TWI623598B - 可固化封裝劑及其用途 - Google Patents
可固化封裝劑及其用途 Download PDFInfo
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- TWI623598B TWI623598B TW102115307A TW102115307A TWI623598B TW I623598 B TWI623598 B TW I623598B TW 102115307 A TW102115307 A TW 102115307A TW 102115307 A TW102115307 A TW 102115307A TW I623598 B TWI623598 B TW I623598B
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- Prior art keywords
- encapsulant
- curable
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- acrylate
- meth
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- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 194
- 238000003475 lamination Methods 0.000 claims abstract description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 52
- 229920002367 Polyisobutene Polymers 0.000 claims description 47
- 150000003254 radicals Chemical class 0.000 claims description 42
- 239000000203 mixture Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 30
- 229920000098 polyolefin Polymers 0.000 claims description 28
- 239000003999 initiator Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 23
- 125000000524 functional group Chemical group 0.000 claims description 20
- 239000002274 desiccant Substances 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 14
- 239000003085 diluting agent Substances 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 10
- 238000013086 organic photovoltaic Methods 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 239000012855 volatile organic compound Substances 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 5
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229920013639 polyalphaolefin Polymers 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 abstract description 12
- 239000001301 oxygen Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 239000000565 sealant Substances 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 73
- -1 but not limited to Chemical group 0.000 description 50
- 239000010410 layer Substances 0.000 description 43
- 229920001577 copolymer Polymers 0.000 description 23
- 239000002904 solvent Substances 0.000 description 20
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 15
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 15
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 15
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 14
- 239000012943 hotmelt Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 description 13
- 239000005020 polyethylene terephthalate Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 229920013640 amorphous poly alpha olefin Polymers 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000001993 wax Substances 0.000 description 11
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 10
- 239000004014 plasticizer Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 8
- 238000009472 formulation Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000001788 irregular Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 239000011800 void material Substances 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 229920002620 polyvinyl fluoride Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229920001897 terpolymer Polymers 0.000 description 5
- 239000004711 α-olefin Substances 0.000 description 5
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 4
- 150000001241 acetals Chemical class 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 229920002313 fluoropolymer Polymers 0.000 description 4
- 239000004811 fluoropolymer Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 239000012760 heat stabilizer Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 235000019198 oils Nutrition 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920001083 polybutene Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 150000003097 polyterpenes Chemical class 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 238000003847 radiation curing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- 238000011074 autoclave method Methods 0.000 description 3
- 229920005549 butyl rubber Polymers 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000005456 glyceride group Chemical group 0.000 description 3
- 229920006270 hydrocarbon resin Polymers 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000003209 petroleum derivative Substances 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 230000002028 premature Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- ZXEYRBLEYIDXMS-UHFFFAOYSA-N C(C)OC(CCCCCCCCC)C=C Chemical compound C(C)OC(CCCCCCCCC)C=C ZXEYRBLEYIDXMS-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 229920005987 OPPANOL® Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- CVPZXHCZKMFVOZ-UHFFFAOYSA-N [4-(benzoyloxymethyl)cyclohexyl]methyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(CC1)CCC1COC(=O)C1=CC=CC=C1 CVPZXHCZKMFVOZ-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000002480 mineral oil Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000010455 vermiculite Substances 0.000 description 2
- 229910052902 vermiculite Inorganic materials 0.000 description 2
