CN116592590B - Glycerol hot plate device based on wafer lifting control mechanism - Google Patents
Glycerol hot plate device based on wafer lifting control mechanism Download PDFInfo
- Publication number
- CN116592590B CN116592590B CN202310868190.8A CN202310868190A CN116592590B CN 116592590 B CN116592590 B CN 116592590B CN 202310868190 A CN202310868190 A CN 202310868190A CN 116592590 B CN116592590 B CN 116592590B
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- Prior art keywords
- wafer
- base
- plate
- shell
- fixedly arranged
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 235000011187 glycerol Nutrition 0.000 claims abstract description 25
- 230000003139 buffering effect Effects 0.000 claims abstract description 15
- 238000001914 filtration Methods 0.000 claims abstract description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 13
- 239000001569 carbon dioxide Substances 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 11
- 230000003028 elevating effect Effects 0.000 claims 1
- 239000006260 foam Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 122
- 238000001035 drying Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
- F26B23/04—Heating arrangements using electric heating
- F26B23/06—Heating arrangements using electric heating resistance heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/005—Treatment of dryer exhaust gases
- F26B25/007—Dust filtering; Exhaust dust filters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/009—Alarm systems; Safety sytems, e.g. preventing fire and explosions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a glycerin hot plate device based on a wafer lifting control mechanism, which comprises a base and a shell, wherein a heating mechanism, an exhaust filtering mechanism and an explosion-proof mechanism are arranged on the surface of the shell. According to the application, the lifting cylinder drives the wafer support seat to adjust the height, meanwhile, the protection component used for buffering the wafer support seat is arranged on the surface of the base, the buffer rod is extruded by the wafer support seat in the descending process through the arrangement of the protection component, and the rotation of the buffer rod is converted into the deformation of the torsion spring, so that the purpose of buffering the wafer support seat is achieved, meanwhile, the locking component used for locking the wafer support seat is also arranged on the surface of the base, and the supporting plate can be fixed and limited through the locking component when the wafer support seat descends, so that the supporting plate can support the bottom of the wafer support seat, the occurrence of collision when foreign matters appear below the wafer support seat is prevented, and the wafer is prevented from being damaged.
Description
Technical Field
The application relates to the technical field of wafer processing, in particular to a glycerin hot plate device based on a wafer lifting control mechanism.
Background
The indium columns are pilled, so that the height of the indium bumps can be improved, on one hand, the interconnection reliability of the area array photosensitive chip and the circuit chip is improved, the problem that partial pixels cannot be interconnected due to uneven surfaces of devices is solved, on the other hand, the difference between the indium columns is effectively reduced, and the smooth development of a later flip chip bonding process is ensured;
the prior art provides a drying groove, a drying device and cleaning equipment (publication number: CN 218884491U), which comprises a groove body and a drying component, wherein the drying component is arranged above the peripheral side of the groove body, a workpiece and cleaning liquid are arranged in the groove body, and when the workpiece is lifted out of the cleaning liquid level, the drying component is used for drying the surface of the workpiece. The device can be directly used as the last cleaning, and simultaneously realizes the slow-lifting dewatering and drying function without independently arranging a drying groove. The groove body is matched with the infrared lamp tube and the wafer lifting mechanism, in the process that the wafer slowly lifts off the water surface of the cleaning tank, infrared rays passing through the infrared lamp tube are focused on the water surface of the wafer, and the surface tension of water at the water surface of the wafer is reduced. The wafer lifting mechanism can realize speed regulation lifting of the wafer;
however, the wafer lifting mechanism in the prior art has the following defects:
1. according to the technical scheme, the wafer is driven to lift through the lifting base, the screw rod, the motor and the workpiece bearing frame, but because the workpiece bearing frame is rigidly connected with the screw rod, when the wafer bearing seat descends, if foreign matters exist at the bottom and the wafer bearing seat collides, the wafer is offset or swayed due to vibration, so that one or more wafers are damaged, undamaged wafers are polluted by broken wafer fragments and chips, meanwhile, the screw rod precision is possibly reduced due to collision, so that the wafer cannot be accurately lifted and controlled, however, a mechanism for driving the wafer to lift by using the air cylinder also exists in the prior art, but the method lacks other limiting structures, and when the air cylinder is damaged, the situation that the wafer falls down due to the lack of other supporting structures occurs, so that the wafer is damaged;
2. aiming at the requirements of the gluing and pilling process of an infrared chip, a drying process is required to be carried out on a wafer coated with glycerol to ensure the requirements of metal indium balls coated after the wafer, as the ignition point of the glycerol is 290 ℃, the wafer is dried to generate higher problems, and a large amount of volatile matters are generated when the glycerol is heated, the scheme lacks a corresponding processing structure, so that the volatile matters are dissipated in the air, and the air environment in a workshop is damaged.
