JP2018107206A - Transport container connecting device, load port device, transport container storage stocker, and transport container connecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transport container connecting device or the like having a simple structure and excellent durability and maintainability.SOLUTION: A transport container connecting device includes: a movable table capable of approaching and separating from a wall opening; a plurality of support pins that protrude upward from the movable table and support a wafer transport container; a housing part including a fixing base for supporting the movable table and a wall part which extends upward from the fixing base and in which the wall opening is formed; and a clamping mechanism that includes a gripping portion to be engaged with a groove portion formed on the bottom surface of the wafer transport container provided to the support pin and that prevents the wafer transport container from being separated from the support pin, and the clamp mechanism is connected to the housing part separately from the movable table.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a transfer container connecting apparatus and a transfer container connecting method for connecting a wafer transfer container to a wall opening, a load port apparatus having a transfer container connecting apparatus, and a transfer container storage stocker.

  In the semiconductor manufacturing process, wafers are transferred between the processing apparatuses using a wafer transfer container called a FOUP or a FOSB. Such a wafer transfer container has a main opening for taking in and out the wafer and a lid for closing the main opening, and the wafer in the wafer transfer container is stored in a space sealed by the cover.

  When opening the lid of the wafer transfer container and taking out the wafer from the inside of the wafer transfer container or introducing the cleaning gas from the main opening of the wafer, the transfer container connecting device that connects the wafer transfer container to the wall opening is used. It is done. By using the transfer container connecting device, the internal space of the wafer transfer container can be hermetically connected to another space called a mini-environment through a wall opening. , While being isolated from other spaces in the semiconductor factory, can be taken in and out of the wafer transfer container. For example, the transfer container connecting device is provided in the EFEM together with a lid opening / closing mechanism that opens the lid of the wafer transfer container, and constitutes a load port device or the like.

  Further, as a transfer container connecting device, there has been proposed an apparatus having a clamp mechanism for preventing a wafer transfer container being placed from dropping from a movable table (see Patent Document 1). A conventional clamping mechanism is provided in a movable table and moves together with the wafer transfer container and the movable table.

JP 2013-219159 A

  However, in the conventional structure in which the clamp mechanism is connected to the movable table and the clamp mechanism moves together with the movable table, the clamp mechanism is mounted on the movable table, so wiring to the drive unit of the clamp mechanism Alternatively, the mechanism for transmitting power to the clamp mechanism becomes complicated, and there are problems in terms of durability and maintainability. In addition, the conventional transport container connecting device may have problems such as generation of particles due to a complicated mechanism or an increased number of parts that rub when the movable table is moved. Also have issues. Further, such a problem is more conspicuous than a transport container connecting apparatus having a movable table that performs only reciprocating movement in a transport container connecting apparatus having many movable parts, such as a rotating table that rotates a container.

  The present invention has been made in view of such a situation, has a simple structure, a transport container connecting device excellent in durability and maintainability, and a transport container performed using such a transport container connecting device and the like. It is to provide a connection method.

In order to achieve the above object, a transport container connecting device according to the present invention comprises:
A transfer container connecting device for connecting a wafer transfer container to a wall opening,
A movable table capable of approaching and separating from the wall opening;
A plurality of support pins that protrude upward from the movable table, have a tip portion that contacts the bottom surface of the wafer transfer container, and support the wafer transfer container;
A casing having a fixed base that supports the movable table, and a wall that extends upward from the fixed base and in which the wall opening is formed;
A clamp mechanism that engages with a groove formed in the bottom surface of the wafer transfer container provided on the support pin, and that prevents the wafer transfer container from being separated from the support pin. And
The clamp mechanism is connected to the housing unit separately from the movable table.

  In the transport container connecting device according to the present invention, the clamp mechanism is separated from the movable table and connected to the casing, and the clamp mechanism itself is not moved along with the movable table. Simple. Therefore, such a transport container connecting device is excellent in maintainability and durability. In addition, since the clamp mechanism and the movable table have a simple structure, problems such as generation of particles can be prevented.

  Further, for example, the clamp mechanism may include a support portion that is connected to the wall portion and protrudes in a direction substantially perpendicular to the wall portion to support the grip portion.

