CN221136461U

CN221136461U - Slicing device for optical wafer production

Info

Publication number: CN221136461U
Application number: CN202322160508.5U
Authority: CN
Inventors: 朱鹏英
Original assignee: Suzhou Jinchao Biotechnology Co ltd
Current assignee: Suzhou Jinchao Biotechnology Co ltd
Priority date: 2023-08-11
Filing date: 2023-08-11
Publication date: 2024-06-14
Anticipated expiration: 2033-08-11

Abstract

The utility model relates to the technical field of wafer production, in particular to a slicing device for optical wafer production, which comprises a slicing table and a frame body, wherein a table top frame is fixedly arranged at the top end of the slicing table, an air box is arranged on the front surface of the table top frame, a fan is fixedly arranged on one side of the frame body, an air pipe is fixedly connected to the output end of the fan, one end, far away from the fan, of the air pipe is fixedly communicated and arranged on the air box, air holes are uniformly formed in the back surface of the air box, a baffle shell is fixedly arranged on the back surface of the frame body, and an inclined plate is fixedly connected to the baffle shell. The utility model is provided with the air pipe, the air box, the baffle shell, the inclined plate and the collecting box, the fan works, the air is blown to the table top frame through the air pipe, the air box and the air hole, the broken powder generated by cutting is blown to the baffle shell, the baffle shell blocks the broken powder, the broken powder falls onto the inclined plate, the inclined plate slides to the collecting box, and the collecting box is used for collecting and treating the broken powder generated by cutting in a concentrated manner so as to treat the broken powder on the slicing table in time, so that the cutting environment is not influenced.

Description

Slicing device for optical wafer production

Technical Field

The utility model relates to the technical field of wafer production, in particular to a slicing device for optical wafer production.

Background

The wafer is one of the most main raw materials of the LED, is a light-emitting component of the LED, and the quality of the wafer directly determines the performance of the LED. The wafer is composed of III and V compound semiconductor materials.

The utility model provides an authorized publication number is CN208133344U, it records optics wafer slicing device that optics wafer slicing device has disclosed, including workstation and frame, the frame is located directly over the workstation, be equipped with on the terminal surface under the frame and feed the pneumatic cylinder, it is connected with the blade to feed the rotation of pneumatic cylinder output shaft tip, the motor is still installed to pneumatic cylinder output shaft tip, motor output shaft and the coaxial fixed connection of blade, the workstation up end is equipped with positioning mechanism, positioning mechanism includes the limiting plate that is parallel to each other in the workstation up end, be equipped with vacuum adsorption mechanism between the limiting plate.

In the prior art, although the slicing device for the optical wafer can realize slicing of the wafer through the arranged blade, when the slicing device is used, as the structure of processing powder is not arranged in the prior device, the powder generated by cutting cannot be processed and collected in time, and the cutting environment is affected, therefore, the slicing device for producing the optical wafer needs to be designed to solve the problems.

Disclosure of utility model

The utility model aims to provide a slicing device for optical wafer production, which solves the problems that the slicing device for optical wafer in the prior art can realize slicing of wafers through a blade, but when the slicing device is used, the powder generated by cutting cannot be processed and collected in time due to the structure of not arranging processed powder in the prior device, and the cutting environment is affected.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a dicing apparatus for optical wafer production, comprising: the slicing machine comprises a slicing table and a frame body, wherein a table top frame is fixedly arranged at the top end of the slicing table;

a fan is fixedly arranged on one side of the frame body, an air pipe is fixedly connected with the output end of the fan, one end of the air pipe, which is far away from the fan, is fixedly communicated with an air box, air holes are uniformly formed in the back surface of the air box, the back fixed mounting of support body has the fender shell, the rigid coupling has the swash plate on the fender shell, the inside of section platform is provided with the collecting box, the both sides on mesa frame upper portion all are provided with fixed establishment.

Preferably, the bottom of the frame body is provided with a mounting frame, a motor is fixedly arranged on the mounting frame, and the output end of the motor is fixedly connected with a cutter.

Preferably, the bottom fixed mounting of support body has the cylinder, the top rigid coupling of mounting bracket is on the cylinder output.

Preferably, the two sides of the top end of the table top frame are fixedly provided with heightening plates.

Preferably, a connecting frame is fixedly welded at the bottom end of the bellows, and the connecting frame is fixedly welded on the front surface of the table top frame.

Preferably, the fixing mechanism comprises an electric telescopic rod, the electric telescopic rod is fixedly arranged on the frame body, and a pressing piece is fixedly connected to the output end of the electric telescopic rod.

