TWI625425B - 蝕刻液、補給液以及銅配線的形成方法 - Google Patents

蝕刻液、補給液以及銅配線的形成方法 Download PDF

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Publication number
TWI625425B
TWI625425B TW103141630A TW103141630A TWI625425B TW I625425 B TWI625425 B TW I625425B TW 103141630 A TW103141630 A TW 103141630A TW 103141630 A TW103141630 A TW 103141630A TW I625425 B TWI625425 B TW I625425B
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TW
Taiwan
Prior art keywords
aromatic heterocyclic
etching
ring
heterocyclic compound
group
Prior art date
Application number
TW103141630A
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English (en)
Chinese (zh)
Other versions
TW201529896A (zh
Inventor
小寺浩史
高垣愛
Original Assignee
Mec股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mec股份有限公司 filed Critical Mec股份有限公司
Publication of TW201529896A publication Critical patent/TW201529896A/zh
Application granted granted Critical
Publication of TWI625425B publication Critical patent/TWI625425B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW103141630A 2013-12-06 2014-12-01 蝕刻液、補給液以及銅配線的形成方法 TWI625425B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-252804 2013-12-06
JP2013252804 2013-12-06
JP2014-069448 2014-03-28
JP2014069448A JP6164614B2 (ja) 2013-12-06 2014-03-28 エッチング液、補給液及び銅配線の形成方法

Publications (2)

Publication Number Publication Date
TW201529896A TW201529896A (zh) 2015-08-01
TWI625425B true TWI625425B (zh) 2018-06-01

Family

ID=53273335

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103141630A TWI625425B (zh) 2013-12-06 2014-12-01 蝕刻液、補給液以及銅配線的形成方法

Country Status (5)

Country Link
JP (1) JP6164614B2 (ja)
KR (1) KR101775858B1 (ja)
CN (1) CN105980603B (ja)
TW (1) TWI625425B (ja)
WO (1) WO2015083570A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102628632B1 (ko) 2015-06-04 2024-01-23 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
KR20240014578A (ko) 2015-08-13 2024-02-01 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
JP6000420B1 (ja) 2015-08-31 2016-09-28 メック株式会社 エッチング液、補給液及び銅配線の形成方法
JP6218000B2 (ja) * 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
KR101699798B1 (ko) * 2016-08-02 2017-01-25 와이엠티 주식회사 구리 에칭 조성물 및 이를 이용한 구리 배선 형성방법
JP6273524B2 (ja) * 2016-08-30 2018-02-07 メック株式会社 エッチング液、補給液及び銅配線の形成方法
US10398034B2 (en) * 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
JP6736088B2 (ja) * 2017-05-22 2020-08-05 メック株式会社 エッチング液、補給液および銅配線の形成方法
CN111155091A (zh) * 2020-02-13 2020-05-15 Tcl华星光电技术有限公司 蚀刻液、添加剂及金属布线的制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201432093A (zh) * 2012-12-20 2014-08-16 羅門哈斯電子材料有限公司 有機保焊劑及方法

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JPS5224508B2 (ja) * 1973-11-19 1977-07-01 Tokai Electro Chemical Co
JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
JP4224436B2 (ja) 2003-07-25 2009-02-12 メック株式会社 エッチング剤と補給液及びこれを用いた銅配線の製造方法
JP2006249519A (ja) * 2005-03-11 2006-09-21 Hitachi Chem Co Ltd 銅の表面処理方法及び銅
JP4750645B2 (ja) * 2006-08-11 2011-08-17 日本表面化学株式会社 銅又は銅合金表面の表面処理剤及び処理方法
JP4729455B2 (ja) * 2006-08-16 2011-07-20 日本電信電話株式会社 フィルタ回路
JP4472006B2 (ja) * 2007-09-04 2010-06-02 メック株式会社 エッチング液及び導体パターンの形成方法
JP2009099945A (ja) * 2007-09-28 2009-05-07 Fujifilm Corp 半導体デバイス用洗浄剤及びそれを用いた洗浄方法
TWI467055B (zh) * 2007-12-21 2015-01-01 Wako Pure Chem Ind Ltd 蝕刻劑及蝕刻方法
JP4916455B2 (ja) 2008-01-15 2012-04-11 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物
JP4278705B1 (ja) * 2008-01-16 2009-06-17 メック株式会社 エッチング液
KR101495683B1 (ko) * 2008-09-26 2015-02-26 솔브레인 주식회사 액정표시장치의 구리 및 구리/몰리브데늄 또는 구리/몰리브데늄합금 전극용 식각조성물
JP2011017052A (ja) * 2009-07-09 2011-01-27 Adeka Corp 銅含有材料のウエットエッチングシステム及びパターニング方法
JP5535060B2 (ja) 2010-12-28 2014-07-02 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP2013104104A (ja) * 2011-11-14 2013-05-30 Mec Kk エッチング液、補給液及び銅配線の形成方法
JP5920972B2 (ja) * 2011-12-26 2016-05-24 メック株式会社 配線形成方法およびエッチング液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201432093A (zh) * 2012-12-20 2014-08-16 羅門哈斯電子材料有限公司 有機保焊劑及方法

Also Published As

Publication number Publication date
WO2015083570A1 (ja) 2015-06-11
JP2015129342A (ja) 2015-07-16
JP6164614B2 (ja) 2017-07-19
CN105980603B (zh) 2019-11-22
TW201529896A (zh) 2015-08-01
KR101775858B1 (ko) 2017-09-06
KR20160087862A (ko) 2016-07-22
CN105980603A (zh) 2016-09-28

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