CN110640324B - Wafer double-side manufacturing system - Google Patents
Wafer double-side manufacturing system Download PDFInfo
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- CN110640324B CN110640324B CN201910824347.0A CN201910824347A CN110640324B CN 110640324 B CN110640324 B CN 110640324B CN 201910824347 A CN201910824347 A CN 201910824347A CN 110640324 B CN110640324 B CN 110640324B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a wafer double-side manufacturing system. The method comprises the following steps: comprises a wafer bearing platform, a wafer turning mechanism and a wafer transmission mechanism; the wafer turnover mechanism comprises: the first clamping part comprises a first clamping base body and a first clamping piece provided with a first clamping groove part, the second clamping part comprises a second clamping base body and a second clamping piece, and the second clamping piece is provided with a second clamping groove part opposite to the first clamping groove part; a clamp positioning portion comprising: the positioning piece is connected with the positioning rail and the clamping part and drives the movable clamping part to move to a first position along the positioning rail, the first clamping groove part and the second clamping groove part are attached to form a clamping groove for clamping the edge of the wafer, and the second position is a position where the clamping groove loosens the wafer; the clamping and overturning part comprises an overturning driving part and is connected with the first clamping part and the second clamping part. The first clamping piece and the second clamping piece are matched to clamp only the edge area of the wafer to realize the turnover of the wafer, so that the front side and the back side of the wafer are prevented from being polluted by dust or scratched.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer double-side manufacturing system.
Background
Advanced integrated circuit fabrication processes typically involve hundreds of steps, and many of the steps involve operations on both sides of a wafer, such as wafer cleaning, wafer marking, and wafer etching.
If the double-sided operation of the wafer is to be realized, the overturning of the front and back surfaces of the wafer and the horizontal rotation of the wafer are realized, and the problem that particle dust is generated and even scratched when the conventional overturning equipment is in contact with the surface of the wafer when the front and back surfaces of the wafer are overturned and horizontally rotated exists.
Therefore, the invention provides a wafer turning scheme, which can avoid the pollution and scratch of the surface of the wafer and can realize the marking of the front side and the back side of the wafer.
Disclosure of Invention
The invention aims to provide a wafer double-side manufacturing system which can avoid the pollution or scratch of dust in the overturning process of a wafer.
In order to achieve the above object, the present invention provides a wafer double-sided manufacturing system, which includes: the device comprises a wafer bearing platform, a wafer overturning mechanism and a wafer transmission mechanism moving between the wafer bearing platform and the wafer overturning mechanism; the wafer overturning mechanism comprises:
the clamping device comprises a first clamping part and a second clamping part, wherein the first clamping part comprises a first clamping base body and a first clamping piece arranged on the first clamping base body, the first clamping piece is provided with a first clamping groove part, the second clamping part comprises a second clamping base body and a second clamping piece arranged on the second clamping base body, the second clamping piece is provided with a second clamping groove part opposite to the first clamping groove part, and the first clamping part and/or the second clamping part are movable clamping parts;
A clamp positioning portion comprising: a positioning rail for defining a moving track of at least one clamping part; the positioning part is connected with the positioning rail and the clamping part and can drive the movable clamping part to move to a first position or a second position along the positioning rail, the first position is a clamping groove formed by the first clamping groove part and the second clamping groove part in a fit mode, the clamping groove clamps the edge of the wafer and can be far away from the other clamping groove to the second position, and the second position is a position where the wafer is loosened by the clamping groove;
and the clamping overturning part comprises an overturning driving part, and the overturning driving part is connected with the first clamping part and the second clamping part.
Optionally, the depth of the slot is less than or equal to 3 mm.
Optionally, the first clamping member comprises a groove, and the second clamping member comprises a protrusion, and in the first position, the protrusion is embedded in the groove.
Optionally, the first clamping base comprises a first bar set, the first clamping member is fixed to the first bar set, and the second clamping base comprises a second bar set, the second clamping member is fixed to the second bar set.
Optionally, the first rod set and the second rod set respectively include a plurality of single rods, and the plurality of single rods are arranged in parallel or in a crossed manner.
Optionally, the single bar is provided with a plurality of mounting holes for mounting the first clamp or the second clamp.