Disclosure of Invention
The application aims to provide a glycerin hot plate device based on a wafer lifting control mechanism, so as to solve the problems in the background art.
In order to achieve the above purpose, the present application provides the following technical solutions:
the glycerin hot plate device based on the wafer lifting control mechanism comprises a base and a shell, wherein a heating mechanism, an exhaust filtering mechanism and an explosion-proof mechanism are arranged on the surface of the shell, the wafer lifting mechanism is arranged on the surface of the base and comprises a lifting cylinder and a wafer supporting seat, the lifting cylinder is fixedly arranged on the surface of the base, the wafer supporting seat is fixedly arranged at the output end of the lifting cylinder, and a protection component used for buffering the wafer supporting seat and a locking component used for locking the wafer supporting seat are arranged on the surface of the base;
the protection subassembly includes base, connecting seat, torsional spring, pivot, buffer rod and supporting mechanism, the connecting seat passes through the fixed surface that sets up in the base of base, the fixed inner wall that sets up in the connecting seat of pivot, the through-hole has been seted up on the surface of buffer rod, and the buffer rod passes through the through-hole and rotate the surface that sets up in the pivot, the torsional spring is installed between through-hole and pivot, the buffer rod takes place to rotate after receiving the extrusion of wafer supporting seat, and then makes the buffer rod drives supporting mechanism, supports the wafer supporting seat.
Preferably, the locking assembly comprises a vertical plate, a support and an elastic assembly, wherein the vertical plate is fixedly arranged on the surface of the base, the support is fixedly arranged on the side surface of the wafer supporting seat, two groups of gears are rotatably arranged on the surface of the support through a support, a supporting plate is fixedly arranged between the gears through a connecting shaft, a latch meshed with the gears is arranged on the surface of the vertical plate, and the elastic assembly used for buffering the gears and the latches when being connected is arranged on the surface of the vertical plate.
Preferably, the supporting mechanism comprises a buffer plate, the surface of the base is provided with a movable plate through the rotation of the fixed seat, the buffer plate is hinged to one side, close to the fixed seat, of the movable plate, and a buffer sponge cushion is adhered to the surface of the buffer plate.
Preferably, the elastic component comprises a metal elastic sheet and a movable arm, the surface of the vertical plate is provided with a groove, the movable arm is rotationally arranged on the inner wall of the groove, the surface of the movable arm is integrally formed with an arc-shaped protruding part, the inner wall of the groove is integrally formed with a baffle, and the metal elastic sheet is fixedly arranged between the movable arm and the baffle.
Preferably, the two sets of risers are connected through the reinforcing plate, the both sides of backup pad all bond first magnetic stripe, the bottom of wafer supporting seat and the surface of reinforcing plate all bond second magnetic stripe, the polarity of first magnetic stripe and second magnetic stripe is opposite.
Preferably, the heating mechanism comprises a disc surface, the disc surface is fixedly arranged on the surface of the base through a supporting rod, a heating body is arranged at the bottom of the disc surface, and a temperature control module for controlling the temperature of the heating body is fixedly arranged on the surface of the shell.
Preferably, the exhaust filtering mechanism comprises a filter screen, a wind box is fixedly arranged on the surface of the shell, the filter screen is fixedly arranged in the wind box, an exhaust fan is arranged on the surface of the wind box, and a total heat exchanger is arranged in the shell.
Preferably, the explosion-proof mechanism is composed of a carbon dioxide nozzle and an infrared detection probe, the carbon dioxide nozzle is arranged at the top of the inner cavity of the shell, and the infrared detection probe is assembled at the top of the shell.
