CN115948720A - Thin film deposition apparatus - Google Patents
Thin film deposition apparatus Download PDFInfo
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- CN115948720A CN115948720A CN202310238231.5A CN202310238231A CN115948720A CN 115948720 A CN115948720 A CN 115948720A CN 202310238231 A CN202310238231 A CN 202310238231A CN 115948720 A CN115948720 A CN 115948720A
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Abstract
The present invention provides a thin film deposition apparatus, comprising: the substrate clamping device comprises a base used for bearing a substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge appearance of the substrate, the first driving unit comprises a push rod and an air cylinder, the push rod is connected with the clamps and the air cylinder, and the push rod drives the clamps to move under the driving of the air cylinder so as to clamp or release the substrate from the side faces of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate. The invention can avoid substrate pollution, has compact structure, can meet the layout of each structure under the condition of not increasing the size of the cavity, has simple and efficient rotation operation and is beneficial to improving the yield of equipment.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to semiconductor equipment, and particularly relates to thin film deposition equipment.
Background
In the prior art, when a thin film deposition process is performed, a film can be generally coated on only a single surface of a wafer (generally, the front surface of the wafer, i.e., the surface facing the gas inflow direction), but deposition coating operations need to be performed on two surfaces of the wafer respectively in some processes, and the process requirements are difficult to meet by using existing deposition equipment. The reason is that in the existing coating equipment, the back surface of the wafer is completely contacted with the surface of the heater, and the front surface of the wafer is exposed in the process cavity, so that the coating operation can be only carried out on the front surface of the wafer. If the back surface of the wafer needs to be coated and the front surface does not need to be coated, the front surface of the wafer needs to be shielded, and the wafer is turned over by a moving device such as a mechanical arm outside the equipment, so that the back surface of the wafer faces to the opposite surface where the gas flows in, and the coating operation is completed. This method is not only prone to wafer damage and contamination, but also inefficient, resulting in reduced equipment throughput.
It should be noted that the above background description is provided only for the sake of clarity and complete description of the technical solutions of the present application, and for the sake of understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present application.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a thin film deposition apparatus, which is used to solve the problems that when a back surface of a wafer needs to be coated, the wafer needs to be turned over by a moving device such as a robot arm outside the coating apparatus, which is not only easy to damage and contaminate the wafer, but also causes a decrease in the yield of the apparatus due to low efficiency.
To achieve the above and other related objects, the present invention provides a thin film deposition apparatus, comprising: the substrate clamping device comprises a base used for bearing a substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge appearance of the substrate, the first driving unit comprises a push rod and an air cylinder, the push rod is connected with the clamps and the air cylinder, and the push rod drives the clamps to move under the driving of the air cylinder so as to clamp or release the substrate from the side surface of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate.
Optionally, the number of the holders is 2, and each holder is semicircular ring-shaped.
More optionally, the clamp includes a side, a first bottom and a second bottom, during clamping of the substrate, the side abuts against the side of the substrate, one end of each of the first bottom and the second bottom is connected to the side, and the other end extends to contact with the upper surface and the lower surface of the substrate respectively.
Optionally, the first driving units are arranged in one-to-one correspondence with the grippers.
Optionally, the first gear and the second gear are both right-angle gears, and the first gear is fixed on the push rod.
Optionally, the thin film deposition apparatus further includes a plurality of lift pins and a third driving unit, one end of each lift pin is connected to the third driving unit, and the other end of each lift pin penetrates through the base, and can be lifted in the base under the driving of the third driving unit, so as to drive the substrate to lift.
Optionally, the second drive unit comprises a rotary motor.
Optionally, the thin film deposition equipment further comprises a corrugated pipe, one end of the corrugated pipe is connected with the outer wall of the process cavity, the other end of the corrugated pipe is connected with the cylinder of the clamping module, and a piston rod of the cylinder is sleeved in the corrugated pipe.
Optionally, the thin film deposition apparatus includes a detection module for detecting whether the substrate is rotated into position.
