CN115948720B - Thin film deposition apparatus - Google Patents
Thin film deposition apparatus Download PDFInfo
- Publication number
- CN115948720B CN115948720B CN202310238231.5A CN202310238231A CN115948720B CN 115948720 B CN115948720 B CN 115948720B CN 202310238231 A CN202310238231 A CN 202310238231A CN 115948720 B CN115948720 B CN 115948720B
- Authority
- CN
- China
- Prior art keywords
- substrate
- gear
- thin film
- driving unit
- film deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides a thin film deposition apparatus, comprising: a base for carrying the substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge shape of the substrate, the first driving unit comprises a push rod and an air cylinder, the push rod is connected with the clamps and the air cylinder, and the push rod drives the clamps to move under the driving of the air cylinder so as to clamp or release the substrate from the side of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate. The invention can avoid the pollution of the substrate, has very compact arrangement of each structure, can meet the layout of each structure without increasing the size of the cavity, has simple and efficient rotation operation, and is beneficial to improving the output rate of equipment.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to semiconductor equipment, and especially relates to thin film deposition equipment.
Background
In the prior art, when a thin film deposition process is performed, only a single surface of a wafer (usually, the front surface of the wafer, i.e. the surface facing the direction of gas inflow) can be coated, but in some processes, deposition coating operations need to be performed on both surfaces of the wafer, which is difficult to meet the process requirement by adopting the existing deposition equipment. The reason is that in the existing film plating equipment, the back surface of the wafer is completely contacted with the surface of the heater, and the front surface of the wafer is exposed in the process cavity, so that film plating operation can only be performed on the front surface of the wafer. If the back surface of the wafer needs to be coated and the front surface does not need to be coated, the front surface of the wafer needs to be shielded, and the wafer is turned over by a moving device such as a mechanical arm outside the equipment, so that the back surface of the wafer faces the opposite surface into which the gas flows to finish the coating operation. This approach is not only prone to wafer damage and contamination, but is inefficient, resulting in reduced device yields.
It should be noted that the foregoing description of the background art is only for the purpose of facilitating a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background section of the present application.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a thin film deposition apparatus, which is used for solving the problems of the prior art that when the back surface of the wafer needs to be coated, the wafer needs to be turned over by a moving device such as a mechanical arm outside the coating apparatus, which is not only easy to cause damage and pollution to the wafer, but also has low efficiency, resulting in reduced yield of the apparatus.
To achieve the above and other related objects, the present invention provides a thin film deposition apparatus comprising: a base for carrying the substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge shape of the substrate, the first driving unit comprises a push rod and an air cylinder, the push rod is connected with the clamps and the air cylinder, and the push rod drives the clamps to move under the driving of the air cylinder so as to clamp or release the substrate from the side of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate.
Optionally, the number of the holders is 2, and each holder is semicircular.
More optionally, the holder includes a side, a first bottom and a second bottom, and in the process of holding the substrate by the holder, the side abuts against the side of the substrate, and one end of each of the first bottom and the second bottom is connected to the side, and the other end extends to contact with the upper surface and the lower surface of the substrate respectively.
Optionally, the first driving units are arranged in one-to-one correspondence with the grippers.
Optionally, the first gear and the second gear are both right-angle gears, and the first gear is fixed on the push rod.
Optionally, the thin film deposition apparatus further includes a plurality of pins and a third driving unit, one end of each pin is connected to the third driving unit, and the other end of each pin passes through the base, and can be lifted in the base under the driving of the third driving unit, so as to drive the substrate to lift.
Optionally, the second drive unit comprises a rotary motor.
Optionally, the thin film deposition device further comprises a corrugated pipe, one end of the corrugated pipe is connected with the outer wall of the process cavity, the other end of the corrugated pipe is connected with the air cylinder of the clamping module, and a piston rod of the air cylinder is sleeved in the corrugated pipe.
Optionally, the thin film deposition apparatus includes a detection module for detecting whether the substrate is rotated into place.
More optionally, the detection module includes more than two position sensors, and is disposed above the base at intervals.