Compared with the prior art, the application has the beneficial effects that:
1. according to the application, the lifting cylinder drives the wafer support seat to adjust the height, meanwhile, the protection component used for buffering the wafer support seat is arranged on the surface of the base, the buffer rod is extruded by the wafer support seat in the descending process through the arrangement of the protection component, and the rotation of the buffer rod is converted into the deformation of the torsion spring, so that the purpose of buffering the wafer support seat is achieved, meanwhile, the locking component used for locking the wafer support seat is also arranged on the surface of the base, and the supporting plate can be fixed and limited through the locking component when the wafer support seat descends, so that the supporting plate can support the bottom of the wafer support seat, the occurrence of collision when foreign matters appear below the wafer support seat is prevented, and the wafer is prevented from being damaged;
2. according to the application, when the wafer supporting seat descends, the supporting plate can be driven to rotate between the two groups of supports through the cooperation of the gears and the clamping teeth, and when the gears are about to be separated from the surfaces of the clamping teeth, the supporting plate can be fixed through the cooperation of the first magnetic strips and the second magnetic strips, so that the supporting plate is vertically arranged on the surface of the base, the descending wafer supporting seat can be supported, and meanwhile, the wafer can be protected when the air cylinder is damaged by being matched with the protection component at the bottom of the wafer supporting seat, and the wafer is prevented from being damaged;
3. according to the application, the exhaust filtering mechanism is arranged on the surface of the shell, so that volatile matters generated by heating glycerin can be conveyed through the exhaust fan, the volatile matters are prevented from escaping, meanwhile, air in the external environment can be conveyed into the shell through the total heat exchanger to keep the internal air pressure balance, the explosion-proof assembly is also arranged on the surface of the shell, the fire extinguishing effect can be achieved through the carbon dioxide nozzle, meanwhile, the drying process of a wafer is monitored in real time through the infrared detection probe, and the safe use requirement of the technological process is ensured.
Drawings
FIG. 1 is a schematic diagram of the main structure of the present application;
FIG. 2 is a schematic diagram of the main structure of the base of the present application;
FIG. 3 is a schematic view of the internal structure of the housing of the present application;
FIG. 4 is a schematic view of the main structure of the push plate of the present application;
FIG. 5 is a schematic view of the bottom structure of the wafer support pedestal of the present application;
FIG. 6 is a schematic diagram of the main structure of the protection component of the present application;
FIG. 7 is a schematic view of an exploded view of the protective assembly of the present application;
FIG. 8 is a schematic diagram of the main structure of the locking assembly of the present application;
FIG. 9 is a schematic side view of the locking assembly of the present application;
FIG. 10 is a schematic diagram of the main structure of the elastic component of the present application;
FIG. 11 is a schematic cross-sectional view of the locking assembly of the present application.
In the figure: 1. a base; 2. a housing; 3. a lifting cylinder; 4. a wafer support; 5. a base; 6. a connecting seat; 7. a torsion spring; 8. a rotating shaft; 9. a buffer rod; 10. a through hole; 11. a riser; 12. a bracket; 13. a support; 14. a gear; 15. a support plate; 16. latch teeth; 17. a buffer plate; 18. a fixing seat; 19. a movable plate; 20. buffering the sponge cushion; 21. a metal spring plate; 22. a movable arm; 23. a groove; 24. an arc-shaped protruding portion; 25. a baffle; 26. a reinforcing plate; 27. a first magnetic stripe; 28. a second magnetic stripe; 29. a disk surface; 30. a support rod; 31. a heating body; 32. a temperature control module; 33. a filter screen; 34. a wind box; 35. an exhaust fan; 36. a total heat exchanger; 37. a carbon dioxide nozzle; 38. an infrared detection probe.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-11, the present application provides a technical solution:
embodiment one: the glycerin hot plate device based on the wafer lifting control mechanism comprises a base 1 and a shell 2, wherein a heating mechanism, an exhaust filtering mechanism and an explosion-proof mechanism are arranged on the surface of the shell 2, and the wafer lifting mechanism is arranged on the surface of the base 1;