- 235000019354 vermiculite Nutrition 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical group C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- OTMBZPVYOQYPBE-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclododecane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCCCCCCCC1 OTMBZPVYOQYPBE-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- FDIPWBUDOCPIMH-UHFFFAOYSA-N 2-decylphenol Chemical compound CCCCCCCCCCC1=CC=CC=C1O FDIPWBUDOCPIMH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ZUDRIPQIHZFWIY-UHFFFAOYSA-N 3-methoxydodec-1-ene Chemical compound CCCCCCCCCC(OC)C=C ZUDRIPQIHZFWIY-UHFFFAOYSA-N 0.000 description 1
- ACZGCWSMSTYWDQ-UHFFFAOYSA-N 3h-1-benzofuran-2-one Chemical compound C1=CC=C2OC(=O)CC2=C1 ACZGCWSMSTYWDQ-UHFFFAOYSA-N 0.000 description 1
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical class OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 1
- XQMVBICWFFHDNN-UHFFFAOYSA-N 5-amino-4-chloro-2-phenylpyridazin-3-one;(2-ethoxy-3,3-dimethyl-2h-1-benzofuran-5-yl) methanesulfonate Chemical compound O=C1C(Cl)=C(N)C=NN1C1=CC=CC=C1.C1=C(OS(C)(=O)=O)C=C2C(C)(C)C(OCC)OC2=C1 XQMVBICWFFHDNN-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 241000771208 Buchanania arborescens Species 0.000 description 1
- JZMZSAWEHUGDMA-UHFFFAOYSA-N C(=C)C(C(OC)(OC)CC1=CC=CC=C1)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)CC1=CC=CC=C1)CCCCCCCC JZMZSAWEHUGDMA-UHFFFAOYSA-N 0.000 description 1
- QRCXDXYGNVQYNX-UHFFFAOYSA-N C(=C)C(CCCCCCCCC)(OC)OC Chemical compound C(=C)C(CCCCCCCCC)(OC)OC QRCXDXYGNVQYNX-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- WGHCEJWMXXZMLV-UHFFFAOYSA-N ClCCCC(CCCCCCCCC)OC Chemical compound ClCCCC(CCCCCCCCC)OC WGHCEJWMXXZMLV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- 229920002368 Glissopal ® Polymers 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229910010082 LiAlH Inorganic materials 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- PTMFPBJQSIUHSJ-UHFFFAOYSA-N SCCCC(CCCCCCCCC)OC Chemical compound SCCCC(CCCCCCCCC)OC PTMFPBJQSIUHSJ-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229930003268 Vitamin C Natural products 0.000 description 1
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 description 1
- OGBVRMYSNSKIEF-UHFFFAOYSA-L benzyl-dioxido-oxo-$l^{5}-phosphane Chemical compound [O-]P([O-])(=O)CC1=CC=CC=C1 OGBVRMYSNSKIEF-UHFFFAOYSA-L 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229920005557 bromobutyl Polymers 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920005556 chlorobutyl Polymers 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- GVJHHUAWPYXKBD-UHFFFAOYSA-N d-alpha-tocopherol Natural products OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 125000005266 diarylamine group Chemical group 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 238000012682 free radical photopolymerization Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000009474 hot melt extrusion Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000000687 hydroquinonyl group Chemical class C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 125000003473 lipid group Chemical group 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical group CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical compound ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- 239000012802 nanoclay Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 101150005648 polB gene Proteins 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920006126 semicrystalline polymer Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- HLWRUJAIJJEZDL-UHFFFAOYSA-M sodium;2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetate Chemical compound [Na+].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC([O-])=O HLWRUJAIJJEZDL-UHFFFAOYSA-M 0.000 description 1
- 238000007614 solvation Methods 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920000247 superabsorbent polymer Polymers 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 229960001295 tocopherol Drugs 0.000 description 1
- 229930003799 tocopherol Natural products 0.000 description 1
- 239000011732 tocopherol Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical group C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical group [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 235000019154 vitamin C Nutrition 0.000 description 1
- 239000011718 vitamin C Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
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Abstract
本發明係關於用於電子裝置且具有壓敏黏接特性之可固化障壁封裝劑或密封劑。該等封裝劑尤其適用於需要較低層壓溫度分佈之有機電子裝置。封裝劑保護有機電子裝置內的活性有機/聚合組分免於受到諸如濕氣及氧氣之環境要素影響。
Description
本發明係關於用於電子裝置且具有壓敏黏接特性之可固化障壁封裝劑或密封劑。其尤其適用於有機電子裝置封裝。封裝劑保護有機電子裝置內的活性有機或聚合(下文可互換使用)組分免於受到諸如濕氣及氧氣之環境要素影響。
諸如有機光伏打(OPV)、有機發光二極體(OLED)、有機電泳顯示器、有機電鉻顯示器及其類似物之有機電子裝置及電路在社會及商業用途中變得日益流行。舉例而言,OLED在虛擬視圖及直接視圖顯示器,如膝上型電腦、電視、數位手錶、電話、呼叫器、蜂巢式電話、計算器、大面積裝置中具有效用。
已知用於有機電子裝置及電路的多種封裝幾何形狀,且一般而言,此等幾何形狀由安置於基板/後罩板(下文可互換使用)與罩蓋/前罩板(下文可互換使用)之間的活性有機組分組成,且基板及罩蓋由封閉活性有機組分之層壓黏接劑或封裝劑黏接在一起。基板及罩蓋中之一者或兩者由透明材料(例如透明玻璃)及可撓性薄塑膠膜製成。活性有機組分附著於基板,且在一些實施例中,由在基板周邊密封該組分與基板之間的接觸區域之無機障壁塗層、緩衝膜或由無機層及/或有機層構成之塗層覆蓋。在活性有機組分上及障壁塗層(存在時)上施加封裝劑。此封裝劑填充基板與罩蓋之間的空間,封閉活性有機組分且
黏接基板與罩蓋。在一些實施例中,呈小袋或薄膜或厚膜形式之乾燥劑封裝一般在罩蓋中的缺口或空腔中附接於罩蓋,或在罩蓋內的凹槽內提供乾燥劑。
有機電子裝置內之最具活性有機組分對濕氣及氧氣引起的降解敏感。舉例而言,簡單描述之OLED由陽極、發光層及陰極組成。通常使用低功函數金屬層作為陰極以確保高效電子注入及低操作電壓。低功函數金屬對氧氣及濕氣具有化學反應性,且該等反應將限制裝置之壽命。氧氣及濕氣亦將與發光有機材料反應且抑制發光。因此,包圍活性有機組分的封裝經設計以限制氧氣與水蒸氣自環境向活性有機組分傳輸。
具有壓敏黏接特性之封裝劑可用於限制氧氣及水蒸氣之傳輸,且壓敏黏接劑通常提供於兩個聚矽氧離型底膜(襯墊)之間用作封裝劑膜的薄膜中。移除一個襯墊時,曝露之封裝劑膜附接於裝置之罩蓋或基板。隨後,移除第二襯墊,使罩蓋與基板彼此層壓(或附接)。封裝劑膜在長期曝露於應力時必須維持黏接及可撓性。