As described above, the thin film deposition apparatus of the present invention has the following advantageous effects: according to the thin film deposition equipment provided by the invention, most of structures required by rotating the substrate can be arranged in the process cavity, so that the process cavity is not required to be opened in the process of rotating the substrate, and the substrate pollution can be avoided. Meanwhile, the arrangement of each structure is very compact, the layout of each structure can be met under the condition that the size of the cavity is not increased, the rotation operation is simple and efficient, and the improvement of the equipment output rate is facilitated.
Drawings
Fig. 1 is a schematic view showing an exemplary structure of a clamping module and a rotating module of a thin film deposition apparatus according to the present invention.
Fig. 2 is a schematic view showing an exemplary structure of a thin film deposition apparatus according to the present invention.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of this application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. In order to make the illustration as concise as possible, not all structures are labeled in the drawings.
When the existing thin film deposition equipment needs to rotate or even turn over a wafer, the operation is usually needed by means of a mechanical arm positioned outside the cavity, so that the operation is complicated, the yield of the equipment is reduced, and the mechanical arm is easy to collide with parts inside the cavity, so that the wafer is easy to damage. In addition, the contact area between the mechanical arm and the wafer is large, so that the coating position is shielded, and the coating yield is affected. In this regard, the inventors of the present application have made long-term studies to propose an improvement.
Specifically, as shown in fig. 1 and 2, the present invention provides a thin film deposition apparatus comprising: a base 11, a clamping module and a rotating module; the susceptor 11 is used for carrying a substrate 12, such as a wafer, which may be held on the basis of vacuum suction principles, and heating and/or cooling means may be provided within the susceptor 11, so that the susceptor 11 may also be referred to as a heater in some examples; the clamping module comprises more than two clamps 131 and a first driving unit, wherein the clamps 131 are matched with the edge shape of the substrate 12 and are suitable for clamping the substrate 12 from the edge of the substrate 12, the first driving unit comprises a push rod 132 and an air cylinder 133, the push rod 132 is connected with the clamps 131 and the air cylinder 133, the push rod 132 drives the clamps 131 to move under the driving of the air cylinder 133, and the more than two clamps 131 move from different directions to the substrate 12 so as to clamp or release the substrate 12 from different sides of the substrate 12; the rotation module includes a first gear 141, a second gear 142, and a second driving unit 143, the first gear 141 being connected with the push rod 132, the second gear 142 being engaged with the first gear 141, the second driving unit 143 being connected with the second gear 142, the second driving unit 143 including, for example, a rotation motor to precisely control rotation readings. The second driving unit 143 drives the second gear 142 to rotate, and under the meshing action, the first gear 141 rotates, so as to drive the push rod 132 connected with the first gear 141 to rotate, and the rotating clamping module drives the substrate 12 to rotate to a required angle, for example, to rotate until the substrate 12 turns over.
The thin film deposition apparatus generally further includes a process chamber 18, i.e., a deposition chamber, the susceptor 11 is disposed in the process chamber 18, and part units of the clamping module and the rotating module, such as a holder 131 of the clamping module, a first gear 141 and a second gear 142 of the rotating module, may be disposed in the process chamber 18, and the pushing rod 132 may be moved from the inside of the process chamber 18 to the outside of the process chamber 18. By the movement of the push rod 132 in the horizontal direction, the relative position of the clamper 131 and the substrate 12 is changed to clamp or release the substrate 12. In order to ensure that the process chamber 18 is kept sealed during the rotation operation, in a preferred example, the push rod 132 is in sealing connection with the cylinder 133 by using the bellows 16, i.e. the device further comprises a plurality of bellows 16, the piston rod of the cylinder 133 is connected with the push rod 132 and sleeved in the bellows 16, one end of the bellows 16 is connected with the outer wall of the process chamber 18, and the other end is connected with the cylinder 133. Similarly, the second driving unit 143 may be disposed outside the process chamber 18, and the second driving unit 143 may include, for example, a cylinder, and its main structure is disposed outside the process chamber 18 and connected to the outer wall of the process chamber 18 through a bellows, but the piston rod of the second driving unit 143 is sleeved in the bellows and extends from the outside to the inside of the process chamber 18 to be connected to the second gear 142. In other examples, in case of ensuring the sealing of the process chamber 18, the first gear 141, the second gear 142, and the second driving unit 143 of the rotation module may be entirely disposed outside the process chamber 18 while only the holder 131 is disposed inside the process chamber 18, so that the rotation of the rotation module may be more conveniently observed.