Optionally, the positioning member includes a beam, one end of the beam is connected to the positioning rail, and the other end of the beam is connected to the clamping base.
Optionally, the clamping device further comprises a first driving part, and the first driving part is connected with the movable clamping part.
Optionally, the first driving part comprises a pneumatic driving part, a hydraulic driving part or an electric driving part.
Optionally, the positioning rail includes a fixed guide rail and a slider, the slider slides along the fixed guide rail, the slider is fixedly connected with the beam, the slider is provided with a first cavity, the fixed guide rail is locked by the first cavity in the direction perpendicular to the sliding direction of the slider, or the fixed guide rail is provided with a second cavity, and the slider is locked by the second cavity in the direction perpendicular to the sliding direction of the slider.
Optionally, the turnover driving portion is connected to the first clamping portion and the second clamping portion by being connected to the clamping and positioning portion.
Optionally, the clamping device further comprises a base, one end of the base is connected with the overturning driving part, and the other end of the base is connected with the positioning rail of the clamping positioning part.
Optionally, the wafer bearing table includes a first fixed wafer supporting portion and a liftable wafer lifting and rotating portion, and the first wafer supporting portion and the wafer lifting and rotating portion can respectively bear the edge of the wafer.
Optionally, the first wafer supporting portion includes a plurality of supporting legs having a fan-shaped supporting surface, and a first retaining wall is disposed on the periphery of the fan-shaped supporting surface of the supporting legs.
Optionally, the wafer lifting and rotating part comprises a lifting and rotating base and a second wafer supporting part connected with the lifting and rotating base, the second wafer supporting part comprises a plurality of bearing surfaces and is in a fan-shaped top foot, and a second protective wall is arranged on the periphery of the fan-shaped bearing surface of the top foot.
Optionally, the wafer transfer mechanism includes a third wafer support portion connected to the end of the moving arm, and the third wafer support portion includes a ring-shaped or fan-shaped support portion capable of contacting the edge of the wafer.
Optionally, the first clamping portion, the second clamping portion, the first wafer supporting portion, the wafer lifting and rotating portion, and the third wafer supporting portion are all made of ceramic materials with teflon coatings on surfaces.
Optionally, the wafer carrying table further comprises a single laser marking machine, and laser of the single laser marking machine can reach the wafer carrying table.
The invention has the beneficial effects that:
the first clamping piece and the second clamping piece in the wafer overturning mechanism are matched to clamp only the edge area of the wafer to realize the overturning of the wafer, so that the front side and the back side of the wafer are effectively prevented from being polluted by dust or scratched in the overturning process.
Furthermore, the first wafer supporting part of the wafer bearing table and the liftable wafer lifting rotating part realize the horizontal rotation of the wafer only contacting the edge of the wafer, so that the wafer is prevented from being polluted or scratched in the horizontal rotation process; the third wafer supporting part of the wafer conveying mechanism only contacts the edge area of the wafer to realize the conveying of the wafer between the wafer bearing platform and the wafer turnover mechanism, so that the front side and the back side of the wafer are prevented from being polluted by dust or scratched in the conveying process; the first clamping part, the second clamping part, the first wafer supporting part, the wafer lifting rotating part and the third wafer supporting part are made of ceramics with Teflon coating layers on the surfaces, so that the surface pollution or scratch of the wafer under special conditions is further effectively avoided; the wafer double-side manufacturing system is combined with the single laser marking machine of the single laser to achieve the effect of marking the wafer double sides, and cost is effectively saved.
The apparatus of the present invention has other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, and which together serve to explain certain principles of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 shows a schematic diagram of a wafer duplex fabrication system according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a wafer turning mechanism of a wafer double-sided fabrication system according to an embodiment of the invention.
Fig. 3 is a schematic diagram illustrating a wafer clamping operation performed by a wafer flipping mechanism of a wafer double-sided fabrication system according to an embodiment of the invention.
Fig. 4 is a front view illustrating a wafer flipping mechanism of a wafer double-sided fabrication system clamping a wafer according to an embodiment of the invention.
Fig. 5 is a schematic diagram illustrating a clamp in a wafer flipping mechanism of a wafer double-sided fabrication system according to an embodiment of the invention.