具有壓敏黏接特性之封裝劑膜或封裝劑(下文可互換使用)可促進裝置之製造通量。儘管針對具有壓敏黏接特性之封裝劑改良製造速度及毒性,但缺點包括裝配期間的差潤濕及空隙形成,因為在裝配溫度下膜的黏度通常高於其液體封裝劑對應物。對於含有諸如電極、匯流排、墨水梯級、積體電路、電線及其類似物之組件之基板而言,此問題由於其不規則表面而加重。為了獲得較佳潤濕且使空隙形成減至最少,一般向未固化封裝劑膜施加熱層壓。然而,有機組分對熱敏感且長期曝露於熱對組分有害。又,因為封裝劑為壓敏黏接膜,所以膜在長期儲存期間必須在室溫下維持最小冷流。
WO 2009/148722及WO 2011/062932揭示基於高(通常大於300,000Da)重量平均分子量(Mw)聚異丁烯之封裝劑的用途。該等封裝劑產生
具有高黏度之壓敏黏接膜,且因此對有機電子裝置中之空隙或氣泡敏感。儘管可提高施加溫度使此問題降至最低,但活性有機組分在約120℃下開始分解。此外,由該高Mw製成之封裝劑藉由溶液澆鑄形成,且除非可利用極端溫度及壓力,否則不以熱熔融物形式經擠壓。
JP2012057065揭示具有壓敏黏接特性之非可固化封裝劑。為了以組分適當潤濕基板且使空隙形成減至最少,在120℃下封裝劑膜之黏度必須保持低於1,000,000cps或低於200,000Da黏度平均分子量(Mv)。此外,熱塑性封裝劑在裝置壽命期間在應力下展現冷流。
因此,此項技術中需要可在低於120℃之溫度下層壓,維持良好黏接,在具有不規則表面之基板上潤濕,使冷流減至最少,且形成無空隙封裝同時允許基板在長期曝露於應力時具有可撓性的可固化封裝劑膜。本發明滿足此需要。
本發明提供適於密封及黏接有機電子裝置之基板及罩蓋以保護裝置之活性有機組分免於受濕氣及氧氣影響的輻射或熱固化封裝劑。輻射或熱固化封裝劑具有壓敏特性,由此允許裝置在長期曝露於應力時維持可撓性及抗蠕變力。封裝劑包含障壁橡膠、輻射或熱反應性障壁樹脂及自由基引發劑。封裝劑可另外包含稀釋劑、蠟、抗氧化劑及/或乾燥劑填充劑。
在一個實施例中,可固化封裝劑包含:(a)Mw為約1,000至約95,000Da之聚異丁烯(PIB);(b)官能化聚異丁烯,其具有(i)約1,000至約95,000Da之Mw(重量平均分子量)及(ii)一個以上自由基反應性官能基,其中自由基反應性官能基選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及(c)自由基引發劑。
封裝劑基本上不含Mw小於約1,000Da的任何丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物,且封裝劑基本上不含增黏劑。本文之術語「基本上不含」指示以全部封裝劑組合物計,封裝劑含有少於5,000ppm(百萬分率)。可固化封裝劑可另外包含具有(i)約1,000至約95,000Da之Mw及(ii)含有一個以上自由基反應性官能基的官能化聚異丁烯之官能化聚烯烴,其中自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基。
在另一實施例中,可固化封裝劑包含:(a)Mw為約1,000至約95,000Da之聚異丁烯;(b)官能化聚烯烴,其具有(i)約1,000至約95,000Da之Mw及(ii)一個以上自由基反應性官能基,其中自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及(c)自由基引發劑。
封裝劑基本上不含Mw小於約1,000Da之任何丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物,且封裝劑基本上不含增黏劑。
在另一實施例中,可固化封裝劑包含:
(a)在190℃下布絡克菲爾德黏度(Brookfield viscosity)小於8,000cps之非晶形聚α烯烴。
(b)具有(i)約1,000至約95,000Da之Mw及(ii)含有一個以上自由基反應性官能基之官能化聚異丁烯的官能化聚烯烴,其中自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及
(c)自由基引發劑;及
(d)增黏劑。
封裝劑基本上不含Mw小於約1,000Da之丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物。
對於上述可固化封裝劑,自由基引發劑係選自由光引發劑及熱引發劑組成之群。具有光引發劑之可固化封裝劑通常以熱熔融物形式形成,且在130℃下,封裝劑之布絡克菲爾德黏度在約10,000至約900,000cps範圍中。具有熱引發劑之可固化封裝劑通常經溶液澆鑄,且在80℃下,封裝劑之布絡克菲爾德黏度在約10,000至約900,000cps範圍中。
在另一實施例中,可固化封裝劑藉由在80℃至約150℃下組合上述封裝劑組分直至形成均質熔融物,擠壓或澆鑄熔融物直至約0.01至約10mm膜厚度且冷卻膜而形成。
在另一實施例中,可固化封裝劑藉由在室溫下組合上述封裝劑組分與溶劑直至形成均質混合物,澆鑄混合物直至約0.01至約10mm膜厚度且蒸發或餾出溶劑而形成。
另一實施例係有關一種形成固化封裝劑裝置之方法,其包含以下步驟:(1)在約50至約120℃之溫度下將上述可固化封裝劑施加於基板的至少一部分上;(2)將罩蓋施加於可固化封裝劑上;及(3)使可固化封裝劑固化
藉此封裝劑固化且黏接基板與罩蓋。
藉由UV照射及/或熱輻射進行可固化封裝劑之固化。在另一實施例中,在步驟(1)中首先將可固化封裝劑施加於罩蓋上,且在步驟(3)中將基板施加於可固化封裝劑上。
另一實施例係有關包含上述固化封裝劑之裝置。裝置包括電子、光電子、OLED、光伏打電池、有機光伏打電池、可撓性薄膜有
機光伏打電池、CIGS光伏打電池及其類似物。
圖1為布絡克菲爾德黏度曲線。
本文引用之所有參考文獻均以全文引用的方式併入本文中。
本文之術語輻射固化係指封裝劑之可固化部分經光化輻射曝露而韌化、硬化或硫化。光化輻射為誘導材料中之化學改變的電磁輻射,且出於本說明書及申請專利範圍之目的將包括電子束固化。在多數情形中,該輻射為紫外線(UV)或可見光。藉由添加適當光引發劑起始此固化。封裝劑藉由直接曝露於紫外線(UV)或可見光或藉由經由聚酯、聚碳酸酯、玻璃及其類似物製成之透明蓋子或蓋板間接曝露而固化。
術語熱固化係指封裝劑之可固化部分藉由曝露於烘箱中之加熱、紅外線(IR)、近IR或微波而韌化、硬化或硫化。熱固化溫度在50-200℃之間,較佳在100-170℃之間。
聚異丁烯(PIB)及PIB稀釋劑實質上為異丁烯之均聚物。其亦可稱為聚丁烯及丁基橡膠。其一般含有每條聚合物鏈少於75%之末端α烯烴。PIB及PIB稀釋劑不含任何其他自由基反應性官能基,包括(但不限於)丙烯酸酯基、(甲基)丙烯酸酯基、苯乙烯C=C鍵、二烯丙基、順丁烯二酸酐及其類似官能基。市售PIB及PIB稀釋劑包括(但不限於)歐巴諾爾(Oppanol)、格力索帕(Glissopal)及印朵泊(Indopol)。儘管此等PIB中許多可含有甚至高達75%末端α C=C鍵,但此等PIB對自由基反應之反應性相對低且不完全,且因此被視為非反應性或非可固化PIB。此外,PIB及PIB稀釋劑之重量平均分子量(Mw)在約1,000至約95,000Da範圍中。PIB稀釋劑通常具有在約1,000至約10,000Da範圍中之Mw。封裝劑中之此等低Mw及低黏度PIB聚合物較佳獲得100%潤
濕及可塗佈熱熔融物。
可固化封裝劑中PIB之量在約10至約90重量%,更佳約70-90重量%範圍中,其以可固化封裝劑之總重量計而不考慮任何溶劑。
例示性非晶形聚α烯烴(APAO)包括乙烯、丙烯及丁烯之無規共聚物或三元共聚物的聚合物,以及其他實質上非晶形或半結晶聚合物。合適地,APAO包括在約20%與約80%之間之共聚物或三元共聚物以及在約20%與約80%之間之其他實質上非晶形或半結晶丙烯-乙烯聚合物。或者,APAO包括在約40%與約60%之間之共聚物或三元共聚物以及在約40%與約60%之間之其他實質上非晶形或半結晶丙烯-乙烯聚合物。APAO可為1-丁烯與乙烯或丙烯之共聚物,或1-丁烯與乙烯及丙烯之三元共聚物,在190℃下布絡克菲爾德黏度小於8,000cps。1-丁烯共聚物應包括約20重量%至約65重量% 1-丁烯,或約30重量%至約55重量% 1-丁烯。或者,APAO可包括具有高達80%乙烯之乙烯-丙烯共聚物。商業上適合之APAO包括Rextac(Rexene LLC)、Eastoflex(Eastman Corporation)、Vestoplast(Evonik Corporation)。適合APAO在190℃下具有小於8,000cps之黏度。熔點低於約100℃之茂金屬催化之半結晶聚烯烴亦可適於可固化封裝劑且替換使用齊格勒-納他(Ziegler Natta)催化劑之APAO。例示性低熔點半結晶聚烯烴包括C2-C6聚烯烴,其重量平均分子量小於約100,000Da且多分散性指數小於約3。此等低熔點半結晶聚烯烴作為Linxar系列由Exxon Mobil市售。
可固化封裝劑中APAO之量在約10至約90重量%,更佳約70-90重量%範圍中,其以可固化封裝劑之總重量計而不考慮任何溶劑。
例示性官能化PIB包括(但不限於)二烯丙基聚異丁烯、二(甲基)丙烯酸酯聚異丁烯及乙烯基封端之聚異丁烯。代表性聚異丁烯(甲基)丙烯酸酯描述於頒予Edison Polymer Innovation Corp.之美國專利5,171,760、頒予Dow Corning Corp.之美國專利5,665,823及Polymer
Bulletin,第6卷,第135頁-第141頁(1981),T.P.Liao及J.P.Kennedy中。代表性聚異丁烯乙烯醚描述於Polymer Bulletin,第25卷,第633頁(1991),J.P.Kennedy及頒予Dow Corning Corp之美國專利6,054,549、6,706,779B2中。較佳官能化PIB為自由基反應性聚異丁烯、丁基橡膠衍生物及其類似物,其以(甲基)丙烯酸或75% α-烯烴官能基封端或接枝。特定言之,官能化聚異丁烯具有(i)約1,000至約95,000Da之Mw且(ii)每條聚合物鏈含有一個以上自由基反應性官能基。官能化PIB由選自以下之自由基官能基形成:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基。
本發明之官能化聚烯烴包括丁二烯、異戊二烯、乙烯、丙烯、丁烯及衍生物的自由基反應性(甲基)丙烯酸封端及接枝之側鏈官能性寡聚物、聚合物或無規共聚物。官能化聚烯烴具有約1,000至約95,000Da之Mw且在聚合物鏈中含有一個以上自由基反應性官能基。官能化聚烯烴由選自以下之自由基官能基形成:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基。官能化烯烴由選自以下之自由基官能基形成:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基。例示性官能化寡聚物、聚合物或共聚物包括(但不限於)二(甲基)丙烯酸化-聚丁二烯、二(甲基)丙烯酸化-聚異戊二烯、氫化二(甲基)丙烯酸化-聚丁二烯、氫化二(甲基)丙烯酸化-聚異戊二烯,其中許多獲自Sartomer及Kuraray。「(甲基)丙烯酸化」在本文中定義為由丙烯酸酯基或甲基丙烯酸酯基官能化。在其他實施例中,其他反應性液體寡聚物及/或聚合物經(甲基)丙烯酸化且可部分用於置換可固化官能性聚烯烴,且其包括(但不限於)(甲基)丙烯酸化-聚胺基甲酸酯、(甲基)丙烯酸化胺基甲酸酯寡聚物及(甲基)丙烯酸化-聚酯、(甲基)丙烯酸化苯乙烯-丁二
烯共聚物、(甲基)丙烯酸化丙烯腈-丁二烯共聚物、(甲基)丙烯酸化聚矽氧烷、(甲基)丙烯酸化EPDM橡膠(乙烯丙烯二烯共聚物)、(甲基)丙烯酸化丁基橡膠、(甲基)丙烯酸化溴丁基橡膠(溴異丁烯-異戊二烯共聚物)、(甲基)丙烯酸化氯丁基橡膠(氯異丁烯-異戊二烯共聚物)。此等樹脂市場有售,其不具有(甲基)丙烯酸酯官能基且可由熟習此項技術者在不需過度實驗下官能化。
可固化封裝劑中官能化PIB之量在約5至約90重量%,更佳約10-50重量%範圍中,其以可固化封裝劑之總重量計,而不計任何溶劑。
反應性PIB或反應性聚烯烴中具有反應性且可藉由輻射或加熱固化的末端及/或接枝側鏈官能基之實例包括(但不限於)選自由以下組成之群者:丙烯酸酯基、甲基丙烯酸酯基、乙烯基、乙烯醚基、丙烯基、巴豆基、烯丙基、氫化矽基、乙烯基矽烷基、炔丙基、環烯基、硫醇基、縮水甘油基、脂族環氧基、環脂族環氧基、氧雜環丁烷基、衣康酸酯基、順丁烯二醯亞胺基、順丁烯二酸酯基、反丁烯二酸酯基、肉桂酸酯基、苯乙烯基、丙烯醯胺基、甲基丙烯醯胺基及查爾酮基(chalcone group)。
