CN112606238A - Clamping equipment for wafer slicer processing - Google Patents
Clamping equipment for wafer slicer processing Download PDFInfo
- Publication number
- CN112606238A CN112606238A CN202011352761.5A CN202011352761A CN112606238A CN 112606238 A CN112606238 A CN 112606238A CN 202011352761 A CN202011352761 A CN 202011352761A CN 112606238 A CN112606238 A CN 112606238A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a clamping device for processing a wafer slicer, which structurally comprises a fixed base, a bottom clamping device, a supporting column, a rotating shaft and a top contact device, wherein the bottom clamping device is embedded and fixedly arranged at the middle end inside the upper end of the fixed base, the left end of the fixed base is welded with the lower end of the supporting column, a clamping piece is used for attaching and clamping the outer side surface of a wafer, a telescopic hose is driven to extend in the moving process of a clamping and clamping plate, so that an adsorption nozzle and the bottom surface of the wafer are kept in a vacuum state, the adsorption firmness of the bottom surface of the wafer is improved, vibration generated in the wafer slicing process can be adsorbed through a spring, a contact plate is rotated and descended through rotating an adjusting screw rod to contact the top end of the wafer, extrusion buffering is performed through a pressure spring, elastic buffering is performed through a rubber plate at the same time, the top of the wafer is, therefore, the vibration generated in the wafer slicing process can be absorbed, and the wafer slicing is prevented from generating position displacement.
Description
Technical Field
The invention relates to the field of wafer slicers for chips, in particular to a clamping device for wafer slicer processing.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material of the wafer is silicon, the wafer is sliced on a slicing machine to form a thin wafer, the wafer needs to be clamped in the slicing process, the wafer is fixedly sliced, but the wafer is in a cylindrical structure before being sliced, the clamping device only clamps the outer side surface of one end of the wafer, the wafer is subjected to certain friction force when a cutter is used for slicing the wafer, vibration is generated, the wafer and the clamping device are prone to shaking, the outer side surface of the wafer is prone to being abraded to a certain extent, meanwhile, the other end of the wafer is far away from the clamping device, the vibration generated by the wafer in the slicing process is conducted to the end far away from the clamping device, and accordingly the wafer is prone to generating excessive shaking, and the slicing position of the wafer is prone to being displaced.
Disclosure of Invention
The technical scheme adopted by the invention for realizing the technical purpose is as follows: the clamping equipment for processing the wafer slicer structurally comprises a fixed base, a bottom clamping device, a supporting column, a rotating shaft and a top contact device, wherein the bottom clamping device is fixedly embedded at the middle end inside the upper end of the fixed base, the left end of the fixed base is welded with the lower end of the supporting column, the upper end of the supporting column is hinged with the left end of the top contact device through the rotating shaft, the right end of the top contact device is positioned right above the bottom clamping device, the bottom clamping device comprises a limiting ring plate, a clamping piece, a push rod, a spring rod and a bottom adsorption device, the lower end of the limiting ring plate is fixedly embedded and installed inside the upper end of the fixed base, the clamping piece is arranged inside the limiting ring plate, the push rod is welded at the outer side end of the clamping piece and penetrates through the limiting ring plate in a clearance fit manner, the spring rod is arranged inside the outer side end of the push rod, the outer side end of the spring, and bottom adsorption equipment is located the spacing crown plate inboard, clamping piece, push rod and spring beam all are equipped with four, are ring type equidistance and distribute on the spacing crown plate, bottom adsorption equipment upper end surface is in same water flat line with terminal surface under the spacing crown plate.
As a further improvement of the invention, the bottom adsorption device comprises a bottom plate, a buckle clamp plate, a top spring, a flexible hose and a suction port device, wherein the bottom plate is fixedly embedded at the bottom of the inner side of the fixed base and is positioned at the inner side of the limit ring plate, the lower end of the buckle clamp plate is arranged inside the upper end of the bottom plate in a clearance fit manner, the outer side end of the buckle clamp plate is fixed with the top spring, the bottom of the buckle clamp plate is fixed with the outer side end of the flexible hose, the inner side end of the flexible hose is fixedly embedded at the outer side end of the suction port device and is communicated with the outer side end of the suction port device, the suction port device is fixedly embedded inside the upper end of the bottom plate, the buckle clamp plate, the top spring and the flexible hose are all provided with four parts, are distributed on the bottom plate in a circular ring shape at equal intervals, has certain resilience.