An exemplary working process of the thin film deposition apparatus provided by the present invention includes that when a substrate 12 needs to be coated, on the premise of ensuring that the gripper 131 does not collide with the base 11, the first driving unit drives the push rod 132 to move towards the substrate 12 until the gripper 131 abuts against the substrate 12, after the different grippers 131 abut against different sides of the substrate 12 to fix the substrate 12, the substrate 12 is separated from the base 11, the second driving unit 143 drives the second gear 142 to rotate, thereby driving the first gear 141 to rotate, and the gripping module drives the substrate 12 to rotate to a desired position, then the substrate 12 is placed on the base 11, the gripping module releases the substrate 12 to perform coating, and after coating, the substrate 12 is turned over again and reset according to the method described above. Or directly coating film in a state where the clamper 131 still holds the substrate 12 after turning over the substrate 12.
The key structure required by the rotation of the substrate can be arranged in the process cavity, so that the process cavity is not required to be opened in the process of rotating the substrate, and the pollution of the substrate can be avoided. Meanwhile, the arrangement of each structure is very compact, the layout of each structure can be met under the condition that the size of the cavity is not increased, the rotation operation is simple and efficient, and the improvement of the equipment output rate is facilitated.
In the case of the substrate 12 being fixable, the number of the holders 131 may be determined according to the structure thereof, and generally, the smaller the holding area thereof, the larger the number of the holders 131 is required, and the capability of sealing all the holders 131 to the side face of the substrate 12 is ensured as much as possible. In a preferred example, the number of the holders 131 is 2, and each holder 131 is in a semicircular shape, so that the 2 holders 131 form a circular ring, and the inner diameter of the circular ring is matched with the size of the base plate 12, so that the base plate 12 can be completely fixed in a circumferential direction. The clamper 131 and the base 11, or the substrate 12 on the base 11, form a closed environment to form a labyrinth seal device, so that the front surface of the substrate 12 is ensured to be free from plating film during the back surface process, and the substrate pollution is avoided. In comparison, the provision of 2 semicircular holders 131 contributes to simplification of the overall structure of the apparatus.
To better clamp the wafer, in one example, the clamp 131 includes a side edge, a first bottom edge and a second bottom edge, where the side edge abuts against the side surface of the substrate 12 during the process of clamping the substrate 12 by the clamp 131, and the first bottom edge and the second bottom edge are connected to the side edge at one end and extend to contact the upper surface and the lower surface of the substrate 12 at the other end respectively. Namely, the side edge, the first bottom edge and the second bottom edge of the holder 131 are connected to form a clamping groove, and the substrate 12 is embedded in the clamping groove in the process of holding the substrate 12. The first and second base edges preferably extend from the edge of the substrate 12 to the surface of the substrate 12 a distance of 2-3mm, which is typically a reserved non-coating area that does not interfere with normal coating operations. The material of the holder 131 may be selected in many ways, but in a preferred example, the holder 131 includes a metal material layer and a non-metal protection layer located inside the metal material layer, for example, a POM (polyoxymethylene) material layer, and the metal material layer may provide good support, and the POM material has good self-lubrication and wear resistance. In the process of clamping the substrate 12, the POM material layer is in contact with the substrate 12, so that damage to the substrate 12 can be avoided, and particle pollution caused by abrasion of the clamp 131 due to the edge of the substrate 12 can be avoided. To facilitate the clamping of the substrate 12, the first bottom edge and the second bottom edge of the clamp 131 may be non-horizontally connected with the side edges to have an inclination angle, so that the clamping groove of the clamp 131 has a V-shaped opening, and the edge of the substrate 12 slides into the clamping groove from the opening during the clamping of the substrate 12. The first bottom edge and the second bottom edge may be further provided with bumps to provide a certain compression during the process of clamping the substrate 12 to firmly fix the substrate 12.