自由基固化引發劑包括藉由電磁能射線(諸如UV射線)分解產生自由基的自由基聚合引發劑,或藉由熱分解產生自由基的可熱分解自由基引發劑。包含一或多種光引發劑之自由基光聚合引發系統可發現於Fouassier,J-P.,Photoinitiation,Photopolymerization and Photocuring Fundamentals and Applications 1995,Hanser/Gardner Publications,Inc.,New York,NY中。
自由基光聚合引發劑包括I型α裂解引發劑,諸如苯乙酮衍生物,諸如2-羥基-2-甲基苯丙酮及1-羥基環己基苯基酮;氧化醯基膦衍生物,諸如氧化雙(2,4,6-三甲基苯甲醯基)苯基膦;及安息香醚衍生物,諸如安息香甲基醚及安息香乙基醚。市售自由基光引發劑包括來
自Ciba Speciality Chemical之Irgacure 651、Irgacure 184、Irgacure 907、Darocur 1173及Irgacure 819。II型光引發劑亦適於可固化封裝劑,且其包括二苯甲酮、異丙基硫雜蒽酮及蒽醌。亦可使用上述化合物之許多經取代衍生物。熟習輻射固化技術者熟悉用於可輻射固化封裝劑之光引發劑的選擇。光引發劑系統將包含一或多種光引發劑以及視情況存在之一或多種光敏劑。適當光引發劑之選擇高度取決於欲使用封裝劑的特殊應用。適合光引發劑為展現與樹脂及封裝劑中之其他添加劑不同的光吸收譜之光引發劑。光引發劑之量通常在約0.01至約10重量%,較佳約0.01至約5重量%之範圍中,其以封裝劑總重量計而不考慮溶劑。
在一個實施例中,封裝劑經光學透明罩蓋或前罩板固化,光引發劑必須能夠吸收罩蓋或基板可透射之波長下的輻射。舉例而言,若封裝劑欲經鹼石灰玻璃蓋板固化,則光引發劑必須具有高於320nm之顯著UV吸光度。低於320nm之UV輻射將由鹼石灰玻璃蓋板吸收且未到達光引發劑。在此實例中,宜在光引發系統中納入紅移光引發劑或與光引發劑一起的光敏劑以增加轉移至光引發劑之能量。若封裝劑欲經截止吸光度低於400nm之障壁PET膜固化,則光引發劑必須具有高於400nm之UV吸光度。該等光引發劑之實例包括(但不限於)Irgacure® 819、Irgacure® 2022、Lucirin TPO或TPO-L,其可自BASF購得。
可熱固化自由基聚合引發劑包括過氧化物,諸如過氧基-2-乙基-己酸1,1,3,3-四甲基丁酯、1,1-雙(第三丁基過氧基)環己烷、1,1-雙(第三丁基過氧基)環十二烷、過氧基間苯二甲酸二第三丁酯、過氧基苯甲酸第三丁酯、過氧化二異丙苯、過氧化第三丁基異丙苯、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、2,5-二甲基-2,5-二(第三丁基過氧基)-3-己炔及氫過氧化異丙苯。自由基熱引發劑之量通常在約0.01至
約10wt%範圍內,其以封裝劑總重量計而不考慮溶劑。
在一個實施例中,熱固化引發劑經合意地選擇以提供適度起始溫度,其足夠高以防止過早交聯,但亦足夠低以防止電子裝置曝露於過高溫度。該等過高溫度可使裝置內的反應性有機組分降解。適合市售自由基熱引發劑之實例包括(但不限於)來自United Initiators之LUPEROX TBEC、來自Akzo Nobel Polymer Chemicals之TRIGONOX 101及TRIGONOX 201、來自Arkema之LUPEROX 101及LUPEROX 231、來自GEO Specialty Chemicals之DICUP、2,5,-二甲基-2,5雙(第三丁基過氧基)己炔-3(諸如以商標名稱LUPEROX 130獲自Arkema者、來自Akzo Nobel Polymer Chemicals之TRIGONOX 145);二第三丁基過氧化物,諸如以商標名稱TRIGONOX B獲自Akzo Nobel Polymer Chemicals者。熱自由基引發劑之適合量在約0.01至約10wt%範圍內,其以封裝劑總重量計而不考慮溶劑。此等自由基引發劑之典型固化溫度通常在約130至約200℃範圍內,但較快固化之溫度可增加。
在一些實施例中,無機填充劑可用於改良封裝劑之濕氣及氧氣障壁特性。代表性填充劑包括(但不限於)石英粉(ground quartz)、熔融矽石、非晶形矽石、滑石、玻璃珠、石墨、碳黑、氧化鋁、黏土、石墨烯、奈米黏土、雲母、氮化鋁及氮化硼。由銀、銅、金、錫、錫/鉛合金及其他合金組成之金屬粉末及薄片亦為導電應用之適合填充劑。亦可使用諸如聚-(四氯乙烯)、聚(氯三氟乙烯)、聚(氯亞乙烯)之有機填充劑粉末。該等適合用於自由基可固化封裝劑之填充劑的類型及量在熟習此項技術之從業人員的專門知識內。然而,一般而言,該等填充劑之含量將在總封裝劑之0.5至50wt%範圍內,而不考慮溶劑。
在另一實施例中,乾燥劑可用於改良封裝劑的濕氣障壁特性。添加時,乾燥劑佔封裝劑之高達20wt%,而不包括溶劑。適用的具有
乾燥劑特性之填充劑(稱為乾燥劑填充劑)可為提供適當濕氣清除速率、容量及殘餘濕氣含量(使得乾燥劑可主動清除水的最低濕氣含量)以滿足特定電子裝置之容許濕氣含量的填充劑中任一者。乾燥劑填充劑將能夠與水及/或水蒸氣反應、吸收或吸附水及/或水蒸氣。該等乾燥劑之代表性清單可發現於Dean,J.Lange's Handbook of Chemistry,1999,McGraw Hill,Inc.,New York,NY,第11.5頁中。
一般而言,適合乾燥劑包括金屬氧化物,諸如CaO、BaO、MgO;其他氧化物,諸如SiO2、P2O5、Al2O3;金屬氫化物,諸如CaH2、NaH、LiAlH4;金屬鹽,諸如CaSO4、Na2SO4、MgSO4、CaCO3、K2CO3及CaCl2;粉末狀沸石,諸如4A及3A分子篩;金屬過氯酸鹽,諸如Ba(ClO4)2、Mg(ClO4)2;超吸收劑聚合物,諸如輕微交聯聚(丙烯酸);及與水反應之金屬,諸如鈣。與任何填充劑一樣,乾燥劑填充劑粒徑、粒徑分佈、形狀及表面官能度將影響其可在樹脂系統中裝載的程度及可能導致的流變學。該等因素為熟習此項技術者所理解且不與本發明組合物另外相關。上文揭示之更常見非乾燥劑填充劑與此等乾燥劑填充劑之摻合物涵蓋及描述於實例內。乾燥劑填充劑之常見粒徑範圍為約0.001至約200微米。熟習此項技術之從業人員將能夠判斷特定最終用途應用所需的樹脂之適當粒徑範圍、流變學及清除速率。
封裝劑可另外包含塑化劑、增黏劑、蠟及礦物油以調整調配物黏度。
塑化劑之非限制性實例包括極性塑化劑、固體塑化劑、液體塑化劑(天然及合成),及性質上主要為脂族且與PIB及聚烯烴可相容的塑化劑。固體塑化劑在環境溫度下為固體,且較佳具有高於60℃之軟化點。能夠隨後在封裝劑中再結晶的任何固體塑化劑均為適合的。實例包括獲自Genovique Specialties之1,4-環己烷二甲醇二苯甲酸酯
Benzoflex 352。天然液體塑化劑之非限制性實例為植物油。合成液體塑化劑包括液體聚烯烴、異石蠟或中等至高分子量石蠟。實例包括來自ExxonMobil Chemical之SpectraSyn Plus 6。例示性液體增黏劑(具有低於約25℃之環球法軟化點)為液體增黏稀釋劑,其包括多萜,諸如獲自Sartomer之Wingtack 10及獲自ExxonMobil Chemical之Escorez 2520。合成液體寡聚物為聚丁烯、聚丙烯、多萜等之高黏度寡聚物,其永久性地呈流體形式。實例包括聚異戊二烯,作為LIR 50獲自Kuraray;及以名稱Indopol獲得之Amoco聚丁烯;來自Sartomer之Wingtack 10;及合成液體寡聚物聚丁烯,諸如來自Amoco之Indopol 300。
適合增黏劑包括(但不限於)與PIB或其聚烯烴可相容的任何樹脂或混合物,諸如(1)天然或經改質松香,諸如松脂膠(gum rosin)、木松香、高油松香(tall oil rosin)、餾出松香(distilled rosin)、氫化松香、二聚松香及聚合松香;(2)天然或經改質松香的甘油及異戊四醇酯,諸如淺色木松香之甘油酯、氫化松香之甘油酯、聚合松香之甘油酯、氫化松香之異戊四醇酯及松香之酚系改質之異戊四醇酯;(3)天然萜類之共聚物及三元共聚物,例如苯乙烯/萜及D-甲基苯乙烯/萜;(4)如ASTM方法E28,58T所測定具有約80至約150℃之軟化點的多萜樹脂;後一種多萜樹脂一般由萜烴(諸如稱為蘋烯之雙環單萜)在弗瑞德-克來福特催化劑(Friedel-Crafts catalyst)存在下在適度低溫下聚合產生;亦包括氫化多萜樹脂;(5)酚系改質之萜樹脂及其氫化衍生物,例如作為由在酸性介質中縮合雙環萜及苯酚產生之樹脂產物;(6)環球法軟化點為約70至約135℃之脂族石油烴樹脂;後一種樹脂由主要由烯烴及二烯烴組成之單體聚合產生;亦包括氫化脂族石油烴樹脂;(7)脂環石油烴樹脂及其氫化衍生物;及(8)脂族/芳族或環脂族/芳族共聚物及其氫化衍生物。特定增黏劑之合意性及選擇可視與障壁膜調配物中
之其他組分的相容性而定。當其存在時,本發明之封裝劑組合物通常將包含小於約80wt%,通常約10至約65wt%之量的增黏劑,其以封裝劑總重量計而不考慮任何溶劑。
與PIB或聚烯烴可相容之適合蠟包括基於石油之習知蠟、基於天然之蠟、官能化蠟及聚烯烴共聚物。術語石油衍生之蠟包括熔點在約130℉至約225℉範圍內之石蠟及微晶蠟以及諸如低分子量聚乙烯或Fisher-Tropsch蠟之合成蠟。最佳為熔點為至少約175℉之聚乙烯或Fisher-Tropsch蠟。實現所需特性所必需的蠟量通常將在約0.5至約10wt%蠟之範圍中,其以封裝劑總重量計而不考慮溶劑。
油之非限制性實例包括石蠟族及環烷系石油;高度精製工業級白凡士林(white petroleum)礦物油,諸如來自Crompton-Witco之Kaydol油;及環烷系石油,諸如來自Calumet Lubricants之Calsol 5550。稀釋劑亦可為液體增黏劑(具有低於約25℃之環球法軟化點)、合成液體寡聚物及其混合物。當其存在時,本發明調配物通常將包含少於約50wt%之量的油稀釋劑,其以封裝劑總重量計而不考慮溶劑。
可固化封裝劑可視情況包含添加劑,包括熱穩定劑、抗氧化劑、UV吸收劑及受阻胺光穩定劑。任何已知熱穩定劑均可適合,且一般類別之較佳熱穩定劑包括(但不限於)酚系抗氧化劑、烷基化單酚、烷基硫甲基酚、氫醌、烷基化氫醌、生育酚、羥基化硫代二苯醚、亞烷基雙酚、O-、N-及S-苯甲基化合物、羥基苯甲基化丙二酸酯、芳族羥基苯甲基化合物、三嗪化合物、胺系(aminic)抗氧化劑、芳基胺、二芳基胺、聚芳基胺、醯胺基酚、乙二醯胺、金屬去活化劑、亞磷酸酯、亞膦酸二酯、苯甲基膦酸酯、抗壞血酸(維生素C)、羥基胺、硝酮、硫代增效劑、苯并呋喃酮、吲哚啉酮及其類似物,及其混合物。視情況使用熱穩定劑且在一些情形中並非較佳,若其與電子裝置內的活性有機組分反應且使其降解,則尤其如此。當使用熱穩
定劑時,其可以約0.00005wt%及至多約10wt%之含量存在,其以封裝劑總重量計而不考慮溶劑。
任何已知UV吸收劑均可適合用於封裝劑組合物中,且一般類別之較佳UV吸收劑包括(但不限於)苯并三唑衍生物、羥基二苯甲酮、羥基苯基三嗪、經取代及未經取代之苯甲酸酯,及其類似物及其混合物。可使用受阻胺光穩定劑(HALS)且其亦為此項技術中熟知。一般而言,受阻胺光穩定劑為二級、三級、乙醯化、N-烴氧基取代、羥基取代之N-烴氧基取代或其他經取代環胺,其特徵為大量位阻,一般衍生自與胺官能相鄰之碳原子上的脂族取代。視情況使用UV吸收劑且在一些情形中並非較佳,若其與電子裝置內之活性有機組分反應且使其降解,則尤其如此。當利用UV吸收劑時,其可以約0.00005wt%及至多約10wt%之含量存在於調配物中,其以可固化封裝劑總重量計而不考慮溶劑。
適用於封裝劑組合物中之矽烷偶合劑之實例包括(但不限於)C3-C24烷基三烷氧基矽烷、(甲基)丙烯醯氧基丙基三烷氧基矽烷、氯丙基甲氧基矽烷、乙烯基甲氧基矽烷、乙烯基乙氧基矽烷、乙烯基參甲氧基乙氧基矽烷、乙烯基苯甲基丙基甲氧基矽烷、胺基丙基三甲氧基矽烷、乙烯基乙醯氧基矽烷、縮水甘油氧基丙基三烷氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷、巰基丙基甲氧基矽烷、胺基丙基三烷氧基矽烷,及其兩者或兩者以上之混合物。視情況使用矽烷偶合劑且在一些情形中並非較佳,若其與電子裝置內之活性有機組分反應且使其降解,則尤其如此。當利用矽烷偶合劑時,其可以約0.01wt%及至多約10wt%之含量存在於調配物中,其以可固化封裝劑總重量計而不考慮溶劑。
