CN213137359U

CN213137359U - Semiconductor package wafer cutting system

Info

Publication number: CN213137359U
Application number: CN202020920684.8U
Authority: CN
Inventors: 张志恒
Original assignee: Individual
Current assignee: Yang Kun
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2021-05-07
Anticipated expiration: 2030-05-27

Abstract

The utility model discloses a semiconductor package wafer cutting system, including annular roof, be equipped with in the roof and wear the export, the upper end fixedly connected with of roof falls the mounting bracket of U type, the interior top end fixed mounting of mounting bracket has telescopic cylinder, telescopic cylinder's telescopic end fixedly connected with sliding plate, the lower extreme fixed mounting of sliding plate has the motor, pivot in the output fixedly connected with of motor, the lower extreme of well pivot rotates and is connected with the top board, a plurality of tensioning springs of the lower extreme fixedly connected with of top board, it is a plurality of the common fixedly connected with holding down plate of lower extreme of tensioning spring, the fixed internal gear that has cup jointed in the well pivot, the lower extreme of roof uses well pivot to be connected with a plurality of limit pivots as centre of a circle circumference even rotation. The utility model discloses can cut the wafer that a plurality of different radiuses required, adsorb at the support that supports the sucking disc and carry out elasticity and compress tightly, the strong wearing and tearing that just avoid the rigid contact to produce of stability.

Description

Semiconductor package wafer cutting system

Technical Field

The utility model relates to a semiconductor package technical field especially relates to a semiconductor package wafer cutting system.

Background

A wafer refers to a substrate (also called a substrate) from which semiconductor transistors or integrated circuits are fabricated. Since it is a crystalline material, it is called a wafer because it is circular in shape. The wafer cutting system in the prior art cannot simultaneously cut a plurality of wafers, and is rigidly clamped during fixing, so that the wafers are easily damaged.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a semiconductor package wafer dicing system that solves the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor packaging wafer cutting system comprises an annular top plate, wherein a penetrating port is formed in the top plate, an inverted U-shaped mounting frame is fixedly connected to the upper end of the top plate, a telescopic cylinder is fixedly mounted at the inner top end of the mounting frame, a sliding plate is fixedly connected to the telescopic end of the telescopic cylinder, a motor is fixedly mounted at the lower end of the sliding plate, a middle rotating shaft is fixedly connected to the output end of the motor, an upper pressing plate is rotatably connected to the lower end of the middle rotating shaft, a plurality of tensioning springs are fixedly connected to the lower end of the upper pressing plate, a lower pressing plate is fixedly connected to the lower ends of the tensioning springs together, an inner gear is fixedly sleeved on the middle rotating shaft, a plurality of side rotating shafts are uniformly and rotatably connected to the lower end of the top plate in the circumferential direction by taking the middle rotating shaft as a circle center, an outer gear meshed, and a supporting sucker is arranged at the lower end of the top plate.

Preferably, the inner walls of the two sides of the mounting frame are provided with sliding chutes in sliding connection with the sliding plates.

Preferably, the thickness of the inner gear is greater than that of the outer gear.

Preferably, the radius adjusting mechanism comprises a fixed box with an opening at the lower side, the inner walls of the two sides of the fixed box are rotatably connected with a screw rod, one end of the screw rod penetrates through the fixed box and is fixedly connected with a rotating plate, a moving block is sleeved on the screw rod in a threaded manner, and the cutting rod is fixed at the lower end of the moving block.

Preferably, the fixed box is provided with scale marks on the lower end surface of the fixed box, wherein the scale marks take the axis of the external gear as a starting point.

Preferably, the supporting suction cup is connected with a vacuum device through a pipeline.

Compared with the prior art, the semiconductor packaging wafer cutting system has the advantages that:

1. the upper press plate pushes down the press plate through the tensioning spring to elastically compress the wafer, so that abrasion caused by rigid contact is avoided, the wafer is supported and adsorbed by the supporting sucker, and the stability is enhanced.