the wafer lifting mechanism comprises a lifting cylinder 3 and a wafer supporting seat 4, wherein the lifting cylinder 3 is fixedly arranged on the surface of the base 1, the wafer supporting seat 4 is fixedly arranged at the output end of the lifting cylinder 3, and the surface of the base 1 is provided with a protection component for buffering the wafer supporting seat 4 and a locking component for locking the wafer supporting seat 4;
the protection component comprises a base 5, a connecting seat 6, a torsion spring 7, a rotating shaft 8 and a buffer rod 9, wherein the connecting seat 6 is fixedly arranged on the surface of the base 1 through the base 5, the rotating shaft 8 is fixedly arranged on the inner wall of the connecting seat 6, a through hole 10 is formed in the surface of the buffer rod 9, the buffer rod 9 is rotatably arranged on the surface of the rotating shaft 8 through the through hole 10, and the torsion spring 7 is arranged between the through hole 10 and the rotating shaft 8;
in this embodiment, the wafer with the surface coated with the glycerol can be placed on the surface of the wafer supporting seat 4, then the wafer on the surface of the wafer supporting seat 4 is driven by the lifting cylinder 3 to approach to the heating mechanism so as to dry the wafer, after the drying is finished, the lifting cylinder 3 drives the wafer supporting seat 4 to reset, at this time, the wafer supporting seat 4 is firstly contacted with the buffer rod 9 and presses the buffer rod 9, so that the buffer rod 9 rotates on the surface of the rotating shaft 8, at the same time, the buffer rod 9 and the rotating shaft 8 deform the torsion spring 7, so that the descending process of the wafer supporting seat 4 is buffered by the elasticity of the torsion spring 7, and when the wafer supporting seat 4 ascends again, the buffer rod 9 is reset under the elasticity of the torsion spring 7, so that the buffer rod 9 is always contacted with the wafer supporting seat 4, and the buffer rod 9 is always in an inclined state so as to facilitate the subsequent rotation of the buffer rod 9;
the locking assembly comprises a vertical plate 11, a bracket 12 and an elastic assembly, wherein the vertical plate 11 is fixedly arranged on the surface of the base 1, the bracket 12 is fixedly arranged on the side surface of the wafer supporting seat 4, two groups of gears 14 are rotatably arranged on the surface of the bracket 12 through a support 13, a supporting plate 15 is fixedly arranged between the two groups of gears 14 through a connecting shaft, clamping teeth 16 meshed with the gears 14 are arranged on the surface of the vertical plate 11, and the elastic assembly for buffering the gears 14 and the clamping teeth 16 when being connected is arranged on the surface of the vertical plate 11;
in this embodiment, when the wafer support seat 4 moves down, the gear 14 is driven to move synchronously, when the gear 14 contacts with the latch 16, the gear 14 rotates on the latch 16 and moves linearly along with the driving of the wafer support seat 4, at this time, the gear 14 drives the support plate 15 through the connecting shaft, so that the first magnetic stripe 27 on the surface of the support plate 15 is separated from the second magnetic stripe 28 at the bottom of the wafer support seat 4, then the support plate 15 can rotate normally through the connecting shaft, when the gear 14 is separated from the surface of the latch 16, the support plate 15 just rotates 90 ° and at this time, the support plate 15 is perpendicular to the base 1 and contacts with the base 1, and the first magnetic stripe 27 on the other side of the support plate 15 and the second magnetic stripe 28 fixed on the surface of the reinforcing plate 26 absorb each other, so as to fix and limit the support plate 15, so that the support plate 15 supports the wafer support seat 4, and thus the wafer support seat 4 is prevented from moving down continuously, and the locking purpose is achieved;
the elastic component comprises a metal elastic sheet 21 and a movable arm 22, a groove 23 is formed in the surface of the vertical plate 11, the movable arm 22 is rotatably arranged on the inner wall of the groove 23, an arc-shaped protruding portion 24 is integrally formed on the surface of the movable arm 22, a baffle 25 is integrally formed on the inner wall of the groove 23, and the metal elastic sheet 21 is fixedly arranged between the movable arm 22 and the baffle 25;
in this embodiment, when the wafer support 4 moves downward, the wafer support 4 drives the gear 14 to move synchronously through the bracket 12, at this time, the gear 14 will contact with one side of the arc-shaped protruding portion 24 and press the arc-shaped protruding portion 24, then the arc-shaped protruding portion 24 presses the metal elastic piece 21, so that the metal elastic piece 21 deforms, and at this time, the metal elastic piece 21 stores kinetic energy, so as to buffer the descending speed of the gear 14, and further enable the lifting cylinder 3 to reduce the descending speed of the wafer support 4 when sensing resistance, and when the gear 14 moves to the other side of the arc-shaped protruding portion 24, the kinetic energy stored by the metal elastic piece 21 is released, so as to drive the arc-shaped protruding portion 24 to reset;