亦可向可固化封裝劑中添加在壓敏黏接劑中常規地用於滿足不同特性及滿足特定應用要求之其他添加劑。該等添加劑包括(但不限
於)顏料、流動改質劑、染料,其可以較少量或較大量併入封裝劑組合物中,視目的而定。
可固化封裝劑膜可以薄片形式或以諸如PET、玻璃等基板上的捲筒形式;或在底膜(諸如聚矽氧PET或牛皮紙離型襯墊)之間傳遞。包含封裝劑膜之薄片或捲筒可藉由任何適合方法製造。舉例而言,薄片可藉由溶液澆鑄或浸塗形成。使用此項技術中已知的技術準備溶液澆鑄。通常,封裝劑組分全部溶解於溶劑或溶劑混合物(例如二甲苯、甲苯、庚烷、己烷、環己烷及其類似物)中以形成溶液。溶液以每平方公尺之規定重量經澆鑄為膜,接著蒸發溶劑以形成固體封裝劑膜。較佳方法為熱熔融膜擠壓、壓模、射出成形、層壓、吹製膜法、串聯擠壓塗佈、熱熔融擠壓澆鑄、熔融共擠壓澆鑄或熟習此項技術者已知的任何適合熔融法。使用此項技術中已知的技術製備熱熔融物。通常,藉由在約50-190℃之溫度下摻合熔融物中之組分直至獲得均質摻合物來製備熱熔融物。摻合溫度應保持儘可能低以避免過早交聯且視特定調配物及組分而定,當封裝劑組合物可熱固化時尤其如此。此項技術中已知多種摻合方法且產生均質摻合物之任何方法均令人滿意。在熱熔融膜塗佈法期間,熱熔融物之溫度應維持低於150℃以避免過早交聯或分解。在一些膜擠壓法中,熱熔融物之溫度保持為或低於約120℃、110℃或甚至低於100℃。
在兩個襯墊之間塗佈可固化封裝劑以形成具有壓敏黏接特性之無可固化封裝劑之膜。可固化封裝劑在塗佈溫度下,通常在約50至約200℃之範圍中具有約10,000至約900,000cps之布絡克菲爾德黏度範圍,較佳在約100至約130℃下具有10,000至500,000cps之布絡克菲爾德黏度範圍。該等黏度範圍使封裝劑可熱熔融塗佈成膜。膜厚度在約0.01mm至約10mm,較佳約0.03至約0.5mm範圍中。可固化封裝劑膜在35℃或35℃以下仍為壓敏性黏接膜且儲存時具有最小冷流。
移除第一襯墊時,經曝露之可固化封裝劑膜由於壓力而經層壓於前罩板或基板。隨後,移除第二襯墊且封裝劑膜經層壓於剩餘前罩板或基板。在一個實施例中,可固化封裝劑膜同時層壓於前罩板及基板。可施予加熱(在約50℃至約190℃,較佳約80℃至約150℃範圍內)及/或真空以促進層壓及移除任何截留空氣及消除各層之間的任何空隙。在另一實施例中,因為基板上的有機活性組分在120℃以上的溫度下開始分解,所以較佳層壓溫度範圍低於約120℃,且在一些應用中,低於約110℃。接著藉由加熱或UV照射使可固化封裝劑膜固化。可使用約100至約190℃之溫度完成熱固化。使用在約280至約450nm範圍內的UV照射完成UV固化。
固化封裝劑膜在長期曝露於應力時維持可撓性且抗蠕變。蠕變或冷流可表示可撓性顯示器或薄膜光伏打在長期彎曲或垂直固持於剛性顯示器或光伏打中時分層失敗。
在一個實施例中,封裝劑膜在基板及罩蓋兩側具有不規則表面以促進層壓加工期間除氣。可在薄片擠壓繼之以淬滅期間藉由機械壓印或藉由熔體破裂使得在處理期間維持表面粗糙度而形成不規則表面。表面圖案可藉由熟知之常見技術方法施加於薄片。舉例而言,壓出薄片可通過緊臨擠壓機模具之出口安置的捲筒模之特殊製備表面。此舉對離開模具之熔融聚合物的一側賦予所要表面特徵。因此,當該捲筒模之表面具有細峰及谷時,其將對通過捲筒之聚合物薄片側面賦予粗糙表面,且粗糙表面一般將分別符合捲筒表面之谷及峰。該等捲筒模描述於例如美國專利第4,035,549號及美國專利公開案第2003/0124296號中。
在另一實施例中,封裝劑膜可呈單層或多層形式。術語「單層」係指由本發明所述之黏接劑製成或基本上由其組成的薄片。當呈多層形式時,薄片包含子層,且至少一個子層由本發明黏接劑製成或
基本上由本發明黏接劑組成,而其他子層可由任何其他適合聚合材料製成或包含任何其他適合聚合材料,諸如例如α-烯烴及α,β-烯系不飽和羧酸之共聚物(亦即酸共聚物)、部分中和之離子酸共聚物(亦即離子聚合物)、乙烯/乙酸乙烯酯共聚物、聚乙烯縮醛(包括聲學級聚乙烯縮醛)、聚胺基甲酸酯、聚氯乙烯、聚乙烯(例如線性低密度聚乙烯)、聚烯烴嵌段共聚物彈性體、α-烯烴及α,β-烯系不飽和羧酸酯之共聚物(例如乙烯丙烯酸甲酯共聚物及乙烯丙烯酸丁酯共聚物)、聚矽氧彈性體、環氧樹脂及其兩者或兩者以上之組合。
在另一實施例中,本文所述之可固化封裝劑用作光伏打電池模組之封裝劑。形成光伏打電池時,包含呈壓敏黏接劑膜形式之可固化封裝劑的封裝劑薄片或捲筒經層壓於光伏打模組總成。光伏打模組總成包括可將光轉化為電能的任何物品或材料。適用光伏打電池包括(但不限於)基於晶圓之光伏打電池(例如基於c-Si或mc-Si之光伏打電池)及薄膜光伏打電池(例如a-Si、c-Si、CdTe、硒化銅銦(CIS)、硒化銅銦鎵(CIGS))、吸光染料或基於有機半導體之太陽能電池。在光伏打模組總成內,電池較佳為電互連或配置於平面中。此外,光伏打模組總成可另外包含電線,諸如交叉帶及匯流排。
光伏打模組/電池(本文可互換使用)總成可為雙面的。在該等實施例中,安置於光伏打電池的任一側的所有層壓材料均應充分透明以允許足夠日光或反射日光到達光伏打電池。或者,光伏打電池可具有正面面向太陽側(其亦稱為正面,且在實際使用情況中時,一般面向太陽)及背面非面向太陽側(其亦稱為背面,且在實際使用情況中時,一般避開太陽)。光伏打電池界定光伏打電池總成之正面與背面之間的邊界。在該總成中,安置於太陽能電池總成之正面面向太陽側之層壓層中存在的所有材料均應具有充分透明度以允許足夠日光到達光伏打電池。安置於光伏打電池層之背面非面向太陽側之層壓層中存在的
材料無需透明。光伏打電池通常包含至少一個包含封裝劑的封裝劑層,其經層壓於太陽能電池總成。彼此「層壓」之兩種組分直接(亦即在兩層之間無任何額外材料)或間接(亦即在兩層之間具有額外材料,諸如夾層或黏接劑材料)結合。在某些層壓物中,包含摻合組合物之封裝劑層直接結合於光伏打電池層。
在一個實施例中,光伏打電池總成具有含峰及空隙之不規則表面。因此,在層壓過程期間,包含封裝劑之封裝劑薄片將熔融且溢出且以均一方式填充光伏打電池總成之空隙。除非在極限情形中另外規定,否則封裝劑層之厚度為封裝劑層在層壓之前的厚度。然而,一般而言,最終光伏打模組中之封裝劑層維持約1至約120密耳(約0.025至約3mm),較佳約2至約40密耳(約0.05至約1mm)之平均總厚度。
光伏打電池可另外包含包埋於模組內的其他功能膜、薄片層、封裝劑層(例如介電層或障壁層)。該等功能層可包含任何上述聚合物膜或經額外功能塗料塗佈者。舉例而言,經金屬氧化物塗料(諸如美國專利第6,521,825號及第6,818,819號及歐洲專利第1182710號中所述者)塗佈之聚(對苯二甲酸伸乙酯)(PET)膜可用作層壓物中之氧氣及濕氣障壁層。額外封裝劑層包含其他聚合材料,諸如酸共聚物、離聚物、乙烯/乙酸乙烯酯共聚物、聚乙烯縮醛(包括聲學級聚乙烯縮醛)、聚胺基甲酸酯、聚氯乙烯、聚乙烯(例如線性低密度聚乙烯)、聚烯烴嵌段共聚物彈性體、α-烯烴及α,β-烯系不飽和羧酸酯之共聚物(例如乙烯丙烯酸甲酯共聚物及乙烯丙烯酸丁酯共聚物)、聚矽氧彈性體、環氧樹脂及其兩者或兩者以上之組合。用於入射層或墊層之適合膜包含聚合物,其包括(但不限於)聚酯(例如聚(對苯二甲酸伸乙酯)及聚(萘二甲酸伸乙酯))、聚碳酸酯、聚烯烴(例如聚丙烯、聚乙烯及環狀聚烯烴)、降冰片烯聚合物、聚苯乙烯(例如間規聚苯乙烯)、苯乙烯-丙烯酸酯共聚物、丙烯腈-苯乙烯共聚物、聚碸(例如聚醚碸、聚碸等)、耐
綸、聚(胺基甲酸酯)、丙烯酸系物、乙酸纖維素類(例如乙酸纖維素、三乙酸纖維素等)、塞璐芬(cellophane)、聚矽氧、聚氯乙烯)(例如聚氯亞乙烯))、氟聚合物(例如聚氟乙烯、聚氟亞乙烯、聚四氟乙烯及乙烯-四氟乙烯共聚物)及其兩者或兩者以上之組合。聚合物膜可為非定向或單軸定向或雙軸定向。可用於光伏打電池模組外層(例如入射層或墊層)之膜的特定實例包括(但不限於)聚酯膜(例如聚(對苯二甲酸伸乙酯)膜)、氟聚合物膜(例如獲自DuPont之Tedlar®)、Tefzel®)及Teflon®)膜)。金屬膜(諸如鋁箔)亦可用作墊層。此外,太陽能電池模組外層中所用之膜可呈多層膜形式,諸如氟聚合物/聚酯/氟聚合物多層膜(例如獲自Austria之Isovolta AG或Woburn,MA之Madico的Tedlar®)/PET/Tedlar®)或TPT層壓膜)。
在一種方法中,光伏打模組之組成層以所要順序堆疊形成預層壓總成。接著將該總成置於能夠維持真空的袋(「真空袋」)中,藉由真空管線或其他方式自該袋抽出空氣,密封該袋同時維持真空(例如至少約27-28in.Hg(689-711mm Hg)),且將經密封之袋置於高壓釜中且使壓力升至約150至約250psi(約11.3至約18.8巴),且溫度為約135℃至約180℃,持續約10至約50分鐘。真空環可取代真空袋。一種類型的適合真空袋描述於美國專利第3,311,517號中。在加熱及壓力循環後,冷卻高壓釜中之空氣,而未添加額外空氣維持高壓釜中的壓力。冷卻約20分鐘後,排出過量空氣壓力且自高壓釜移出層壓物。或者,預層壓總成可在烘箱中在約80℃至約120℃下加熱約20至約40分鐘,且此後,經加熱總成可通過一組夾壓捲筒,使得擠出個別層之間的空隙空間(void space)中之空氣,且密封總成之邊緣。此階段之總成稱為預壓。預壓接著可置於在約100至約300psi(約6.9至約20.7巴)之壓力下溫度升至約135℃至約180℃的空氣高壓釜中。此等條件維持約15至約60分鐘,此後冷卻空氣同時不再向高壓釜中引入空氣。冷卻約
20至約40分鐘後,排出過量空氣壓力且自高壓釜移出層壓產物。亦可藉由非高壓釜方法製造光伏打電池模組。該等非高壓釜方法描述於例如美國專利第3,234,062號;第3,852,136號;第4,341,576號;第4,385,951號;第4,398,979號;第5,536,347號;第5,853,516號;第6,342,116號及第5,415,909號;美國專利公開案第2004/0182493號;歐洲專利第1235683 B1號;及PCT專利公開案第WO91/01880號及第WO03/057478號中。一般而言,非高壓釜方法包括加熱預層壓總成及施加真空、壓力或其兩者。舉例而言,總成可連續通過加熱爐及夾壓捲筒。
在一個實施例中,可固化封裝劑膜適用作光電子、OLED、光伏打電池、有機光伏打電池、可撓性薄膜有機光伏打電池、CIGS光伏打電池及其類似物之封裝劑。在一個較佳實施例中,封裝劑適用作最需要濕氣及氧氣障壁要求之有機光伏打(OPV)之封裝劑。可固化封裝劑膜具有許多優於習知液體封裝劑之優勢。本文所述之可固化封裝劑膜允許材料在層壓過程期間完全圍繞光伏打電池總成之不規則表面及在其上流動且因此使氣泡及電池破裂降至最低。此外,PIB及完全可相容之反應性(甲基)丙烯酸官能化PIB或聚烯烴寡聚物/聚合物之併入傳遞高濕氣及氧氣障壁特性以及封裝劑層之光學澄清度。
在一個實施例中,具有含有不揮發低分子量(Mw小於約1,000Da)有機分子之封裝劑層的有機光伏打電池之模組效率高於具有含有揮發性低分子量分子之封裝劑層的電池。不希望受理論約束,咸信封裝劑層中該等分子之存在可在加熱時形成空隙,影響封裝劑層與活性有機層之間的黏接,且更重要的是,因為活性有機層中低有機分子之遷移及溶劑化而改變活性有機層之形態。如自「Organic Photovoltaics:Challenges and Opportunities,」Russell Gaudiana,J.of Polymer Science:Part B:Polymer Physics 2012,DOI:10.1002/polb.23083)已
知,活性層之形態對模組效率至關重要。舉例而言,高加工時間百分比集中於控制溶劑自活性有機組分蒸發的速率,因為其為形成最佳活性層形態之主要因素。活性層之塗佈品質可能由精密厚度、表面粗糙度及無針孔膜決定。
在另一實施例中,封裝劑層具有小於約50×10^4Pa(帕斯卡(Pascal))之模數。在一個實施例中,封裝劑層之模數在約1×10^4Pa至約5×10^4Pa,且較佳約1×10^4Pa至約3×10^4Pa範圍內。因為電子裝置需要較高可撓性,所以包括封裝劑層之組件的較低模數合乎需要。
提供以下實例來進一步詳細描述本發明。此等實例闡述目前預期用於進行本發明之較佳模式,其欲說明而非限制本發明。
樣品之組分如下。