Fig. 6 is a schematic diagram illustrating a wafer edge clamped by a clamping member in a wafer turning mechanism of a wafer double-sided manufacturing system according to an embodiment of the invention.
FIG. 7 is a schematic diagram of a wafer stage of a wafer duplex fabrication system according to an embodiment of the invention.
FIG. 8 is a schematic diagram of a circular lift rotation portion of a wafer support stage of a wafer duplex processing system according to an embodiment of the present invention.
FIG. 9 is a schematic diagram of a first wafer support portion of a wafer stage of a wafer duplex processing system according to an embodiment of the invention.
FIG. 10 is a schematic diagram of a second wafer support in the wafer stage of the wafer duplex processing system according to one embodiment of the invention.
FIG. 11 illustrates a perspective view of a wafer carrier table of a wafer duplex fabrication system in accordance with an embodiment of the present invention.
FIG. 12 is a top view of a third wafer support of a wafer duplex manufacturing system according to an embodiment of the invention.
FIG. 13 is a top view of a third wafer support of a system for dual-sided processing of wafers according to one embodiment of the invention.
Fig. 14 is a partially enlarged view illustrating a wafer edge supported by a supporting portion of a third wafer support of a wafer double-side fabrication system according to an embodiment of the invention.
Description of the reference numerals:
1. a wafer transfer mechanism; 1a, a third wafer support; 1b, moving an arm; 1c, a support site; 2. a wafer turnover mechanism; 3. a wafer bearing table; 4. a card slot; 5a, a first clamping part; 5b, a second clamping part; 6a, a first rod group; 6b, a second rod group; 7. a first clamping member; 8. a second clamping member; 9. a cross beam; 10. clamping the positioning part; 11. positioning the track; 12. a turnover driving part; 13. mounting holes; 14. a first wafer support part; 14a, a foot; 15. a wafer lifting rotating part; 16. a lifting and rotating base; 17. a second wafer support; 17a, a top leg.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Fig. 1 is a schematic diagram illustrating a wafer double-sided manufacturing system according to an embodiment of the present invention, fig. 2 is a schematic diagram illustrating a wafer flipping mechanism of a wafer double-sided manufacturing system according to an embodiment of the present invention, and as shown in fig. 1 to 2, a wafer double-sided manufacturing system includes:
the wafer turnover mechanism comprises a wafer bearing platform 3, a wafer turnover mechanism 2 and a wafer transmission mechanism 1 moving between the wafer bearing platform 3 and the wafer turnover mechanism 2;
the wafer turnover mechanism 2 includes:
the clamping device comprises a first clamping part 5a and a second clamping part 5b, wherein the first clamping part 5a comprises a first clamping base body and a first clamping piece 7 arranged on the first clamping base body, the first clamping piece 7 is provided with a first clamping groove part, the second clamping part 5b comprises a second clamping base body and a second clamping piece 8 arranged on the second clamping base body, the second clamping piece 8 is provided with a second clamping groove part opposite to the first clamping groove part, and the first clamping part 5a and/or the second clamping part 5b are movable clamping parts;
a grip positioning portion 10 comprising: a positioning rail 11 for defining a track for moving at least one of the clamping parts; the positioning part is connected with the positioning rail 11 and the clamping part and can drive the movable clamping part to move to a first position or a second position along the positioning rail 11, the first position is a position where the first clamping groove part and the second clamping groove part are attached to form a clamping groove 4, the clamping groove 4 clamps the edge of the wafer and can be far away from the other position to the second position, and the second position is a position where the clamping groove 4 loosens the wafer;
And the clamping turnover part comprises a turnover driving part 12, and the turnover driving part 12 is connected with the first clamping part 5a and the second clamping part 5 b.
Specifically, a first clamping piece 7 arranged on a first clamping portion 5a and a second clamping piece 8 arranged on a second clamping portion 5b in the wafer overturning mechanism 2 are respectively provided with a first clamping groove portion and a second clamping groove portion, referring to fig. 5, the positioning piece can drive the movable clamping portion to move along the positioning rail 11 to enable the first clamping groove portion and the second clamping groove portion to be attached to form a clamping groove 4, so that the edge area of the wafer is clamped, and the first clamping portion 5a and the second clamping portion 5b clamp the wafer to synchronously overturn through the clamping overturning portion; the overturned wafer can be taken out from the wafer overturning mechanism 2 through the wafer transmission mechanism 1, and the wafer transmission mechanism 1 can also transmit the wafer into the wafer bearing table 3, so that the double-sided related manufacturing process of the wafer is realized.
