this centre line.
In a specific implementation, the linear motion bearing guide 101 and the blade fixing strip 102 may be made of a metal material and/or a composite material.
In a specific implementation process, the robot arm may be disposed in a transfer chamber of the semiconductor processing equipment, and a motor or a hydraulic air pump is further disposed in the transfer chamber, and is connected to the linear movement bearing guide 101 of the robot arm, for driving the linear movement bearing guide 101 to move back and forth.
In the implementation, as shown in fig. 2, when it is required to transfer the wafer 201 by using the robot arm, the wafer 201 is placed on the blade 106, and at this time, the wafer 201 does not reach the designated position (i.e. the position of the fence 105 in front of the blade 106), the two support handles 103 are required to be pushed by the linear movement bearing 101 to move forward, so that the two support handles 103 push the wafer 201 to the fence 105 in front of the blade 106, and at this time, the wafer 201 slides smoothly to the designated position. The linear motion bearing guide 101 retracts, and the two support rods 103 retract accordingly, so that the wafer 201 is attached to the blade 106, thereby preventing the wafer 201 from slipping or tilting. Therefore, the wafer 201 can be transferred into the reaction chamber to be reacted, and the wafer 201 is safely transferred.
Also, since the wafer 201 can be effectively prevented from sliding or tilting, it is also advantageous to protect an ESC (Electro-Static Chuck) for holding the wafer 201 when the wafer 201 is transferred to the ESC, and to prevent damage to the ESC by stabilizing the wafer 201.
Further, the robot arm for transferring the wafer further includes:
and the blade moving bar 104 is positioned at the front end of the linear moving bearing guide 101 and connected with the linear moving bearing guide 101, the blade moving bar 104 is perpendicular to the blade fixing bar 102, and the two support handles 103 are respectively fixed at two ends of the blade moving bar 103.
In particular implementations, blade-moving bars 104 may be made of a metallic material and/or a composite material.
In the specific implementation process, the blade moving bar 104 is arranged, and the two support handles 103 are respectively fixed at two ends of the blade moving bar 103, so that the stability of the two support handles 103 can be improved, and the two support handles 103 are kept at a certain angle.
As an alternative embodiment, the two support handles 103 are in a figure-of-eight shape and are open in the direction from the rear section of the blade 106 to the front end of the blade 106.
In the specific implementation process, the two support handles 103 are splayed and diverge at a certain angle, so that the support handles 103 are beneficial to limiting the wafer 201, the wafer is prevented from shaking left and right, the wafer 201 is prevented from shifting, automatic alignment is realized, and the wafer 201 is accurately pushed to the designated position.
As an alternative embodiment, the included angle between the contact surface of the wafer pushed by the two support handles 103 and the upper surface of the blade 106 is an obtuse angle.
In the specific implementation process, as shown in fig. 2, an included angle α between the contact surface of the two support handles 103 pushing the wafer 201 and the upper surface of the blade 106 is an obtuse angle, and after the two support handles 103 push the wafer 201 to the rail 105, when the two support handles 103 retract along with the linearly moving bearing guide 101, the wafer can be slowly put down due to the obtuse angle α, so as to prevent the wafer from being damaged.
In the specific implementation process, the blade 106 is made of metal and/or composite materials, and has the advantages of high strength and wear resistance.
In one embodiment, the fence 105 is arc-shaped, and has a certain arc to closely fit the wafer 201, so that the wafer 201 is more stably placed at a designated position on the blade 106.
In one embodiment, the support handle 103 is made of a flexible material (e.g., teflon) to reduce damage to the wafer 201 from the support handle 103.
The technical scheme in the embodiment of the application at least has the following technical effects or advantages:
in an embodiment of the present application, a robot arm for transferring a wafer is disclosed, comprising: a blade; a rail fixed to a front end of the blade; the blade fixing strip is fixed at the rear end of the blade and is positioned on a middle line where the front end of the blade and the rear end of the blade are positioned; the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip; the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide. Therefore, the wafer can smoothly reach the safe position and is stably attached to the blade, and the wafer cannot be inclined in the process of transferring the wafer. Therefore, the technical problem that when the wafer is transferred through the mechanical arm in the prior art, the wafer is prone to being skewed, and the wafer is damaged is solved, the wafer is safely transferred through the mechanical arm, the wafer is prevented from being skewed and damaged, and therefore the technical effect of improving the yield of the manufacturing process is achieved.
In addition, since the wafer 201 can be effectively prevented from sliding or tilting, it is also beneficial to protect the ESC for holding the wafer, and prevent the ESC from being damaged.
Example two
The embodiment provides a semiconductor processing apparatus, including:
a process chamber (i.e., a reaction chamber);
a transfer chamber in which the robot arm of any one of the above embodiments is disposed.
In the specific implementation process, a motor or a hydraulic air pump is arranged in the transfer cabin, is connected with the linear moving bearing guide 101 of the mechanical arm, and is used for driving the linear moving bearing guide 101 to move back and forth.