As a further improvement of the invention, the suction port device comprises a fixed seat, an exhaust pipe, an air guide pipe, three adsorption nozzles and a spring, wherein the fixed seat is fixedly embedded inside the upper end of the bottom plate, the exhaust pipe penetrates through the fixed seat, the outer side end of the exhaust pipe is communicated with the inner side end of the telescopic hose, the exhaust pipe is fixedly embedded on the outer side surface of the air guide pipe and communicated with the outer side end of the air guide pipe, the upper end of the air guide pipe is communicated with the lower end of the adsorption nozzles, the adsorption nozzles are fixedly embedded inside the upper end of the fixed seat, the springs are installed inside the adsorption nozzles, the air guide pipes are of a circular structure and are provided with three adsorption nozzles, the upper ends.
As a further improvement of the invention, the top contact device comprises a connecting transverse plate, an adjusting screw rod and a contact plate, wherein one end of the connecting transverse plate is hinged with the upper end of the supporting column through a rotating shaft, the inside of the other end of the connecting transverse plate is in threaded connection with the adjusting screw rod, the lower end of the adjusting screw rod is fixed with the upper end of the top of the contact plate, the contact plate is positioned right above the bottom clamping device, and the contact plate and the adjusting screw rod are installed at a vertical angle.
As a further improvement of the invention, the collision plate comprises a lifting frame, a pressure spring and a buffer mechanism, the upper end of the lifting frame is fixed with the lower end of the adjusting screw, the pressure spring is arranged at the lower end in the lifting frame, the lower end of the pressure spring is fixed with the upper end of the buffer mechanism, and the five pressure springs are transversely and equidistantly distributed between the inner part of the lower end of the lifting frame and the upper end of the buffer mechanism.
As a further improvement of the invention, the buffer mechanism comprises a connecting plate, a rubber plate and a rubber pipe sleeve, wherein the upper end of the connecting plate is fixed with the lower end of the pressure spring, the rubber plate is arranged at the bottom of the connecting plate, the rubber pipe sleeve is arranged in the rubber plate, the lower end of the rubber plate is of an arc surface structure, the top end of the arc surface and the circle center of the top of the wafer are positioned on the same vertical line, and seven rubber pipe sleeves are arranged and distributed in the rubber plate in an arc shape.
The invention has the beneficial effects that:
1. contradict through wafer outside surface to the clamping piece inside surface, the clamping piece is laminated to wafer outside surface and is pressed from both sides tightly, and the in-process that the buckle clamping plate removed has driven the expansion hose and has extended, takes out the inside atmospheric pressure of blast pipe, and the bottom surface of absorption mouth and wafer keeps vacuum state, improves the absorption fastness of wafer bottom surface, can adsorb the vibrations that the wafer section in-process produced through the spring, prevents that the outside surface of wafer from receiving wearing and tearing.
2. Make conflict board rotate through rotating adjusting screw and descend, contradict the wafer top, extrude the buffering through the pressure spring, carry out elastic buffer through the rubber slab simultaneously, avoid causing the crushing to the wafer top, conflict the top of wafer through the rubber pipe box after that to can adsorb the vibrations that the wafer section in-process produced, avoid the wafer section to produce the position displacement.
Drawings
FIG. 1 is a schematic structural diagram of a clamping apparatus for wafer slicer processing according to the present invention.
Fig. 2 is a schematic top view of an internal structure of a bottom clamping device according to the present invention.
FIG. 3 is an enlarged view of the interior and a portion of a bottom adsorption device according to the present invention.
FIG. 4 is a schematic top view of the internal structure of a mouthpiece apparatus of the present invention.