2. The inner gear is always meshed with the outer gear in the downward moving process, torque is transmitted, the plurality of cutting rods are driven to cut the wafer, the plurality of wafers can be cut simultaneously, and the production capacity is high.

3. The position of the cutting rod relative to the axis of the outer gear can be adjusted through the radius adjusting mechanism, so that wafers with different radii can be cut, the requirements of different product production are met, and the practicability is higher.

To sum up, the utility model discloses can cut the wafer that a plurality of different radiuses required, carry out elasticity and compress tightly under the support of supporting the sucking disc adsorbs, the strong wearing and tearing of just avoiding the rigid contact production of stability.

Drawings

Fig. 1 is a front view of a semiconductor package wafer dicing system according to the present invention;

fig. 2 is a schematic structural diagram of a radius adjustment mechanism of a semiconductor package wafer dicing system according to the present invention.

In the figure: the device comprises a top plate 1, a mounting frame 2, a telescopic cylinder 3, a sliding plate 4, a sliding chute 5, a motor 6, a rotating shaft 7, an internal gear 8, an upper pressing plate 9, a lower pressing plate 10, a tension spring 11, a rotating shaft 12, an external gear 13, a radius adjusting mechanism 14, a fixing box 141, a screw 142, a rotating plate 143, a moving block 144, a cutting rod 15, a supporting sucker 16 and a vacuum device 17.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a semiconductor package wafer cutting system includes an annular top plate 1, a through hole is provided in the top plate 1, an inverted U-shaped mounting frame 2 is fixedly connected to the upper end of the top plate 1, a telescopic cylinder 3 is fixedly mounted at the inner top end of the mounting frame 2, a sliding plate 4 is fixedly connected to the telescopic end of the telescopic cylinder 3, a motor 6 is fixedly mounted at the lower end of the sliding plate 4, a middle rotating shaft 7 is fixedly connected to the output end of the motor 6, an upper pressing plate 9 is rotatably connected to the lower end of the middle rotating shaft 7, a plurality of tension springs 11 are fixedly connected to the lower end of the upper pressing plate 9, a lower pressing plate 10 is fixedly connected to the lower ends of the tension springs 11, the lower pressing plate 10 can be a rubber plate, the upper pressing plate 9 presses the wafer elastically through the tension springs 11, abrasion caused by rigid contact is avoided, an, the lower end of the top plate 1 is circumferentially and uniformly connected with a plurality of side rotating shafts 12 in a rotating mode by taking the middle rotating shaft 7 as a circle center, the lower end of each side rotating shaft 12 is fixedly connected with an outer gear 13 meshed with the inner gear 8, the lower end of each outer gear 13 is connected with a cutting rod 15 through a radius adjusting mechanism 14, and the lower end of the top plate 1 is provided with a supporting sucker 16.

The inner walls of the two sides of the mounting frame 2 are provided with sliding grooves 5 which are connected with the sliding plates 4 in a sliding mode, the sliding plates 4 are limited, and the sliding process is more stable.

The thickness of the internal gear 8 is larger than that of the external gear 13, and the internal gear 8 is always in a meshed state with the external gear 13 in the process of descending for a certain distance, so that dynamic meshing is realized.

The radius adjusting mechanism 14 includes a fixing box 141 with an opening at a lower side, inner walls of two sides of the fixing box 141 are rotatably connected with a screw 142, one end of the screw 142 penetrates through the fixing box 141 and is fixedly connected with a rotating plate 143, a moving block 144 is sleeved on the screw 142 in a threaded manner, the cutting rod 15 is fixed at a lower end of the moving block 144, and the rotating plate 143 and the screw 142 are rotated to drive the moving block 144 to linearly move.

The fixed box 141 is provided with scale marks starting from the axis of the external gear 13 on the lower end surface of the fixed box 141, and the cutting radius of the wafer is changed by adjusting the position of the cutting rod 15 relative to the fixed box 141.

The supporting suction cup 16 is connected with a vacuum device 17 through a pipeline, the vacuum device 17 is in the prior art, and air between the supporting suction cup 16 and the wafer can be pumped out through the pipeline to form negative pressure.

Use the utility model discloses the time, the wafer that will wait to cut is placed in supporting sucking disc 16 upper end, vacuum apparatus 17 will support the air between sucking disc 16 and the wafer through the pipeline and take out, thereby carry out the negative pressure to it and adsorb, telescopic cylinder 3 releases sliding plate 4 simultaneously and makes holding down plate 10 and wafer contact and tensioning spring 11 compress gradually, the in-process that moves down of internal gear 8 meshes with external gear 13 all the time, at above-mentioned in-process, motor 6 drives pivot 7 and the internal gear 8 rotation of being connected with it, internal gear 8 meshes external gear 13 and drives limit pivot 12 and rotates, cutting rod 15 just can use limit pivot 12 to cut the wafer as the centre of a circle, and can set up in the wafer below and connect the material part, the utility model discloses not draw.

It should be noted that, the worker can cut the wafers with different radii as required, specifically, the worker can rotate the rotating plate 143, move relative to the fixed box 141 under the rotation of the screw 142 under the limit of the fixed box 141 and the moving block 144, and can know the radius of the wafer to be cut by the cutting rod 15 by referring to the graduation lines, so that the practicability is high.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The semiconductor packaging wafer cutting system comprises an annular top plate (1) and is characterized in that a penetrating port is formed in the top plate (1), an inverted U-shaped mounting frame (2) is fixedly connected to the upper end of the top plate (1), a telescopic cylinder (3) is fixedly mounted at the top end of the mounting frame (2), a sliding plate (4) is fixedly connected to the telescopic end of the telescopic cylinder (3), a motor (6) is fixedly mounted at the lower end of the sliding plate (4), a middle rotating shaft (7) is fixedly connected to the output end of the motor (6), an upper pressing plate (9) is rotatably connected to the lower end of the middle rotating shaft (7), a plurality of tensioning springs (11) are fixedly connected to the lower end of the upper pressing plate (9), a lower pressing plate (10) is fixedly connected to the lower ends of the tensioning springs (11) jointly, and an internal gear (8) is fixedly sleeved on the middle, the lower extreme of roof (1) uses the middle rotating shaft (7) to be connected with a plurality of limit pivots (12) as centre of a circle circumference even rotation, the lower extreme fixedly connected with of limit pivot (12) and internal gear (8) meshed external gear (13), the lower extreme of external gear (13) is connected with cutting rod (15) through radius adjustment mechanism (14), the lower extreme of roof (1) is equipped with support sucking disc (16).

2. The system for dicing a semiconductor package wafer according to claim 1, wherein the mounting frame (2) has sliding grooves (5) formed on both inner walls thereof for slidably connecting with the sliding plate (4).

3. The semiconductor package wafer dicing system according to claim 1, wherein the thickness of the inner gear (8) is larger than that of the outer gear (13).

4. The system for cutting the semiconductor package wafer as claimed in claim 1, wherein the radius adjusting mechanism (14) comprises a fixed box (141) with an opening at a lower side, a screw rod (142) is rotatably connected to inner walls of two sides of the fixed box (141), one end of the screw rod (142) penetrates through the fixed box (141) and is fixedly connected with a rotating plate (143), a moving block (144) is sleeved on the screw rod (142) in a threaded manner, and the cutting rod (15) is fixed at a lower end of the moving block (144).

5. The system of claim 4, wherein the fixed box (141) is provided with a scale mark starting from the axis of the external gear (13) on the lower end surface of the fixed box (141).

6. The system of claim 1, wherein the support chuck (16) is connected to a vacuum device (17) through a pipe.