The plurality of grippers 131 may share one driving unit, but it is necessary to realize interlocking of the plurality of grippers 131 by means of a connecting device such as a bearing. In a preferred example, each first driving unit driving each gripper 131 is independent, that is, the first driving units are disposed in one-to-one correspondence with the grippers 131, so as to avoid mutual interference, and the substrate 12 can be rotated to any angle, so that the rotation operation is more flexible.
The first gear 141 and the second gear 142 may be positioned so as to be engaged with each other. In a preferred embodiment, the first gear 141 and the second gear 142 are right angle gears, the first gear 141 is fixed on the push rod 132, and the second gear 142 is located below the first gear 141 to achieve a smoother transmission.
In some examples, the thin film deposition apparatus includes a detection module to detect whether the substrate 12 is rotated into place. There are various options for the detection module, such as in an example, the detection module includes more than two position sensors 17 spaced above the base 11, for example, disposed in the process chamber 18 and at the top, i.e. 2 position sensors 17 are spaced from each other, and each has a distance from the base 11, for example, 2 position sensors 17 may be respectively located directly above two ends of the base 11. The position sensor 17 is preferably a non-contact sensor, or a distance sensor may be used. The detection module is arranged, and whether the rotation position of the substrate 12 is in place is judged by the length of the optical fiber emitted by the position sensors 17 at the two sides of the upper side of the process cavity 18. When the positions of the two position sensors 17 show non-uniformity, then a low-speed fine adjustment is performed by the second drive unit 143 of the rotary module, for example by a rotary motor, thereby ensuring that the readings of the two position sensors 17 are uniform. The signal of the position sensor 17 is transmitted to the central processing unit of the console, which transmits a signal to the rotation mechanism to adjust the horizontal state of the substrate 12. In other examples, a displacement sensor or other detection module may be used, for example, a detection device disposed at a predetermined position to detect whether the substrate is horizontal, but compared with the position sensor 17, the detection device is simpler to use.
To better realize the rotation of the substrate 12, collision damage between the substrate 12 and other components during the rotation is avoided as much as possible, and in an example, the thin film deposition apparatus further includes a plurality of pins 151 and a third driving unit. The number of the ejector pins 151 is 3, for example, and the ejector pins are uniformly distributed at intervals along the circumferential direction of the base 11, one end of each ejector pin 151 is connected with a third driving unit, and the other end of each ejector pin passes through the base 11, and can be lifted in the base 11 under the driving of the third driving unit, so that the substrate 12 is driven to lift. The third driving unit includes, for example, a fixing plate 152 and a lifting cylinder 153, where the main body of the lifting cylinder 153 may be disposed outside the process chamber 18 and connected to the outer wall of the process chamber 18 through a bellows, and one end of the ejector pin 151 is fixed on the fixing plate 152 and extends upward into the base 11, and the fixing plate 152 moves up and down under the driving of the lifting cylinder 153, so as to drive the ejector pin 151 to lift in the base 11. Of course, in other examples, the rotation module may be connected to the lifting device, or the rotation module may be integrated with a lifting function, and the rotation module may be lifted up while rotating to gradually lift the substrate 12, so that the collision with the base 11 during the rotation operation may be reduced to some extent by lifting the rotation module itself. Alternatively, in other examples, the substrate 12 may be separated from the base 11 before the substrate 12 is clamped by using a pneumatic suspension method, for example, a plurality of air holes are formed in the base 11, and when the substrate needs to be turned over, air flows are ejected from the air holes so that the substrate floats above the base. However, the lifting thimble 151 is arranged in the base 11, which is a safer and more efficient design. The ejector pins 151 are made of ceramic or silicon carbide, for example, and the surface of the ejector pins contacting the substrate 12 may be an inclined slope so as to avoid scratching the substrate 12 during the process of lifting the substrate 12 as much as possible.