the two groups of vertical plates 11 are connected through the reinforcing plate 26, the two sides of the supporting plate 15 are adhered with the first magnetic strips 27, the bottom of the wafer supporting seat 4 and the surface of the reinforcing plate 26 are adhered with the second magnetic strips 28, and the polarities of the first magnetic strips 27 and the second magnetic strips 28 are opposite;
in this embodiment, when the wafer support seat 4 moves upwards, the wafer support seat 4 drives the gear 14 to move synchronously, the gear 14 can rotate under the drive of the latch 16, so that the gear 14 drives the support plate 15 to rotate synchronously, at this time, the support plate 15 can rotate towards a direction close to the wafer support seat 4, so that the first magnetic stripe 27 and the second magnetic stripe 28 at the bottom of the wafer support seat 4 adsorb each other, and thus limit and fix the support plate 15, at this time, the gear 14 is just separated from the latch 16, and when the wafer support seat 4 moves downwards, the wafer support seat 4 drives the gear 14 to move synchronously, so that the support plate 15 rotates towards a direction close to the reinforcing plate 26, and the first magnetic stripe 27 at the other side of the support plate 15 adsorbs each other with the second magnetic stripe 28 on the surface of the reinforcing plate 26, so that the support plate 15 is fixed and limited, and at this time, the gear 14 is just separated from the latch 16;
the heating mechanism comprises a disk surface 29, the disk surface 29 is fixedly arranged on the surface of the base 1 through a supporting rod 30, a heating body 31 is arranged at the bottom of the disk surface 29, and a temperature control module 32 for controlling the temperature of the heating body 31 is fixedly arranged on the surface of the shell 2;
in the embodiment, the heating body 31 is arranged below the disc surface 29, and then the lifting cylinder 3 drives the wafer on the surface of the wafer support seat 4 to move upwards, so that the wafer is dried by being close to the heating body 31, and the temperature control module 32 can accurately control the temperature of the heating body 31;
the exhaust filtering mechanism comprises a filter screen 33, a wind box 34 is fixedly arranged on the surface of the shell 2, the filter screen 33 is fixedly arranged in the wind box 34, an exhaust fan 35 is arranged on the surface of the wind box 34, and a total heat exchanger 36 is arranged in the shell 2;
in the embodiment, the exhaust filtering mechanism is arranged in the shell 2, the air in the shell 2 can be conveyed to the outside through the arrangement of the exhaust fan 35, one end of the exhaust fan 35 can be connected with the existing gas collecting equipment in actual use, so that the gas generated during the heating and volatilizing of the glycerin is collected, and the total heat exchanger 36 can convey the air in the outside into the shell 2 after purification, so that the air pressure balance inside and outside the shell 2 is maintained;
the explosion-proof mechanism consists of a carbon dioxide nozzle 37 and an infrared detection probe 38, wherein the carbon dioxide nozzle 37 is arranged at the top of the inner cavity of the shell 2, and the infrared detection probe 38 is assembled at the top of the shell 2;
the heating body 31 is set as a constant temperature ceramic PTC heating sheet in the application, the ignition point of glycerin is 290 ℃, but the highest temperature of the constant temperature ceramic PTC heating sheet is only 270 ℃, glycerin on the surface of the constant temperature ceramic PTC heating sheet is not burnt when a wafer is dried, but the constant temperature ceramic PTC heating sheet heats other objects with lower ignition points, if the ignition point of the objects is exceeded, the objects can cause combustion phenomena to occur, thereby causing fire, but the embodiment is provided with a carbon dioxide nozzle 37 and an infrared detection probe 38, the heat distribution condition of each component in the shell 2 can be monitored in real time through the infrared detection probe 38, abnormal temperature distribution condition is prevented, and if the abnormal temperature distribution condition even object combustion condition occurs, the oxygen concentration in the shell 2 can be reduced by spraying carbon dioxide into the shell 2 through the carbon dioxide nozzle 37, thereby achieving the aim of fire extinguishment.