More optionally, the detection module includes more than two position sensors, and the position sensors are arranged above the base at intervals.
As described above, the thin film deposition apparatus of the present invention has the following advantageous effects: most structures required by the rotating substrate of the thin film deposition equipment provided by the invention can be arranged in the process cavity, so that the process cavity does not need to be opened in the process of rotating the substrate, and the substrate pollution can be avoided. Simultaneously, the setting of each structure is very compact, can satisfy the overall arrangement of each structure under the condition that does not increase the cavity size, and rotatory operation is simple high-efficient, helps improving equipment output capacity.
Drawings
Fig. 1 is a schematic view illustrating exemplary structures of a clamping module and a rotating module of a thin film deposition apparatus according to the present invention.
Fig. 2 is a schematic structural diagram of a thin film deposition apparatus according to an exemplary embodiment of the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Spatially relative terms, such as "under," "below," "lower," "below," "over," "upper," and the like, may be used herein for convenience in describing the relationship of one element or feature to another element or feature illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated. In order to keep the drawings as concise as possible, not all features of a single figure may be labeled in their entirety.
When the wafer needs to be rotated and even turned over, the conventional film deposition equipment is usually operated by a mechanical arm positioned outside the cavity, so that the operation is complicated, the yield of the equipment is reduced, and the mechanical arm easily collides with a component inside the cavity to easily damage the wafer. In addition, the contact area between the robot and the wafer is large, which results in the shielding of the coating position and affects the coating yield. In view of the above, the inventors of the present application have made a long-term study and have proposed an improvement.
Specifically, as shown in fig. 1 and 2, the present invention provides a thin film deposition apparatus, comprising: the device comprises a base 11, a clamping module and a rotating module; the susceptor 11 is used for carrying a substrate 12, such as a wafer, and may be used for fixing the wafer based on the vacuum adsorption principle, and a heating and/or cooling device may be disposed in the susceptor 11, so that the susceptor 11 may also be referred to as a heater in some examples; the clamping module comprises more than two clampers 131 and a first driving unit, the clampers 131 are matched with the edge of the substrate 12 in shape and are suitable for clamping the substrate 12 from the edge of the substrate 12, the first driving unit comprises a push rod 132 and an air cylinder 133, the push rod 132 is connected with the clampers 131 and the air cylinder 133, the push rod 132 drives the clampers 131 to move under the driving of the air cylinder 133, and the more than two clampers 131 move to the substrate 12 from different directions so as to clamp or release the substrate 12 from different sides of the substrate 12; the rotation module includes a first gear 141, a second gear 142 and a second driving unit 143, the first gear 141 is connected with the push rod 132, the second gear 142 is engaged with the first gear 141, the second driving unit 143 is connected with the second gear 142, and the second driving unit 143 includes a rotation motor, for example, to precisely control the rotation reading. The second driving unit 143 drives the second gear 142 to rotate, and under the engagement action, the first gear 141 rotates, thereby driving the push rod 132 connected to the first gear 141 to rotate, and the rotating clamping module drives the substrate 12 to rotate to a desired angle, for example, to turn the substrate 12 over.