In the case of the provision of the ejector pins 151, an exemplary operating state of the device is described as follows:
a) Substrate 12 is initially not within process chamber 18 and substrate 12 is transferred to process chamber 18 by a robot arm, such as with substrate 12 facing up and back down, with pins 151 in a raised position to raise substrate 12 above the bottom edge of holder 131 (this position typically being when the front side of substrate 12 is not coated or the front side coating has been completed in other chambers prior to entering the process chamber).
b) Alternatively, the front surface coating of the substrate 12 performed in the process chamber 18 is completed, and at this time, the front surface of the substrate 12 is upward, the back surface is downward, the substrate 12 is lifted by the ejector pins 151, and the susceptor 11 is positioned at a low position, and is in a standby state for coating the back surface of the substrate 12.
In the above states a and b, the base 11 is in the low position. The reason why the two process operations a and b can be performed is that there is a clamping module, and the clamping module cooperates with the edge of the base 11 and the base 12 to form a sealed environment after the base 12 rotates to form a labyrinth seal device, so that the front surface of the base 12 is ensured to be free of coating during the back surface process, and the front surface of the base 12 is ensured not to be coated or secondarily coated. In other words, even if the operation of b as described above is not completed in one process chamber, the operation of a can be performed, still having the above-described effect.
When the substrate 12 needs to be coated by overturning, the piston rod of the air cylinder 133 extends outwards, the clamp 131 is abutted against the edge of the substrate 12 to clamp the substrate 12, the ejector pins 151 descend to gradually separate from the substrate 12, after the ejector pins 151 are in a low position (at this time, the ejector pins 151 and the base 11 are in a low position), the substrate 12 is overturned by utilizing the rotary motor through the rotary module of the design, the front surface of the substrate 12 faces downwards and the back surface faces upwards, the base 11 is lifted to the lower side of the substrate 12 (for example, the base 11 is in unlimited access to a wafer by adjusting the step number of the rotary motor) so as to support the substrate 12, and therefore the front surface of the substrate 12 is blocked, and then the back surface coating operation is performed.
The thin film deposition apparatus provided herein may be a chemical vapor deposition apparatus, and thus the apparatus may further include a gas distribution plate at the top of the process chamber to introduce the deposition source gas into the process chamber. And may further include an inert gas line, which may be disposed in a support module supporting the susceptor to introduce an inert gas to the surface of the susceptor, the inert gas may perform a cleaning and protecting function on the substrate, and the support module of the susceptor may be provided with a lifting unit (not shown). The thin film deposition apparatus may also be a physical vapor deposition apparatus, such as a magnetron sputtering apparatus, and thus the apparatus may further include a magnetron assembly located at the top of the process chamber. The embodiment is not limited to a specific type of the apparatus, or is applicable to various types of thin film deposition apparatuses, and can meet diversified thin film deposition requirements.
As can be seen from the foregoing description, the thin film deposition apparatus provided by the present application will have several of the following advantages:
1) By adopting the thin film deposition equipment provided by the application, only the edge of the substrate is contacted when the rotation operation of the substrate is carried out, devices such as a mechanical arm and the like outside the cavity are not needed, and the overturning operation is completed in the sealed process cavity, so that the pollution of the substrate can be effectively avoided.
2) The rotation of arbitrary angle of base plate can be realized to this application, can detect the upset simultaneously and whether put in place, if the upset fails in place, can correct the operation, improves the operation yield.
3) When any surface of the substrate is coated, the other surface of the substrate is effectively shielded, so that accurate coating is realized.
4) The equipment has simple structure, compact layout and convenient use, can greatly reduce the operation time and improve the production efficiency and the equipment yield.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A thin film deposition apparatus, comprising: a base for carrying the substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge shape of the substrate, the first driving unit comprises a push rod and an air cylinder, the push rod is connected with the clamps and the air cylinder, and the push rod drives the clamps to move under the driving of the air cylinder so as to clamp or release the substrate from the side of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate.
2. The thin film deposition apparatus according to claim 1, wherein the number of holders is 2, and each holder is semicircular.
3. The thin film deposition apparatus according to claim 2, wherein the holder includes a side edge, a first bottom edge and a second bottom edge, the side edge being abutted against a side surface of the substrate in the process of holding the substrate by the holder, the first bottom edge and the second bottom edge each having one end connected to the side edge and the other end extending to be in contact with an upper surface and a lower surface of the substrate, respectively.