皆來自BASF之Oppanol PIB系列及Glassipol系列為PIB。
PIB二丙烯酸酯為PIB,Mw為約14,000,具有兩個末端丙烯酸酯基。其根據T.P.Liao及J.P.Kennedy,Polymer Bulletin,第6卷,第135頁-第141頁(1981)中所述之方法合成。
來自Sartomer之CN308為反應性聚丁二烯二丙烯酸酯。
來自Rextac LLC之RT2814及RT2315為非晶形聚-α-烯烴,190℃下布絡克菲爾德黏度小於8,000cps。
來自Exxon Mobil之Linxar系列為半結晶C2-C6聚烯烴,Mw小於約100,000Da,多分散性指數小於約3,且熔點低於約100℃。
來自BASF之Irgacure系列及Lucirin TPO-L為光引發劑。
來自Arkema之Luperox系列為熱引發劑。
來自Akzo Nobel之Trigonox 101為熱引發劑。
來自Exxon Mobil之Escorez 5380為增黏劑。
來自Sartomer之SR833S為雙官能丙烯酸酯單體且具有304Da之分子量。
如下量測黏度、水蒸氣傳輸速率(WVTR)、水攝取、透射百分比(T%)折射率、剪切強度、空隙形成及樣品模數。
使用布絡克菲爾德黏度計spindle 27在80℃、120℃或130℃下量測一些未固化封裝劑之黏度。一些實例之黏度亦使用流變儀藉由在10rad/s之頻率下進行溫度掃描來量測。
藉由使用ARES-M流變儀量測一些未固化封裝劑之黏度。
在18密耳厚之固化封裝劑膜上量測WVTR、水攝取、光學透射率及折射率值。除非另外規定,否則封裝劑在130℃下使用實驗室規模熱熔融物塗佈器(來自ChemInstruments之Hot Melt Coater HLC-101)以熱熔融物形式塗佈於2密耳聚矽氧離型PET(聚對苯二甲酸伸乙酯)襯墊上。封裝劑膜藉由以D-bulb(Fusion Systems)以500-5000mJ/cm2之UVA及UVB劑量(視樣品而定)照射而固化,或藉由在烘箱中在150-170℃下(視樣品而定)加熱封裝劑膜而固化。移除襯墊且在18密耳厚之固化封裝劑膜上進行測試。
在38℃/100% RH下根據ASTM F-1249以Mocon Permeatran 3/33量測WVTR。
以Surface Measurement Systems,Ltd之Dynamic Vapour Sorption DVS-2000量測水攝取。
以Perkin Elmer UV/Vis光譜儀量測光學透射率(T%)。
以ATAGO之ABBE折射計量測折射率值。
根據程序A,PSTC-107量測固化封裝劑膜之剪切強度,如下改適:(1)如上文所述在2密耳PET障壁膜上塗佈5-6密耳厚之封裝劑,以2密耳PET離型襯墊層壓,如上文所述固化,接著在23℃及50%相對濕度下調節,(2)在濕潤不鏽鋼測試面板15分鐘後於12×25mm區域上施
加之500g剪切負載下量測剪切黏接。在23℃及50%相對濕度下進行剪切強度測試。
對於層壓空隙測試,如上文在2密耳聚矽氧離型PET襯墊上塗佈約5-6密耳厚度之封裝劑。自襯墊轉移封裝劑膜且在120℃下使用來自Western Magnum之XRL 180 Hot Roll Laminator層壓於兩個PET障壁膜之間以促進黏接於包含罩蓋及基板之裝置上。如上文所述固化封裝劑膜。冷卻後,經PET障壁膜目視檢查空隙(氣泡)形成。
樣品1-6之組分列於表1中。所有樣品均藉由在130℃下,在Brabender中混合各組分或如熟習此項技術者已知與Glas-Col混合來製備。對於樣品2及5,使樣品冷卻至80℃,接著添加熱引發劑。樣品4之布絡克菲爾德黏度概況顯示於圖1中。
如上文所述,樣品1-6之封裝劑接著以膜形式塗佈且固化。在38℃/100% RH下在18密耳厚度之純密封劑膜上量測WVTR。在18密耳固化封裝劑膜上量測水攝取、T%、折射率及剪切強度。
層壓測試指示上述樣品無可見空隙。
樣品4及比較樣品C-1至C-4之組分及特性列於表2中。比較樣品C-1至C-4類似於實例1中之樣品製備。
添加低分子量SR833S在120℃下在層壓期間不會不利地影響剪切強度或引起空隙,然而,使用由低分子量單體形成之封裝劑膜可顯著降低有機電子裝置之效能,通常導致效率較低。
向表3中所列之比較調配物C-5至C-8中添加增黏劑。比較樣品C-5至C-8類似於實例1樣品製備。
比較樣品之黏度隨著添加增黏劑而降低,然而,添加低分子量單體可降低有機電子裝置之效能。
表4中列出樣品7-12的組分。樣品類似於實例1製備。
樣品7-11在80℃下具有可接受之低黏度,且因此可以熱熔融物形式經塗佈或擠壓,且即使在低於100℃之溫度下亦無任何溶劑。
除了低溫下之可塗佈黏度,樣品7、10及11之低模數值(小於約10
×104dyn/cm2之模數值)指示此等材料亦為可撓性的及軟凝膠狀,其合乎一些電子顯示器之需要。
本發明可在不悖離其精神及範疇的情況下進行許多修改及改變,如熟習此項技術者將顯而易見。本文描述之特定實施例僅以實例之方式提供,且本發明欲僅由隨附申請專利範圍之各項以及該等申請專利範圍授權之相等物的全部範疇所限制。
Claims (25)
- 一種可固化封裝劑,其包含:a)Mw為約1,000至約95,000Da之聚異丁烯;b)官能化聚異丁烯,其具有(i)約1,000至約95,000Da之Mw及(ii)每條聚合物鏈一個以上自由基反應性官能基,其中該自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及c)自由基引發劑;其中該可固化封裝劑(i)基本上不含Mw小於約1,000Da之丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物;及(ii)基本上不含增黏劑。
- 一種可固化封裝劑,其包含:a)Mw為約1,000至約95,000Da之聚異丁烯;b)官能化聚烯烴,其具有(i)約1,000至約95,000Da之Mw及(ii)每條聚合物鏈一個以上自由基反應性官能基,其中該自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及c)自由基引發劑;其中該可固化封裝劑(i)基本上不含Mw小於約1,000Da之丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物;及(ii)基本上不含增黏劑。
- 一種可固化封裝劑,其包含:a)在190℃下布氏黏度(Brookfield viscosity)低於8,000cps之非 晶形聚α烯烴;b)官能化聚烯烴,其具有(i)約1,000至約95,000Da之Mw及(ii)每條聚合物鏈一個以上自由基反應性官能基,其中該自由基反應性官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基;及c)自由基引發劑;d)增黏劑;其中該可固化封裝劑基本上不含Mw小於約1,000Da之丙烯酸單體或Mw小於約1,000Da之揮發性有機化合物。
- 如請求項1至3中任一項之可固化封裝劑,其中該自由基引發劑為光引發劑,且該封裝劑在130℃下之布氏黏度為約10,000至約900,000cps。
- 如請求項1至3中任一項之可固化封裝劑,其中該自由基引發劑為熱引發劑,且該封裝劑在80℃下之布氏黏度為約10,000至約2,000,000cps。
- 如請求項1之可固化封裝劑,其另外包含官能化聚烯烴,其中該官能化聚烯烴具有(i)約1,000至約95,000Da之Mw及(ii)一個以上自由基反應性官能基;其中該自由基官能基係選自由以下組成之群:末端(甲基)丙烯酸酯基、側鏈(甲基)丙烯酸酯基、末端丙烯酸酯基及/或側鏈丙烯酸酯基。
- 如請求項1至3及6中任一項之可固化封裝劑,其另外包含Mw為約1,000至約10,000Da之聚異丁烯稀釋劑。
- 如請求項1至3及6中任一項之可固化封裝劑,其另外包含高達20wt%之複數種乾燥劑填充劑。
- 如請求項1至3及6中任一項之可固化封裝劑,其包含少於5,000ppm的Mw小於1,000Da之揮發性有機分子。
- 如請求項2、3或6之可固化封裝劑,其中該官能化聚烯烴係選自由以下組成之群:(甲基)丙烯酸酯基封端之聚丁二烯、具有側鏈(甲基)丙烯酸酯基之聚丁二烯、氫化(甲基)丙烯酸酯基封端之聚丁二烯、具有側鏈(甲基)丙烯酸酯基之氫化聚丁二烯及其混合物。
- 如請求項1至3及6中任一項之可固化封裝劑,其為可固化壓敏性黏接劑膜。
- 如請求項1至3及6中任一項之可固化封裝劑,其中在30℃下該封裝劑之模數在約1×10^4至約5,000×10^4dyn/cm2之範圍內。
- 如請求項1至3及6中任一項之可固化封裝劑,其中在30℃下該封裝劑之模數在約1×10^4至約50×10^4dyn/cm2之範圍內。
- 一種固化封裝劑,其係藉由固化如請求項1至13中任一項之可固化封裝劑所獲得者。
- 如請求項14之固化封裝劑,其具有0.01mm至10mm之厚度。
- 一種物品,其包含如請求項14至15中任一項之固化封裝劑。
- 如請求項16之物品,其為電子裝置。
- 如請求項17之物品,其中該電子裝置為OLED、有機光伏打模組或CIGS光伏打模組。
- 一種形成可固化封裝劑膜之方法,其包含以下步驟:(1)在80℃至約190℃下混合如請求項1至6及8中任一項之可固化封裝劑之組分以形成均質熔融物;(2)塗佈或擠壓該熔融物直至約0.01至約100mm之厚度;及(3)使該熔融物冷卻至室溫。
- 一種形成可固化封裝劑膜之方法,其包含以下步驟: (1)混合如請求項7至8中任一項之可固化封裝劑之組分以形成混合物;(2)塗佈或澆鑄該混合物直至約0.01至約100mm之厚度;及(3)蒸發或餾出該稀釋劑。
- 一種形成電子裝置之方法,其包含:(1)將如請求項1至13中任一項之可固化封裝劑層壓於第一基板上;(2)將第二基板施加於該封裝劑上;及(3)以UV輻射及/或加熱固化該可固化封裝劑;藉此該封裝劑使該第一基板與該第二基板黏接在一起。
- 如請求項21之形成電子裝置之方法,其中該可固化封裝劑在步驟(1)中在約80℃至約190℃之溫度範圍下經層壓。
- 如請求項22之形成電子裝置之方法,其中該等層壓溫度範圍高達約120℃。
- 如請求項21之形成電子裝置之方法,其中該可固化封裝劑在步驟(3)中以在約280至約450nm之範圍內的UV照射固化。
- 如請求項21之形成電子裝置之方法,其中該可固化封裝劑在步驟(1)中在約100至約190℃之溫度下經層壓且在步驟(3)中在約100至約190℃之溫度下固化。
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Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014204223A1 (ko) | 2013-06-19 | 2014-12-24 | 주식회사 엘지화학 | 봉지재 필름용 조성물, 봉지재 필름 및 이를 포함하는 전자장치 |
KR101662889B1 (ko) * | 2013-07-19 | 2016-10-05 | 주식회사 엘지화학 | 봉지 조성물 |
CN103972267B (zh) * | 2014-04-16 | 2016-09-14 | 京东方科技集团股份有限公司 | 一种有机发光显示装置 |
KR101861893B1 (ko) * | 2014-04-23 | 2018-05-29 | 삼성에스디아이 주식회사 | 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치 |
TWI679259B (zh) * | 2014-08-11 | 2019-12-11 | 德商漢高智慧財產控股公司 | 光學透明的熱熔黏著劑及其用途 |
KR101871549B1 (ko) * | 2014-10-29 | 2018-07-03 | 삼성에스디아이 주식회사 | 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치 |
JP6675322B2 (ja) * | 2015-02-17 | 2020-04-01 | エルジー・ケム・リミテッド | 封止フィルム |
CN107636072B (zh) * | 2015-03-24 | 2020-09-15 | 株式会社Lg化学 | 粘合剂组合物 |