In one example, the depth of the card slot 4 is less than or equal to 3 mm. Specifically, in the conventional semiconductor manufacturing process, a 3mm area of the edge of the wafer surface is allowed to be defective, so as shown in fig. 6, the depth of the notch 4 formed after the first notch portion of the first clamping member 7 and the second notch portion of the second clamping member 8 are attached is less than or equal to 3mm, that is, only the notch contacts an area where a defect may exist, except the edge with the radial depth of 3mm, of the wafer edge, and the wafer surface can be effectively prevented from being scratched or contaminated to cause the defect.
In one example, the first clamp 7 comprises a recess and the second clamp 8 comprises a protrusion, the protrusion engaging in the recess in the first position. Specifically, as shown in fig. 2 and 4, in the embodiment, the first clamping member 7 includes a groove and a first slot portion is disposed on an inner side of the groove, the second clamping member 8 includes a protrusion matching with the groove and a second slot portion is disposed on an inner side of the groove, the protrusion can be embedded into the groove to perform a limiting function, and the wafer edge is prevented from sliding laterally when being clamped by the first slot portion and the second slot portion. Other forms of clamping members suitable for clamping the edge of the wafer can be designed by those skilled in the art according to practical situations, and will not be described herein.
In one example, the first clamping base comprises a first bar set 6a, the first clamping member 7 is fixed to the first bar set 6a, the second clamping base comprises a second bar set 6b, and the second clamping member 8 is fixed to the second bar set 6 b. The first rod group 6a and the second rod group 6b respectively comprise a plurality of single rods, and the single rods are arranged in parallel or in a crossed manner. Specifically, as shown in fig. 2, in this embodiment, the first clamping base includes a first rod group 6a and a first clamping member 7 disposed on the first rod group 6a, and the second clamping base includes a second rod group 6b and a second clamping member 8 disposed on the second rod group 6b, where the first rod group 6a and the second rod group 6b are the same and are formed by two single rods crossing to form two X-shaped brackets opposite to each other up and down, the four first clamping members 7 and the four second clamping members 8 are disposed on the two X-shaped brackets one-to-one, and the four first clamping members 7 and the four second clamping members 8 are uniformly distributed on the circumference of a circle having the same size as the wafer. In other embodiments of the present invention, the first rod group 6a or the second rod group 6b may also be composed of three or more single rods, the structures of the first clamping base and the second clamping base may be the same or different, the single rods may be arranged in parallel or in an intersecting manner, and other forms of clamping bases may be selected, so long as the first clamping members 7 and the second clamping members 8 arranged on the first rod group 6a and the second rod group 6b are all distributed on the circumference of a circle having the same size as the wafer, the same wafer edge clamping effect as in this embodiment may be achieved, and those skilled in the art may select or design specific structures of the first clamping base and the second clamping base according to actual requirements, which are not repeated herein.
In one example, the single bar is provided with a plurality of mounting holes 13 for mounting the first clamp 7 or the second clamp 8. Specifically, referring to fig. 2, the single rod in this embodiment is further provided with a plurality of sets of mounting holes 13 for mounting the clamping members, different mounting holes 13 correspond to sizes of different wafers, the current major diameter sizes of the wafers are 200mm and 300mm, the clamping members are mounted on different mounting holes 13 according to the size of the wafer to be turned over, and the clamping of wafers with different sizes by the same set of clamping device can be realized.
In one example, the positioning member comprises a beam 9, one end of the beam 9 is connected to the positioning rail 11, and the other end of the beam is connected to the clamping base. Specifically, referring to fig. 3, the first clamping base and the first clamping base in this embodiment are respectively connected to the positioning rail 11 through a cross beam 9, and the cross beam 9 mainly supports the clamping base and suspends the first clamping base and the second clamping base, so as to prevent the wafer from contacting with the components except the clamping member and ensure that the wafer is not contaminated or scratched.