Embodiment two: in the above-mentioned scheme, the protection component can play a role in buffering when the wafer supporting seat 4 descends, so that the wafer on the surface of the wafer supporting seat is protected, the wafer is prevented from being damaged when the wafer supporting seat 4 descends due to the damage of the air cylinder, but the wafer is difficult to further protect only by the arrangement of the protection component, so that the supporting mechanism is arranged between the wafer supporting seat 4 and the base 1, the buffer rod 9 rotates after being extruded by the wafer supporting seat 4, the buffer rod 9 drives the supporting mechanism and supports the wafer supporting seat 4, the supporting mechanism comprises the buffer plate 17, the movable plate 19 is rotatably arranged on the surface of the base 1 through the fixed seat 18, the buffer plate 17 is hinged to one side, close to the fixed seat 18, of the movable plate 19, and the buffer sponge cushion 20 is adhered on the surface of the buffer plate 17;
can drive buffer rod 9 at the surface rotation of pivot 8 when wafer supporting seat 4 descends, make torsional spring 7 take place deformation simultaneously, and can extrude one side of fly leaf 19 when buffer rod 9 rotates, make one side of fly leaf 19 that receives the extrusion reduce, the opposite side is risen, the opposite side of fly leaf 19 can drive buffer plate 17 synchronous movement this moment, and then make buffer plate 17 drive buffering foam-rubber cushion 20 laminating in wafer supporting seat 4 below, thereby play buffering and protection's effect to wafer supporting seat 4, can follow the bottom of wafer supporting seat 4 through base 5 and four sets of buffer plates 17 at this moment, and because buffer rod 9 receives the extrusion, buffer rod 9 all can contact with it at the whole journey that wafer supporting seat 4 removed, when wafer supporting seat 4 stops moving, wafer supporting seat 4 can push down the one end of fly leaf 19 through the one end of buffer rod 9, can support wafer supporting seat 4 through four sets of buffer rods 9 this moment, four sets of buffer plates 17 and an independent base 5, thereby make the wafer place steadily.
Working principle: the wafer coated with the glycerol can be placed on the surface of the wafer supporting seat 4, then the wafer on the surface of the wafer supporting seat 4 is driven by the lifting cylinder 3 to be close to the heating body 31 for drying, the temperature control module 32 can accurately control the temperature of the heating body 31, the air in the shell 2 can be conveyed to the outside through the arrangement of the exhaust fan 35, one end of the exhaust fan 35 can be connected with the existing gas collecting equipment in actual use, so that the gas generated when the glycerol is heated and volatilized is collected, and the air outside can be conveyed to the inside of the shell 2 after being purified through the total heat exchanger 36, so that the air pressure balance inside and outside the shell 2 is maintained;
after the drying is finished, the lifting cylinder 3 can drive the wafer supporting seat 4 to reset, at this moment, the wafer supporting seat 4 can be firstly contacted with the buffer rod 9 and extrude the buffer rod 9, so that the buffer rod 9 rotates on the surface of the rotating shaft 8, meanwhile, the buffer rod 9 and the rotating shaft 8 can deform the torsion spring 7, thereby buffering the descending process of the wafer supporting seat 4 through the elasticity of the torsion spring 7, the buffer rod 9 can be driven to rotate on the surface of the rotating shaft 8 when the wafer supporting seat 4 descends, simultaneously, the torsion spring 7 can deform, and when the buffer rod 9 rotates, one side of the movable plate 19 can be extruded, the extruded side of the movable plate 19 is lowered, the other side of the movable plate 19 is raised, at this moment, the other side of the movable plate 19 can drive the buffer plate 17 to synchronously move, and further the buffer plate 17 drives the buffer sponge cushion 20 to be attached below the wafer supporting seat 4, therefore, the wafer support seat 4 is buffered and protected, the gear 14 is driven to synchronously move when the wafer support seat 4 moves downwards, when the gear 14 contacts with the latch 16, the gear 14 rotates on the latch 16 and linearly moves along with the driving of the wafer support seat 4, the gear 14 drives the support plate 15 to rotate through the connecting shaft, so that the first magnetic strip 27 on the surface of the support plate 15 is separated from the second magnetic strip 28 at the bottom of the wafer support seat 4, then the support plate 15 can normally rotate reversely through the connecting shaft, when the gear 14 is separated from the surface of the latch 16, the support plate 15 just rotates by 90 degrees, the support plate 15 is vertical to the base 1 and contacts with the base 1, the first magnetic strip 27 on the other side of the support plate 15 is mutually adsorbed with the second magnetic strip 28 fixed on the surface of the reinforcing plate 26, and the support plate 15 is fixed and limited, so that the support plate 15 supports the wafer support base 4;
