CN218482218U - Wafer clamping arm - Google Patents

Wafer clamping arm Download PDF

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Publication number
CN218482218U
CN218482218U CN202222821043.9U CN202222821043U CN218482218U CN 218482218 U CN218482218 U CN 218482218U CN 202222821043 U CN202222821043 U CN 202222821043U CN 218482218 U CN218482218 U CN 218482218U
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CN
China
Prior art keywords
wafer
grip block
centre gripping
clamping
transmission shaft
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CN202222821043.9U
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Chinese (zh)
Inventor
刘劲松
郭俭
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Jiangsu Hongqi Industrial Automation Co ltd
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Jiangsu Hongqi Industrial Automation Co ltd
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Priority to CN202222821043.9U priority Critical patent/CN218482218U/en
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Abstract

The utility model relates to the field of semiconductor technology, specifically be a wafer centre gripping arm, including the device shell, two centre gripping cylinders, two are installed to the surface symmetry of device shell the output of centre gripping cylinder all is provided with the fly leaf, the internal connection of fly leaf has the guide bar, the lower fixed surface of fly leaf has the grip block, one side of grip block is provided with three stopper, the inside of grip block is provided with the protection cushion, the inside of protection cushion is provided with the centre gripping groove, the end of grip block is provided with buffer spacer, buffer spacer's internally mounted has pressure sensor. The utility model discloses a protection cushion that sets up on the grip block under the cooperation in centre gripping groove, can protect the wafer spacing, can effectual reduction take place the condition that drops, and through the pressure sensor who sets up on the blotter piece, the pressure data that pressure sensor received is when 0, represents the wafer centre gripping and accomplishes, improves the practicality.