KR102579772B1 (ko) * | 2015-03-26 | 2023-09-15 | 니폰 제온 가부시키가이샤 | 봉지재, 봉지재의 제조 방법 및 발광 장치의 제조 방법 |
WO2016171284A1 (en) * | 2015-04-24 | 2016-10-27 | Canon Kabushiki Kaisha | Curable liquid developer |
CN104993067A (zh) * | 2015-07-13 | 2015-10-21 | 深圳市华星光电技术有限公司 | 有机发光二极管封装件、其制造方法及显示装置 |
CN107922554B (zh) * | 2015-07-30 | 2020-08-11 | 三键有限公司 | 光固化性树脂组合物、燃料电池和密封方法 |
WO2017031074A1 (en) * | 2015-08-17 | 2017-02-23 | 3M Innovative Properties Company | Nanoclay filled barrier adhesive compositons |
CN107922558B (zh) * | 2015-09-02 | 2020-12-15 | 三键有限公司 | 光固化性树脂组合物、燃料电池和密封方法 |
JP7166756B2 (ja) * | 2015-10-16 | 2022-11-08 | 住友化学株式会社 | 有機光電変換素子 |
KR101835941B1 (ko) * | 2015-10-19 | 2018-03-08 | 삼성에스디아이 주식회사 | 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치 |
JP6873682B2 (ja) * | 2015-12-25 | 2021-05-19 | 日東電工株式会社 | ゴム系粘着剤組成物、ゴム系粘着剤層、ゴム系粘着剤層付光学フィルム、光学部材、画像表示装置、及びゴム系粘着剤層の製造方法 |
WO2017159589A1 (ja) * | 2016-03-18 | 2017-09-21 | 日本ゼオン株式会社 | 有機エレクトロニクスデバイス封止体の製造方法 |
KR102322016B1 (ko) * | 2016-06-01 | 2021-11-09 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조방법 |
US20200172771A1 (en) * | 2016-09-23 | 2020-06-04 | Lg Chem, Ltd. | Adhesive composition |
KR20200018774A (ko) * | 2017-06-14 | 2020-02-20 | 헨켈 아이피 앤드 홀딩 게엠베하 | 매우 낮은 수분 투과도를 갖는 라미네이팅 필름 접착제 |
TWI782066B (zh) | 2017-08-03 | 2022-11-01 | 德商漢高股份有限及兩合公司 | 可固化的聚矽氧光學透明黏著劑及其用途 |
CN111094483A (zh) | 2017-08-31 | 2020-05-01 | 三星Sdi株式会社 | 接着膜及包括其的光学构件 |
US11591501B2 (en) | 2017-12-06 | 2023-02-28 | 3M Innovative Properties Company | Barrier adhesive compositions and articles |
KR20230148381A (ko) | 2017-12-27 | 2023-10-24 | 헨켈 아게 운트 코. 카게아아 | 광학적으로 투명한 감압성 접착제 및 그의 용도 |
US11004918B2 (en) | 2018-03-09 | 2021-05-11 | Samsung Display Co., Ltd. | Electronic apparatus |
US11349103B2 (en) | 2018-03-15 | 2022-05-31 | Dell Products L.P. | Display assembly apparatus and methods for information handling systems |
US11643494B2 (en) | 2018-07-12 | 2023-05-09 | 3M Innovative Properties Company | Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer |
JP6852725B2 (ja) * | 2018-11-26 | 2021-03-31 | 日立金属株式会社 | ケーブル及びハーネス |
WO2020163975A1 (en) * | 2019-02-11 | 2020-08-20 | Henkel Ag & Co. Kgaa | Light curable (meth)acrylate resin composition for thermoplastic elastomers bonding |
US20220195203A1 (en) * | 2019-06-05 | 2022-06-23 | Lg Chem, Ltd. | Composition for encapsulation |
KR102430601B1 (ko) | 2020-03-03 | 2022-08-08 | 삼성에스디아이 주식회사 | 점착 필름, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치 |
CN111378232A (zh) * | 2020-03-19 | 2020-07-07 | 深圳市天宁达胶粘技术有限公司 | 一种锂电池用uv固化无溶剂密封材料及其制备方法 |
KR102527459B1 (ko) | 2020-05-29 | 2023-04-28 | 삼성에스디아이 주식회사 | 점착성 보호 필름, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치 |
US20230295363A1 (en) * | 2020-08-19 | 2023-09-21 | Lg Chem, Ltd. | Thermosetting resin composition and encapsulation film using the same |
TW202221082A (zh) * | 2020-11-17 | 2022-06-01 | 明基材料股份有限公司 | 一種矽膠阻氣膜 |
KR102672308B1 (ko) * | 2020-12-10 | 2024-06-04 | 주식회사 엘지화학 | 봉지재 |
EP4323447A1 (en) | 2021-04-15 | 2024-02-21 | H.B. Fuller Company | Hot melt composition in the form of a film for use in thin film photovoltaic modules |
CN117957647A (zh) | 2021-11-30 | 2024-04-30 | 工程吸气公司 | 吸气剂组合物和包含所述吸气剂组合物的可分配糊料 |
CN114316809B (zh) * | 2022-01-10 | 2023-10-20 | 南亚新材料科技股份有限公司 | 锂电池用密封胶及其制备方法 |
TWI832554B (zh) * | 2022-11-14 | 2024-02-11 | 聯茂電子股份有限公司 | 固化物與金屬箔層基板的製造方法 |
TWI829425B (zh) * | 2022-11-14 | 2024-01-11 | 聯茂電子股份有限公司 | 樹脂組成物與金屬箔層基板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062851A1 (en) * | 2009-11-19 | 2011-05-26 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acylic polymer |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL284479A (zh) | 1961-10-23 | 1900-01-01 | ||
NL295987A (zh) | 1962-08-02 | 1900-01-01 | ||
US3852136A (en) | 1971-12-08 | 1974-12-03 | Glaverbel | Production of laminated glazing |
US4035549A (en) | 1975-05-19 | 1977-07-12 | Monsanto Company | Interlayer for laminated safety glass |
US4385951A (en) | 1981-03-25 | 1983-05-31 | Ppg Industries, Inc. | Low pressure lamination of safety glass |
US4341576A (en) | 1981-06-01 | 1982-07-27 | Ppg Industries, Inc. | Fabricating laminated safety glass without an autoclave |
US4398979A (en) | 1982-02-22 | 1983-08-16 | Ppg Industries, Inc. | Vacuum channel method of laminating glass sheets |
US4852965A (en) * | 1987-02-27 | 1989-08-01 | American Telephone And Telegraph Company At&T Bell Laboratories | Composite service and distribution communications media |
US5656286A (en) * | 1988-03-04 | 1997-08-12 | Noven Pharmaceuticals, Inc. | Solubility parameter based drug delivery system and method for altering drug saturation concentration |
US5171760A (en) | 1988-08-05 | 1992-12-15 | Edison Polymer Innovation Corp. | UV curable polymer formulation |
GB8917590D0 (en) | 1989-08-01 | 1989-09-13 | Mortimore Charles R | Bonding laminations |
AU672250B2 (en) | 1992-12-17 | 1996-09-26 | Sekisui Chemical Co., Ltd. | An interlayer film and laminated glass using the same |
US5536347A (en) | 1994-09-22 | 1996-07-16 | Monsanto Company | No autoclave process for forming a safety glass laminate |
FI100009B (fi) | 1994-10-20 | 1997-08-15 | Tamglass Ltd Oy | Menetelmä ja laite lasilevyjen laminoimiseksi |
US5665823A (en) | 1996-08-30 | 1997-09-09 | Dow Corning Corporation | Polyisobutylene polymers having acrylic functionality |