4. The thin film deposition apparatus according to claim 1, wherein the first driving units are provided in one-to-one correspondence with the grippers.
5. The thin film deposition apparatus according to claim 1, wherein the first gear and the second gear are right angle gears, and the first gear is fixed to the push rod.
6. The thin film deposition apparatus according to claim 1, further comprising a plurality of pins and a third driving unit, wherein one end of each pin is connected to the third driving unit, and the other end of each pin passes through the base and is driven by the third driving unit to be lifted in the base, thereby lifting the substrate.
7. The thin film deposition apparatus according to claim 1, wherein the second driving unit includes a rotation motor.
8. The thin film deposition apparatus according to claim 1, further comprising a bellows having one end connected to an outer wall of the process chamber and the other end connected to a cylinder of the clamping module, a piston rod of the cylinder being sleeved in the bellows.
9. The thin film deposition apparatus according to any one of claims 1 to 8, wherein the thin film deposition apparatus comprises a detection module for detecting whether the substrate is rotated into place.
10. The thin film deposition apparatus according to claim 9, wherein the detection module comprises two or more position sensors, which are disposed above the susceptor at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310238231.5A CN115948720B (en) | 2023-03-14 | 2023-03-14 | Thin film deposition apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310238231.5A CN115948720B (en) | 2023-03-14 | 2023-03-14 | Thin film deposition apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115948720A CN115948720A (en) | 2023-04-11 |
| CN115948720B true CN115948720B (en) | 2023-06-02 |
Family
ID=85893061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310238231.5A Active CN115948720B (en) | 2023-03-14 | 2023-03-14 | Thin film deposition apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115948720B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117051372B (en) * | 2023-08-08 | 2024-04-02 | 上海悦匠实业有限公司 | Wafer carrying platform lifting device with limit control function |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101178502A (en) * | 2006-11-10 | 2008-05-14 | 爱德牌工程有限公司 | Lift pin driving device and a flat panel display manufacturing apparatus having same |
| DE102007057891A1 (en) * | 2006-12-01 | 2008-07-03 | Ingenia Gmbh | Wafer gripper has gripper jaw which is shifted in guidance by drive, where gripper jaw grips wafer, and rotating drive has low pressure driven impeller |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| CN108193187A (en) * | 2017-11-29 | 2018-06-22 | 北京中科优唯科技有限公司 | A kind of substrate frame of achievable automatic turning |
| CN109695022A (en) * | 2017-10-24 | 2019-04-30 | 北京北方华创微电子装备有限公司 | Processing chamber, semiconductor processing equipment and membrane deposition method |
| CN110640324A (en) * | 2019-09-02 | 2020-01-03 | 中芯集成电路（宁波）有限公司 | Wafer double-side manufacturing system |
| CN113430504A (en) * | 2021-08-26 | 2021-09-24 | 上海陛通半导体能源科技股份有限公司 | Chemical vapor deposition equipment capable of conveniently lifting and clamping wafer |
| CN214409362U (en) * | 2020-10-30 | 2021-10-15 | 天津精创锐势光电科技有限公司 | Optical lens coating device |
| CN114104677A (en) * | 2020-09-01 | 2022-03-01 | 松下知识产权经营株式会社 | Substrate inverting apparatus and substrate inverting method |
| CN217709660U (en) * | 2022-06-14 | 2022-11-01 | 苏州华星光电技术有限公司 | Thin film deposition equipment |
| CN218482218U (en) * | 2022-10-25 | 2023-02-14 | 江苏弘琪工业自动化有限公司 | Wafer clamping arm |
| CN218602415U (en) * | 2022-11-25 | 2023-03-10 | 上海交震半导体科技有限公司 | Overturning actuating mechanism based on stepping motor control |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102590328B1 (en) * | 2020-12-24 | 2023-10-16 | 세메스 주식회사 | Substrate gripping apparatus and liquid processing apparatus, and substrate processing equipment including the same |