The technical scheme in the embodiment of the application at least has the following technical effects or advantages:
in the embodiment of the application, as the semiconductor processing equipment adopts the robot arm newly proposed by the application, the wafer can smoothly reach the safe position and is stably attached to the blade, and the wafer cannot be inclined in the process of transferring the wafer. Therefore, the technical problem that when the wafer is transferred through the mechanical arm in the prior art, the wafer is prone to being skewed, and the wafer is damaged is solved, the wafer is safely transferred through the mechanical arm, the wafer is prevented from being skewed and damaged, and therefore the technical effect of improving the yield of the manufacturing process is achieved.
And, because the wafer can be effectively prevented from sliding or inclining, the ESC for containing the wafer can be protected, and the ESC can be prevented from being damaged.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A robot arm for transferring wafers, comprising:
a blade;
a rail fixed to a front end of the blade;
the blade fixing strip is fixed at the rear end of the blade and is positioned on a middle line where the front end of the blade and the rear end of the blade are positioned;
the linear moving bearing guide is arranged on the blade fixing strip and can move back and forth along the blade fixing strip;
the two support handles are respectively positioned at two ends of the linear moving bearing guide, and the two support handles can push the wafer to the fence under the driving of the linear moving bearing guide.
2. A robot arm for transferring wafers as recited in claim 1, further comprising:
the blade moving strip is positioned at the guide front end of the linear moving bearing and is connected with the linear moving bearing in a guide mode, the blade moving strip is perpendicular to the blade fixing strip, and the two supporting handles are fixed at the two ends of the blade moving strip respectively.
3. A robot arm for transferring wafers as in claim 1, wherein the support handle is made of a flexible material.
4. A robot arm for transferring wafers according to claim 3, characterized in that said flexible material is in particular polytetrafluoroethylene.
5. A robot arm for transferring wafers according to claim 1, wherein said two support handles are splayed and open in the direction from the rear section of the blade to the front end of the blade.
6. A robot arm for transferring wafers according to claim 1, wherein the angle between the contact surface of the two support handles pushing the wafer and the upper surface of the blade is obtuse.
7. A robot arm for transferring wafers according to any of claims 1 to 6, wherein said blade is made of metal or composite material.
8. A semiconductor processing apparatus, comprising:
a process cabin;
a transfer chamber in which a robot arm for transferring wafers as claimed in any one of claims 1 to 7 is disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010507041.5A CN111660309A (en) | 2020-06-05 | 2020-06-05 | Robot arm for transferring wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010507041.5A CN111660309A (en) | 2020-06-05 | 2020-06-05 | Robot arm for transferring wafers |
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| Publication Number | Publication Date |
|---|---|
| CN111660309A true CN111660309A (en) | 2020-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010507041.5A Pending CN111660309A (en) | 2020-06-05 | 2020-06-05 | Robot arm for transferring wafers |
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Citations (9)
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| JP2002141405A (en) * | 2000-10-31 | 2002-05-17 | Daikin Ind Ltd | Substrate transfer apparatus |
| JP2006237407A (en) * | 2005-02-25 | 2006-09-07 | Semes Co Ltd | Substrate conveying device |
| CN102205540A (en) * | 2010-03-31 | 2011-10-05 | 株式会社安川电机 | Substrate transport hand and substrate transport robot |
| CN203331034U (en) * | 2013-07-02 | 2013-12-11 | 上海和辉光电有限公司 | Vacuum chamber mechanical arm |
| CN103943545A (en) * | 2013-01-21 | 2014-07-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Manipulator and semiconductor device |
| CN104956273A (en) * | 2013-01-25 | 2015-09-30 | 欧姆龙株式会社 | Control device and operation method for control device |
| CN108155143A (en) * | 2016-12-06 | 2018-06-12 | 捷普有限公司 | For providing the devices, systems, and methods of end effector |
| CN108604567A (en) * | 2016-02-26 | 2018-09-28 | 川崎重工业株式会社 | Substrate grasping hand and base board delivery device |
| CN110034047A (en) * | 2018-01-05 | 2019-07-19 | 东京毅力科创株式会社 | Substrate grasping mechanism, substrate transport device and substrate handling system |
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2020
- 2020-06-05 CN CN202010507041.5A patent/CN111660309A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141405A (en) * | 2000-10-31 | 2002-05-17 | Daikin Ind Ltd | Substrate transfer apparatus |
| JP2006237407A (en) * | 2005-02-25 | 2006-09-07 | Semes Co Ltd | Substrate conveying device |
| CN102205540A (en) * | 2010-03-31 | 2011-10-05 | 株式会社安川电机 | Substrate transport hand and substrate transport robot |
| CN103943545A (en) * | 2013-01-21 | 2014-07-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Manipulator and semiconductor device |
| CN104956273A (en) * | 2013-01-25 | 2015-09-30 | 欧姆龙株式会社 | Control device and operation method for control device |
| CN203331034U (en) * | 2013-07-02 | 2013-12-11 | 上海和辉光电有限公司 | Vacuum chamber mechanical arm |
| CN108604567A (en) * | 2016-02-26 | 2018-09-28 | 川崎重工业株式会社 | Substrate grasping hand and base board delivery device |
| CN108155143A (en) * | 2016-12-06 | 2018-06-12 | 捷普有限公司 | For providing the devices, systems, and methods of end effector |
| CN110034047A (en) * | 2018-01-05 | 2019-07-19 | 东京毅力科创株式会社 | Substrate grasping mechanism, substrate transport device and substrate handling system |
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Application publication date: 20200915 |
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