DE69912868T2 (de) * | 1998-03-04 | 2004-07-29 | Pirelli & C. S.P.A. | Elektrisches Kabel mit selbstheilendem Kabelschutz |
US6054549A (en) | 1998-11-25 | 2000-04-25 | Dow Corning Asia, Ltd. | Alkenyl ether functional polyisobutylenes and methods for the preparation thereof |
DE19903171C2 (de) | 1999-01-27 | 2003-03-20 | Saint Gobain Sekurit D Gmbh | Verfahren und Vorrichtung zum Laminieren von Verbundscheiben |
JP2000294813A (ja) | 1999-04-07 | 2000-10-20 | Bridgestone Corp | 太陽電池用バックカバー材及び太陽電池 |
DE19951444A1 (de) | 1999-10-25 | 2001-04-26 | Huels Troisdorf | Verfahren und Folie zur Herstellung von Verbundsicherheitsscheiben |
US6664318B1 (en) * | 1999-12-20 | 2003-12-16 | 3M Innovative Properties Company | Encapsulant compositions with thermal shock resistance |
JP4036616B2 (ja) | 2000-01-31 | 2008-01-23 | 三洋電機株式会社 | 太陽電池モジュール |
US6703433B1 (en) | 2000-05-12 | 2004-03-09 | Dow Corning Corporation | Radiation curable compositions containing alkenyl ether functional polyisobutylenes |
WO2002003475A1 (en) | 2000-07-03 | 2002-01-10 | Bridgestone Corporation | Backside covering material for a solar cell module and its use |
US20030124296A1 (en) | 2000-10-26 | 2003-07-03 | Smith Charles Anthony | Glass laminates for threat resistant window systems |
US7704342B2 (en) | 2001-12-27 | 2010-04-27 | Solutia, Inc. | Glass lamination process |
US7143800B2 (en) | 2003-03-20 | 2006-12-05 | Cardinal Lg Company | Non-autoclave laminated glass |
JP2006036947A (ja) * | 2004-07-28 | 2006-02-09 | Three Bond Co Ltd | 放射線硬化性組成物 |
US20090162715A1 (en) * | 2005-10-20 | 2009-06-25 | Henkel Corporation | Polyisobutylene compositions with improved reactivity and properties for bonding and sealing fuel cell components |
EP2004746B1 (en) * | 2006-03-29 | 2018-08-01 | Henkel AG & Co. KGaA | Radiation-curable rubber adhesive/sealant |
US8581094B2 (en) * | 2006-09-20 | 2013-11-12 | Dow Global Technologies, Llc | Electronic device module comprising polyolefin copolymer |
EP2139967B1 (en) * | 2007-03-21 | 2014-12-10 | Avery Dennison Corporation | Pressure sensitive adhesives |
JP4437502B2 (ja) * | 2007-04-03 | 2010-03-24 | 日東電工株式会社 | 塗膜保護用シート |
DE102007045104A1 (de) | 2007-09-20 | 2009-04-02 | Kömmerling Chemische Fabrik GmbH | Dichtungsmasse zur Herstellung von Zwei- oder Mehrscheiben-Isolierglas oder Solarmodulen |
EP2291477B1 (en) * | 2008-06-02 | 2016-03-23 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
DE102009001885A1 (de) * | 2009-03-26 | 2010-09-30 | Evonik Degussa Gmbh | Grundierungsmittel für Polyolefin-Oberflächen basierend auf Polyolefin-graft-poly(meth)acrylat Copolymeren |
EP2432832A1 (en) * | 2009-05-19 | 2012-03-28 | Specialized Technology Resources, Inc | Encapsulant compositions, methods of manufacture and uses thereof |
EP2439246B1 (en) | 2009-06-01 | 2015-09-30 | Nitto Denko Corporation | Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
WO2011062932A1 (en) | 2009-11-18 | 2011-05-26 | 3M Innovative Properties Company | Flexible assembly and method of making and using the same |
JP5593175B2 (ja) | 2010-09-09 | 2014-09-17 | リンテック株式会社 | 封止用粘着シート、電子デバイス、及び有機デバイス |
US20120208013A1 (en) * | 2011-02-15 | 2012-08-16 | 3M Innovative Properties Company | Isobutylene copolymer with grafted polymer groups |
ES2808700T3 (es) * | 2011-04-27 | 2021-03-01 | Henkel IP & Holding GmbH | Composiciones de elastómeros curables con capacidad de sellado a baja temperatura |
US8623480B2 (en) * | 2011-06-27 | 2014-01-07 | H. B. Fuller Company | Hot melt adhesive compositions including olefinic polymer blends and articles including the same |
US8728568B2 (en) * | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
-
2013
- 2013-04-02 EP EP13784651.5A patent/EP2845241A4/en not_active Withdrawn
- 2013-04-02 KR KR1020147031735A patent/KR20150008873A/ko active Application Filing
- 2013-04-02 JP JP2015510288A patent/JP6423339B2/ja not_active Expired - Fee Related
- 2013-04-02 CN CN201710356983.6A patent/CN107275511A/zh active Pending
- 2013-04-02 KR KR1020187021443A patent/KR101919294B1/ko active IP Right Grant
- 2013-04-02 CN CN201380028831.3A patent/CN104584257B/zh not_active Expired - Fee Related
- 2013-04-02 WO PCT/US2013/034893 patent/WO2013165637A1/en active Application Filing
- 2013-04-29 TW TW102115307A patent/TWI623598B/zh not_active IP Right Cessation
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2014
- 2014-10-31 US US14/529,438 patent/US9676928B2/en not_active Expired - Fee Related
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2017
- 2017-05-09 US US15/590,119 patent/US10141532B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062851A1 (en) * | 2009-11-19 | 2011-05-26 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acylic polymer |
Also Published As
Publication number | Publication date |
---|---|
KR20150008873A (ko) | 2015-01-23 |
TW201402740A (zh) | 2014-01-16 |
KR20180087470A (ko) | 2018-08-01 |
JP6423339B2 (ja) | 2018-11-14 |
US9676928B2 (en) | 2017-06-13 |
US10141532B2 (en) | 2018-11-27 |
EP2845241A1 (en) | 2015-03-11 |
CN104584257A (zh) | 2015-04-29 |
JP2015528023A (ja) | 2015-09-24 |
US20150056757A1 (en) | 2015-02-26 |
CN104584257B (zh) | 2017-06-20 |
US20170244058A1 (en) | 2017-08-24 |
EP2845241A4 (en) | 2016-02-10 |
WO2013165637A1 (en) | 2013-11-07 |
KR101919294B1 (ko) | 2018-11-15 |
CN107275511A (zh) | 2017-10-20 |
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