  The clamp mechanism supports the gripping part that engages with the bottom surface of the wafer transfer container at a short distance while avoiding interference with the movable table by supporting the gripping part with a support part that protrudes vertically from the wall part. can do. In particular, the transfer container connecting device lifts the wafer transfer container from the bottom and transfers it, not only from the transfer apparatus that holds the upper part of the wafer transfer container such as OHT (Overhead Hoist Transfer) and transfers the wafer transfer container. Also from the apparatus, when the wafer transfer container can be placed on the movable table, it is necessary to lengthen the support pins that support the bottom surface of the wafer transfer container. In this case, if the support part that protrudes in the vertical direction from the fixed base or the movable table is provided, the support part becomes long like the support pin, and when the force along the moving direction of the movable table acts on the support part, the clamp mechanism Has a problem of being easily deformed. On the other hand, in the case of a support portion that protrudes vertically from the wall portion, the support portion can be used without interfering with the movable table by utilizing the gap between the bottom surface of the wafer transfer container supported by the support pins and the movable table. It is possible to employ a structure that firmly supports the grip portion.

  Further, for example, the movable table is moved together with the first table in a direction approaching and separating from the wall opening, and the second table is moved together with the first table and is rotatable relative to the first table. And a table.

  When the movable table has not only the first table that approaches and separates from the wall opening but also the second table that rotates relative to the first table, the structure of the movable table tends to be complicated. Then, since the clamp mechanism is separated from the movable table and connected to the casing, it is possible to prevent the structure of the movable table from becoming complicated.

A load port device according to the present invention includes any one of the above-described transfer container connection devices and a lid opening / closing mechanism that opens a lid portion of the wafer transfer container.
In addition, a transfer container storage stocker according to the present invention includes any one of the transfer container connection devices described above and a lid opening / closing mechanism that opens a lid portion of the wafer transfer container.

  The transfer container connecting device is used together with a lid opening / closing mechanism that opens the lid of the wafer transfer container, and constitutes a load port device and a transfer container storage stocker. The clamp mechanism can effectively prevent a problem that the wafer transfer container is separated from the support pins due to the influence of vibration or the like generated in the transfer container housing portion of the wafer transfer container when the lid of the wafer transfer container is opened and closed.

Further, the transport container connecting method according to the present invention is as follows.
A transport container connecting method for connecting a wafer transport container to a transport container connecting device having a wall opening for connecting the wafer transport container,
The bottom surface of the wafer transport container is brought into contact with the front ends of a plurality of support pins protruding upward from the movable table in the transport container connecting device, so that the movable table at a separated position separated from the wall opening A mounting step of mounting the wafer transfer container;
Moving the movable table from the separated position to an approach position approaching the wall opening, and connecting the wafer transfer container to the wall opening;
Driving a clamp mechanism that is separated from the movable table and connected to the housing portion of the transfer container connecting device, with respect to the groove formed on the bottom surface of the wafer transfer container connected to the wall opening, A clamping step for engaging a gripping portion of the clamping mechanism and preventing the wafer transfer container from separating from the support pins;
A lid opening step for driving a lid opening / closing mechanism of the transport container connecting device and opening the lid of the wafer transport container connected to the wall opening and engaged with the gripping section;
Have

  In the transport container connecting method according to the present invention, the clamping process is performed using a clamp mechanism that is separated from the movable table and connected to the casing of the transport container connecting apparatus. After and before the lid opening step. Therefore, in the transport container connecting method, it is not necessary to move the clamp mechanism itself together with the movable table, and it is possible to perform using the transport container connecting apparatus with a simple structure of the clamp mechanism and the movable table.

FIG. 1 is a schematic diagram of a load port device 10 according to an embodiment of the present invention. FIG. 2 is a partially enlarged view of the load port device 10 shown in FIG. FIG. 3A is a conceptual diagram showing a placing process in the transport container connecting method by the load port device shown in FIG. 1, and FIG. 3B is a conceptual diagram showing a first rotation process in the transport container connecting method. It is. FIG. 4A is a conceptual diagram showing a first movement process in the transport container connecting method by the load port device shown in FIG. 1, and FIG. 4B is a conceptual diagram showing a clamping process in the transport container connecting method. is there. 5A is a conceptual diagram showing a lid opening process in the transport container connecting method by the load port device shown in FIG. 1, and FIG. 5B is a conceptual diagram showing a lid closing process in the transport container connecting method. is there. 6A is a conceptual diagram illustrating a clamp release process in the transport container connecting method by the load port device illustrated in FIG. 1, and FIG. 6B is a conceptual diagram illustrating a second moving process in the transport container connecting method. It is. FIG. 7 is a conceptual diagram showing a second rotation process in the transport container connecting method by the load port device shown in FIG. 1. FIG. 8 is an external view of the wafer transfer container as viewed obliquely from the rear. FIG. 9 is a flowchart showing a transport container connecting method according to an embodiment of the present invention.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a schematic perspective view of a load port device 40 having a transport container connecting device 40a according to an embodiment of the present invention. The load port device 40 includes a transfer container connecting device 40a for connecting the wafer transfer container 20 to the wall opening 48a as shown in FIG. 8, a door 62 for closing the wall opening 48a, and a door driving unit (not shown) for moving the door 62. And a lid opening / closing mechanism 60 having the lid portion 26 of the wafer transfer container 20.

  The transport container connecting device 40 a in the load port device 40 includes a movable table 41, a support pin 45 provided on the upper surface of the movable table 41, a fixed base 47 that supports the movable table 41, and a wall 48 that extends upward from the fixed base 47. It has the housing | casing part 46 which has, the clamp mechanism 50, and the information reading part 70. The transfer container connecting device 40a connects the wafer transfer container 20 to a wall opening 48a formed in the wall portion 48 (see FIG. 5A and the like). Note that a transfer container connecting method for connecting the wafer transfer container 20 to the wall opening 48a using the load port device 40 will be described later with reference to FIG.

  As shown in FIG. 3A, the wafer transfer container 20 is placed on the load port device 40. The wafer transfer container 20 is a container for transferring a wafer in a semiconductor factory or the like, and examples thereof include a FOUP and a FOSB that comply with the SEMI standard. However, the wafer transfer container 20 is not limited to this, and other containers that can transfer or store the wafer in a sealed manner are also included in the wafer transfer container 20.

  The wafer transfer container 20 has a substantially rectangular or cubic box-shaped outer shape. The wafer transfer container 20 is provided with a container housing part 22 in which a main opening 22a for loading and unloading a wafer is formed on the side surface, and a cover that covers the main opening 22a. Part 26. On the bottom surface 22 b of the container housing portion 22, a groove portion 22 ba is provided that engages the grip portion 52 in the clamp mechanism 50 of the load port device 40. In addition, although groove part 22ba in the wafer conveyance container 20 which concerns on embodiment does not have a side wall which plugs up the both sides of a X-axis direction, groove part 22ba may have a side wall which plugs up the both sides of a X-axis direction. Further, the shape of the groove 22ba may be another shape having an opening in the same direction as the main opening 22a, and is not particularly limited.

  As shown in FIG. 8, the wafer transport container 20 relates to the wafer transport container 20 or the wafer accommodated in the wafer transport container 20 on the side surface opposite to the side surface where the main opening 22 a is formed in the container housing portion 22. An information recording unit 25 that records information is provided. Examples of the information recording unit 25 include a barcode and an IC tag (RF tag). However, the information recording unit 25 is not particularly limited as long as the information can be read from the outside.

  As shown in FIGS. 1 and 2, the movable table 41 in the load port device 40 is provided on a fixed base 47 and can reciprocate on the fixed base 47 in the Y-axis direction. The movable table 41 can be moved toward and away from a wall opening 48a formed in the wall 48 extending upward from the side (negative Y-axis) end of the fixed base 47 by reciprocating movement in the Y-axis direction. It is.

  As shown in FIG. 2, the movable table 41 has a first table 42 and a second table 43. The first table 42 has a substantially rectangular flat plate shape, is disposed below the second table 43, and slides on the fixed base 47 in the Y-axis direction. Examples of the driving unit for moving the first table 42 include an air cylinder and a linear motor, but are not particularly limited. The first table 42 reciprocates in the Y-axis direction with the second table 43 placed on top. The movable table 41 including the first table 42 and the first table 42 is separated from the wall opening 48a as shown in FIGS. 3 and 7, and to the wall opening 48a as shown in FIGS. On the other hand, it reciprocates between the approach positions approached.

  The second table 43 is placed over the first table 42. The second table 43 has a substantially octagonal flat plate shape and has the same area as the first table 42, but the shape and area of the second table 43 are not particularly limited. As can be understood from FIGS. 3B and 4A, the second table 43 reciprocates in the Y-axis direction together with the first table 42. Further, as shown in FIG. 3A and FIG. 3B, the second table 43 can rotate relative to the first table 42 at a separated position separated from the wall opening 48a. When the second table 43 relatively rotates, the center position of the relative rotation substantially coincides with the center position of the first table 42 and the second table 43, but the center of rotation of the second table 43 is not particularly limited.

  As shown in FIG. 2, three support pins 45 and three seating sensors 44 are provided on the surface of the movable table 41. The support pin 45 protrudes upward from the movable table 41, and the tip 45a of the support pin 45 contacts the bottom surface 22b of the wafer transfer container 20 to support the wafer transfer container 20 as shown in FIG. To do.

  As shown in FIG. 2, the base end of the support pin 45 is fixed to a second table 43 disposed on the upper side of the movable table 41. The three support pins 45 are arranged on the surface of the second table 43 so as to be separated from each other. In the present embodiment, the three support pins 45 are arranged so as to constitute the apex of a substantially equilateral triangle. . As shown in FIG. 3A, the three support pins 45 have the same length, and the three support pins 45 support the bottom surface 22 b of the wafer transfer container 20 with respect to the movable table 41. Play the role of a pillar. The bottom surface 22b of the wafer transfer container 20 is placed at a position away from the surface of the second table 43 on which the base ends of the support pins 45 are disposed by a length substantially corresponding to the length of the support pins 45. Placed. Although the length of the support pin 45 is not specifically limited, For example, it can be 10-130 mm.

  Each seating sensor 44 is provided adjacent to each of the three support pins 45. The seating sensor 44 of the present embodiment is a contact-type sensor that contacts the bottom surface 22b of the transport container 30 provided on the support pin 45 and detects the placement of the wafer transport container 20, but the seating sensor 44 is a wafer transport sensor. As long as it is possible to detect the placement of the container 20 on the support pins 45, a non-contact sensor such as an optical sensor may be used. Moreover, although the load port apparatus 40 of this embodiment has the three support pins 45 and the three seating sensors 44, if the number of the support pins 45 and the seating sensors 44 is plural, it will not be specifically limited.

  As shown in FIG. 1, the housing portion 46 of the load port device 40 includes a fixed base 47 that supports the movable table 41 and a wall portion 48 that extends upward from the fixed base 47. The height of the fixed base 47 is such that the arm that supports the bottom surface 22b of the wafer transfer container 20 in the transfer robot that transfers the wafer transfer container 20 is the upper surface of the movable table 41 (second table 43) and the tip 45a of the support pin 45. It is adjusted to be inserted at a height between.

  As shown in FIG. 1, the wall 48 is provided at the end of the fixed base 47 on the Y axis negative direction side. The wall portion 48 extends further upward from the upper surface of the fixed base 47 provided with the movable table 41, and the wall opening 48 a formed in the wall portion 48 is disposed above the movable table 41. The load port device 40 includes a lid opening / closing mechanism 60 that opens and closes the wall opening 48 a together with the lid portion 26 of the wafer transfer container 20. The lid opening / closing mechanism 60 has a door 62 that opens and closes the wall opening 48 a, and the door 62 includes an engagement pin 62 a for engaging with the lid portion 26 of the wafer transfer container 20. Further, the lid opening / closing mechanism 60 has a door drive unit for driving the door 62, and the lid opening / closing mechanism 60 is engaged with the lid portion 26 of the wafer transfer container 20, as shown in FIG. By moving the door 62, the lid portion 26 is removed from the container housing portion 22, and the main opening 22a of the wafer transfer container 20 is opened.

  As shown in FIG. 1, the information reading unit 70 provided in the fixed base 47 is provided on the upper surface of the fixed base 47 so as to be movable up and down. As shown in FIG. 3B, the information reading unit 70 moves the scanner 70a, the transmission / reception unit, and the like for reading information from the information recording unit 25 provided in the wafer transport container 20 up and down. And a movable support portion 70b to be moved. The information reading unit 70 can retract the scanner 70 a and the transmission / reception unit downward so as not to hinder the rotation operation of the wafer transfer container 20. Further, when reading the information in the information recording unit 25, the information reading unit 70 moves the scanner 70 a and the transmission / reception unit upward to approach the information recording unit 25, or to the information recording unit 25 of the scanner 70 a and the transmission / reception unit. You can adjust the angle.

  As shown in FIG. 2, the load port apparatus 10 includes a clamp mechanism 50 that prevents the wafer transfer container 20 from being separated from the support pins 45. The clamp mechanism 50 is separated from the movable table 41 and connected to the wall portion 48 of the housing portion 46. As shown in FIG. 3A, the clamp mechanism 50 includes a grip portion 52, a clamp support portion 53, and a clamp drive portion 54. As shown in FIG. 5B, the grip portion 52 engages with a groove portion 22 ba formed on the bottom surface 22 b of the wafer transfer container 20 provided on the support pin 45, and the wafer transfer container 20 moves away from the support pin 45. To prevent.

  As shown in FIG. 3A, the clamp support portion 53 of the clamp mechanism 50 supports the grip portion 52 so that the grip portion 52 can be rotated by the clamp drive portion 54. The base end of the clamp support portion 53 is connected to the wall portion 48, and the clamp support portion 53 protrudes in the Y-axis direction, which is a direction substantially perpendicular to the wall portion 48 extending in the Z-axis direction, and near the distal end portion. The holding part 52 is supported.

  As shown in FIG. 3A, the clamp drive unit 54 of the clamp mechanism 50 has an air cylinder that expands and contracts in the Y-axis direction, and the base end of the clamp drive unit 54 is connected to the wall 48. Has been. The tip of the clamp drive unit 54 is connected to the grip unit 52. When the air cylinder of the clamp drive unit 54 extends in the Y-axis direction, the grip unit 52 rotates counterclockwise when viewed from the X-axis positive direction side. Then, the engagement between the grip portion 52 and the groove portion 22ba of the wafer transfer container 20 is released. Further, when the air cylinder of the clamp driving unit 54 is contracted, the gripping part 52 is rotated clockwise as viewed from the X axis positive direction side, and the gripping part 52 and the groove part 22ba of the wafer transfer container 20 are engaged. However, the clamp drive unit 54 is not limited to the one having an air cylinder, and may have a motor or other drive unit that moves the gripping unit 52.

  9 is a flowchart showing an example of a transfer container connecting method for connecting the wafer transfer container 20 to the wall opening 48a of the load port apparatus 10 shown in FIG. 1, and FIGS. 3 to 7 show the load port apparatus in each step. FIG. 4 is a conceptual diagram showing the state of 40 and the wafer transfer container 20. In the example shown in FIGS. 3 to 7, the load port device 10 functions as an interface device that connects the wafer transfer container 20 to the millienvironment of the EFEM 80. Hereinafter, an example of the transport container connecting method by the load port device 10 will be described with reference to FIGS. 3 to 7, for convenience of explanation, only the wall 48 and the EFEM are shown in cross section.

  In the mounting step of step S001 in FIG. 9, the transfer device that transfers the wafer transfer container 20 places the wafer transfer container 20 on the movable table 41 that is in a separated position separated from the wall opening 48a. FIG. 3A is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the mounting process. As shown in FIG. 3A, the transfer device places the wafer transfer container 20 by bringing the bottom surface 22b of the wafer transfer container 20 into contact with the tip 45a of the support pin 45 protruding upward from the movable table 41. Put. The transfer device may be an OHT, or may lift the wafer transfer container 20 from the bottom surface 22b with an arm. In the case of a transfer container that lifts the bottom surface 22b of the wafer transfer container 20 with an arm, the arm that supports the wafer transfer container 20 passes between the three support pins 45 and moves back and forth in the Y-axis direction. It can be installed in the correct position. The length of the support pins 45 is preferably set to a length that allows the arm of the transfer device of the wafer transfer container 20 to pass between the bottom surface 22b of the wafer transfer container 20 and the movable table 41.

  In addition, as shown in FIG. 3A, in the mounting process of step S001, the wafer transfer container 20 has a main opening 22a in a direction opposite to the side where the wall opening 48a is located (the Y-axis negative direction side) ( It is placed on the support pin 45 and the movable table 41 in a posture facing the Y axis positive direction). Further, the information reading unit 70 (see FIG. 3B) provided in the fixed base 47 is accommodated in the fixed base 47 so as not to interfere with the mounting operation of the wafer transfer container 20.

  In the first rotation process of step S002 in FIG. 9, the control unit of the load port apparatus 10 rotates the second table 43 in the movable table 41 at the separation position to change the orientation of the main opening 22a of the wafer transfer container 20. . FIG. 3B is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the first rotation process. As shown in FIG. 3B, the wafer transfer container 20 is rotated by approximately 180 degrees as shown by an arrow 91 in the first rotation process, and the main opening 22a of the wafer transfer container 20 after the rotation is formed by a wall opening 48a. It faces the Y axis negative direction which is a certain side.

  In the first rotation process, the control unit of the load port device 10 drives the movable support unit 70b of the information reading unit 70 during or before the rotation of the second table 43, as indicated by an arrow 92. The scanner 70a is raised. Further, the information reading unit 70 reads the information in the information recording unit 25 provided in the wafer transfer container 20 before the wafer transfer container 20 starts to move in the first moving process which is the next process.

  In the first movement process of step S003 in FIG. 9, the control unit of the load port device 10 moves from the separated position shown in FIG. 3B to an approach position approaching the wall opening 48a as shown in FIG. 4A. Then, the movable table 41 is moved to connect the wafer transfer container 20 to the wall opening 48 a of the load port device 40. FIG. 4A is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the first movement process. As shown in FIG. 4A, the first table 42 in the movable table 41 is slid in the negative Y-axis direction as indicated by an arrow 93 by the first movement process, and the movable table 41 and the wafer transfer container 20 are moved. Move to the approach position.

  The approach position shown in FIG. 4A is a dock position where the wafer transfer container 20 is connected to the wall opening 48a, and the wafer transfer container 20 contacts the wall portion 48 around the wall opening 48a at the approach position. However, at the stage where the first movement process is completed, the main opening 22 a of the wafer transfer container 20 is closed by the lid portion 26 (see FIG. 5), and the wall opening 48 a is also closed by the door 62. Therefore, at this stage, the inside of the wafer transfer container 20 and the mini-environment in the EFEM 80 are not connected.

  In the clamping process of step S004 in FIG. 9, the control unit of the load port device 40 drives the clamping mechanism 50, and the gripping part 52 included in the clamping mechanism 50 with respect to the groove 22ba formed on the bottom surface 22b of the wafer transfer container 20. Engage. FIG. 4B is a conceptual diagram showing the state of the wafer transport container 20 and the load port device 40 in the clamping process. As shown in FIG. 4B, in the clamping process, the clamp driving portion 54 in the clamping mechanism 50 is driven so that the air cylinder contracts, so that the gripping portion 52 rotates counterclockwise as indicated by an arrow 94. The grip portion 52 engages with the groove portion 22ba of the wafer transfer container 20.

  In the clamping process, the wafer transfer container 20 is connected to the wall opening 48 a of the load port device 40. That is, the position of the grip portion 52 in the clamp mechanism 50 is the groove portion 22ba formed on the bottom surface 22b of the wafer transfer container 20 when the movable table 41 is moved to the approach position and the wafer transfer container 20 is connected to the wall opening 48a. The grip 52 is adjusted so that it can be engaged. By engaging the grip portion 52 with the groove portion 22ba of the wafer transfer container 20 by the clamping process, it is possible to prevent the bottom surface 22b of the wafer transfer container 20 from being separated from the tip portion 45a of the support pin 45.

  In the lid opening process of step S005 in FIG. 9, the controller of the load port device 10 drives the lid opening / closing mechanism including the door 62 to connect to the wall opening 48a, and the grip 52 is engaged with the groove 22ba. The lid portion 26 of the wafer transfer container 20 is opened. FIG. 5A is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the lid opening process. As shown in FIG. 5A, in the lid opening process, the lid portion 26 of the wafer transfer container 20 and the door 62 are engaged, and the door 62 engaged with the lid portion 26 is further EFEM 80 as indicated by an arrow 96. The lid portion 26 of the wafer transfer container 20 is opened by moving to the mini-environment side. Thereby, the main opening 22a of the wafer transfer container 20 is opened, and the interior of the wafer transfer container 20 communicates with the mini-environment in the EFEM 80.

  As shown in FIG. 5A, in the state where the main opening 22a of the wafer transfer container 20 is opened and the interior of the wafer transfer container 20 communicates with the mini-environment in the EFEM 80, the wafer is transferred from the wafer transfer container 20. A step of taking out, a step of returning a wafer that has been processed in another processing apparatus into the wafer transfer container 20, a step of cleaning the inside of the wafer transfer container 20, and the like are performed. In the lid opening process in step S005, for example, when a negative pressure is formed inside the wafer transfer container 20, a certain amount of vibration is applied to the container casing 22 at the moment when the lid 26 is opened. May occur. However, as described above, in the load port device 40, since the grip portion 52 of the clamp mechanism 50 is engaged with the groove portion 22ba of the wafer transfer container 20, the wafer transfer container 20 is supported by the support pin by the vibration generated in the lid opening process. The problem of leaving 45 can be prevented.

  In the lid closing process of step S006 in FIG. 9, the controller of the load port device 10 drives the lid opening / closing mechanism including the door 62, thereby closing the lid 26 of the wafer transfer container 20 connected to the wall opening 48a. . FIG. 5B is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the lid closing process. As shown in FIG. 5B, in the lid closing process, the door 62 engaged with the lid portion 26 of the wafer transfer container 20 is returned to the position where the wall opening 48a is closed as indicated by the arrow 97, thereby the wafer transfer container. The 20 lid portions 26 are closed. Thereby, the main opening 22a of the wafer transfer container 20 is closed, and the wafer transfer container 20 is sealed.

  In the lid closing step, after the lid portion 26 of the wafer transfer container 20 is closed, the engagement between the lid portion 26 of the wafer transfer container 20 and the door 62 is released.

  In the clamp release process of step S007 in FIG. 9, the control unit of the load port device 10 drives the clamp mechanism 50 to release the engagement between the groove 22ba of the wafer transfer container 20 and the grip 52 of the clamp mechanism 50. FIG. 6A is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the clamp release process. As shown in FIG. 6A, in the clamp releasing step, the clamp driving unit 54 in the clamp mechanism 50 is driven so that the air cylinder extends. As a result, the gripping portion 52 rotates clockwise as indicated by an arrow 98, and the gripping portion 52 is detached from the groove 22ba of the wafer transfer container 20.

  In the second movement process of step S008 in FIG. 9, the control unit of the load port device 40 moves the movable table 41 from the approach position shown in FIG. 6 (a) to the separation position shown in FIG. 6 (b). FIG. 6B is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the second movement process. As shown in FIG. 6B, the first table 42 in the movable table 41 is slid in the positive direction of the Y axis as shown by the arrow 99 in the second movement process, and the movable table 41 and the wafer transfer container 20 are moved. , Move to the separation position. Thereby, the wafer transfer container 20 and the wall opening 48a are separated from each other, and the connection between the wafer transfer container 20 and the wall opening 48a is released.

  In the second rotation process of step S009 in FIG. 9, the control unit of the load port apparatus 10 rotates the second table 43 in the movable table 41 at the separation position, and changes the direction of the main opening 22a of the wafer transfer container 20. . FIG. 7 is a conceptual diagram showing the state of the wafer transfer container 20 and the load port device 40 in the second rotation process. As shown in FIG. 7, the wafer transfer container 20 is rotated by approximately 180 degrees as indicated by an arrow 111 in the second rotation process, and the main opening 22a of the wafer transfer container 20 after the rotation is on the side where the wall opening 48a is located. Points in the positive direction of the Y axis, which is the opposite direction. As a result, the position and orientation of the wafer transfer container 20 return to the state when placed by the transfer device in step S001.

  In the unloading process of step S010 in FIG. 9, the transfer device that transfers the wafer transfer container 20 unloads the wafer transfer container 20 from the load port device 40, and moves the wafer transfer container to another device other than the load port device 40. . The transfer device may be an OHT, or may lift the wafer transfer container 20 from the bottom surface 22b with an arm. Further, the transport device used in the carry-out process in step S010 may be the same as or different from the transport device used in the mounting process in step S001.

  By performing the transfer container connecting step as shown in FIG. 9, the load port device 40 connects the wafer transfer container 20 to the wall opening 48a and opens the lid portion 26 of the wafer transfer container 20 to open the wafer transfer container 20. The inside of the wafer transfer container 20 can be cleaned by taking out the wafer in the wafer or introducing a cleaning gas into the wafer transfer container 20.

  As described above, in the load port device 40 according to the present embodiment, the clamp mechanism 50 is separated from the movable table 41 and connected to the housing unit 46. Since such a load port device 40 does not move the clamping mechanism 50 itself with the movable table 41, the structure of the clamping mechanism 50 and the movable table 41 is simple. Therefore, such a load port device 40 is excellent in maintainability and durability. Moreover, since the clamp mechanism 50 and the movable table 41 have a simple structure, problems such as generation of particles can be prevented.

  Further, in the lid opening process in which a large vibration may occur with respect to the wafer transfer container 20, the wafer transfer container 20 is fixed to the support pin 45 by the clamp mechanism 50. The problem of falling off 45 and the movable table 41 can be prevented. Note that the load port device 40 does not clamp the wafer transfer container 20 in the moving steps S003 and S008 and the rotating steps S002 and S009. However, in these processes, since there is very little possibility of large vibrations occurring on the wafer transfer container 20, the wafer transfer container 20 is pressed against the support pins 45 by its own weight and is stably supported by the support pins 45. .

  In addition, the clamp mechanism 50 of the load port device 40 has a structure in which the clamp support portion 53 that protrudes vertically from the wall portion 48 supports the grip portion 52, so that it can avoid the interference with the movable table 41 and the wafer at a short distance. The grip portion 52 that engages with the bottom surface 22b of the transport container 20 can be supported. Since the load port device 40 has a long support pin 45 that supports the bottom surface 22b of the wafer transfer container 20, even if the load transfer device 40 is a transfer device that lifts and transfers the wafer transfer container 20 from the bottom surface 22b, the load transport device 20 is loaded with the load port device 40. Can be mounted. In this case, in the configuration in which the clamp support part protruding in the vertical direction from the fixed base 47 and the movable table 41 is provided, the clamp support part becomes long, and a problem arises in the durability of the clamp support part. On the other hand, in the case of the load port device 10 having the clamp support portion 53 protruding vertically from the wall portion 48, a gap between the bottom surface 22 b of the wafer transfer container 20 supported by the support pins 45 and the movable table 41 is used. By doing so, the clamp support portion 53 can firmly support the grip portion 52 without interfering with the movable table 41.

  Needless to say, the present invention is not limited to the above-described embodiment, and includes other examples and modifications. For example, in the present embodiment, the clamp support portion 53 of the clamp mechanism 50 protrudes vertically from the wall portion 48, but the clamp support portion may be connected to the fixed base 47 and protrude upward from the fixed base 47. Good. In this case, the movable table 41 of the load port device 40 is formed with a cut or the like for avoiding interference with the clamp support portion.

  In the above-described embodiment, the example in which the transfer container connecting device 40a is adopted as the load port device 40 has been described. However, the transfer container connecting device 40a may be a transfer container storage stocker for storing the wafer transfer container 20 or the like. The cleaning device may be used for cleaning the wafer transfer container 20.

DESCRIPTION OF SYMBOLS 20 ... Wafer transfer container 22 ... Container housing | casing part 22a ... Main opening 22b ... Bottom 22ba ... Groove part 25 ... Information recording part 26 ... Cover part 40 ... Load port apparatus 40a ... Transfer container connection apparatus 41 ... Movable table 42 ... 1st table 43 ... Second table 44 ... Seating sensor 45 ... Support pin 45a ... Tip 46 ... Housing part 47 ... Fixing base 48 ... Wall 48a ... Wall opening 50 ... Clamp mechanism 52 ... Grip 53 ... Clamp support 54 ... Clamp Drive unit 60 ... Lid opening / closing mechanism 62 ... Door 62a ... Engagement pin 70 ... Information reading unit 70a ... Scanner 70b ... Movable support unit 80 ... EFEM

Claims (6)

A transfer container connecting device for connecting a wafer transfer container to a wall opening,
A movable table capable of approaching and separating from the wall opening;
A plurality of support pins that protrude upward from the movable table, have a tip portion that contacts the bottom surface of the wafer transfer container, and support the wafer transfer container;
A casing having a fixed base that supports the movable table, and a wall that extends upward from the fixed base and in which the wall opening is formed;
A clamp mechanism that engages with a groove formed in the bottom surface of the wafer transfer container provided on the support pin, and that prevents the wafer transfer container from being separated from the support pin. And
The transfer container connecting device, wherein the clamp mechanism is connected to the housing unit separately from the movable table.   2. The transport container connecting device according to claim 1, wherein the clamp mechanism includes a support portion that is connected to the wall portion and protrudes in a direction substantially perpendicular to the wall portion to support the grip portion. .   The movable table includes: a first table that moves in a direction toward and away from the wall opening; and a second table that moves together with the first table and is rotatable relative to the first table. The wafer transfer container connecting device according to claim 1, wherein the wafer transfer container connecting device is provided. The transport container connecting device according to any one of claims 1 to 3,
A lid opening / closing mechanism for opening the lid of the wafer transfer container;
Having a load port device. The transport container connecting device according to any one of claims 1 to 3,
A lid opening / closing mechanism for opening the lid of the wafer transfer container;
Transport container storage stocker. A transport container connecting method for connecting a wafer transport container to a transport container connecting device having a wall opening for connecting the wafer transport container,
The bottom surface of the wafer transport container is brought into contact with the front ends of a plurality of support pins protruding upward from the movable table in the transport container connecting device, so that the movable table at a separated position separated from the wall opening A mounting step of mounting the wafer transfer container;
Moving the movable table from the separated position to an approach position approaching the wall opening, and connecting the wafer transfer container to the wall opening;
Driving a clamp mechanism that is separated from the movable table and connected to the housing portion of the transfer container connecting device, with respect to the groove formed on the bottom surface of the wafer transfer container connected to the wall opening, A clamping step for engaging a gripping portion of the clamping mechanism and preventing the wafer transfer container from separating from the support pins;
A lid opening step for driving a lid opening / closing mechanism of the transport container connecting device and opening the lid of the wafer transport container connected to the wall opening and engaged with the gripping section;
A transport container connecting method.

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