In one example, a first drive portion is further included, the first drive portion being coupled to the movable clamp portion. Specifically, the first driving portion is connected to the movable clamping portion (the first clamping portion 5a and/or the second clamping portion 5b) to drive the movable clamping portion to move, so that the first clamping portion 5a and the second clamping portion 5b are relatively displaced, and the first clamping member 7 and the second clamping member 8 are attached to each other to form the clamping groove 4 to clamp the edge of the wafer. The first clamping portion 5a and the second clamping portion 5b in this embodiment are both movable clamping portions.
In one example, the first drive comprises a pneumatic drive, a hydraulic drive or an electric drive. Specifically, the first driving part may be a pneumatic driving device, a hydraulic driving device, or an electrical driving device, such as a pneumatic telescopic rod, a hydraulic telescopic rod, an electrical telescopic rod, etc., the first driving part in this embodiment is two cylinders (not shown), in a specific implementation process, two cylinders may be fixed on the clamping and positioning portion 10, a push rod of each cylinder is connected to one cross beam 9, the two cross beams 9 are pushed to move relatively along a positioning track 11 on the clamping and positioning portion 10 by a stroke of the push rod of the cylinder, so as to drive the first clamping portion 5a and the second clamping portion 5b to move relatively, and further clamp an edge of a wafer through the plurality of first clamping members 7 and the plurality of second clamping members 8 to clamp the wafer. In other embodiments of the present invention, when there is only one movable clamping portion, for example, only the first clamping portion 5a is a movable clamping portion, the first clamping portion 5a can be driven to move only by one cylinder, the second clamping portion 5b and the cross beam 9 are fixedly connected to the clamping and positioning portion 10, and the same clamping effect can be achieved only by placing the wafer at a suitable position. The specific forms of the movable clamping part and the first driving part can be selected by those skilled in the art according to practical situations, and are not described herein again.
In one example, the positioning rail 11 includes a fixed guide rail and a slider, the slider slides along the fixed guide rail, the slider is fixedly connected to the cross beam 9, the slider is provided with a first cavity, the first cavity locks the fixed guide rail in a direction perpendicular to a sliding direction of the slider, or the fixed guide rail is provided with a second cavity, and the second cavity locks the slider in a direction perpendicular to the sliding direction of the slider. Specifically, crossbeam 9 passes through the sliding connection of slider realization and guide rail, forms interlocking limit structure between slider or the guide rail in the perpendicular to slider sliding direction, makes the slider only can slide along the direction of guide rail restriction, realizes being connected between slider and the guide rail through the die cavity (set up to worker's die cavity as the slider cross-section) for prior art, and the field person realizes easily, and this is no longer repeated here. Crossbeam 9 and slider structure as an organic whole in this embodiment, can guarantee the stability of structure.
In one example, the inversion driving part 12 connects the first clamping part 5a and the second clamping part 5b by connecting the clamping and positioning parts 10. Specifically, the turnover driving portion 12 is connected to the first clamping portion 5a and the second clamping portion 5b through the clamping and positioning portion 10, and when the turnover driving portion 12 can drive the clamping and positioning portion 10 to rotate, the first clamping portion 5a and the second clamping portion 5b are driven to turn over, and then the wafer is turned over. In this embodiment, the turning driving part 12 may select a stepping motor, which is an open-loop control motor that converts an electrical pulse signal into an angular displacement or a linear displacement, and when the stepping driver receives a pulse signal, the stepping motor is driven to rotate by a fixed angle in a set direction, and the rotation of the stepping motor is driven to operate step by step at the fixed angle. Consequently can control the angular displacement volume through control pulse number to reach the purpose that drives the upset of wafer accurate positioning, through control step motor's step driver in this embodiment, thereby make step motor clockwise or anticlockwise rotation 180 degrees at every turn, realize driving the upset of first clamping part 5a and second clamping part 5b, and then realize the upset to the wafer.
In one example, the clamp positioning device further comprises a base, one end of the base is connected with the overturning driving part 12, and the other end of the base is connected with the positioning rail 11 of the clamping and positioning part 10. Specifically, referring to fig. 3, the base in this embodiment is cylindrical and has an integral structure with the positioning rail 11 of the clamping and positioning portion 10, the positioning rail 11 is disposed on one end surface of the base, and the other end surface is fixedly connected to the motor shaft of the stepping motor. In other embodiments of the present invention, the base and the positioning rail of the clamping and positioning portion 10 may be in other forms, and those skilled in the art can design the structural forms of the base and the rail according to specific requirements, which is not described herein again.