The thin film deposition apparatus generally further includes a process chamber 18, i.e., a deposition chamber, the aforementioned susceptor 11 is located in the process chamber 18, and some units of the clamping module and the rotating module, such as the clamper 131 of the clamping module, the first gear 141 and the second gear 142 of the rotating module, may be disposed in the process chamber 18, and the push rod 132 may be moved from the inside of the process chamber 18 to the outside of the process chamber 18. By the movement of the push rod 132 in the horizontal direction, the relative position of the clamper 131 and the substrate 12 is changed to clamp or release the substrate 12. In order to ensure that the process chamber 18 is kept sealed during the rotation operation, in a preferred example, the push rod 132 is hermetically connected to the cylinder 133 by using a bellows 16, that is, the apparatus further includes a plurality of bellows 16, a piston rod of the cylinder 133 is connected to the push rod 132 and is sleeved in the bellows 16, one end of the bellows 16 is connected to an outer wall of the process chamber 18, and the other end of the bellows is connected to the cylinder 133. Similarly, the second driving unit 143 may also be disposed outside the process chamber 18, and the second driving unit 143 may also include a cylinder, for example, the main structure of which is disposed outside the process chamber 18 and connected to the outer wall of the process chamber 18 through a bellows, but a piston rod of the second driving unit 143 is sleeved in the bellows and extends from the outside to the inside of the process chamber 18 to be connected to the second gear 142. In other examples, the first gear 141, the second gear 142 and the second driving unit 143 of the rotating module may be entirely disposed outside the process chamber 18 while only the holder 131 is disposed inside the process chamber 18, while ensuring the process chamber 18 to be sealed, so that the rotation of the rotating module can be observed more conveniently.
An exemplary working process of the thin film deposition apparatus provided by the present invention includes, when the substrate 12 needs to be subjected to reverse film deposition, under the premise that the clamp 131 does not collide with the base 11, the first driving unit drives the push rod 132 to move towards the substrate 12 until the clamp 131 abuts against the substrate 12, different clamps 131 abut against different sides of the substrate 12 to fix the substrate 12, the substrate 12 is separated from the base 11, the second driving unit 143 drives the second gear 142 to rotate, thereby driving the first gear 141 to rotate, and further the clamping module drives the substrate 12 to rotate to a desired position, and then the substrate 12 is placed on the base 11, the clamping module releases the substrate 12 to perform film deposition, and the substrate 12 is again subjected to reverse reset according to the aforementioned method after the film deposition is completed. Or after the substrate 12 is turned over, the plating is directly performed in a state where the clamper 131 still holds the substrate 12.
According to the film deposition equipment provided by the invention, the key structure required by the rotating substrate can be arranged in the process cavity, so that the process cavity does not need to be opened in the process of rotating the substrate, and the substrate pollution can be avoided. Simultaneously, the setting of each structure is very compact, can satisfy the overall arrangement of each structure under the condition that does not increase the cavity size, and rotatory operation is simple high-efficient, helps improving equipment output capacity.
In the case of fixing the substrate 12, the number of the clampers 131 may be determined according to the structure thereof, and generally, the smaller the clamping area thereof, the more clampers 131 are required, and it is possible to secure as much as possible that all the clampers 131 can form a closed state to the side of the substrate 12. In a preferred example, the number of the holders 131 is 2, and each holder 131 is a half-circle ring, so that the 2 holders 131 form a circle ring, and the inner diameter of the circle ring matches with the size of the substrate 12, thereby completely covering and fixing the substrate 12 in the circumferential direction. The clamper 131 and the base 11, or the substrate 12 on the base 11, form a sealed environment to form a labyrinth sealing device, so as to ensure that no film coating operation is performed on the front surface of the substrate 12 during the back surface process, thereby avoiding substrate contamination. In comparison, the arrangement of 2 semicircular ring-shaped holders 131 contributes to simplification of the entire structure of the apparatus.
In order to better clamp the wafer, in an example, the clamper 131 includes a side edge, a first bottom edge and a second bottom edge, the side edge abuts against the side surface of the substrate 12 during the clamping of the substrate 12 by the clamper 131, and one end of each of the first bottom edge and the second bottom edge is connected with the side edge, and the other end extends to contact with the upper surface and the lower surface of the substrate 12 respectively. That is, the side edge, the first bottom edge and the second bottom edge of the clamper 131 are connected to form a clamping groove, and the substrate 12 is embedded in the clamping groove in the process of clamping the substrate 12. The first bottom edge and the second bottom edge preferably extend from the edge of the substrate 12 to the surface of the substrate 12 by a distance of 2-3mm, which is usually a reserved non-coating area and does not affect the normal coating operation. The material of the holder 131 can be selected in many ways, but in a preferred example, the holder 131 includes a metal material layer and a non-metal protective layer on the inner side of the metal material layer, the non-metal protective layer is, for example, a POM (polyoxymethylene) material layer, the metal material layer can provide good support, and the POM material has good self-lubrication and wear resistance. In the process of clamping the substrate 12, the POM material layer contacts the substrate 12, so that the substrate 12 is prevented from being damaged, and particle contamination caused by abrasion of the clamper 131 due to the edge of the substrate 12 is avoided. To facilitate clamping the substrate 12, the first bottom edge, the second bottom edge and the side edges of the clamper 131 may be connected non-horizontally and have an inclination angle, so that the slot of the clamper 131 has a V-shaped opening, and during clamping the substrate 12, the edge of the substrate 12 slides into the slot from the opening. The first bottom edge and the second bottom edge may be further provided with bumps to provide a certain compression during clamping of the substrate 12 to firmly fix the substrate 12.
The plurality of grippers 131 may share one driving unit, but it is necessary to realize the interlocking of the plurality of grippers 131 by a connecting device such as a bearing. In a preferred example, the first driving units driving the grippers 131 are independent, i.e., the first driving units and the grippers 131 are disposed in a one-to-one correspondence so as to avoid mutual interference, and the substrate 12 can be rotated to any angle, so that the rotation operation is more flexible.
The first gear 141 and the second gear 142 may be positioned so that they can mesh with each other. However, in a preferred example, the first gear 141 and the second gear 142 are right-angle gears, the first gear 141 is fixed on the push rod 132, and the second gear 142 is located below the first gear 141, so as to achieve a smoother transmission.
In some examples, the thin film deposition apparatus includes a detection module for detecting whether the substrate 12 is rotated into position. There are various options for the detection module, such as in one example, the detection module includes more than two position sensors 17 spaced above the susceptor 11, for example, in the process chamber 18 and on top, i.e. 2 position sensors 17 are spaced apart from each other and spaced apart from the susceptor 11, for example, 2 position sensors 17 can be respectively located right above two ends of the susceptor 11. The position sensor 17 is preferably a non-contact sensor, or a distance sensor may be used. The detection module is arranged to determine whether the rotation position of the substrate 12 is in place or not by the length of the optical fiber emitted by the position sensors 17 on both sides of the upper side of the process chamber 18. When the positions of the two position sensors 17 do not coincide, a low-speed fine adjustment is performed by the second drive unit 143 of the rotation module, for example, by the rotation motor, so as to ensure that the readings of the two position sensors 17 coincide. The signal from the position sensor 17 is transmitted to a central processing unit of the console, which transmits a signal to the rotation mechanism to adjust the horizontal state of the substrate 12. In other examples, a displacement sensor or other detection module may be used, such as a detection device disposed at a predetermined position to detect whether the substrate is horizontal, but the position sensor 17 is simpler and more convenient to use.
In order to better realize the rotation of the substrate 12 and avoid the collision and damage of the substrate 12 and other components during the rotation as much as possible, in an example, the thin film deposition apparatus further includes a plurality of lift pins 151 and a third driving unit. For example, 3 ejector pins 151 are uniformly distributed at intervals along the circumferential direction of the base 11, one end of each ejector pin 151 is connected to the third driving unit, and the other end of each ejector pin 151 penetrates through the base 11 and can be driven by the third driving unit to lift in the base 11, so that the substrate 12 is driven to lift. The third driving unit includes, for example, a fixing plate 152 and a lifting cylinder 153, a main body of the lifting cylinder 153 may also be disposed outside the process chamber 18 and connected to an outer wall of the process chamber 18 through a bellows, one end of the thimble 151 is fixed to the fixing plate 152 and extends upward into the base 11, and the fixing plate 152 moves up and down under the driving of the lifting cylinder 153, thereby driving the thimble 151 to lift in the base 11. Of course, in other examples, the rotation module may be connected to the lifting device, or the rotation module may be integrated with a lifting function, and the rotation module may be lifted while rotating to gradually lift the substrate 12, so that the collision with the susceptor 11 during the rotation operation may be reduced to some extent by the lifting of the rotation module itself. Alternatively, in another example, the substrate 12 may be separated from the susceptor 11 before the substrate 12 is held by the air levitation system, for example, a plurality of air holes may be provided in the susceptor 11, and when the substrate needs to be turned over, air flow may be ejected from the air holes to levitate the substrate above the susceptor. However, the liftable thimble 151 disposed in the base 11 is a safer and more efficient design. The ejector pins 151 are made of, for example, ceramic or silicon carbide, and the surface thereof contacting the substrate 12 may be an inclined slope surface to avoid scratching the substrate 12 during the process of lifting the substrate 12 as much as possible.
In the case where ejector pin 151 is provided, exemplary operating states of the apparatus are described as follows:
a) Substrate 12 is initially not in process chamber 18 and substrate 12 is transferred by a robot arm to process chamber 18, such as with substrate 12 facing up and back down, with pins 151 in a raised position so that substrate 12 is raised and substrate 12 is positioned above the bottom edge of grippers 131 (this is typically substrate 12 left uncoated or coated on its front side in another chamber before entering the process chamber).
b) Alternatively, the front surface of the substrate 12 is completely coated in the process chamber 18, wherein the front surface of the substrate 12 faces upward and the back surface faces downward, the substrate 12 is lifted by the ejector pins 151, the susceptor 11 is at a low position, and the substrate 12 is in a standby state for coating the back surface of the substrate 12.
In both the above a and b states, the base 11 is in the low position. The reason why the two process operations a and b can be performed is that there is a clamping module, which forms a labyrinth seal by cooperating with the edge of the base 11 and the substrate 12 after the substrate 12 rotates, so as to ensure that the front surface of the substrate 12 is not coated during the back process and ensure that the front surface of the substrate 12 is not coated or secondarily coated. In other words, even if the operation b is not completed in one process chamber, the operation a can still be performed, and the above-mentioned effects are still obtained.
When the substrate 12 needs to be flip-coated, the piston rod of the cylinder 133 extends outward, the clamper 131 is pressed against the edge of the substrate 12 to clamp the substrate 12, the ejector pin 151 descends to gradually separate from the substrate 12, after the ejector pin 151 finishes the action (at this time, the ejector pin 151 and the base 11 are both in a low position), the rotary module of the present design is used to rotate the rotary motor to flip the substrate 12, so that the front surface of the substrate 12 faces downward, the back surface of the substrate 12 faces upward, and then the base 11 is lifted to the lower side of the substrate 12 (for example, the base 11 is infinitely close to the wafer by adjusting the number of steps of the rotary motor) to support the substrate 12, thereby shielding the front surface of the substrate 12, and then the back surface coating operation is performed.
The thin film deposition apparatus provided herein may be a chemical vapor deposition apparatus, and thus the apparatus may further include a gas distribution plate positioned at a top of the process chamber to introduce the deposition source gas into the process chamber. The apparatus may further include an inert gas line disposed in a support module supporting the susceptor to introduce an inert gas to a surface of the susceptor, the inert gas may perform a cleaning and protecting function on the substrate, and the support module of the susceptor may include a lift unit (not shown). The thin film deposition apparatus may also be a physical vapor deposition apparatus, such as a magnetron sputtering apparatus, and thus the apparatus may further comprise a magnetron assembly located at the top of the process chamber. The embodiment does not limit the specific type of the equipment, or the embodiment is suitable for various types of thin film deposition equipment, and can meet diversified thin film deposition requirements.
As can be seen from the foregoing description, with the thin film deposition apparatus provided by the present application, there will be several of the following advantages:
1) The thin film deposition equipment provided by the application is only in contact with the edge of the substrate when the substrate is rotated, devices such as a mechanical arm outside the cavity do not need to be adopted, the overturning operation is completed in the closed process cavity, and the pollution of the substrate can be effectively avoided.
2) The rotation of the arbitrary angle of base plate can be realized to this application, can detect simultaneously whether the upset targets in place, if the upset fails to target in place, can correct the operation, improves the operation yield.
3) When any surface of the substrate is subjected to film coating operation, the other surface of the substrate is effectively shielded, so that accurate film coating is realized.
4) The equipment structure is succinct, and the overall arrangement is compact, and convenient to use can greatly reduce the activity duration, improves production efficiency and equipment output rate.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A thin film deposition apparatus, comprising: the substrate clamping device comprises a base used for bearing a substrate, a clamping module and a rotating module; the clamping module comprises more than two clamps and a first driving unit, the clamps are matched with the edge appearance of the substrate, the first driving unit comprises a push rod and a cylinder, the push rod is connected with the clamps and the cylinder, and the push rod drives the clamps to move under the driving of the cylinder so as to clamp or release the substrate from the side face of the substrate; the rotating module comprises a first gear, a second gear and a second driving unit, the first gear is connected with the push rod, the second gear is meshed with the first gear, the second driving unit is connected with the second gear, and the second driving unit drives the second gear to rotate, so that the clamping module and the substrate are driven to rotate.
2. The thin film deposition apparatus according to claim 1, wherein the number of the holders is 2, and each holder has a semicircular ring shape.
3. The thin film deposition apparatus as claimed in claim 2, wherein the holder includes a side edge, a first bottom edge and a second bottom edge, the side edge abuts against a side surface of the substrate during the holding of the substrate by the holder, and the first bottom edge and the second bottom edge are connected to the side edge at one end and extend to contact with an upper surface and a lower surface of the substrate, respectively, at the other end.
4. The thin film deposition apparatus according to claim 1, wherein the first driving units are provided in one-to-one correspondence with the grippers.
5. The thin film deposition apparatus as claimed in claim 1, wherein the first gear and the second gear are right-angle gears, and the first gear is fixed to the push rod.
6. The thin film deposition apparatus according to claim 1, further comprising a plurality of lift pins and a third driving unit, wherein one end of each lift pin is connected to the third driving unit, and the other end of each lift pin passes through the susceptor, and the lift pins can be driven by the third driving unit to move up and down in the susceptor, thereby driving the substrate to move up and down.
7. The thin film deposition apparatus of claim 1, wherein the second driving unit includes a rotation motor.
8. The thin film deposition apparatus according to claim 1, further comprising a bellows, wherein one end of the bellows is connected to an outer wall of the process chamber, the other end of the bellows is connected to a cylinder of the clamping module, and a piston rod of the cylinder is sleeved in the bellows.
9. The thin film deposition apparatus according to any one of claims 1 to 8, comprising a detection module for detecting whether the substrate is rotated into position.
10. The thin film deposition apparatus according to claim 9, wherein the detection module includes two or more position sensors spaced above the susceptor.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117051372A (en) * | 2023-08-08 | 2023-11-14 | 上海悦匠实业有限公司 | Wafer carrying platform lifting device with limit control function |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101178502A (en) * | 2006-11-10 | 2008-05-14 | 爱德牌工程有限公司 | Lift pin driving device and a flat panel display manufacturing apparatus having same |
| DE102007057891A1 (en) * | 2006-12-01 | 2008-07-03 | Ingenia Gmbh | Wafer gripper has gripper jaw which is shifted in guidance by drive, where gripper jaw grips wafer, and rotating drive has low pressure driven impeller |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| CN108193187A (en) * | 2017-11-29 | 2018-06-22 | 北京中科优唯科技有限公司 | A kind of substrate frame of achievable automatic turning |
| CN109695022A (en) * | 2017-10-24 | 2019-04-30 | 北京北方华创微电子装备有限公司 | Processing chamber, semiconductor processing equipment and membrane deposition method |
| CN110640324A (en) * | 2019-09-02 | 2020-01-03 | 中芯集成电路（宁波）有限公司 | Wafer double-side manufacturing system |
| CN113430504A (en) * | 2021-08-26 | 2021-09-24 | 上海陛通半导体能源科技股份有限公司 | Chemical vapor deposition equipment capable of conveniently lifting and clamping wafer |
| CN214409362U (en) * | 2020-10-30 | 2021-10-15 | 天津精创锐势光电科技有限公司 | Optical lens coating device |
| CN114104677A (en) * | 2020-09-01 | 2022-03-01 | 松下知识产权经营株式会社 | Substrate inverting apparatus and substrate inverting method |
| US20220208589A1 (en) * | 2020-12-24 | 2022-06-30 | Semes Co., Ltd. | Substrate gripping apparatus and liquid processing apparatus, and substrate processing equipment including same |
| CN217709660U (en) * | 2022-06-14 | 2022-11-01 | 苏州华星光电技术有限公司 | Thin film deposition equipment |
| CN218482218U (en) * | 2022-10-25 | 2023-02-14 | 江苏弘琪工业自动化有限公司 | Wafer clamping arm |
| CN218602415U (en) * | 2022-11-25 | 2023-03-10 | 上海交震半导体科技有限公司 | Overturning actuating mechanism based on stepping motor control |
-
2023
- 2023-03-14 CN CN202310238231.5A patent/CN115948720B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101178502A (en) * | 2006-11-10 | 2008-05-14 | 爱德牌工程有限公司 | Lift pin driving device and a flat panel display manufacturing apparatus having same |
| DE102007057891A1 (en) * | 2006-12-01 | 2008-07-03 | Ingenia Gmbh | Wafer gripper has gripper jaw which is shifted in guidance by drive, where gripper jaw grips wafer, and rotating drive has low pressure driven impeller |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| CN109695022A (en) * | 2017-10-24 | 2019-04-30 | 北京北方华创微电子装备有限公司 | Processing chamber, semiconductor processing equipment and membrane deposition method |
| CN108193187A (en) * | 2017-11-29 | 2018-06-22 | 北京中科优唯科技有限公司 | A kind of substrate frame of achievable automatic turning |
| CN110640324A (en) * | 2019-09-02 | 2020-01-03 | 中芯集成电路（宁波）有限公司 | Wafer double-side manufacturing system |
| CN114104677A (en) * | 2020-09-01 | 2022-03-01 | 松下知识产权经营株式会社 | Substrate inverting apparatus and substrate inverting method |
| JP2022041541A (en) * | 2020-09-01 | 2022-03-11 | パナソニックＩｐマネジメント株式会社 | Substrate inversion device and substrate inversion method |
| CN214409362U (en) * | 2020-10-30 | 2021-10-15 | 天津精创锐势光电科技有限公司 | Optical lens coating device |
| US20220208589A1 (en) * | 2020-12-24 | 2022-06-30 | Semes Co., Ltd. | Substrate gripping apparatus and liquid processing apparatus, and substrate processing equipment including same |
| CN113430504A (en) * | 2021-08-26 | 2021-09-24 | 上海陛通半导体能源科技股份有限公司 | Chemical vapor deposition equipment capable of conveniently lifting and clamping wafer |
| CN217709660U (en) * | 2022-06-14 | 2022-11-01 | 苏州华星光电技术有限公司 | Thin film deposition equipment |
| CN218482218U (en) * | 2022-10-25 | 2023-02-14 | 江苏弘琪工业自动化有限公司 | Wafer clamping arm |
| CN218602415U (en) * | 2022-11-25 | 2023-03-10 | 上海交震半导体科技有限公司 | Overturning actuating mechanism based on stepping motor control |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117051372A (en) * | 2023-08-08 | 2023-11-14 | 上海悦匠实业有限公司 | Wafer carrying platform lifting device with limit control function |
| CN117051372B (en) * | 2023-08-08 | 2024-04-02 | 上海悦匠实业有限公司 | Wafer carrying platform lifting device with limit control function |
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