Fig. 5 is a schematic view of an internal structure of a top contact device according to the present invention.
Fig. 6 is a schematic view of an internal structure of an interference plate according to the present invention.
Fig. 7 is a schematic view of an internal structure of a buffer mechanism according to the present invention.
In the figure: the device comprises a fixed base-1, a bottom clamp device-2, a support column-3, a rotating shaft-4, a top contact device-5, a limit ring plate-21, a clamping piece-22, a push rod-23, a spring rod-24, a bottom adsorption device-25, a bottom plate-25 a, a buckle clamping plate-25 b, a top spring-25 c, a telescopic hose-25 d, a suction port device-25 e, a fixed seat-e 1, an exhaust pipe-e 2, an air guide pipe-e 3, an adsorption nozzle-e 4, a spring-e 5, a connecting transverse plate-51, an adjusting screw rod-52, a touch plate-53, a lifting frame-531, a pressure spring-532, a buffer mechanism-533, a connecting plate-33 a, a rubber plate-33 b and a rubber pipe sleeve-33 c.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 4:
the invention relates to a clamping device for processing a wafer slicer, which structurally comprises a fixed base 1, a bottom clamping device 2, a supporting column 3, a rotating shaft 4 and a top contact device 5, wherein the bottom clamping device 2 is fixedly installed at the middle end inside the upper end of the fixed base 1 in an embedded manner, the left end of the fixed base 1 is welded with the lower end of the supporting column 3, the upper end of the supporting column 3 is hinged with the left end of the top contact device 5 through the rotating shaft 4, the right end of the top contact device 5 is positioned right above the bottom clamping device 2, the bottom clamping device 2 comprises a limiting ring plate 21, clamping pieces 22, push rods 23, spring rods 24 and a bottom adsorption device 25, the lower end of the limiting ring plate 21 is fixedly installed inside the upper end of the fixed base 1 in an embedded manner, the clamping pieces 22 are arranged inside the limiting ring plate 21, the push rods 23 are welded at the outer side ends of the clamping pieces 22, the push rods 23 penetrate through the limiting ring plate 21, the end welds inside unable adjustment base 1 in 24 outside of spring beam, bottom adsorption equipment 25 inlays to be fixed and installs in the inboard bottom of unable adjustment base 1 to bottom adsorption equipment 25 is located spacing crown plate 21 inboardly, clamping piece 22, push rod 23 and spring beam 24 all are equipped with four, are ring type equidistance and distribute on spacing crown plate 21, do benefit to four positions to wafer outside surface and carry out synchronous screens fixed, and it is fixed to improve to carry out the screens to the wafer of different diameters, bottom adsorption equipment 25 upper end surface is in same water flat line with spacing crown plate 21 lower terminal surface, ensures that the bottom of wafer carries out the horizontally and places.
Wherein, the bottom adsorption device 25 comprises a bottom plate 25a, a buckle clamp plate 25b, a top spring 25c, a flexible hose 25d and a suction port device 25e, the bottom plate 25a is embedded and installed at the bottom of the inner side of the fixed base 1, the bottom plate 25a is positioned at the inner side of the limit ring plate 21, the lower end of the buckle clamp plate 25b is installed inside the upper end of the bottom plate 25a in a clearance fit manner, the outer side end of the buckle clamp plate 25b is fixed with the top spring 25c, the bottom of the buckle clamp plate 25b is fixed with the outer side end of the flexible hose 25d, the inner side end of the flexible hose 25d is embedded and installed at the outer side end of the suction port device 25e and is communicated with the suction port device 25e, the suction port device 25e is embedded and installed inside the upper end of the bottom plate 25a, four buckle clamp plates 25b, four top springs 25c and flexible hoses 25d are, the vertical end of buckle splint 25b is the arc structure, does benefit to the bottom and the side end to the wafer and carries out lock in step, improves the fastness between bottom and the side, reduces rocking that the wafer section in-process produced, bellows 25d is fold type structure to adopt the rubber material, have certain resilience, do benefit to buckle splint 25b and carry out the in-process of displacement, stretch and compress bellows 25d, thereby change the inside atmospheric pressure of bellows 25 d.
Wherein, the suction port device 25e comprises a fixed seat e1, an exhaust pipe e2, an air duct e3, an adsorption nozzle e4 and a spring e5, the fixed seat e1 is fixedly installed inside the upper end of the bottom plate 25a, the exhaust pipe e2 penetrates inside a fixed seat e1, the outer end of the exhaust pipe e2 is communicated with the inner end of the telescopic hose 25d, the exhaust pipe e2 is fixedly installed on the outer side surface of the air duct e3 and is communicated with the outer end of the air duct e3, the upper end of the air duct e3 is communicated with the lower end of the adsorption nozzle e4, the adsorption nozzle e4 is fixedly installed inside the upper end of the fixed seat e1, the adsorption nozzle e4 is internally provided with the spring e5, the air duct e3 is in a circular ring structure and is provided with three adsorption nozzles e4, the upper end of the adsorption nozzle e4 is provided with a structure with a wide upper end and a narrow lower end, which is beneficial to adsorb air inside the adsorption nozzle e4 to enter the, the absorption firmness between the bottom of the wafer and the fixed seat e1 is improved, and the abrasion of the outer surface of the wafer is reduced.
The specific use mode and function of the embodiment are as follows:
in the invention, the bottom of the wafer is extended into the limiting ring plate 21, the inner side surface of the clamping piece 22 is abutted by the outer side surface of the wafer, so that the push rod 23 moves, the outer top of the elastic force of the spring rod 24 is pressed, so that the clamping piece 22 is attached and clamped to the outer side surface of the wafer for preliminary fixing, then the outer top of the top spring 25c is pressed, the clamping clamp plate 25b is synchronously buckled to the bottom and the side end of the wafer, the firmness between the bottom and the side is improved, the shaking generated in the wafer slicing process is reduced, the telescopic hose 25d is driven to extend in the moving process of the clamping clamp plate 25b, so that the air pressure in the telescopic hose 25d is changed, the air pressure in the exhaust pipe e2 is extracted, the air pressure in the air guide pipe e3 is changed, the vacuum state of the adsorption nozzle e4 and the bottom surface of the wafer is kept in a vacuum state, and, meanwhile, the bottom surface of the wafer is abutted against the spring e5 in the adsorption nozzle e4, vibration generated in the wafer slicing process can be adsorbed through the spring e5, shaking generated by the wafer is weakened, and the outer side surface of the wafer is prevented from being abraded.
Example 2:
as shown in fig. 5 to 7:
wherein, the top touches device 5 including connecting diaphragm 51, adjusting screw 52, conflict board 53, it is articulated mutually with support column 3 upper end to connect diaphragm 51 one end through axis of rotation 4 to connect diaphragm 51 other end inside and adjusting screw 52 threaded connection, adjusting screw 52 lower extreme is fixed mutually with conflict board 53 top middle-end, it is directly over pressing from both sides device 2 at the bottom to touch board 53 is located, touch board 53 is the vertical angle installation with adjusting screw 52, ensures that adjusting screw 52 can drive touch board 53 and rotate vertical decline.
Wherein, the touch panel 53 includes lifting frame 531, pressure spring 532, buffer gear 533, lifting frame 531 upper end is fixed mutually with adjusting screw 52 lower extreme, pressure spring 532 is installed in the inside lower extreme of lifting frame 531 to pressure spring 532 lower extreme is fixed mutually with buffer gear 533 upper end, pressure spring 532 is equipped with five altogether, and be horizontal equidistance and distribute between lifting frame 531 lower extreme inside and buffer gear 533 upper end, improve buffer gear 533 and wholly carry out steady lift buffering, ensure that buffer gear 533 wholly conflicts the top of wafer to stabilize the top of wafer.