-
2023
- 2023-03-14 CN CN202310238231.5A patent/CN115948720B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101178502A (en) * | 2006-11-10 | 2008-05-14 | 爱德牌工程有限公司 | Lift pin driving device and a flat panel display manufacturing apparatus having same |
| DE102007057891A1 (en) * | 2006-12-01 | 2008-07-03 | Ingenia Gmbh | Wafer gripper has gripper jaw which is shifted in guidance by drive, where gripper jaw grips wafer, and rotating drive has low pressure driven impeller |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| CN109695022A (en) * | 2017-10-24 | 2019-04-30 | 北京北方华创微电子装备有限公司 | Processing chamber, semiconductor processing equipment and membrane deposition method |
| CN108193187A (en) * | 2017-11-29 | 2018-06-22 | 北京中科优唯科技有限公司 | A kind of substrate frame of achievable automatic turning |
| CN110640324A (en) * | 2019-09-02 | 2020-01-03 | 中芯集成电路（宁波）有限公司 | Wafer double-side manufacturing system |
| CN114104677A (en) * | 2020-09-01 | 2022-03-01 | 松下知识产权经营株式会社 | Substrate inverting apparatus and substrate inverting method |
| JP2022041541A (en) * | 2020-09-01 | 2022-03-11 | パナソニックＩｐマネジメント株式会社 | Substrate inversion device and substrate inversion method |
| CN214409362U (en) * | 2020-10-30 | 2021-10-15 | 天津精创锐势光电科技有限公司 | Optical lens coating device |
| CN113430504A (en) * | 2021-08-26 | 2021-09-24 | 上海陛通半导体能源科技股份有限公司 | Chemical vapor deposition equipment capable of conveniently lifting and clamping wafer |
| CN217709660U (en) * | 2022-06-14 | 2022-11-01 | 苏州华星光电技术有限公司 | Thin film deposition equipment |
| CN218482218U (en) * | 2022-10-25 | 2023-02-14 | 江苏弘琪工业自动化有限公司 | Wafer clamping arm |
| CN218602415U (en) * | 2022-11-25 | 2023-03-10 | 上海交震半导体科技有限公司 | Overturning actuating mechanism based on stepping motor control |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115948720A (en) | 2023-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10490427B2 (en) | Apparatus for treating substrate | |
| KR102124417B1 (en) | Substrate supporting apparatus | |
| CN115948720B (en) | Thin film deposition apparatus | |
| US6874515B2 (en) | Substrate dual-side processing apparatus | |
| TWI627693B (en) | Substrate processing apparatus and substrate processing method | |
| US9421617B2 (en) | Substrate holder | |
| JPH1092916A (en) | Lift pin and support pin apparatus for process chamber | |
| TWI574341B (en) | Vacuum treatment apparatus and a method for manufacturing | |
| CN101501833B (en) | Device for supporting substrate | |
| KR19980041847A (en) | Substrate processing system | |
| US20070110895A1 (en) | Single side workpiece processing | |
| US20020017237A1 (en) | Apparatus for processing a workpiece | |
| WO2016141650A1 (en) | Holding device for disc-like object | |
| CN110957242A (en) | Substrate processing apparatus | |
| JP5795920B2 (en) | Substrate processing equipment | |
| US20060043750A1 (en) | End-effectors for handling microfeature workpieces | |
| KR101409752B1 (en) | Multi Chamber Substrate Processing Apparatus using Robot for Transferring Substrate | |
| CN114171430A (en) | Cleaning jig, substrate processing apparatus including the same, and cleaning method of the substrate processing apparatus | |
| JPH11163094A (en) | Substrate, chucking device and substrate cleaning apparatus | |
| KR101972226B1 (en) | Substrate cleaning device and substrate processing apparatus including the same | |
| EP1955369B1 (en) | Device and method for holding a substrate | |
| TWI794675B (en) | Substrate processing apparatus | |
| KR102646567B1 (en) | Substrate treating apparatus, and method for adjusting substrate position | |
| US20180061649A1 (en) | Apparatus and method for treating substrate | |
| TWI743512B (en) | Substrate conveying robot and its control method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |