TWI633817B - Coreless assembly support substrate - Google Patents

Coreless assembly support substrate Download PDF

Info

Publication number
TWI633817B
TWI633817B TW106114233A TW106114233A TWI633817B TW I633817 B TWI633817 B TW I633817B TW 106114233 A TW106114233 A TW 106114233A TW 106114233 A TW106114233 A TW 106114233A TW I633817 B TWI633817 B TW I633817B
Authority
TW
Taiwan
Prior art keywords
copper foil
layer
ultra
thin copper
carrier
Prior art date
Application number
TW106114233A
Other languages
English (en)
Chinese (zh)
Other versions
TW201731355A (zh
Inventor
立岡步
Original Assignee
三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金屬鑛業股份有限公司 filed Critical 三井金屬鑛業股份有限公司
Publication of TW201731355A publication Critical patent/TW201731355A/zh
Application granted granted Critical
Publication of TWI633817B publication Critical patent/TWI633817B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW106114233A 2013-11-22 2014-11-21 Coreless assembly support substrate TWI633817B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013241584 2013-11-22
JP2013-241584 2013-11-22

Publications (2)

Publication Number Publication Date
TW201731355A TW201731355A (zh) 2017-09-01
TWI633817B true TWI633817B (zh) 2018-08-21

Family

ID=53179631

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106114233A TWI633817B (zh) 2013-11-22 2014-11-21 Coreless assembly support substrate
TW103140381A TWI589201B (zh) 2013-11-22 2014-11-21 Manufacturing method of a printed circuit board having a buried circuit and a printed circuit board obtained by the manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103140381A TWI589201B (zh) 2013-11-22 2014-11-21 Manufacturing method of a printed circuit board having a buried circuit and a printed circuit board obtained by the manufacturing method

Country Status (5)

Country Link
JP (2) JP6753669B2 (ko)
KR (2) KR20160089364A (ko)
CN (2) CN107708314B (ko)
TW (2) TWI633817B (ko)
WO (1) WO2015076372A1 (ko)

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CN107708314B (zh) * 2013-11-22 2021-01-01 三井金属矿业株式会社 无芯堆积支持基板以及用该无芯堆积支持基板制造的印刷线路板
KR20160095487A (ko) * 2015-02-03 2016-08-11 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6546526B2 (ja) * 2015-12-25 2019-07-17 三井金属鉱業株式会社 キャリア付銅箔及びコアレス支持体用積層板、並びに配線層付コアレス支持体及びプリント配線板の製造方法
WO2017149810A1 (ja) 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
KR102179799B1 (ko) * 2016-10-06 2020-11-17 미쓰이금속광업주식회사 다층 배선판의 제조 방법
JP7032578B2 (ja) * 2019-01-11 2022-03-08 三井金属鉱業株式会社 積層体
CN110996540B (zh) * 2019-12-31 2022-02-08 生益电子股份有限公司 一种pcb的制作方法
WO2022115280A1 (en) * 2020-11-24 2022-06-02 Corning Incorporated Substrates for microled and micro-electronics transfer
CN113380529A (zh) * 2021-05-13 2021-09-10 江苏普诺威电子股份有限公司 单层无线充电线圈载板的加工工艺
KR102429384B1 (ko) * 2021-07-02 2022-08-04 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법
CN113473721A (zh) * 2021-07-08 2021-10-01 江西柔顺科技有限公司 一种柔性印刷电路板及其制备方法
WO2023016061A1 (zh) * 2021-08-09 2023-02-16 广州方邦电子股份有限公司 金属箔、线路板及线路板的制备方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
TW201212743A (en) * 2010-03-30 2012-03-16 Hitachi Chemical Co Ltd Composite metal layer provided with supporting body metal foil, wiring board using the composite metal layer, method for manufacturing the wiring board, and method for manufacturing semiconductor package using the wiring board
TW201218323A (en) * 2010-09-29 2012-05-01 Hitachi Chemical Co Ltd Method for manufacturing package substrate for semiconductor element mounting
TW201242471A (en) * 2011-03-30 2012-10-16 Mitsui Mining & Smelting Co Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method

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US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
US6930256B1 (en) * 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
JP4517564B2 (ja) * 2002-05-23 2010-08-04 住友金属鉱山株式会社 ２層銅ポリイミド基板
EP1531656A3 (en) * 2003-11-11 2007-10-03 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP2008258636A (ja) * 2003-11-14 2008-10-23 Hitachi Chem Co Ltd 内層導体回路処理方法
JP4756637B2 (ja) * 2005-11-10 2011-08-24 三井金属鉱業株式会社 硫酸系銅電解液及び該硫酸系銅電解液を用いて得られた電解銅箔
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
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JP2010157605A (ja) * 2008-12-26 2010-07-15 Panasonic Electric Works Co Ltd 回路基板及び回路基板の製造方法
KR101298999B1 (ko) * 2009-09-01 2013-08-23 일진머티리얼즈 주식회사 미세회로 형성을 위한 임베디드용 동박
JP5672524B2 (ja) * 2010-07-02 2015-02-18 日立化成株式会社 半導体素子搭載用パッケージ基板の製造方法
CN101892499B (zh) * 2010-07-24 2011-11-09 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
CN107708314B (zh) * 2013-11-22 2021-01-01 三井金属矿业株式会社 无芯堆积支持基板以及用该无芯堆积支持基板制造的印刷线路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201212743A (en) * 2010-03-30 2012-03-16 Hitachi Chemical Co Ltd Composite metal layer provided with supporting body metal foil, wiring board using the composite metal layer, method for manufacturing the wiring board, and method for manufacturing semiconductor package using the wiring board
TW201218323A (en) * 2010-09-29 2012-05-01 Hitachi Chemical Co Ltd Method for manufacturing package substrate for semiconductor element mounting
TW201242471A (en) * 2011-03-30 2012-10-16 Mitsui Mining & Smelting Co Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method

Also Published As

Publication number Publication date
JP6753669B2 (ja) 2020-09-09
JP2017224848A (ja) 2017-12-21
CN107708314B (zh) 2021-01-01
TWI589201B (zh) 2017-06-21
JPWO2015076372A1 (ja) 2017-03-16
WO2015076372A1 (ja) 2015-05-28
KR20170104648A (ko) 2017-09-15
JP6753825B2 (ja) 2020-09-09
CN107708314A (zh) 2018-02-16
KR20160089364A (ko) 2016-07-27
CN105746003A (zh) 2016-07-06
CN105746003B (zh) 2018-12-21
TW201731355A (zh) 2017-09-01
TW201536134A (zh) 2015-09-16

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