Wherein, buffer gear 533 includes connecting plate 33a, rubber slab 33b, rubber tube sleeve 33c, connecting plate 33a upper end is fixed mutually with pressure spring 532 lower extreme to rubber slab 33b establishes in connecting plate 33a bottom, rubber slab 33b internally mounted has rubber tube sleeve 33c, rubber slab 33b lower extreme is arc surface structure to the cambered surface top is in same vertical line with wafer top centre of a circle, does benefit to and contradicts the centre of a circle of wafer, improves the fastness of wafer installation, rubber tube sleeve 33c is equipped with seven altogether to it is inside rubber slab 33b to be arc distribution, ensures to adsorb the vibrations that produce the wafer top, thereby reduces rocking of wafer self.
The specific use mode and function of the embodiment are as follows:
according to the invention, after the bottom clamping of the wafer is finished, the connecting transverse plate 51 is rotated to the position above the top of the wafer through the rotation of the rotating shaft 4, then the contact plate 53 is rotated and descended through rotating the adjusting screw 52 to collide the top end of the wafer, in the process of collision, the compression spring 532 is used for extrusion buffering to prevent the contact plate 53 from descending too much, meanwhile, the rubber plate 33b is used for elastic buffering to avoid crushing the top of the wafer, and then the rubber pipe sleeve 33c is used for collision to the top of the wafer, so that the vibration generated in the wafer slicing process can be absorbed, the phenomenon that the whole wafer is shaken too much is prevented, and the wafer slicing is prevented from generating position displacement.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (6)
1. The utility model provides a wafer slicer is centre gripping equipment for processing, its structure includes unable adjustment base (1), end clamp device (2), support column (3), axis of rotation (4), top and touches device (5), end clamp device (2) are embedded to be installed in unable adjustment base (1) upper end inside middle-end, unable adjustment base (1) left end welds mutually with support column (3) lower extreme, support column (3) upper end is articulated mutually with top and is touched device (5) left end through axis of rotation (4), it touches device (5) right-hand member and is located end clamp device (2) directly over to push up, its characterized in that:
end clamp device (2) include spacing crown plate (21), clamping piece (22), push rod (23), spring beam (24), bottom adsorption equipment (25), spacing crown plate (21) lower extreme is embedded solid and is installed inside unable adjustment base (1) upper end to spacing crown plate (21) inside is equipped with clamping piece (22), clamping piece (22) outside end welding has push rod (23), push rod (23) adopt clearance fit to run through inside spacing crown plate (21) to push rod (23) outside end is inside to be equipped with spring beam (24), spring beam (24) outside end welds inside unable adjustment base (1), bottom adsorption equipment (25) are embedded solid and are installed in unable adjustment base (1) inboard bottom to bottom adsorption equipment (25) are located spacing crown plate (21) inboard.
2. The wafer slicer processing clamping apparatus as defined in claim 1, wherein: bottom adsorption equipment (25) includes bottom plate (25a), buckle splint (25b), top spring (25c), flexible hose (25d), suction inlet device (25e), bottom plate (25a) is embedded and is installed in unable adjustment base (1) inboard bottom to bottom plate (25a) are located spacing crown plate (21) inboard, buckle splint (25b) lower extreme adopts clearance fit to install inside bottom plate (25a) upper end, buckle splint (25b) outside end is fixed mutually with top spring (25c), buckle splint (25b) bottom is fixed with flexible hose (25d) outside end, flexible hose (25d) inboard end is embedded and is installed in suction inlet device (25e) outside end and link up mutually, suction inlet device (25e) is embedded and is installed inside bottom plate (25a) upper end.
3. The wafer slicer processing clamping apparatus of claim 2, wherein: suction inlet device (25e) includes fixing base (e1), blast pipe (e2), air duct (e3), absorption nozzle (e4), spring (e5), fixing base (e1) is embedded and fixed inside bottom plate (25a) upper end to blast pipe (e2) runs through inside fixing base (e1), blast pipe (e2) outside end and flexible hose (25d) medial extremity link up mutually, blast pipe (e2) is embedded and fixed and is installed in air duct (e3) outside surface and link up mutually, air duct (e3) upper end and absorption nozzle (e4) lower extreme link up mutually to absorption nozzle (e4) is embedded and fixed inside fixing base (e1) upper end, absorption nozzle (e4) internally mounted has spring (e 5).