Description

Wafer clamping arm
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a wafer centre gripping arm.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are mainly 8 inches and 12 inches, and manufacturers often need to check the quality of wafers in the delivery or receiving links. In addition to the front side detection, the back side also needs to be detected.
Like a wafer clamping device of publication number CN217405396U, this utility model discloses a wafer clamping device relates to monolithic wet process's technical field. The wafer clamping device comprises a power part and a clamping part, wherein the power part is positioned above the clamping device, the clamping part is positioned below the clamping device, the clamping part comprises a lower chuck plate and an upper chuck plate, and the power part comprises a clamping cylinder and a motor; the lower chuck is connected to the lower chuck horizontal connecting rod through the lower chuck vertical connecting rod, the upper chuck is connected to the clamping cylinder, the cylinder fixing plate is arranged on the lower chuck horizontal connecting rod, thrust is stably and consistently output through the cylinders uniformly distributed on two sides, and risks of damaging wafers can be reduced.
In summary, the following technical problems are known in the prior art: the existing clamping arm is inconvenient to adjust the angle of the clamped wafer when in use, so that the other side of the wafer is inconvenient to inspect, and therefore the wafer clamping arm is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer centre gripping arm to solve the problem that proposes in the above-mentioned background art.
In order to solve the technical problem, the utility model adopts the following technical scheme:
the utility model provides a wafer centre gripping arm, includes, the device shell, two centre gripping cylinders, two are installed to the surface symmetry of device shell the output of centre gripping cylinder all is provided with the fly leaf, the internal connection of fly leaf has the guide bar, the lower fixed surface of fly leaf has the grip block, one side of grip block is provided with three stopper, the inside of grip block is provided with the protection cushion, the inside of protection cushion is provided with the centre gripping groove, the end of grip block is provided with buffer spacer, buffer spacer's internally mounted has pressure sensor.
Preferably, the clamping cylinder is connected with the device shell through a bolt, and the clamping plate and the clamping cylinder form a telescopic structure through a movable plate.
Preferably, be fixed connection between stopper and the grip block, and fixed knot as an organic whole constructs between protection cushion and the grip block to the centre gripping groove runs through to the inner wall of protection cushion, be fixed connection between buffer spacer and the grip block.
Preferably, the device housing is further provided with:
the mounting shell is arranged on the upper surface of the device shell, the upper end of the mounting shell is provided with a connecting seat, and the inside of the mounting shell is provided with an adjusting motor.
Preferably, the connecting seat and the mounting shell are of an integrated fixing structure, and the adjusting motor and the mounting shell are connected through screws.
Preferably, the adjusting motor is further provided with:
the driving gear is arranged on an output shaft of the adjusting motor, a driven gear is connected to the left side of the driving gear, a transmission shaft is connected to the inside of the driven gear, and a limiting bearing is arranged on one side of the transmission shaft.
Preferably, the transmission shaft forms a rotating structure with the adjusting motor through the driven gear and the driving gear, the inner wall of the limiting bearing is tightly attached to the outer wall of the transmission shaft, and the device shell is fixedly connected with the transmission shaft.
The above description shows that, with the above technical solutions of the present application, the technical problems to be solved by the present application can be solved.
Simultaneously, through above technical scheme, the utility model discloses possess following beneficial effect at least:
the clamping cylinder arranged on the device shell can drive the movable plate to horizontally move, so that the two clamping plates are close to each other, thereby clamping the wafer and facilitating the use of people; the wafer can be protected and limited under the matching of the clamping grooves through the protective rubber pads arranged on the clamping plates, the falling-off condition can be effectively reduced, and the pressure sensor arranged on the buffer pad represents that the wafer is clamped when the pressure data received by the pressure sensor is 0, so that the practicability is improved;
the utility model is convenient to connect the device with an external mechanical arm through the connecting seat arranged on the mounting shell, thereby being convenient for use, and the arranged adjusting motor can drive the device shell to rotate, thereby adjusting the angle of the clamped wafer; through the driven gear and the driving gear that set up for the adjustment motor starts and can drive the transmission shaft and rotate, thereby the drive arrangement shell is rotatory, conveniently detects the operation to the another side of centre gripping wafer, and the practicality is strong.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional view of the device housing of the present invention;
fig. 3 is a partially enlarged view of a portion a in fig. 1 according to the present invention;
fig. 4 is a schematic view of the sectional structure of the mounting case of the present invention.
In the figure: 1. a device housing; 2. a clamping cylinder; 3. a movable plate; 4. a guide bar; 5. a clamping plate; 6. a limiting block; 7. a protective rubber pad; 8. a clamping groove; 9. a cushion pad; 10. a pressure sensor; 11. mounting a shell; 12. a connecting seat; 13. an adjustment motor; 14. a driving gear; 15. a driven gear; 16. a drive shaft; 17. and limiting the bearing.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Embodiment 1
As shown in the attached drawings 1-3, the utility model provides a technical scheme: the utility model provides a wafer centre gripping arm, including device shell 1, device shell 1's surface symmetry installs two centre gripping cylinders 2, two centre gripping cylinder 2's output all is provided with fly leaf 3, the internal connection of fly leaf 3 has guide bar 4, the lower fixed surface of fly leaf 3 has grip block 5, one side of grip block 5 is provided with three stopper 6, the inside of grip block 5 is provided with protection cushion 7, the inside of protection cushion 7 is provided with centre gripping groove 8, the end of grip block 5 is provided with buffer spacer 9, buffer spacer 9's internally mounted has pressure sensor 10, through setting up the protection cushion 7 that forms for the preparation of rubber material, can play good guard action to the wafer, avoid grip block 5 to cause the damage to the wafer.
Example two
The scheme in the first embodiment is further described in the following with reference to specific working modes, which are described in detail in the following:
as shown in fig. 1, 2 and 3, as a preferred embodiment, on the basis of the above manner, further, the clamping cylinder 2 is connected with the device housing 1 by a bolt, and the clamping plate 5 forms a telescopic structure with the clamping cylinder 2 through the movable plate 3, and the clamping cylinder 2 arranged on the device housing 1 can drive the movable plate 3 to perform horizontal movement, so that the two clamping plates 5 approach each other, thereby clamping the wafer, which is convenient for people to use; be fixed connection between stopper 6 and the grip block 5, and fixed knot as an organic whole constructs between protection cushion 7 and the grip block 5, and centre gripping groove 8 runs through to the inner wall of protection cushion 7, be fixed connection between buffer spacer 9 and the grip block 5, through the protection cushion 7 that sets up on the grip block 5, under the cooperation of centre gripping groove 8, can protect the wafer spacing, the condition that can effectual reduction take place to drop, and through the pressure sensor 10 that sets up on the buffer spacer 9, when the pressure data that pressure sensor 10 received is 0, represent the wafer centre gripping and accomplish, and the high practicality is improved.
As shown in fig. 1, 2 and 4, as a preferred embodiment, in addition to the above-mentioned manner, further, a mounting shell 11 is disposed on the upper surface of the device housing 1, a connection seat 12 is disposed at the upper end of the mounting shell 11, an integral fixing structure is formed between the connection seat 12 and the mounting shell 11, an adjusting motor 13 is mounted inside the mounting shell 11, the adjusting motor 13 is in screw connection with the mounting shell 11, the device is conveniently connected with an external robot arm through the connection seat 12 disposed on the mounting shell 11, so that the device is convenient to use, and the adjusting motor 13 is disposed to drive the device housing 1 to rotate, so as to adjust the angle of the clamped wafer; driving gear 14, its setting is at the output shaft of adjusting motor 13, the left side of driving gear 14 is connected with driven gear 15, driven gear 15's internal connection has transmission shaft 16, transmission shaft 16 passes through driven gear 15 and constitutes revolution mechanic between driving gear 14 and the adjusting motor 13, one side of transmission shaft 16 is provided with spacing bearing 17, spacing bearing 17's inner wall and transmission shaft 16's outer wall closely laminate, and be fixed connection between device shell 1 and the transmission shaft 16, driven gear 15 and driving gear 14 through setting up, make adjusting motor 13 start can drive transmission shaft 16 and rotate, thereby drive arrangement shell 1 is rotatory, conveniently detect the operation to the another side of centre gripping wafer, therefore, the clothes hanger is strong in practicability.
In summary, the following can be found:
the utility model is directed to the technical problem: when the existing clamping arm is used, the angle of the clamped wafer is inconvenient to adjust, so that the other side of the wafer is inconvenient to inspect; the technical scheme of each embodiment is adopted. Meanwhile, the implementation process of the technical scheme is as follows:
before using this wafer centre gripping arm, place suitable position earlier device shell 1, connecting seat 12 through setting up on installation shell 11, can connect connecting seat 12 and outside robotic arm, thereby conveniently use, when using, through the centre gripping cylinder 2 that sets up on device shell 1, can drive fly leaf 3 and move, guide bar 4 through setting up in device shell 1, can play the effect of direction, avoid taking place the skew, make two grip blocks 5 be close to each other, carry out the centre gripping to the wafer, and stopper 6 that sets up on two grip blocks 5 can play spacing effect, avoid taking place the skew when centre gripping to the wafer, make the edge of wafer get into to the inside centre gripping groove 8 of protection cushion 7, carry out spacingly to the wafer, through pressure sensor 10 that sets up on buffer pad 9, when the centre gripping has the wafer in two grip blocks 5, make the pressure that pressure sensor 10 received be 0, thereby accomplish the centre gripping, when pressure sensor 10 detected there is pressure, make pressure sensor 10's pressure data send the change, thereby it has not the centre gripping to detect out the wafer in two grip blocks 5, the convenient use of people to use, the regulation shell can drive the regulation of the driven gear wheel drive the rotation of bearing 16, the rotation of this kind of the regulation shell, it can carry out the another side of the rotation of the regulation of the convenience of the bearing 16 to the rotation of the driven gear wheel, it can drive device, it can carry out the another side to carry out the pivoted to the convenience of the regulation of the rotation of the bearing 16 to the other side to the wafer, it can be carried out the regulation of the convenience of the rotation of the wafer, it can carry out the rotation of the convenience.