In one example, the wafer stage 3 includes a fixed first wafer supporting portion 14 and a liftable wafer lifting rotation portion 15, and the first wafer supporting portion 14 and the wafer lifting rotation portion 15 can respectively support the edge of a wafer. Specifically, referring to fig. 7 and 8, the wafer stage 3 in this embodiment includes a first wafer supporting portion 14 fixed on the base and a liftable wafer lifting and rotating portion 15, where the first wafer supporting portion 14 is used to support the edge of the wafer, and the wafer lifting and rotating portion 15 is used to lift the wafer by supporting the edge of the wafer and rotate and adjust the wafer to a position suitable for manufacturing and processing, and then descend to place the wafer with the adjusted position back on the first wafer supporting portion 14, so as to perform operations such as manufacturing and processing on the wafer.
In one example, the first wafer supporting portion 14 includes a plurality of supporting legs 14a having a fan-shaped supporting surface, and a first retaining wall is disposed on the periphery of the fan-shaped supporting surface of the supporting legs 14 a. Specifically, referring to fig. 9, in the embodiment, the top ends of the plurality of supporting legs 14a of the first wafer supporting portion 14 are stepped, the fan-shaped supporting surfaces of the supporting legs 14a only contact the flawed area beyond 3mm of the radial depth of the edge of the wafer, the outer edge of the top corner is provided with a retaining wall, which can avoid the wafer from side slipping, the plurality of supporting legs 14a are uniformly distributed on the base and enclose a circle matched with the wafer, and the supporting surfaces of the top portions of the plurality of supporting legs 14a should be distributed on the circumference of the same circle matched with the size of the wafer, so as to support the entire wafer. In other embodiments of the present invention, the structure of the first wafer supporting portion 14 may be in other forms, and those skilled in the art can design the structure of the supporting leg 14a according to the present invention, which will not be described herein.
In one example, the wafer lifting and rotating part 15 includes a lifting and rotating base 16 and a second wafer supporting part 17 connected to the lifting and rotating base 16, the second wafer supporting part 17 includes a plurality of top legs 17a with a sector bearing surface, and a second protection wall is disposed on the periphery of the sector bearing surface of the top legs 17 a. Specifically, referring to fig. 8 and 10, the wafer lifting and rotating part 15 in this embodiment includes a lifting and rotating base 16 and a second wafer supporting part 17 disposed on the top of the lifting and rotating base 16, wherein the second wafer supporting part 17 is an X-shaped support, the top of the end of the support is provided with a step-shaped vertex angle, the vertex angle includes a sector-shaped supporting surface for supporting the wafer edge in an area less than or equal to 3mm, the outer edge of the sector-shaped supporting surface is provided with a second protection wall for preventing the wafer from sliding, the second wafer supporting part 17 and the lifting and rotating base 16 are located in the lower space of the first wafer supporting part 14 when not lifted, the lifting and rotating base 16 drives the second wafer supporting part 17 to lift when the wafer needs to be adjusted, the step-shaped top leg 17a of the second wafer supporting part 17 contacts with the edge of the wafer and supports the wafer to lift up to the first wafer supporting part 14, and then the second wafer supporting part 17 and the wafer can be driven by the lifting and rotating base 16 to rotate horizontally to adjust the position of the wafer, after the position of the wafer is adjusted, the lifting and rotating base 16 drives the second wafer supporting portion 17 to descend together with the wafer until the wafer falls back onto the first wafer supporting portion 14, and then the related process can be performed on the surface of the wafer. It should be noted that the first wafer supporting portion 14 should be provided with a corresponding gap (a clearance space) that allows the second wafer supporting portion 17 to ascend and descend, so as to avoid affecting the ascending and descending of the second wafer supporting portion 17.
In one example, the wafer transfer mechanism 1 includes a third wafer support portion 1a connected to the end of the moving arm 1b, and the third wafer support portion 1a includes a ring-shaped or fan-shaped support portion 1c capable of contacting the edge of the wafer. Specifically, referring to fig. 12 to 14, in the present embodiment, the third wafer supporting portion 1a of the wafer transferring mechanism 1 is a strip-shaped wafer loading plate, the length of the loading plate is greater than the diameter of the wafer, the width of the wafer loading plate is smaller than the diameter of the wafer, a groove is formed on the upper surface of the wafer loading plate, the groove penetrates through the wafer loading plate in the width direction of the wafer loading plate, two semi-ring-shaped wafer loading surfaces are formed on the side walls of the groove, which are matched with the edges of the wafer, referring to fig. 14, the wafer loading surface and the side walls of the groove form a step structure, the edge of the wafer is supported by the supporting portion 1c of the step structure of the two side walls, and a gap is formed between the lower surface of the wafer and the bottom surface of the groove, so that the wafer loading plate can support the entire wafer without contacting the surface of the wafer, one end of the wafer loading plate is connected to the moving arm 1b through a handle, the moving arm 1b may be various existing mechanical arms, such as an intelligent six-axis mechanical arm, and the wafer carrier plate may be connected to the moving arm 1b to implement an accurate displacement operation, so as to implement the transfer of the wafer between the mechanisms. It should be noted that, in the present invention, a space capable of accommodating the third wafer supporting portion 1a is disposed between the first wafer supporting portion 14, the first clamping portion 5a and the second clamping portion 5b, so as to be able to pass through the third wafer supporting portion 1a and to be able to bring the wafer into and out of the space between the above components, for example, the third wafer supporting portion 1a in this embodiment is a strip-shaped wafer carrier, referring to fig. 3, the strip-shaped wafer carrier is able to bring the wafer into and out of the space between the first clamping portion 5a and the second clamping portion 5b, and after the wafer edge is clamped by the first clamping portion 5a and the second clamping portion 5b, the strip-shaped wafer carrier is able to be smoothly pulled out of the space between the X-shaped rod sets, and after the wafer carrier is turned over, the wafer carrier is also able to be inserted into the space between the X-shaped rod sets to lift the wafer and take the wafer out of the first clamping portion 5a and the second clamping portion 5b, referring to fig. 11, the wafer carrier is also able to be able to transfer the wafer into and take the first wafer supporting portion 14 and take the wafer out of the first wafer supporting portion from the first wafer supporting portion 14 The gaps between the legs 14a of the wafer support 14 allow the wafer to be inserted and removed from the first wafer support 14.
In one example, the first clamping portion 5a, the second clamping portion 5b, the first wafer supporting portion 14, the wafer lifting and rotating portion 15, and the third wafer supporting portion 1a are made of ceramic materials with teflon coatings on the surfaces. Specifically, in order to prevent the wafer surface from being scratched and to increase the performance of transferring and turning under special conditions, the first clamping portion 5a, the second clamping portion 5b (mainly a clamping member), the first wafer supporting portion 14, the wafer lifting and rotating portion 15, and the third wafer supporting portion 1a are made of ceramic materials, and the surfaces of the ceramic materials are provided with teflon coatings, so that the surfaces of the wafers can be effectively prevented from generating particle dust and scratches during the transferring and turning processes.
In one example, a single laser marking machine is also included, the laser of which is able to reach the wafer carrier table 3. Specifically, in the embodiment, the wafer double-side manufacturing system further comprises a single laser marking machine, each processed wafer generally has a specific serial number in the conventional wafer process, and before the wafer is detected or manufactured, the serial number of each wafer needs to be correctly identified to perform the process step corresponding to the marking, so that the occurrence of misoperation is avoided, therefore, laser marking needs to be performed on the front side and the back side of the wafer when the front side and the back side of the wafer are manufactured.
While embodiments of the present invention have been described above, the above description is illustrative, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. It should be noted that, in the present specification, all the embodiments are described in a related manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the structural embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (13)
1. A wafer double-sided manufacturing system is characterized by comprising a wafer bearing platform, a wafer overturning mechanism and a wafer transmission mechanism moving between the wafer bearing platform and the wafer overturning mechanism;
The wafer overturning mechanism comprises:
the first clamping part comprises a first clamping base body and a first clamping piece arranged on the first clamping base body, and the first clamping piece is provided with a first clamping groove part; the second clamping part comprises a second clamping base body and a second clamping piece arranged on the second clamping base body, the second clamping piece is provided with a second clamping groove part opposite to the first clamping groove part, and the first clamping part and/or the second clamping part are movable clamping parts; the first clamping part and the second clamping part are made of ceramic materials with Teflon coating layers on the surfaces;
a clamp positioning portion comprising: a positioning track for defining the moving track of at least one clamping part; the positioning part is connected with the positioning rail and the clamping part and can drive the movable clamping part to move to a first position or a second position along the positioning rail, the first position is a position where the first clamping groove part and the second clamping groove part are attached to form a clamping groove, the clamping groove clamps the edge of the wafer, and the second position is a position where the clamping groove loosens the wafer;
the first clamping piece comprises a groove, the second clamping piece comprises a protrusion, the extending direction of the groove and the extending direction of the protrusion are perpendicular to the extending direction of the clamping groove, and the protrusion is embedded into the groove at the first position;
The clamping and overturning part comprises an overturning driving part, and the overturning driving part is connected with the first clamping part and the second clamping part;
the wafer bearing table comprises a fixed first wafer supporting part and a liftable wafer lifting rotating part, and the first wafer supporting part and the wafer lifting rotating part can respectively bear the edge of a wafer;
the first wafer supporting part comprises a plurality of supporting legs with sector bearing surfaces, and a first protective wall is arranged on the periphery of the sector bearing surfaces of the supporting legs;
the wafer lifting rotating part comprises a lifting rotating base and a second wafer supporting part connected with the lifting rotating base, the second wafer supporting part comprises a plurality of top pins with sector bearing surfaces, and second protective walls are arranged on the periphery of the sector bearing surfaces of the top pins;
the single laser marking machine is used for marking the wafer on the wafer bearing table in a double-sided mode.
2. The wafer double-sided fabrication system of claim 1, wherein the pocket depth is less than or equal to 3 mm.
3. The wafer bi-planar fabrication system of claim 1, wherein the first clamping base comprises a first set of bars, the first clamping member secured to the first set of bars, and the second clamping base comprises a second set of bars, the second clamping member secured to the second set of bars.
4. The wafer double-sided manufacturing system of claim 3, wherein the first rod set and the second rod set respectively comprise a plurality of single rods, and the single rods are arranged in parallel or in a crossed manner.
5. The wafer double-sided fabrication system of claim 4, wherein the single rod is provided with a plurality of mounting holes for mounting the first clamp or the second clamp.
6. A system for dual side fabrication of a wafer as claimed in claim 1, wherein the positioning member comprises a beam, one end of the beam is connected to the positioning rail, and the other end of the beam is connected to the clamping base.
7. The wafer double-sided fabrication system of claim 1, further comprising a first drive portion coupled to the movable clamp portion.
8. The wafer double-sided fabrication system of claim 7, wherein the first driving portion comprises a pneumatic driving portion, a hydraulic driving portion, or an electric driving portion.
9. A system for manufacturing double faces of wafers as claimed in claim 6, wherein the positioning rail comprises a fixed guide rail and a slide block, the slide block slides along the fixed guide rail, the slide block is fixedly connected with the cross beam, the slide block is provided with a first cavity, the first cavity locks the fixed guide rail in a direction perpendicular to a sliding direction of the slide block, or the fixed guide rail is provided with a second cavity, and the second cavity locks the slide block in a direction perpendicular to the sliding direction of the slide block.
10. The wafer double-sided manufacturing system of claim 1, wherein the flip driving portion connects the first clamping portion and the second clamping portion by connecting the clamping and positioning portion.
11. The system for manufacturing double faces of wafers as claimed in claim 10, further comprising a base, wherein one end of the base is connected with the turnover driving part, and the other end of the base is connected with the positioning rail of the clamping and positioning part.
12. The system of claim 1, wherein the wafer transfer mechanism comprises a third wafer support coupled to the end of the movable arm, the third wafer support comprising a ring or fan shaped support portion capable of contacting the edge of the wafer.
13. The system of claim 12, wherein the first wafer support portion, the wafer lift and rotation portion, and the third wafer support portion are made of a ceramic material with a teflon coating on a surface thereof.
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| CN115948720B (en) * | 2023-03-14 | 2023-06-02 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
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