4. The wafer slicer processing clamping apparatus as defined in claim 1, wherein: the top touch device (5) comprises a connecting transverse plate (51), an adjusting screw rod (52) and a touch plate (53), one end of the connecting transverse plate (51) is hinged to the upper end of the supporting column (3) through a rotating shaft (4), the other end of the connecting transverse plate (51) is connected with the adjusting screw rod (52) in a threaded manner, the lower end of the adjusting screw rod (52) is fixed to the middle end of the top of the touch plate (53), and the touch plate (53) is located right above the bottom clamping device (2).
5. The wafer slicer processing clamping apparatus of claim 4, wherein: the touch panel (53) comprises a lifting frame (531), a pressure spring (532) and a buffer mechanism (533), wherein the upper end of the lifting frame (531) is fixed to the lower end of the adjusting screw rod (52), the pressure spring (532) is installed at the lower end of the inner portion of the lifting frame (531), and the lower end of the pressure spring (532) is fixed to the upper end of the buffer mechanism (533).
6. The wafer slicer processing clamping apparatus of claim 5, wherein: buffer gear (533) include connecting plate (33a), rubber slab (33b), rubber pipe box (33c), connecting plate (33a) upper end is fixed mutually with pressure spring (532) lower extreme to rubber slab (33b) are established in connecting plate (33a) bottom, rubber slab (33b) internally mounted has rubber pipe box (33 c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011352761.5A CN112606238A (en) | 2020-11-27 | 2020-11-27 | Clamping equipment for wafer slicer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011352761.5A CN112606238A (en) | 2020-11-27 | 2020-11-27 | Clamping equipment for wafer slicer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112606238A true CN112606238A (en) | 2021-04-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011352761.5A Withdrawn CN112606238A (en) | 2020-11-27 | 2020-11-27 | Clamping equipment for wafer slicer processing |
Country Status (1)
| Country | Link |
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| CN (1) | CN112606238A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790938A (en) * | 2021-08-25 | 2021-12-14 | 山东省地质矿产勘查开发局第一地质大队（山东省第一地质矿产勘查院） | Variable-caliber rock core splitting machine |
| CN115194963A (en) * | 2022-08-16 | 2022-10-18 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing production device |
| CN115415932A (en) * | 2022-09-29 | 2022-12-02 | 合肥玖福半导体技术有限公司 | Positioning device for semiconductor wafer processing |
| CN116592590A (en) * | 2023-07-17 | 2023-08-15 | 沈阳芯达科技有限公司 | Glycerol hot plate device based on wafer lifting control mechanism |
-
2020
- 2020-11-27 CN CN202011352761.5A patent/CN112606238A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790938A (en) * | 2021-08-25 | 2021-12-14 | 山东省地质矿产勘查开发局第一地质大队（山东省第一地质矿产勘查院） | Variable-caliber rock core splitting machine |
| CN113790938B (en) * | 2021-08-25 | 2024-04-19 | 山东省地质矿产勘查开发局第一地质大队（山东省第一地质矿产勘查院） | Core splitting machine with variable caliber |
| CN115194963A (en) * | 2022-08-16 | 2022-10-18 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing production device |
| CN115194963B (en) * | 2022-08-16 | 2023-04-28 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor wafer manufacturing apparatus |
| CN115415932A (en) * | 2022-09-29 | 2022-12-02 | 合肥玖福半导体技术有限公司 | Positioning device for semiconductor wafer processing |
| CN116592590A (en) * | 2023-07-17 | 2023-08-15 | 沈阳芯达科技有限公司 | Glycerol hot plate device based on wafer lifting control mechanism |
| CN116592590B (en) * | 2023-07-17 | 2023-09-08 | 沈阳芯达科技有限公司 | Glycerol hot plate device based on wafer lifting control mechanism |
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Application publication date: 20210406 |