if the cylinder is damaged, the wafer supporting seat 4 drives the gear 14 to synchronously move through the bracket 12, at this time, the gear 14 firstly contacts with one side of the arc-shaped protruding part 24 and extrudes the arc-shaped protruding part 24, then the arc-shaped protruding part 24 extrudes the metal elastic sheet 21, the metal elastic sheet 21 is deformed, and at this time, the metal elastic sheet 21 stores kinetic energy, so that the descending speed of the gear 14 is buffered, at this time, the impact force when the gear 14 contacts with the latch 16 can be reduced, and the gear 14 and the latch 16 are protected, so that the normal use of the gear 14 and the latch 16 is maintained.
It should be noted that the lifting cylinder 3, the heating body 31, the temperature control module 32, the exhaust fan 35, the total heat exchanger 36, the carbon dioxide nozzle 37 and the infrared detection probe 38 are devices or apparatuses existing in the prior art or are devices or apparatuses that can be implemented in the prior art, and the specific power supply components and principles of the lifting cylinder 3, the heating body 31, the temperature control module 32, the exhaust fan 35, the total heat exchanger 36, the carbon dioxide nozzle 37 and the infrared detection probe 38 are clear to those skilled in the art, so that detailed descriptions thereof are omitted.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a glycerin hot plate device based on wafer lift control mechanism, includes base (1) and shell (2), the surface of shell (2) is provided with heating mechanism, filtration mechanism and explosion-proof mechanism of airing exhaust, the surface of base (1) is provided with wafer elevating system, its characterized in that: the wafer lifting mechanism comprises a lifting cylinder (3) and a wafer supporting seat (4), wherein the lifting cylinder (3) is fixedly arranged on the surface of the base (1), the wafer supporting seat (4) is fixedly arranged at the output end of the lifting cylinder (3), and the surface of the base (1) is provided with a protection component for buffering the wafer supporting seat (4) and a locking component for locking the wafer supporting seat (4);
the protection assembly comprises a base (5), a connecting seat (6), a torsion spring (7), a rotating shaft (8), a buffer rod (9) and a supporting mechanism, wherein the connecting seat (6) is fixedly arranged on the surface of the base (1) through the base (5), the rotating shaft (8) is fixedly arranged on the inner wall of the connecting seat (6), a through hole (10) is formed in the surface of the buffer rod (9), the buffer rod (9) is rotatably arranged on the surface of the rotating shaft (8) through the through hole (10), the torsion spring (7) is arranged between the through hole (10) and the rotating shaft (8), the buffer rod (9) rotates after being extruded by the wafer supporting seat (4), and then the buffer rod (9) drives the supporting mechanism to support the wafer supporting seat (4);
the supporting mechanism comprises a buffer plate (17), the surface of the base (1) is rotatably provided with a movable plate (19) through a fixed seat (18), the buffer plate (17) is hinged to one side, close to the fixed seat (18), of the movable plate (19), and a buffer foam cushion (20) is adhered to the surface of the buffer plate (17).
2. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 1, wherein: the locking assembly comprises a vertical plate (11), a support (12) and an elastic assembly, wherein the vertical plate (11) is fixedly arranged on the surface of the base (1), the support (12) is fixedly arranged on the side face of the wafer supporting seat (4), and two groups of gears (14) are rotatably arranged on the surface of the support (12) through a support (13).
3. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 2, wherein: the two groups of gears (14) are fixedly provided with a supporting plate (15) through a connecting shaft, the surface of the vertical plate (11) is provided with a latch (16) meshed with the gears (14), and the surface of the vertical plate (11) is provided with an elastic component for buffering the gears (14) and the latch (16) when being connected.