Through above-mentioned setting, above-mentioned technical problem can be solved certainly to this application, simultaneously, realizes following technological effect:
the utility model can drive the movable plate 3 to move horizontally through the clamping cylinder 2 arranged on the device shell 1, so that the two clamping plates 5 are close to each other, thereby clamping the wafer and facilitating the use of people; through the protective rubber pad 7 arranged on the clamping plate 5, the wafer can be protected and limited under the coordination of the clamping groove 8, the falling-off condition can be effectively reduced, and through the pressure sensor 10 arranged on the buffer gasket 9, when the pressure data received by the pressure sensor 10 is 0, the clamping of the wafer is finished, so that the practicability is improved;
the utility model has the advantages that the connecting seat 12 arranged on the mounting shell 11 is convenient for connecting the device with an external mechanical arm, thereby facilitating the use, and the adjusting motor 13 arranged can drive the device shell 1 to rotate, thereby adjusting the angle of the clamped wafer; through driven gear 15 and the driving gear 14 that sets up for adjusting motor 13 and starting can drive transmission shaft 16 and rotate, thereby drive arrangement shell 1 is rotatory, conveniently detects the operation to the another side of centre gripping wafer, and the practicality is strong.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A wafer clamping arm is characterized by comprising
Device shell (1), two die clamping cylinder (2), two are installed to the surface symmetry of device shell (1) the output of die clamping cylinder (2) all is provided with fly leaf (3), the internal connection of fly leaf (3) has guide bar (4), the lower fixed surface of fly leaf (3) has grip block (5), one side of grip block (5) is provided with three stopper (6), the inside of grip block (5) is provided with protection cushion (7), the inside of protection cushion (7) is provided with centre gripping groove (8), the end of grip block (5) is provided with buffer pad (9), the internally mounted of buffer pad (9) has pressure sensor (10).
2. A wafer-holding arm as claimed in claim 1, characterized in that the holding cylinder (2) is bolted to the device housing (1), and the holding plate (5) forms a telescopic structure with the holding cylinder (2) via the movable plate (3).
3. The wafer clamping arm as claimed in claim 1, wherein the limiting block (6) is fixedly connected with the clamping plate (5), the protective rubber pad (7) and the clamping plate (5) are integrally fixed, the clamping groove (8) penetrates through the inner wall of the protective rubber pad (7), and the buffer gasket (9) is fixedly connected with the clamping plate (5).
4. A wafer-holding arm as claimed in claim 1, characterized in that the device housing (1) is further provided with:
the device comprises a mounting shell (11) arranged on the upper surface of the device shell (1), a connecting seat (12) is arranged at the upper end of the mounting shell (11), and an adjusting motor (13) is arranged inside the mounting shell (11).
5. A wafer-holding arm as claimed in claim 4, characterized in that the connecting seat (12) and the mounting shell (11) are integrally fixed, and the adjusting motor (13) and the mounting shell (11) are screwed together.
6. A wafer-holding arm as claimed in claim 4, characterized in that the adjustment motor (13) is further provided with:
the adjusting mechanism comprises a driving gear (14) arranged on an output shaft of the adjusting motor (13), a driven gear (15) is connected to the left side of the driving gear (14), a transmission shaft (16) is connected to the inside of the driven gear (15), and a limiting bearing (17) is arranged on one side of the transmission shaft (16).
7. A wafer-holding arm as claimed in claim 6, characterized in that the transmission shaft (16) forms a rotary structure with the adjustment motor (13) through the driven gear (15) and the driving gear (14), and the inner wall of the limit bearing (17) is closely attached to the outer wall of the transmission shaft (16), and the device housing (1) is fixedly connected to the transmission shaft (16).
CN202222821043.9U 2022-10-25 2022-10-25 Wafer clamping arm Active CN218482218U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222821043.9U CN218482218U (en) 2022-10-25 2022-10-25 Wafer clamping arm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222821043.9U CN218482218U (en) 2022-10-25 2022-10-25 Wafer clamping arm

Publications (1)

Publication Number Publication Date
CN218482218U true CN218482218U (en) 2023-02-14

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ID=85169523

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222821043.9U Active CN218482218U (en) 2022-10-25 2022-10-25 Wafer clamping arm

Country Status (1)

Country Link
CN (1) CN218482218U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115948720A (en) * 2023-03-14 2023-04-11 上海陛通半导体能源科技股份有限公司 Thin film deposition apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115948720A (en) * 2023-03-14 2023-04-11 上海陛通半导体能源科技股份有限公司 Thin film deposition apparatus
CN115948720B (en) * 2023-03-14 2023-06-02 上海陛通半导体能源科技股份有限公司 Thin film deposition apparatus

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