Preferably, a rubber pad is fixedly adhered to the bottom end of the pressing piece.

Compared with the prior art, the utility model has the beneficial effects that:

1. Through being provided with tuber pipe, bellows, fender shell, swash plate and collecting box, the fan work is bloied on to the mesa frame through tuber pipe, bellows and gas pocket, blows the garrulous end that produces the cutting to keeping off the shell, keeps off the shell and blocks garrulous end, and garrulous end falls to the swash plate on, slides to the collecting box through the swash plate, and collecting box carries out concentrated collection to garrulous end that the cutting produced to in time handle garrulous end on the section platform, in order to avoid influencing the cutting environment.

2. Through being provided with electric telescopic handle, casting die and rubber pad, place the mesa frame upper portion with the work piece, through electric telescopic handle control casting die downward movement for the casting die presses the both sides limit of work piece, realizes fixing in location to the work piece, and when the casting die pressed the work piece, by the rubber pad and the work piece direct contact of setting.

Drawings

FIG. 1 is a schematic elevational view of the structure of the present utility model;

FIG. 2 is a schematic side cross-sectional view of the structure of the present utility model;

FIG. 3 is a schematic side cross-sectional view of a bellows structure of the present utility model;

fig. 4 is an enlarged schematic view of a portion of the structure of fig. 1 a according to the present utility model.

In the figure: 110. a slicing table; 111. a frame body; 112. a table top frame; 113. a wind box; 114. a blower; 115. an air duct; 116. air holes; 117. a blocking shell; 118. a sloping plate; 119. a collection box; 120. a connecting frame; 121. a mounting frame; 122. a motor; 123. a cutter; 124. a cylinder; 125. a height-increasing plate; 200. a fixing mechanism; 210. an electric telescopic rod; 211. a pressing piece; 212. and a rubber pad.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1-3, an embodiment of the present utility model is provided: a dicing apparatus for optical wafer production, comprising: the slicing table 110 and the frame 111, the top end of the slicing table 110 is fixedly provided with a table top frame 112, and the front surface of the table top frame 112 is provided with an air box 113;

the device comprises a frame body 111, a fan 114 is fixedly arranged on one side of the frame body 111, an air pipe 115 is fixedly connected to the output end of the fan 114, one end, far away from the fan 114, of the air pipe 115 is fixedly connected to an air box 113, air holes 116 are uniformly formed in the back surface of the air box 113, a baffle shell 117 is fixedly arranged on the back surface of the frame body 111, an inclined plate 118 is fixedly connected to the baffle shell 117, a collecting box 119 is arranged in the slicing table 110, fixing mechanisms 200 are arranged on two sides of the upper portion of the table frame 112, when the device is used, a workpiece is placed on the table frame 112, after the workpiece is fixed through the fixing mechanisms 200, slicing is carried out, and when the workpiece is cut, the fan 114 works, air is blown to the table frame 112 through the air pipe 115, the air box 113 and the air holes 116, the crushed dust generated by cutting is blown to the baffle shell 117, the crushed dust is prevented from falling onto the inclined plate 118, the crushed dust generated by cutting is intensively collected by the inclined plate 118, and the crushed dust generated by cutting is processed by the collecting box 119 so as to timely treat the crushed dust on the slicing table 110, so that the cutting environment is not affected.

Further, a connecting frame 120 is fixedly welded at the bottom end of the bellows 113, the connecting frame 120 is fixedly welded on the front surface of the table top frame 112, and the connecting frame 120 is used for supporting and fixing the bellows 113, so that the bellows 113 is stably positioned on the front surface of the table top frame 112, and the device can be conveniently used.

Example two

Compared with the first embodiment, referring to fig. 1, the bottom of the frame 111 is provided with a mounting frame 121, a motor 122 is fixedly mounted on the mounting frame 121, a cutter 123 is fixedly connected to an output end of the motor 122, and after the workpiece is fixed, the cutter 123 is controlled to rotate by the motor 122, so that the rotating cutter 123 contacts the workpiece to cut the workpiece.

Further, the bottom end of the frame 111 is fixedly provided with an air cylinder 124, the top end of the mounting frame 121 is fixedly connected to the output end of the air cylinder 124, and the air cylinder 124 is used for controlling the mounting frame 121 to move downwards, so that the rotating cutter 123 moves downwards to cut a workpiece.

Example III

Compared with the first embodiment, referring to fig. 1-4, the slicing device for optical wafer production provided by the utility model has the advantages that the two sides of the top end of the table frame 112 are fixedly provided with the raised plates 125, the workpiece is placed on the top of the raised plates 125 on the table frame 112 due to the raised plates 125, the raised plates 125 raise the workpiece, and then the pressing piece 211 presses and fixes the workpiece.