4. A glycerol hot plate apparatus based on a wafer lift control mechanism as claimed in claim 3, wherein: the elastic component includes metal shrapnel (21) and movable arm (22), recess (23) are seted up on the surface of riser (11), movable arm (22) rotate and set up in the inner wall of recess (23), and the surface integrated into one piece of movable arm (22) has arc bellying (24).
5. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 4, wherein: the inner wall integrated into one piece of recess (23) has baffle (25), metal shrapnel (21) are fixed to be set up between movable arm (22) and baffle (25).
6. A glycerol hot plate apparatus based on a wafer lift control mechanism as claimed in claim 3, wherein: two sets of riser (11) are connected through reinforcing plate (26), first magnetic stripe (27) have all been bonded to the both sides of backup pad (15), the bottom of wafer supporting seat (4) and the surface of reinforcing plate (26) have all been bonded second magnetic stripe (28), the polarity of first magnetic stripe (27) and second magnetic stripe (28) are opposite.
7. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 1, wherein: the heating mechanism comprises a disc surface (29), the disc surface (29) is fixedly arranged on the surface of the base (1) through a supporting rod (30), a heating body (31) is arranged at the bottom of the disc surface (29), and a temperature control module (32) for controlling the temperature of the heating body (31) is fixedly arranged on the surface of the shell (2).
8. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 1, wherein: the exhaust filtering mechanism comprises a filter screen (33), a wind box (34) is fixedly arranged on the surface of the shell (2), the filter screen (33) is fixedly arranged in the wind box (34), an exhaust fan (35) is arranged on the surface of the wind box (34), and a safety heat exchanger (36) is arranged in the shell (2).
9. The glycerol hot plate device based on the wafer lifting control mechanism according to claim 1, wherein: the explosion-proof mechanism consists of a carbon dioxide nozzle (37) and an infrared detection probe (38), wherein the carbon dioxide nozzle (37) is arranged at the top of an inner cavity of the shell (2), and the infrared detection probe (38) is assembled at the top of the shell (2).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310868190.8A CN116592590B (en) | 2023-07-17 | 2023-07-17 | Glycerol hot plate device based on wafer lifting control mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310868190.8A CN116592590B (en) | 2023-07-17 | 2023-07-17 | Glycerol hot plate device based on wafer lifting control mechanism |
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| CN116592590B true CN116592590B (en) | 2023-09-08 |
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| CN112606238A (en) * | 2020-11-27 | 2021-04-06 | 张明 | Clamping equipment for wafer slicer processing |
| CN113063271A (en) * | 2021-04-14 | 2021-07-02 | 创微微电子(常州)有限公司 | Drying equipment and wafer drying method |
| CN213802750U (en) * | 2020-12-02 | 2021-07-27 | 深圳远东卓越科技有限公司 | Wafer substrate conveying and lifting device |
| CN115346882A (en) * | 2022-10-17 | 2022-11-15 | 芯达半导体设备(苏州)有限公司 | Indium column balling-up control method, device and equipment |
| CN218884491U (en) * | 2022-09-22 | 2023-04-18 | 常州捷佳创精密机械有限公司 | Drying tank, drying device and cleaning equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102588731B1 (en) * | 2021-05-31 | 2023-10-13 | 에스피티주식회사 | Wafer test and cleaning apparatus |
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- 2023-07-17 CN CN202310868190.8A patent/CN116592590B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112606238A (en) * | 2020-11-27 | 2021-04-06 | 张明 | Clamping equipment for wafer slicer processing |
| CN213802750U (en) * | 2020-12-02 | 2021-07-27 | 深圳远东卓越科技有限公司 | Wafer substrate conveying and lifting device |
| CN113063271A (en) * | 2021-04-14 | 2021-07-02 | 创微微电子(常州)有限公司 | Drying equipment and wafer drying method |
| CN218884491U (en) * | 2022-09-22 | 2023-04-18 | 常州捷佳创精密机械有限公司 | Drying tank, drying device and cleaning equipment |
| CN115346882A (en) * | 2022-10-17 | 2022-11-15 | 芯达半导体设备(苏州)有限公司 | Indium column balling-up control method, device and equipment |
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| CN116592590A (en) | 2023-08-15 |
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