Further, the fixing mechanism 200 includes an electric telescopic rod 210, the electric telescopic rod 210 is fixedly installed on the frame 111, the output end of the electric telescopic rod 210 is fixedly connected with a pressing piece 211, when the workpiece is sliced, the workpiece is placed on the upper portion of the table top frame 112, the pressing piece 211 is controlled to move downwards through the electric telescopic rod 210, so that the pressing piece 211 presses two side edges of the workpiece, and positioning and fixing are achieved on the workpiece.

Further, a rubber pad 212 is adhesively fixed to the bottom end of the pressing member 211, and the pressing member 211 directly contacts the work by the rubber pad 212 provided when pressing the work.

Working principle: when the device is used, a workpiece is placed on the table top frame 112, after the workpiece is fixed by the fixing mechanism 200, slicing is carried out, when cutting is carried out, the fan 114 works, air is blown to the table top frame 112 through the air pipe 115, the air box 113 and the air hole 116, the fragments generated by cutting are blown to the baffle shell 117, the baffle shell 117 blocks the fragments, the fragments fall onto the inclined plate 118 and slide to the collecting box 119 through the inclined plate 118, and the collecting box 119 carries out centralized collecting treatment on the fragments generated by cutting so as to timely treat the fragments on the slicing table 110, so that the cutting environment is not influenced.

When slicing, the workpiece is placed on the upper part of the table top frame 112, the pressing part 211 is controlled to move downwards through the electric telescopic rod 210, so that the pressing part 211 presses two side edges of the workpiece, positioning and fixing are realized on the workpiece, after the workpiece is fixed, the cutter 123 is controlled to rotate through the motor 122, so that the rotating cutter 123 contacts the workpiece, the workpiece is cut, the air cylinder 124 is used for controlling the mounting frame 121 to move downwards, so that the rotating cutter 123 moves downwards, the workpiece is cut, when the pressing part 211 presses the workpiece, the rubber pad 212 is directly contacted with the workpiece, and the heightening plate 125 is arranged by the device, so that the workpiece is placed on the top of the heightening plate 125 on the table top frame 112, the heightening plate 125 heightens the workpiece, and then the pressing part 211 presses and fixes the workpiece, and the connecting frame 120 is used for supporting and fixing the bellows 113, so that the bellows 113 is stably positioned on the front surface of the table top frame 112, and the device is convenient to use.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A dicing apparatus for optical wafer production, comprising: the slicing machine comprises a slicing table (110) and a frame body (111), wherein a table top frame (112) is fixedly arranged at the top end of the slicing table (110), and is characterized in that an air box (113) is arranged on the front surface of the table top frame (112);

One side fixed mounting of support body (111) has fan (114), the output rigid coupling of fan (114) has tuber pipe (115), the one end fixed communication that fan (114) was kept away from to tuber pipe (115) is installed on bellows (113), gas pocket (116) have evenly been seted up at the back of bellows (113), the back fixed mounting of support body (111) has fender shell (117), the rigid coupling has swash plate (118) on fender shell (117), the inside of section platform (110) is provided with collection box (119), the both sides on mesa frame (112) upper portion all are provided with fixed establishment (200).

2. The dicing apparatus for optical wafer production according to claim 1, wherein: the bottom of support body (111) is provided with mounting bracket (121), fixed mounting has motor (122) on mounting bracket (121), the output rigid coupling of motor (122) has cutter (123).

3. The dicing apparatus for optical wafer production according to claim 2, wherein: the bottom end of the frame body (111) is fixedly provided with a cylinder (124), and the top end of the mounting frame (121) is fixedly connected to the output end of the cylinder (124).

4. The dicing apparatus for optical wafer production according to claim 1, wherein: the two sides of the top end of the table top frame (112) are fixedly provided with heightening plates (125).

5. The dicing apparatus for optical wafer production according to claim 1, wherein: the bottom end of the bellows (113) is fixedly welded with a connecting frame (120), and the connecting frame (120) is fixedly welded on the front surface of the table top frame (112).

6. The dicing apparatus for optical wafer production according to claim 4, wherein: the fixing mechanism (200) comprises an electric telescopic rod (210), the electric telescopic rod (210) is fixedly arranged on the frame body (111), and a pressing piece (211) is fixedly connected to the output end of the electric telescopic rod (210).

7. The dicing apparatus for optical wafer production according to claim 6, wherein: and a rubber pad (212) is fixedly adhered to the bottom end of the pressing piece (211).